TW200718662A - Device and method for cutting off substrate of fragile material - Google Patents

Device and method for cutting off substrate of fragile material

Info

Publication number
TW200718662A
TW200718662A TW095119086A TW95119086A TW200718662A TW 200718662 A TW200718662 A TW 200718662A TW 095119086 A TW095119086 A TW 095119086A TW 95119086 A TW95119086 A TW 95119086A TW 200718662 A TW200718662 A TW 200718662A
Authority
TW
Taiwan
Prior art keywords
substrate
cutting
fragile material
scribe line
divided
Prior art date
Application number
TW095119086A
Other languages
English (en)
Other versions
TWI457302B (zh
Inventor
Yuki Nishisaka
Kenji Otoda
Shuichi Inoue
Toru Kumagai
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200718662A publication Critical patent/TW200718662A/zh
Application granted granted Critical
Publication of TWI457302B publication Critical patent/TWI457302B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW95119086A 2005-05-30 2006-05-30 Fragile material substrate segmentation device and segmentation method TWI457302B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005187324 2005-05-30

Publications (2)

Publication Number Publication Date
TW200718662A true TW200718662A (en) 2007-05-16
TWI457302B TWI457302B (zh) 2014-10-21

Family

ID=37481492

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95119086A TWI457302B (zh) 2005-05-30 2006-05-30 Fragile material substrate segmentation device and segmentation method

Country Status (7)

Country Link
US (1) US8276796B2 (zh)
EP (1) EP1886782A1 (zh)
JP (1) JP4718546B2 (zh)
KR (1) KR100907462B1 (zh)
CN (1) CN101232982B (zh)
TW (1) TWI457302B (zh)
WO (1) WO2006129563A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417260B (zh) * 2008-05-26 2013-12-01 三星鑽石工業股份有限公司 Set
TWI451523B (zh) * 2009-03-30 2014-09-01 三星鑽石工業股份有限公司 Substrate fixing device

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JP5171186B2 (ja) * 2007-09-27 2013-03-27 三星ダイヤモンド工業株式会社 脆性材料基板の割断装置および割断方法
TWI430968B (zh) * 2008-04-28 2014-03-21 Mitsuboshi Diamond Ind Co Ltd Fracture material of brittle material and cracking method of brittle material
DE102009018836A1 (de) * 2009-04-28 2010-11-11 Nordischer Maschinenbau Rud. Baader Gmbh + Co. Kg Vorrichtung und Verfahren zum Separieren von Produktteilen geschnittener Produkte
KR101034377B1 (ko) * 2009-05-06 2011-05-16 세메스 주식회사 기판 절단 방법 및 장치
KR20110002208A (ko) 2009-07-01 2011-01-07 삼성전자주식회사 반도체 소자의 형성방법
JP5129826B2 (ja) * 2010-02-05 2013-01-30 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
ITVI20100090A1 (it) * 2010-03-30 2011-10-01 Emanuele Falloppi Dispositivo di asportazione o divisione a spacco con avanzamento continuo di materiali come rocce o pietre semilavorate quali marmi o graniti, laterizi, conglomerati , ed impianti utilizzanti tale dispositivo.
KR101651258B1 (ko) * 2010-05-14 2016-08-25 주식회사 탑 엔지니어링 글래스 패널 절단용 브레이킹 롤러 장치
CN102917991B (zh) * 2010-06-07 2015-11-25 日本电气硝子株式会社 玻璃板的切断方法
FR2962209B1 (fr) * 2010-07-02 2012-07-13 Nexter Munitions Reliefs anti adherence pour dispositif de securite et d'armement
JP5210409B2 (ja) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 ブレイク装置
CN102441943B (zh) * 2011-11-11 2015-12-02 福建海源自动化机械股份有限公司 一种不规则表面砖的制造方法和装置
WO2013073477A1 (ja) * 2011-11-16 2013-05-23 日本電気硝子株式会社 板ガラス割断装置、板ガラス割断方法、板ガラス作製方法、および、板ガラス割断システム
TWI455200B (zh) * 2012-01-05 2014-10-01 Wecon Automation Corp 切割裝置及方法
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CN103412432B (zh) * 2013-08-29 2016-07-06 深圳市华星光电技术有限公司 液晶面板裂片装置及裂片方法
US9508570B2 (en) * 2013-10-21 2016-11-29 Asm Technology Singapore Pte Ltd Singulation apparatus and method
JP6349970B2 (ja) * 2014-05-30 2018-07-04 三星ダイヤモンド工業株式会社 基板分断方法並びに基板分断装置
JP6117755B2 (ja) * 2014-09-22 2017-04-19 ファナック株式会社 予め切断された基板の引っ掛かりを解除する装置、ロボット、およびロボットシステム
JP5890505B1 (ja) * 2014-10-14 2016-03-22 ファナック株式会社 基板を切断するための切断装置、ロボット、およびロボットシステム
JP2016104683A (ja) * 2014-11-19 2016-06-09 坂東機工株式会社 ガラス板の折割方法及びその折割装置
KR101756072B1 (ko) * 2015-08-07 2017-07-11 로체 시스템즈(주) 롤러를 이용한 비금속 재료의 절단 장치 및 절단 방법
CN106569359A (zh) * 2015-10-07 2017-04-19 罗泽系统株式会社 粘合基板切断方法及利用该方法的粘合基板切断系统
TWI614198B (zh) * 2015-10-21 2018-02-11 裂片製程之設備及其方法
KR101694200B1 (ko) * 2015-11-20 2017-01-09 주식회사 에스에프에이 인라인 더미 분리장치
CN106977089B (zh) * 2017-05-05 2019-11-08 东旭科技集团有限公司 玻璃压断装置、玻璃压断方法和玻璃切割系统
CN107116602B (zh) * 2017-06-29 2018-06-22 深圳市鸿智电子技术有限公司 导光板切割机
JP2019038238A (ja) * 2017-08-29 2019-03-14 三星ダイヤモンド工業株式会社 ブレイク装置
CN111247104B (zh) * 2017-09-26 2022-10-21 康宁公司 玻璃制造设备和用于分离玻璃带的方法
JP2019107779A (ja) * 2017-12-15 2019-07-04 三星ダイヤモンド工業株式会社 ピックアップユニット
JP7171305B2 (ja) * 2018-08-10 2022-11-15 株式会社ジャパンディスプレイ ガラス基板切断方法
JP2020066539A (ja) * 2018-10-22 2020-04-30 坂東機工株式会社 ガラス板の折割機械
WO2020086274A1 (en) * 2018-10-25 2020-04-30 Corning Incorporated Scrim glass management
CN111362568B (zh) * 2020-04-30 2024-11-15 河北南玻玻璃有限公司 一种玻璃清边辅助装置
DE102020134451A1 (de) * 2020-12-21 2022-06-23 Schott Ag Verfahren zum Bearbeiten, insbesondere zum Vortrennen, eines flächigen Substrats
CN115061302A (zh) * 2022-06-30 2022-09-16 无锡尚实电子科技有限公司 一种液晶面板切割后的拉裂分离装置及方法
CN115417588B (zh) * 2022-08-12 2023-08-01 彩虹（合肥）液晶玻璃有限公司 一种基板玻璃纵向切割辅助装置
CN120395198B (zh) * 2025-07-01 2025-08-29 北京合锐赛尔电力科技股份有限公司 一种低压开关柜加工用异形板裁板装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417260B (zh) * 2008-05-26 2013-12-01 三星鑽石工業股份有限公司 Set
TWI451523B (zh) * 2009-03-30 2014-09-01 三星鑽石工業股份有限公司 Substrate fixing device

Also Published As

Publication number Publication date
CN101232982A (zh) 2008-07-30
JP4718546B2 (ja) 2011-07-06
EP1886782A1 (en) 2008-02-13
CN101232982B (zh) 2012-03-21
US8276796B2 (en) 2012-10-02
JPWO2006129563A1 (ja) 2008-12-25
KR100907462B1 (ko) 2009-07-13
KR20080011702A (ko) 2008-02-05
US20100065599A1 (en) 2010-03-18
WO2006129563A1 (ja) 2006-12-07
TWI457302B (zh) 2014-10-21

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