TW200711182A - Opto-electronic semiconductor chip - Google Patents
Opto-electronic semiconductor chipInfo
- Publication number
- TW200711182A TW200711182A TW095127729A TW95127729A TW200711182A TW 200711182 A TW200711182 A TW 200711182A TW 095127729 A TW095127729 A TW 095127729A TW 95127729 A TW95127729 A TW 95127729A TW 200711182 A TW200711182 A TW 200711182A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor chip
- active region
- opto
- electronic semiconductor
- layer
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0421—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
- H01S5/320275—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth semi-polar orientation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3072—Diffusion blocking layer, i.e. a special layer blocking diffusion of dopants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3095—Tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3407—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers characterised by special barrier layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Led Devices (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005035722.9A DE102005035722B9 (de) | 2005-07-29 | 2005-07-29 | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200711182A true TW200711182A (en) | 2007-03-16 |
| TWI323948B TWI323948B (en) | 2010-04-21 |
Family
ID=37192450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095127729A TWI323948B (en) | 2005-07-29 | 2006-07-28 | Opto-electronic semiconductor chip |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20090090900A1 (zh) |
| EP (1) | EP1911103B1 (zh) |
| JP (2) | JP5167127B2 (zh) |
| KR (1) | KR20080047376A (zh) |
| CN (2) | CN102664223A (zh) |
| DE (1) | DE102005035722B9 (zh) |
| TW (1) | TWI323948B (zh) |
| WO (1) | WO2007012327A1 (zh) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005035722B9 (de) | 2005-07-29 | 2021-11-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
| DE102007019079A1 (de) | 2007-01-26 | 2008-07-31 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
| DE102007003991A1 (de) * | 2007-01-26 | 2008-07-31 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip mit einem Tunnelübergang |
| US8115213B2 (en) * | 2007-02-08 | 2012-02-14 | Phoseon Technology, Inc. | Semiconductor light sources, systems, and methods |
| DE102007031926A1 (de) | 2007-07-09 | 2009-01-15 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterkörper |
| JP2009026956A (ja) * | 2007-07-19 | 2009-02-05 | Sumitomo Electric Ind Ltd | 発光素子、発光素子のための基板生産物、および発光素子を作製する方法 |
| DE102007035687A1 (de) * | 2007-07-30 | 2009-02-05 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einem Schichtenstapel |
| DE102007035896A1 (de) | 2007-07-31 | 2009-02-05 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und optoelektronisches Bauelement |
| KR100887050B1 (ko) * | 2007-12-06 | 2009-03-04 | 삼성전기주식회사 | 질화물 반도체 소자 |
| DE102008028036A1 (de) * | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper mit Tunnelübergang und Verfahren zur Herstellung eines solchen |
| DE102008019268A1 (de) | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| DE102008027045A1 (de) | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Halbleiterleuchtdiode und Verfahren zur Herstellung einer Halbleiterleuchtdiode |
| DE102008013900A1 (de) | 2008-03-12 | 2009-09-17 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
| DE102008032318A1 (de) | 2008-03-31 | 2009-10-01 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines solchen |
| DE102008028345A1 (de) | 2008-06-13 | 2009-12-17 | Osram Opto Semiconductors Gmbh | Halbleiterkörper und Verfahren zur Herstellung eines Halbleiterkörpers |
| CN102144342B (zh) * | 2008-09-05 | 2013-10-09 | 夏普株式会社 | 氮化物半导体发光器件和半导体发光器件 |
| JP2010062460A (ja) * | 2008-09-05 | 2010-03-18 | Sharp Corp | 窒化物半導体発光素子 |
| JP2010080741A (ja) * | 2008-09-26 | 2010-04-08 | Sharp Corp | 半導体発光素子 |
| DE102009015569B9 (de) * | 2009-03-30 | 2023-06-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
| US10134948B2 (en) * | 2011-02-25 | 2018-11-20 | Sensor Electronic Technology, Inc. | Light emitting diode with polarization control |
| KR101836122B1 (ko) * | 2011-08-24 | 2018-04-19 | 엘지이노텍 주식회사 | 발광소자 |
| KR101888606B1 (ko) * | 2011-12-20 | 2018-09-21 | 엘지이노텍 주식회사 | 발광 소자 및 그를 이용한 조명 시스템 |
| DE102012101718B4 (de) | 2012-03-01 | 2025-08-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
| TW201347233A (zh) * | 2012-05-08 | 2013-11-16 | 華夏光股份有限公司 | 發光二極體裝置及其製造方法 |
| US8884268B2 (en) * | 2012-07-16 | 2014-11-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Diffusion barrier layer for group III nitride on silicon substrate |
| KR101903360B1 (ko) | 2012-07-25 | 2018-10-04 | 삼성전자주식회사 | 반도체 발광소자 |
| JP6223075B2 (ja) | 2012-10-09 | 2017-11-01 | キヤノン株式会社 | 発光素子の製造方法及び発光素子 |
| DE102013104351B4 (de) | 2013-04-29 | 2022-01-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterschichtenfolge und Verfahren zum Betreiben eines optoelektronischen Halbleiterchips |
| TWI597862B (zh) * | 2013-08-30 | 2017-09-01 | 晶元光電股份有限公司 | 具阻障層的光電半導體元件 |
| KR102276422B1 (ko) | 2014-07-18 | 2021-07-12 | 삼성전자주식회사 | 투과형 고흡수 광 변조기 및 그 제조방법 |
| DE102015108875B4 (de) * | 2015-06-04 | 2016-12-15 | Otto-Von-Guericke-Universität Magdeburg | Bauelement mit einer transparenten leitfähigen Nitridschicht |
| JP7155723B2 (ja) | 2018-08-02 | 2022-10-19 | 株式会社リコー | 発光素子及びその製造方法 |
| DE102018133123A1 (de) * | 2018-12-20 | 2020-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement mit einem zentralen Bereich und einem Randbereich und Verfahren zur Herstellung des optoelektronischen Halbleiterbauelements |
| US11584859B2 (en) | 2019-08-15 | 2023-02-21 | The Boeing Company | Titanium and magnesium compound for corrosion-resistant coatings |
| TWI912314B (zh) * | 2020-05-04 | 2026-01-21 | 美商谷歌有限責任公司 | 顯示器、發光二極體結構及用於形成其之相關聯的方法 |
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| JP4624064B2 (ja) * | 2003-10-14 | 2011-02-02 | 昭和電工株式会社 | Iii族窒化物半導体積層物 |
| JP3894191B2 (ja) | 2003-11-26 | 2007-03-14 | 住友電気工業株式会社 | 窒化ガリウム系半導体膜を形成する方法、および半導体基板生産物 |
| JP2005123657A (ja) | 2005-01-31 | 2005-05-12 | Sanyo Electric Co Ltd | チップ型発光素子およびその製造方法 |
| DE102005037022A1 (de) | 2005-06-28 | 2007-01-04 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender optoelektronischer Halbleiterchip mit einer Diffusionsbarriere |
| DE102005035722B9 (de) | 2005-07-29 | 2021-11-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
| WO2007149487A2 (en) * | 2006-06-21 | 2007-12-27 | The Regents Of The University Of California | Opto-electronic and electronic devices using n-face or m-plane gan substrate prepared with ammonothermal growth |
-
2005
- 2005-07-29 DE DE102005035722.9A patent/DE102005035722B9/de not_active Expired - Lifetime
-
2006
- 2006-07-28 EP EP06775767.4A patent/EP1911103B1/de active Active
- 2006-07-28 WO PCT/DE2006/001323 patent/WO2007012327A1/de not_active Ceased
- 2006-07-28 KR KR1020087005214A patent/KR20080047376A/ko not_active Ceased
- 2006-07-28 JP JP2008523121A patent/JP5167127B2/ja not_active Expired - Fee Related
- 2006-07-28 CN CN2012101074198A patent/CN102664223A/zh active Pending
- 2006-07-28 TW TW095127729A patent/TWI323948B/zh not_active IP Right Cessation
- 2006-07-28 US US11/989,512 patent/US20090090900A1/en not_active Abandoned
- 2006-07-28 CN CN2006800274518A patent/CN101233622B/zh active Active
-
2012
- 2012-07-11 US US13/546,857 patent/US8994000B2/en active Active
- 2012-10-09 JP JP2012224564A patent/JP2013009013A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TWI323948B (en) | 2010-04-21 |
| EP1911103B1 (de) | 2016-08-31 |
| CN102664223A (zh) | 2012-09-12 |
| WO2007012327A1 (de) | 2007-02-01 |
| CN101233622A (zh) | 2008-07-30 |
| JP5167127B2 (ja) | 2013-03-21 |
| KR20080047376A (ko) | 2008-05-28 |
| DE102005035722B4 (de) | 2021-09-09 |
| DE102005035722A1 (de) | 2007-02-01 |
| JP2013009013A (ja) | 2013-01-10 |
| DE102005035722B9 (de) | 2021-11-18 |
| US20090090900A1 (en) | 2009-04-09 |
| JP2009503823A (ja) | 2009-01-29 |
| EP1911103A1 (de) | 2008-04-16 |
| US8994000B2 (en) | 2015-03-31 |
| CN101233622B (zh) | 2012-06-13 |
| US20120280207A1 (en) | 2012-11-08 |
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