TW200746332A - Method of manufacturing a semiconductor device - Google Patents

Method of manufacturing a semiconductor device

Info

Publication number
TW200746332A
TW200746332A TW095145389A TW95145389A TW200746332A TW 200746332 A TW200746332 A TW 200746332A TW 095145389 A TW095145389 A TW 095145389A TW 95145389 A TW95145389 A TW 95145389A TW 200746332 A TW200746332 A TW 200746332A
Authority
TW
Taiwan
Prior art keywords
underfill
substrate
semiconductor chip
chip
hardening
Prior art date
Application number
TW095145389A
Other languages
English (en)
Other versions
TWI332688B (en
Inventor
Norio Kainuma
Hidehiko Kira
Kenji Kobae
Kimio Nakamura
Kuniko Ishikawa
Yukio Ozaki
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of TW200746332A publication Critical patent/TW200746332A/zh
Application granted granted Critical
Publication of TWI332688B publication Critical patent/TWI332688B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H10W72/07233—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW095145389A 2006-05-11 2006-12-06 Method of manufacturing a semiconductor device TWI332688B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006132967A JP2007305799A (ja) 2006-05-11 2006-05-11 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200746332A true TW200746332A (en) 2007-12-16
TWI332688B TWI332688B (en) 2010-11-01

Family

ID=38685634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095145389A TWI332688B (en) 2006-05-11 2006-12-06 Method of manufacturing a semiconductor device

Country Status (4)

Country Link
US (1) US7566586B2 (zh)
JP (1) JP2007305799A (zh)
CN (1) CN101071777B (zh)
TW (1) TWI332688B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9362247B2 (en) 2013-10-08 2016-06-07 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
US9779965B2 (en) 2013-10-08 2017-10-03 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
US9780065B2 (en) 2013-10-08 2017-10-03 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311584A (ja) * 2007-06-18 2008-12-25 Elpida Memory Inc 半導体パッケージの実装構造
US7871860B1 (en) * 2009-11-17 2011-01-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method of semiconductor packaging
CN102315134B (zh) * 2010-07-08 2013-05-01 技鼎股份有限公司 快速升降温覆晶方法
TWI473228B (zh) * 2013-04-24 2015-02-11 矽品精密工業股份有限公司 半導體封裝件之製法
JP6130312B2 (ja) * 2014-02-10 2017-05-17 新光電気工業株式会社 半導体装置及びその製造方法
CN104112684A (zh) * 2014-07-03 2014-10-22 上海交通大学 一种基于镍微针锥的固态超声键合方法
CN104112681A (zh) * 2014-07-03 2014-10-22 上海交通大学 一种基于铜微针锥的固态超声键合方法
CN104112683A (zh) * 2014-07-03 2014-10-22 上海交通大学 一种基于铜微针锥同种结构的固态超声键合方法
CN104134615A (zh) * 2014-07-31 2014-11-05 华进半导体封装先导技术研发中心有限公司 铜铜键合的方法
CN108463891B (zh) 2016-01-20 2020-09-22 歌尔股份有限公司 微发光二极管转移方法及制造方法
CN114637352B (zh) * 2022-03-17 2023-01-03 杭州名光微电子科技有限公司 一种基于机器视觉的芯片制作点胶机在线控制管理系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1067916A (zh) 1991-06-25 1993-01-13 中国科学院西北高原生物研究所 沙棘属植物全果油的提取方法
US6108704A (en) * 1995-09-25 2000-08-22 Netspeak Corporation Point-to-point internet protocol
CA2250817A1 (en) * 1996-04-08 1997-10-16 Zakaryae Fathi Curing liquid resin encapsulants of microelectronics components with microwave energy
JP2870497B2 (ja) * 1996-08-01 1999-03-17 日本電気株式会社 半導体素子の実装方法
JP3367886B2 (ja) * 1998-01-20 2003-01-20 株式会社村田製作所 電子回路装置
US20030001286A1 (en) * 2000-01-28 2003-01-02 Ryoichi Kajiwara Semiconductor package and flip chip bonding method therein
JP3506233B2 (ja) * 2000-06-28 2004-03-15 シャープ株式会社 半導体装置及びその製造方法
JP3491827B2 (ja) * 2000-07-25 2004-01-26 関西日本電気株式会社 半導体装置及びその製造方法
JP2002110715A (ja) * 2000-10-04 2002-04-12 Sony Corp 半導体装置の製造方法
US6518096B2 (en) * 2001-01-08 2003-02-11 Fujitsu Limited Interconnect assembly and Z-connection method for fine pitch substrates
JP4288196B2 (ja) * 2003-03-28 2009-07-01 株式会社タムラ製作所 電子部品の実装装置
JP2004356419A (ja) 2003-05-29 2004-12-16 Nec Electronics Corp 半導体製造装置および半導体装置の製造方法
JP2005026579A (ja) * 2003-07-04 2005-01-27 Fujitsu Ltd ハンダバンプ付き電子部品の実装方法およびこれに用いるフラックスフィル

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9362247B2 (en) 2013-10-08 2016-06-07 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
TWI548012B (zh) * 2013-10-08 2016-09-01 庫利克和索夫工業公司 接合半導體元件的系統及方法
US9633981B2 (en) 2013-10-08 2017-04-25 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
US9779965B2 (en) 2013-10-08 2017-10-03 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
US9780065B2 (en) 2013-10-08 2017-10-03 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
US9905530B2 (en) 2013-10-08 2018-02-27 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
US10297568B2 (en) 2013-10-08 2019-05-21 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements
US10312216B2 (en) 2013-10-08 2019-06-04 Kulicke And Soffa Industries, Inc. Systems and methods for bonding semiconductor elements

Also Published As

Publication number Publication date
JP2007305799A (ja) 2007-11-22
TWI332688B (en) 2010-11-01
US7566586B2 (en) 2009-07-28
CN101071777A (zh) 2007-11-14
US20070264752A1 (en) 2007-11-15
CN101071777B (zh) 2010-05-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees