TW200629593A - Capacitor device with vertically arranged capacitor regions of various kind - Google Patents

Capacitor device with vertically arranged capacitor regions of various kind

Info

Publication number
TW200629593A
TW200629593A TW094123265A TW94123265A TW200629593A TW 200629593 A TW200629593 A TW 200629593A TW 094123265 A TW094123265 A TW 094123265A TW 94123265 A TW94123265 A TW 94123265A TW 200629593 A TW200629593 A TW 200629593A
Authority
TW
Taiwan
Prior art keywords
capacitor
regions
capacitor device
vertically arranged
various kind
Prior art date
Application number
TW094123265A
Other languages
English (en)
Other versions
TWI256153B (en
Inventor
Yueh-You Chen
Chung-Long Chang
Chih-Ping Chao
Chun-Hong Chen
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Application granted granted Critical
Publication of TWI256153B publication Critical patent/TWI256153B/zh
Publication of TW200629593A publication Critical patent/TW200629593A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H10W20/496—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/62—Capacitors having potential barriers
    • H10D1/64—Variable-capacitance diodes, e.g. varactors 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
    • H10D84/215—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors of only varactors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/423—Shielding layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers

Landscapes

  • Semiconductor Integrated Circuits (AREA)
TW094123265A 2005-02-11 2005-07-08 Capacitor device with vertically arranged capacitor regions of various kind TWI256153B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/055,933 US7335956B2 (en) 2005-02-11 2005-02-11 Capacitor device with vertically arranged capacitor regions of various kinds

Publications (2)

Publication Number Publication Date
TWI256153B TWI256153B (en) 2006-06-01
TW200629593A true TW200629593A (en) 2006-08-16

Family

ID=36814828

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123265A TWI256153B (en) 2005-02-11 2005-07-08 Capacitor device with vertically arranged capacitor regions of various kind

Country Status (3)

Country Link
US (1) US7335956B2 (zh)
CN (1) CN100499121C (zh)
TW (1) TWI256153B (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7645675B2 (en) * 2006-01-13 2010-01-12 International Business Machines Corporation Integrated parallel plate capacitors
US20070267733A1 (en) 2006-05-18 2007-11-22 International Business Machines Corporation Symmetrical MIMCAP capacitor design
US7518850B2 (en) * 2006-05-18 2009-04-14 International Business Machines Corporation High yield, high density on-chip capacitor design
CN101436593B (zh) * 2007-11-16 2011-02-09 瑞昱半导体股份有限公司 半导体电容结构及其布局
KR101595788B1 (ko) * 2009-03-18 2016-02-22 삼성전자주식회사 커패시터 구조물 및 그 제조 방법
JP2010225880A (ja) * 2009-03-24 2010-10-07 Nec Corp 半導体装置及びその製造方法
TWI484643B (zh) * 2009-04-28 2015-05-11 United Microelectronics Corp 電容結構
TW201110167A (en) * 2009-09-04 2011-03-16 Novatek Microelectronics Corp Metal-oxide-metal capacitor having low parasitic capacitor
US8232624B2 (en) 2009-09-14 2012-07-31 International Business Machines Corporation Semiconductor structure having varactor with parallel DC path adjacent thereto
KR101241466B1 (ko) * 2011-04-13 2013-03-11 엘지이노텍 주식회사 픽셀 어레이, 이를 포함하는 이미지센서 및 그 구동 방법
CN102820279B (zh) * 2011-06-10 2015-06-17 台湾积体电路制造股份有限公司 垂直相互交叉的半导体电容器
US9293521B2 (en) 2012-03-02 2016-03-22 Taiwan Semiconductor Manufacturing Co., Ltd. Concentric capacitor structure
US9159718B2 (en) 2013-03-08 2015-10-13 Taiwan Semiconductor Manufacturing Co., Ltd. Switched capacitor structure
US8980708B2 (en) 2013-02-19 2015-03-17 Qualcomm Incorporated Complementary back end of line (BEOL) capacitor
US9685433B2 (en) 2013-09-25 2017-06-20 Taiwan Semiconductor Manufacturing Company Ltd. Capacitor device
US9640532B2 (en) * 2014-02-14 2017-05-02 Qualcomm Incorporated Stacked metal oxide semiconductor (MOS) and metal oxide metal (MOM) capacitor architecture
US9576735B2 (en) * 2014-06-06 2017-02-21 Globalfoundries Inc. Vertical capacitors with spaced conductive lines
CN111357103A (zh) * 2017-12-29 2020-06-30 华为技术有限公司 电容器
CN111834359B (zh) * 2020-08-03 2025-07-29 牛芯半导体(深圳)有限公司 电容版图结构
US11164935B1 (en) * 2020-09-15 2021-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. High density metal insulator metal capacitor
US11942467B2 (en) 2021-06-18 2024-03-26 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure, electronic device, and method of manufacturing semiconductor structure
CN114582840B (zh) * 2022-02-18 2025-10-21 联芸科技(杭州)股份有限公司 一种mom电容器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6667506B1 (en) 1999-04-06 2003-12-23 Peregrine Semiconductor Corporation Variable capacitor with programmability
US6458648B1 (en) 1999-12-17 2002-10-01 Agere Systems Guardian Corp. Method for in-situ removal of side walls in MOM capacitor formation
US6635916B2 (en) * 2000-08-31 2003-10-21 Texas Instruments Incorporated On-chip capacitor
US6906548B1 (en) * 2000-11-02 2005-06-14 Tokyo Electron Limited Capacitance measurement method of micro structures of integrated circuits
KR100425578B1 (ko) 2001-09-17 2004-04-03 한국전자통신연구원 ＳｉＧｅ 이종접합 바이폴라 트랜지스터를 이용하여개선된 Ｑ-인자 특성을 갖는 버렉터 및 그 제조 방법
US6645810B2 (en) 2001-11-13 2003-11-11 Chartered Semiconductors Manufacturing Limited Method to fabricate MIM capacitor using damascene process
WO2003052829A1 (fr) * 2001-12-14 2003-06-26 Hitachi, Ltd. Dispositif semi-conducteur et procede de fabrication correspondant
US6744129B2 (en) * 2002-01-11 2004-06-01 Microtune (San Diego), Inc. Integrated ground shield
US6720608B2 (en) 2002-05-22 2004-04-13 United Microelectronics Corp. Metal-insulator-metal capacitor structure
US6800923B1 (en) * 2003-04-25 2004-10-05 Oki Electric Industry Co., Ltd. Multilayer analog interconnecting line layout for a mixed-signal integrated circuit

Also Published As

Publication number Publication date
US20060180895A1 (en) 2006-08-17
CN100499121C (zh) 2009-06-10
CN1819194A (zh) 2006-08-16
TWI256153B (en) 2006-06-01
US7335956B2 (en) 2008-02-26

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