TW200740902A - Flame-retardant resin composition, prepreg, resin sheet and molded product using the same - Google Patents

Flame-retardant resin composition, prepreg, resin sheet and molded product using the same

Info

Publication number
TW200740902A
TW200740902A TW096105447A TW96105447A TW200740902A TW 200740902 A TW200740902 A TW 200740902A TW 096105447 A TW096105447 A TW 096105447A TW 96105447 A TW96105447 A TW 96105447A TW 200740902 A TW200740902 A TW 200740902A
Authority
TW
Taiwan
Prior art keywords
flame
resin composition
retardant resin
prepreg
same
Prior art date
Application number
TW096105447A
Other languages
English (en)
Other versions
TWI383018B (zh
Inventor
Hiroharu Inoue
Keiko Kashihara
Kenji Ogasawara
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of TW200740902A publication Critical patent/TW200740902A/zh
Application granted granted Critical
Publication of TWI383018B publication Critical patent/TWI383018B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
TW096105447A 2006-02-23 2007-02-14 耐火性樹脂組成物及其所構成之半固化片、樹脂片及成形物 TWI383018B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006047471A JP2007224162A (ja) 2006-02-23 2006-02-23 難燃性樹脂組成物、プリプレグ、樹脂シート、成形品

Publications (2)

Publication Number Publication Date
TW200740902A true TW200740902A (en) 2007-11-01
TWI383018B TWI383018B (zh) 2013-01-21

Family

ID=38437236

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105447A TWI383018B (zh) 2006-02-23 2007-02-14 耐火性樹脂組成物及其所構成之半固化片、樹脂片及成形物

Country Status (4)

Country Link
US (1) US20100233486A1 (zh)
JP (1) JP2007224162A (zh)
TW (1) TWI383018B (zh)
WO (1) WO2007097196A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739017B (zh) * 2017-07-27 2021-09-11 日商三井金屬鑛業股份有限公司 樹脂組成物、配線板用絕緣層及層合體

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TW200900446A (en) * 2007-06-22 2009-01-01 Advanced Int Multitech Co Ltd Flame resistant prepreg
JP5240758B2 (ja) * 2007-12-12 2013-07-17 株式会社伏見製薬所 難燃性樹脂組成物
JP5233710B2 (ja) 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび金属箔張り積層板
JP2010114118A (ja) * 2008-11-04 2010-05-20 Bridgestone Corp 太陽電池用封止膜、及びこれを用いた太陽電池
JP5427515B2 (ja) * 2009-08-26 2014-02-26 パナソニック株式会社 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
JP5920349B2 (ja) * 2011-06-21 2016-05-18 三菱瓦斯化学株式会社 難燃化された脂環式ポリイミド樹脂組成物およびその薄肉成型体
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9023922B2 (en) 2012-05-24 2015-05-05 Sabic Global Technologies B.V. Flame retardant compositions, articles comprising the same and methods of manufacture thereof
US9018286B2 (en) 2012-05-24 2015-04-28 Sabic Global Technologies B.V. Flame retardant polycarbonate compositions, methods of manufacture thereof and articles comprising the same
JP5793718B2 (ja) * 2013-11-29 2015-10-14 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
JP6506385B2 (ja) * 2015-02-19 2019-04-24 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
JP6896591B2 (ja) * 2017-11-14 2021-06-30 Ｅｎｅｏｓ株式会社 プリプレグ、繊維強化複合材料及び成形体
JP7137950B2 (ja) * 2018-03-28 2022-09-15 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法
JP6919074B2 (ja) * 2019-08-09 2021-08-11 昭和電工株式会社 複合積層体及び、金属―変性ポリフェニレンエーテル接合体
CN111423708B (zh) * 2020-05-06 2023-02-28 信之高新材料(浙江)有限公司 一种改性ppe树脂及其制备方法
CN111592689A (zh) * 2020-06-04 2020-08-28 郑州大学 一种含磷杂菲和联苯结构的环三磷腈阻燃剂、制备工艺及其应用
CN115286880B (zh) * 2022-08-10 2024-04-16 佛山中科吉港科技有限公司 一种硅藻泥木塑墙板及其制备方法
CN119350951A (zh) * 2024-12-24 2025-01-24 大厂金隅涂料有限责任公司 一种用于辐射控制区的防火涂料及其制备方法和应用

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JP2002114981A (ja) * 1997-02-14 2002-04-16 Otsuka Chem Co Ltd 難燃剤、難燃性樹脂組成物及び難燃性樹脂成形体
JPH11181429A (ja) * 1997-02-14 1999-07-06 Otsuka Chem Co Ltd 難燃剤、難燃性樹脂組成物及び難燃性樹脂成形体
ATE378379T1 (de) * 2000-03-21 2007-11-15 Hitachi Chemical Co Ltd Harzzusammensetzung mit exzellentem dielektrischem verhalten, verfahren zur herstellung einer harzzusammensetzung, mit der zusammensetzung hergestellter lack, verfahren zur herstellung des lacks, mit dem lack hergestellte schichtplatten sowie metallbeschichtetes laminat
JP2001329142A (ja) * 2000-05-22 2001-11-27 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2004059777A (ja) * 2002-07-30 2004-02-26 Kyocera Chemical Corp 難燃性接着剤組成物及びフレキシブル銅張積層板とその関連製品
JP2004210849A (ja) * 2002-12-27 2004-07-29 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4503239B2 (ja) * 2003-05-07 2010-07-14 京セラケミカル株式会社 難燃性接着剤組成物、フレキシブル銅張積層板、カバーレイおよび接着フィルム
JP2005015616A (ja) * 2003-06-26 2005-01-20 Kyocera Chemical Corp 積層板用樹脂組成物、有機基材プリプレグ、金属箔張り積層板及びプリント配線板
JP2005120228A (ja) * 2003-10-16 2005-05-12 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
JP2005248147A (ja) * 2004-02-04 2005-09-15 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、印刷配線板
JP2006131743A (ja) * 2004-11-05 2006-05-25 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、プリント配線板
JP2007045916A (ja) * 2005-08-09 2007-02-22 Kyocera Chemical Corp 封止用樹脂組成物および樹脂封止型半導体装置
JP2007081151A (ja) * 2005-09-14 2007-03-29 Kyocera Chemical Corp フレキシブル配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI739017B (zh) * 2017-07-27 2021-09-11 日商三井金屬鑛業股份有限公司 樹脂組成物、配線板用絕緣層及層合體

Also Published As

Publication number Publication date
US20100233486A1 (en) 2010-09-16
TWI383018B (zh) 2013-01-21
JP2007224162A (ja) 2007-09-06
WO2007097196A1 (ja) 2007-08-30

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