TW200736618A - Clamping mechanism of probe card and probe device - Google Patents

Clamping mechanism of probe card and probe device

Info

Publication number
TW200736618A
TW200736618A TW095134346A TW95134346A TW200736618A TW 200736618 A TW200736618 A TW 200736618A TW 095134346 A TW095134346 A TW 095134346A TW 95134346 A TW95134346 A TW 95134346A TW 200736618 A TW200736618 A TW 200736618A
Authority
TW
Taiwan
Prior art keywords
clamping mechanism
probe
cam follower
ring
probe device
Prior art date
Application number
TW095134346A
Other languages
English (en)
Other versions
TWI402508B (zh
Inventor
Hiroshi Yamada
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200736618A publication Critical patent/TW200736618A/zh
Application granted granted Critical
Publication of TWI402508B publication Critical patent/TWI402508B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
TW095134346A 2005-09-16 2006-09-15 Probe card holding mechanism and probe device TWI402508B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005270791A JP4625387B2 (ja) 2005-09-16 2005-09-16 プローブカードのクランプ機構及びプローブ装置

Publications (2)

Publication Number Publication Date
TW200736618A true TW200736618A (en) 2007-10-01
TWI402508B TWI402508B (zh) 2013-07-21

Family

ID=37878462

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134346A TWI402508B (zh) 2005-09-16 2006-09-15 Probe card holding mechanism and probe device

Country Status (4)

Country Link
US (1) US7355425B2 (zh)
JP (1) JP4625387B2 (zh)
CN (1) CN100547404C (zh)
TW (1) TWI402508B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
JP5277827B2 (ja) * 2008-09-22 2013-08-28 東京エレクトロン株式会社 プローブ装置
TWM361634U (en) * 2009-04-10 2009-07-21 Princeton Technology Corp Testing circuit board
JP2011064659A (ja) * 2009-09-21 2011-03-31 Tokyo Electron Ltd プローブカードのクランプ機構及び検査装置
CN102859370B (zh) * 2010-04-19 2014-10-29 日本电产理德株式会社 检查用探针及检查用夹具
CN102945788B (zh) * 2011-08-16 2015-04-15 北京北方微电子基地设备工艺研究中心有限责任公司 遮蔽装置及具有其的半导体处理设备
DE102012103893A1 (de) * 2012-05-03 2013-11-07 Turbodynamics Gmbh Modul zum Austauschen einer Schnittstelleneinheit in einem Testsystem zum Testen von Halbleiterelementen und Testsystem mit einem solchen Modul
US9000793B2 (en) * 2012-11-15 2015-04-07 Advantest America, Inc. Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same
JP6298373B2 (ja) * 2014-07-11 2018-03-20 東京エレクトロン株式会社 プラズマ処理装置および上部電極アセンブリ
TWI583963B (zh) * 2016-04-18 2017-05-21 旺矽科技股份有限公司 探針卡
KR102566685B1 (ko) 2016-07-18 2023-08-14 삼성전자주식회사 프로브 카드용 클램핑 장치 및 이를 포함하는 프로브 카드
KR102227072B1 (ko) * 2016-11-23 2021-03-12 주식회사 기가레인 프로브 카드용 나사 체결 장치 및 이를 구비한 프로브 카드 조립장치
JP7138004B2 (ja) * 2018-09-28 2022-09-15 株式会社日本マイクロニクス プローブカード保持具
CN117109486B (zh) * 2023-10-23 2024-01-23 北京华力兴科技发展有限责任公司 一种x射线测厚仪探头

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264787A (en) * 1991-08-30 1993-11-23 Hughes Aircraft Company Rigid-flex circuits with raised features as IC test probes
KR100248569B1 (ko) * 1993-12-22 2000-03-15 히가시 데쓰로 프로우브장치
US5561377A (en) * 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
JPH10308424A (ja) * 1997-05-08 1998-11-17 Tokyo Electron Ltd プローブカードクランプ機構及びプローブ装置
JP2000150596A (ja) * 1998-11-10 2000-05-30 Tokyo Seimitsu Co Ltd プローバ
JP2002107420A (ja) * 2000-09-29 2002-04-10 Ando Electric Co Ltd テストボード取付装置
TWM270488U (en) * 2005-01-12 2005-07-11 Advanced Semiconductor Eng A RF interface apparatus applied for prober

Also Published As

Publication number Publication date
JP2007078656A (ja) 2007-03-29
CN100547404C (zh) 2009-10-07
US7355425B2 (en) 2008-04-08
JP4625387B2 (ja) 2011-02-02
US20070063719A1 (en) 2007-03-22
TWI402508B (zh) 2013-07-21
CN1932527A (zh) 2007-03-21

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