TW200635689A - Holder and method for separating objects, and flexible material layer with separated objects - Google Patents

Holder and method for separating objects, and flexible material layer with separated objects

Info

Publication number
TW200635689A
TW200635689A TW094147180A TW94147180A TW200635689A TW 200635689 A TW200635689 A TW 200635689A TW 094147180 A TW094147180 A TW 094147180A TW 94147180 A TW94147180 A TW 94147180A TW 200635689 A TW200635689 A TW 200635689A
Authority
TW
Taiwan
Prior art keywords
objects
material layer
holder
flexible material
separated
Prior art date
Application number
TW094147180A
Other languages
Chinese (zh)
Inventor
Joannes Leonardus Jurrian Zijl
Egmond Henri Joseph Van
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Publication of TW200635689A publication Critical patent/TW200635689A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention related to a holder and to a method for supporting and engaging objects, such as for instance, but not exclusively, semiconductor products, during separation of the objects using laser light. The invention also relates to a flexible material layer provided with a number of separated objects connecting on one side to the material layer.
TW094147180A 2004-12-31 2005-12-29 Holder and method for separating objects, and flexible material layer with separated objects TW200635689A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1027929A NL1027929C2 (en) 2004-12-31 2004-12-31 Holder and method for separating objects, and flexible material layer with separated objects.

Publications (1)

Publication Number Publication Date
TW200635689A true TW200635689A (en) 2006-10-16

Family

ID=34974706

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094147180A TW200635689A (en) 2004-12-31 2005-12-29 Holder and method for separating objects, and flexible material layer with separated objects

Country Status (4)

Country Link
KR (1) KR20060079123A (en)
CN (1) CN1814392A (en)
NL (1) NL1027929C2 (en)
TW (1) TW200635689A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103737184B (en) * 2013-12-25 2015-06-10 广州兴森快捷电路科技有限公司 Device and fixture for performing laser machining on through hole and fixture installation method
CN104096980B (en) * 2014-06-26 2016-01-20 长春光华微电子设备工程中心有限公司 laser cutting vacuum absorbing platform
CN106583944B (en) * 2016-12-09 2019-06-14 无锡航亚科技股份有限公司 A kind of device and method cutting forging flash

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6202292B1 (en) * 1998-08-26 2001-03-20 Micron Technology, Inc. Apparatus for removing carrier film from a semiconductor die
JP4546626B2 (en) * 2000-08-29 2010-09-15 株式会社ディスコ Method for picking up semiconductor element
NL1022463C2 (en) * 2003-01-22 2004-07-26 Fico Bv Support, holder, laser cutting device and method for separating semiconductor products with the aid of laser light.

Also Published As

Publication number Publication date
CN1814392A (en) 2006-08-09
NL1027929C2 (en) 2006-07-03
KR20060079123A (en) 2006-07-05

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