TW200636840A - Wafer treating apparatus - Google Patents

Wafer treating apparatus

Info

Publication number
TW200636840A
TW200636840A TW095106199A TW95106199A TW200636840A TW 200636840 A TW200636840 A TW 200636840A TW 095106199 A TW095106199 A TW 095106199A TW 95106199 A TW95106199 A TW 95106199A TW 200636840 A TW200636840 A TW 200636840A
Authority
TW
Taiwan
Prior art keywords
wafers
treating
transport mechanism
jigs
joined
Prior art date
Application number
TW095106199A
Other languages
English (en)
Other versions
TWI306274B (en
Inventor
Koji Hasegawa
Akira Morita
Kenichiro Arai
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200636840A publication Critical patent/TW200636840A/zh
Application granted granted Critical
Publication of TWI306274B publication Critical patent/TWI306274B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
    • B60N2/00—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
    • B60N2/56—Heating or ventilating devices
    • B60N2/5607—Heating or ventilating devices characterised by convection
    • B60N2/5621—Heating or ventilating devices characterised by convection by air
    • B60N2/5657—Heating or ventilating devices characterised by convection by air blown towards the seat surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
    • B60N2/00—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
    • B60N2/56—Heating or ventilating devices
    • B60N2/5607—Heating or ventilating devices characterised by convection
    • B60N2/5621—Heating or ventilating devices characterised by convection by air
    • B60N2/5635—Heating or ventilating devices characterised by convection by air coming from the passenger compartment

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW095106199A 2005-02-28 2006-02-24 Wafer treating apparatus TWI306274B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005053418A JP2006237492A (ja) 2005-02-28 2005-02-28 ウエハ処理装置

Publications (2)

Publication Number Publication Date
TW200636840A true TW200636840A (en) 2006-10-16
TWI306274B TWI306274B (en) 2009-02-11

Family

ID=36930974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106199A TWI306274B (en) 2005-02-28 2006-02-24 Wafer treating apparatus

Country Status (5)

Country Link
US (1) US7758717B2 (zh)
JP (1) JP2006237492A (zh)
KR (1) KR100743514B1 (zh)
CN (1) CN100401494C (zh)
TW (1) TWI306274B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573662B (zh) * 2011-03-25 2017-03-11 不二越機械工業股份有限公司 工作件之貼附方法以及貼附裝置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101487205B1 (ko) * 2007-07-13 2015-01-30 삼성전자 주식회사 미디어 서버 내의 컨텐츠를 제공하는 장치, 시스템 및 그방법
CN101510516B (zh) * 2009-03-20 2010-04-14 南京德研电子有限公司 用于晶片粘接的方法及其装置
CN102674710A (zh) * 2011-06-21 2012-09-19 京东方科技集团股份有限公司 玻璃基板加工的保护装置及方法
CN102629567B (zh) * 2011-10-19 2015-06-24 京东方科技集团股份有限公司 一种基板固定装置及制作方法以及固定基板的方法
CN106356322A (zh) * 2016-10-20 2017-01-25 北方电子研究院安徽有限公司 一种晶圆腐蚀装置以及腐蚀方法
JP2020138225A (ja) * 2019-03-01 2020-09-03 株式会社ディスコ レーザー加工方法
JP7257199B2 (ja) * 2019-03-18 2023-04-13 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
CN110181382B (zh) * 2019-05-15 2020-12-01 徐州鑫晶半导体科技有限公司 制备半导体晶片的系统和方法
CN117001529A (zh) * 2023-08-16 2023-11-07 业泓科技(成都)有限公司 抛光设备及抛光方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922117Y2 (ja) * 1978-04-24 1984-07-02 日本電信電話株式会社 化学エツチング用試料保持装置
JPS5795632A (en) * 1980-12-04 1982-06-14 Nec Kyushu Ltd Jig for etching back surface of semiconductor wafer
JPS63117445A (ja) * 1986-11-05 1988-05-21 Citizen Watch Co Ltd 半導体ウエハ−の加工方法
US5227001A (en) * 1990-10-19 1993-07-13 Integrated Process Equipment Corporation Integrated dry-wet semiconductor layer removal apparatus and method
JPH0582491A (ja) * 1991-09-20 1993-04-02 Mitsubishi Electric Corp ウエハはがし装置
US5605487A (en) * 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
JPH0950947A (ja) * 1995-08-07 1997-02-18 Shimada Phys & Chem Ind Co Ltd ウエハ処理方法
JPH1145297A (ja) * 1997-07-28 1999-02-16 Sharp Corp 料理支援装置
JP2000068355A (ja) * 1998-08-21 2000-03-03 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001176761A (ja) * 1999-12-17 2001-06-29 Chemitoronics Co Ltd 薄層基板半導体装置及びその製造方法
JP2002203821A (ja) * 2000-12-28 2002-07-19 Mitsubishi Gas Chem Co Inc 接着および剥離法
JP4738626B2 (ja) 2001-04-20 2011-08-03 株式会社デンソー 半導体基板のエッチング方法
JP3724431B2 (ja) 2002-02-05 2005-12-07 株式会社デンソー 半導体基板のエッチング方法
US7535100B2 (en) * 2002-07-12 2009-05-19 The United States Of America As Represented By The Secretary Of The Navy Wafer bonding of thinned electronic materials and circuits to high performance substrates
JP2004142045A (ja) 2002-10-25 2004-05-20 Seiko Epson Corp Ｃｍｐ装置、ｃｍｐ研磨方法、半導体装置及びその製造方法
JP2004288920A (ja) 2003-03-24 2004-10-14 Denso Corp 半導体基板のエッチング方法
JP2005051055A (ja) * 2003-07-29 2005-02-24 Tokyo Electron Ltd 貼合せ方法および貼合せ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573662B (zh) * 2011-03-25 2017-03-11 不二越機械工業股份有限公司 工作件之貼附方法以及貼附裝置

Also Published As

Publication number Publication date
JP2006237492A (ja) 2006-09-07
KR20060095507A (ko) 2006-08-31
CN1828859A (zh) 2006-09-06
KR100743514B1 (ko) 2007-07-27
CN100401494C (zh) 2008-07-09
TWI306274B (en) 2009-02-11
US20060191635A1 (en) 2006-08-31
US7758717B2 (en) 2010-07-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees