TW200714043A - Image sensor package and digital camera module therewith - Google Patents

Image sensor package and digital camera module therewith

Info

Publication number
TW200714043A
TW200714043A TW094130337A TW94130337A TW200714043A TW 200714043 A TW200714043 A TW 200714043A TW 094130337 A TW094130337 A TW 094130337A TW 94130337 A TW94130337 A TW 94130337A TW 200714043 A TW200714043 A TW 200714043A
Authority
TW
Taiwan
Prior art keywords
image sensor
sensor package
digital camera
camera module
substrate
Prior art date
Application number
TW094130337A
Other languages
Chinese (zh)
Inventor
Steven Webster
Ying-Cheng Wu
Original Assignee
Altus Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Altus Technology Inc filed Critical Altus Technology Inc
Priority to TW094130337A priority Critical patent/TW200714043A/en
Publication of TW200714043A publication Critical patent/TW200714043A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The present invention relates an image sensor package and a digital camera module therewith. The image sensor package includes a holder, an image sensor, a plurality of bonding wires and a plate. The holder includes a conductor gateway and a substrate. The conductor gateway inlays in the substrate. There is a solder pad zone formed out of the body. The image sensor has a sensing area, and is disposed in the holder. One end of each bonding wire is connected to the solder pad zone and another end of the bonding wire is connected to the image sensor. The bonding wires are surrounded by pastern. The pastern is pasted on the plate to form a cavum. The plate is fixed on the substrate.
TW094130337A 2005-09-05 2005-09-05 Image sensor package and digital camera module therewith TW200714043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094130337A TW200714043A (en) 2005-09-05 2005-09-05 Image sensor package and digital camera module therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094130337A TW200714043A (en) 2005-09-05 2005-09-05 Image sensor package and digital camera module therewith

Publications (1)

Publication Number Publication Date
TW200714043A true TW200714043A (en) 2007-04-01

Family

ID=57911457

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130337A TW200714043A (en) 2005-09-05 2005-09-05 Image sensor package and digital camera module therewith

Country Status (1)

Country Link
TW (1) TW200714043A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425825B (en) * 2009-12-31 2014-02-01 勝開科技股份有限公司 Adjustable focus image sensor package structure
CN104660926A (en) * 2013-11-25 2015-05-27 光宝科技股份有限公司 Optical image acquisition module, manufacturing method thereof, and optical auxiliary unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425825B (en) * 2009-12-31 2014-02-01 勝開科技股份有限公司 Adjustable focus image sensor package structure
CN104660926A (en) * 2013-11-25 2015-05-27 光宝科技股份有限公司 Optical image acquisition module, manufacturing method thereof, and optical auxiliary unit
CN104660926B (en) * 2013-11-25 2018-04-06 光宝科技股份有限公司 Optical image acquisition module, manufacturing method thereof and optical auxiliary unit

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