TW201211121A - Wholly aromatic liquid crystalline polyester resin compound with enhanced electrical insulating property - Google Patents
Wholly aromatic liquid crystalline polyester resin compound with enhanced electrical insulating property Download PDFInfo
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- TW201211121A TW201211121A TW100123872A TW100123872A TW201211121A TW 201211121 A TW201211121 A TW 201211121A TW 100123872 A TW100123872 A TW 100123872A TW 100123872 A TW100123872 A TW 100123872A TW 201211121 A TW201211121 A TW 201211121A
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- Prior art keywords
- wholly aromatic
- aromatic liquid
- inorganic filler
- liquid crystal
- polyester resin
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- 125000003118 aryl group Chemical group 0.000 title claims abstract description 60
- 239000004645 polyester resin Substances 0.000 title claims abstract description 44
- 229920001225 polyester resin Polymers 0.000 title claims abstract description 44
- 150000001875 compounds Chemical class 0.000 title claims abstract description 41
- 239000007788 liquid Substances 0.000 title claims abstract description 7
- 239000011256 inorganic filler Substances 0.000 claims abstract description 34
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 34
- 239000004973 liquid crystal related substance Substances 0.000 claims description 50
- 239000010445 mica Substances 0.000 claims description 15
- 229910052618 mica group Inorganic materials 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000003365 glass fiber Substances 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 4
- 241000587008 Pachyphytum oviferum Species 0.000 claims 1
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000011014 moonstone Substances 0.000 claims 1
- 150000008442 polyphenolic compounds Chemical class 0.000 claims 1
- 235000013824 polyphenols Nutrition 0.000 claims 1
- 239000000463 material Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 239000003381 stabilizer Substances 0.000 description 7
- -1 aromatic diol Chemical class 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000010292 electrical insulation Methods 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 229930182556 Polyacetal Natural products 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 238000012643 polycondensation polymerization Methods 0.000 description 3
- 229920006324 polyoxymethylene Polymers 0.000 description 3
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- RIZUCYSQUWMQLX-UHFFFAOYSA-N 2,3-dimethylbenzoic acid Chemical compound CC1=CC=CC(C(O)=O)=C1C RIZUCYSQUWMQLX-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 244000166124 Eucalyptus globulus Species 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012345 acetylating agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- UKMSUNONTOPOIO-UHFFFAOYSA-M behenate Chemical compound CCCCCCCCCCCCCCCCCCCCCC([O-])=O UKMSUNONTOPOIO-UHFFFAOYSA-M 0.000 description 1
- 229940116224 behenate Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000001175 calcium sulphate Substances 0.000 description 1
- 235000011132 calcium sulphate Nutrition 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001212 derivatisation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- UTOPWMOLSKOLTQ-UHFFFAOYSA-M octacosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O UTOPWMOLSKOLTQ-UHFFFAOYSA-M 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
- C09K19/54—Additives having no specific mesophase characterised by their chemical composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
- C09K19/3804—Polymers with mesogenic groups in the main chain
- C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/006—Other inhomogeneous material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/421—Polyesters
- H01B3/422—Linear saturated polyesters derived from dicarboxylic acids and dihydroxy compounds
- H01B3/423—Linear aromatic polyesters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/47—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes fibre-reinforced plastics, e.g. glass-reinforced plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
- C09K2019/521—Inorganic solid particles
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- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Description
201211121 六、發明說明: 【相關專利申請的互相參照】 7曰申請的韓國專利申請 ’其揭露的全文併入本案 本申請案主張於2010年7月 案第10-2010-0065456號之權益 供參考。 1 【發明所屬之技術領域】 本發明是涉及全芳香族液晶聚醋樹脂化合物,且特別 的是涉及由於包含具有低導的無機填料而具有優異的 電絕緣特性之全料驗晶聚軸脂化合物。 【先前技術】 全芳香族液晶聚g旨樹脂具有優異的耐熱性及尺寸穩定 性Umiens—bUity),以及當溶化時有優異的流動性, 且由於這些躲’其在包含電子零件的廣泛應用範圍中被 用來當作精密射出成型的材料。特別是,由於優異的尺寸 穩定性及魏_性,全衫魏晶糕齡的應用範圍 延伸到用於電子材料的薄膜及用於基板的材料。 /詳細來說,全芳香族液晶聚酯樹脂經形成樹脂化合物 之後,被廣泛地使用在電絕緣特性需求高的電子零件上。 然而,由於習知的樹脂化合物的電絕緣特性不夠高,當其 被使用在例如受高電壓(諸如微波範圍)的電子零件,絕 緣特性被破壞且因此耐電派性(arc resistance)減少,而導 致電子零件被破壞。 【發明内容】 本發明提供一種全芳香族液晶聚酯樹脂化合物,因其 201211121 包含具有低導電性的無機填料,所以有優異的電絕緣特性。 依據本發明之觀點,提供-種全芳香族液晶聚醋樹脂 化合物包含:全芳香族液晶聚賴脂、第―益機填料(表 面電阻率^ <吻或更高),及第二無機填料i表面電 阻率為H) Ω/sq或更高具有比第—無機填料更高的耐执 性USTM腦)及機械強度),其中全芳香族液晶聚醋 樹脂化合物具有3級或更低的耐電弧等級(astmd495) 及250°C或更高的耐熱性(ASTMD648)。 第-無機填料可包含選自於雲母(mica)、滑石⑽) 及矽灰石(wollastonite)所組成族群中的至少一者。 基於100重i伤的全芳香族液晶聚g旨樹脂,第一無機 填料的量可為5重量份到40重量份。 第二無機填料可包含選自於長玻璃纖維、短玻璃纖維 及晶鬚(whisker)所組成族群中的至少一者。 基於100重量份的全芳香族液晶聚醋樹脂,第二無機 填料的量可為5重量份到40重量份。 【實施方式】 依本發明的實施例,將在下文詳細地描述全芳香族液 晶聚醋樹脂化合物及其製備的方法。 依本發明之一實施例,全芳香族液晶聚酯樹脂化合物 包含有全芳香族液晶聚醋樹脂、第一無機填料(表面電阻 率為1013Q/sq或更高)、第二無機填料(表面電阻率為1〇n Ω/sq或更高且具有比第一無機填料更高的耐熱性(ASTM D648)及機械強度)’其中全芳香族液晶聚酯樹脂化合物
S 4 201211121^ 具有3級或更低的耐電弧等級(ASTM D495)及250°C或 更高的耐熱性(ASTMD648)。就此而言,「機械強度」的 用語是指不會因外力而變形的一種特性’舉例來說這樣的 特性為抗拉強度(tensile strength)及撓曲強度(flexural strength)。 —如果第一無機填料及第二無機填料的表面電阻率在上 述範圍内’則第-及第二無機填料具有非導電躲,且因 此包含第-及第二無機填料的全料絲晶聚§|樹脂化合 物具有優制魏緣特性。料,第二無機填料比第一無 機填料有較高_熱性及機械強度,可提供含有第二無機 f料的全芳香錄晶聚_聽合物高耐祕及機械強 又。再者’如果全芳香麵晶聚賴脂化合物具有3級或 更低的耐電弧等級(ASTMD495)及2贼或更高的对熱 =AS:M D648),甚至當全芳香族液晶聚醋樹脂化合物 ㈤電㈣好零件時,全料驗晶聚醋樹脂 化緣特性是持久的,因此狐形放電(ad—) 不會心生,進而防止電子零件被破壞。 全芳香知液晶聚g旨樹脂可經由以下製程方法製備: ⑷使至少兩個單體進行縮聚(condensation polymerization ),以人# 入朴土 ^ Λ σ成全方香族液晶聚酯預聚物 (prepolymer);以及 (b)使物騎_騎,以合成全芳香族液晶聚 酯樹脂。 在製程方法⑷中使用的單體包含選自芳香族二醇 201211121 (aromatic diol)、芳香族二胺(aromatic diamine)、芳香族 羥胺(aromatic hydroxylamine)及芳香族二繞酸(ar〇matic dicarboxylicacid)所組成族群中的至少一化合物。此外,單 體可再包含芳香族羥基羧酸(aromatic hydroxy carboxylic add)及/或芳香族胺基羧酸(aromatic amin〇 carb〇xylic acid )。 在製程方法(a)中使用的合成方法可以是溶液縮聚 (solution condensation polymerization)或是整體縮聚(bulk condensation polymerization)。此外,在製程方法⑻中,可 藉由使用以化學材料預先處理使其反應性增加之 酿化單體)而讓縮合反應加速,上述化學㈣諸如酿化劑 (特別是乙醯化劑)。 在製程方法(b)中進行固相縮聚,需要適當地加熱預聚 ,,加熱料的舉例可叹❹加熱㈣綠、使用熱空 氣的方法、使用高溫流體的方法。在固相縮聚過程中產生 的副產,可由惰性氣體沖洗或是利用真空來移除。 全芳香魏晶㈣概在鏈段(ehain) 複單元,以下為重複單元的舉例: 7有多種重 (1) 衍生自芳香族二醇的重複單元: -〇-Ar-〇- (2) 衍生自芳香族二胺的重複單元: -HN-Ar-NH- (3) 衍生自芳香族羥胺的重複單元: -HN-Ar-〇-
S 6 201211121 (4) 衍生自芳香族二羧酸的重複單元: -OC-Ar-CO- (5) 衍生自芳香族羥基羧酸的重複單元: -O-Ar-CO- (6)衍生自芳香族胺基叛酸的重複單元: -HN-Ar-CO- 在上述定義的化學式中,Ar可以是伸苯基 (Phenylene )、伸聯苯基(biPhenylene )、萘(naphthalene)、 其中兩個伸苯基經由碳或非碳元素彼此鍵結的芳香族化合 物本或是選自於伸苯基、伸聯苯基、萘、或經由碳或非^ 兀素彼此鍵結的兩個伸苯基所喊族群t的料族化合物 且其中至少一個氫原子被其他元素取代。 "Ϊ —無機填料可包含選自雲母、滑石及魏石所組成 杈群中的至少一者。 旦/讀的全芳香族液晶聚酯樹脂,第一無機 的1為5重量份到4G重量份。如果第—無機填料的量 範關’可實質上改進全料族液晶雜樹脂 物的電絕緣特性。 第一無機填料可包合選自長玻璃纖維、短玻璃纖維及 晶鬚所組成族群中的至少一者。 填料份的全芳香族液晶聚醋樹脂,第二無機 穴:到4°重量份。如果第二無機填料的量 ,則可提供第—無機填料所不能充分提供的 耐熱性及機_度給全料麵晶㈣触化合物,且同 201211121 時使全芳香族液晶聚酯樹脂化合物的電絕緣特性可以 在高的水準。 王芳香族液晶聚酯樹脂化合物可更包含穩定劑當作 是添加劑,穩定劑可包含選自褐煤酸鈣(ca][ciuni montanate,Ca-MON)、二十二酸鈣(caicium behenate, Ca-BEH)及硬脂酸辦(caicium stearate,ca_sT)所組成 族群中的至少一者。 ' 為了 I備王方香無液晶聚S旨樹脂化合物,基於1 〇〇重 里伤的全方香族液晶聚酯樹脂,混合5重量份到4〇重量份 的第一無機填料及5重量份到40重量份的第二無機填料來 製備樹脂組成物,將樹脂組成物乾燥且然後進行熔融揉合 (melt-kneaded)。 ° 溶融揉合可使用雙螺桿壓出機(twin_screw extruder)、批式捏合機(batch type kneader)或混合輥 (mixingroll)。此外,在熔融揉合過程中也可使用潤滑劑 (lubricant),以順利地進行熔融揉合。 此外,全芳香族液晶聚酯樹脂化合物可更包含上述的 穩定劑,以在熔融揉合後可提升所製備的全芳香族液晶聚 酯樹脂化合物的射出成型穩定性及量測特性。 在熔融揉合之後或穩定劑加入之後,充份混合全芳香 族液晶聚酯樹脂化合物,以均勻地熔化熔合第一及第二無 機填料以及穩定劑,其中穩定劑被當作是在含有添加物的 全芳香族液晶聚酯樹脂化合物表面上的添加物,然後混合
S 8 201211121 物在等於或高於添加物熔點的溫度下進行乾燥2個小時以 上。 此外,本發明之實施例提供變壓器的零件,其含有全 芳香無液晶聚酯樹脂化合物,且此零件的例子為絕緣薄膜 (insulating film)。 以下,本發明更詳細描述實例。然而,本發明並不限 制於這些實例。 實例 實例1 (1) 全芳香族液晶聚酯樹脂的選擇 使用二星精密化學株式會社(Samsung Fine chemicals Co.,Ltd.)製造的KF級(KF-grade)全芳香族液晶聚酯樹 脂。使用示差掃描熱量測定儀(differential scanning calorimeter)測量樹脂的溶點為35〇。(:。 (2) 全芳香族液晶聚酯樹脂化合物(丨)的製備 將上述(1)中所選擇之全芳香族液晶聚酯樹脂、雲母 (表面電阻率為 l〇13Q/sq) (D〇ngYangMaterialsIndustrial
Co·,Ltd. ’雲母#4〇〇)及短玻璃纖維(表面電阻率為ι〇η Ω/sq) (Sungjin Fiber Co” Ltd.,MF150W-NT)以 6:1:3 的 重量比加入自動攪拌器(由Jeil Industry Device c〇.,Ltd. 製造),接著混合20分鐘,使用方形乾燥箱(JdlIndustry
Device Co.,Ltd.)使其在130°C下乾燥2小時,使用雙螺桿 壓出機(L/D : 40 ’ 直徑:25mm) (Collin Company)進行 201211121 熔融揉合,而製備成全芳香族液晶聚酯樹脂彳匕合物(丨)。此 外’在熔融揉合時’使雙螺桿壓出機成真空來去除副產物。 (3)加入穩定劑至全芳香族液晶聚酯樹脂化合物(1) 基於全芳香族液晶聚酯樹脂化合物(丨)的重量,1〇〇 ppm的Ca-ST被加入至上述(2)中所製備的全芳香族液晶聚 酯樹脂化合物(1) ’然後藉由自動攪拌器(Jeil Industry Device Co.,Ltd)攪拌混合物ι0分鐘,並藉由使用方形乾 燥箱(Jeil Industry Device Co.,Ltd)在 13〇t:下乾燥 2 小 時。 實例2 除了在實例1之(1)中所選擇的全芳香族液晶聚酯樹 脂、雲母(表面電阻率為 l〇13Q/Sq) (D〇ngYang Materials Industrial Co.,Ltd.,雲母#4〇〇)及短玻璃纖維(表面電阻 率為 10 Ω/sq) ( Sungjin Fiber Co” Ltd·,MF150W-NT )的 混合重量比為6:2:2之外,以與實例丨相同方式來製備全 方香族液晶聚醋樹脂化合物(2)。 實例3 除了在實例1之(1)中所選擇的全芳香族液晶聚酯樹 脂、雲母(表面電阻率為 1013 Ω/sq) (Dong Yang Materials Industrial Co.,Ltd. ’雲母#400)及短玻璃纖維(表面電阻 率為 1013Q/sq)(SungjinFiberCo.,Ltd·,MF150W-NT)的 混合重量比為6:3:1之外,以與實例1相同方式來製備全 芳香族液晶聚酯樹脂化合物(3)。 比較實例1 201211121 除了在實例1之(1)中所選擇的全芳香族液晶聚酯樹 脂、雲母(表面電阻率為 1〇13 Ω/sq) ( Dong Yang Materials Industrial Co.,Ltd.,雲母#4〇〇)及短玻璃纖維(表面電阻 率為 1013Q/sq) (SungjinFiberCo·, Ltd.,MF150W-NT)的 混合重量比為6:1:0 (亦即未使用短玻璃纖維)之外,以與 實例1相同方式來製備全芳香族液晶聚酯樹脂化合物(4)。 比較實例2 除了在實例1之(1)中所選擇的全芳香族液晶聚酯樹 月曰、雲母(表面電阻率為l〇13D/Sq) (DongYang Materials Industrial Co” Ltd.,雲母#4〇〇)及短玻璃纖維(表面電阻 率為 10 Ω/sq) (SungjinFiberCo.,Ltd.,MF150W-NT)的 混合重量比為6:0:3 (亦即未使用雲母)之外,以與實例1 相同方式來製備全芳香族液晶聚酯樹脂化合物(5)。 §平估實例 依貫例1到實例3及比較實例1到比較實例2所製備 作為押出原料的全芳香族液晶聚酯樹脂化合物(1)到(5)的 樣本’其是藉由使用注射壓出機(injecti〇n extnjder ) (FANUCR〇B〇SHOT2000i-50B)在料筒溫度為 380°C、 外模/ja度為120C、擠出速度為i5〇mm/s及冷卻時間為 秒,製備出大小為長50 mmx寬50 mmx厚3 mm的樣本。 (耐熱性的測量) 每一樣本的耐熱性是依ASTMD648測量。 (耐電弧性(電絕緣特性)的測量) 11 201211121 每一樣本的耐電弧性是依ASTM D495測量。耐電弧 等級越小,則耐電弧性越高。 (抗拉強度的測量) 每一樣本的抗拉強度是依ASTMD638測量。 (撓曲強度的測量) 每一樣本的撓曲強度是依ASTMD790測量。 【表一】 實例1 實例2 實例3 比較實例1 比較實例2 耐熱性(°c) 299 293 290 254 310 耐電弧性(級) 3 3 3 2 5 抗拉強度(MPa) 126 125 118 105 129 撓曲強度(MPa) 168 165 157 142 172 參照表一,依實例1到實例3製備的全芳香族液晶聚 酯樹脂化合物(1)到(3)具有較高的耐熱性、耐電弧性、抗拉 強度、撓㈣度。因此’證實上述全芳魏液晶聚酯樹脂 化合物適合作為需要優異的耐電弧性(電絕緣特性)及機 械特,的高電壓電子零件材料。然、而,依比較實例i製備 的王芳香族液晶聚酯樹脂化合物(4)具有較高的耐熱性、耐 ,弧性及比較低的抗拉強度、撓曲強度。因此,證實此全 方香族液晶聚賴魏合物(4)不適合料需要優異的機 械特性的高電壓電子零件材料。
S 12 201211121 二=實+例2製備的全芳香族液晶聚醋樹脂化 ==因T 、抗拉強度、撓曲強度及非常低 (5)不適合作為必然需要有優匕二物 零件材料。 3熳異的耐電弧性的高電壓電子 依本發明的實施例所製 化合物具有優異的電絕緣牲μ仏方㈣H1曰樹月曰 由於其中包含具有低導電性:而十::生及機械強度,這是 機填料。㈣if愤性及高機械強度的無 電壓電子料的材料。^日料触化合物適合作為高 雖然本發明是特別以參 f,:=貝域中的具有通常技術者將理解t= 叙,太菸昍张劳… 在形式上及細節上皆可作多種更 X I疋之保護範圍視以下申請專 【圖示簡單說明】 Y貢寻和範圍而疋。 無 【主要元件符號說明】 無 13
Claims (1)
- 201211121 七、申請專利範園 L —種全芳香族液晶聚酯樹脂化合物’包含: 全芳香族液晶聚酯樹脂; 第一無機填料,具有I0i3n/Sq或更高的表面電 以及 且率; ,二無機填料,具有1013Q/sq或更高的表面電卩且 及比第一無機填料有更高的耐熱性(ASTMD648)及她'’ 強度, 久瑪:械 其中全芳香族液晶聚酯樹脂化合物具有3級或 耐電弧等級(ASTM D495),及250〇c或更高 (ASTMD648)。 的耐熱性 2. 如申請專利範圍第!項所述之全芳香族液 樹脂化合物,其中所述第一無機填料包含選自雲母、^曰 及石夕灰石所組成之族群中的至少一者。 /月石 3. 如申請專利範圍第i項所述之全芳香族液 樹脂化合物,其令基於100重量份的所述全芳香族;^ 酯樹脂,所述第一無機填料的量為5重量份到4〇重曰^ /人t申2利範圍第1項所述之全芳香族液晶聚醋刀樹 脂化a物’其巾所述第二無機填料包含選自長玻璃、 短玻璃纖維及晶鬚所組成之族群中的至少一者。、 ηί:範圍第1項所述之全芳香族液晶聚醋樹 樹脂,所述第二無機填料的量為5重量份到 6.-種變壓器的零件,其包括 :里伤 至第5項中任-項所述之全芳香族液=項 201211121“ 四、 指定代表圖: (一) 本案之指定代表圖:無 (二) 本代表圖之元件符號簡單說明:無 五、 本案若有化學式時,請揭示最能顯示發明特徵 的化學式: 益 S 2
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| TW100123872A TWI513750B (zh) | 2010-07-07 | 2011-07-06 | 具有增進電絕緣特性的全芳香族液晶聚酯樹脂化合物 |
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| US (1) | US8894880B2 (zh) |
| EP (1) | EP2592630B1 (zh) |
| JP (1) | JP5934199B2 (zh) |
| KR (1) | KR20120004782A (zh) |
| CN (1) | CN102971804B (zh) |
| TW (1) | TWI513750B (zh) |
| WO (1) | WO2012005452A2 (zh) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105542408A (zh) * | 2015-12-29 | 2016-05-04 | 江苏沃特特种材料制造有限公司 | 改性全芳香族液晶聚酯树脂复合物及其制备方法 |
| CN105602210B (zh) * | 2015-12-29 | 2018-07-10 | 江苏沃特特种材料制造有限公司 | 轻质液晶聚酯树脂复合物及其制备方法 |
| US11637365B2 (en) | 2019-08-21 | 2023-04-25 | Ticona Llc | Polymer composition for use in an antenna system |
| US11258184B2 (en) | 2019-08-21 | 2022-02-22 | Ticona Llc | Antenna system including a polymer composition having a low dissipation factor |
| US11912817B2 (en) | 2019-09-10 | 2024-02-27 | Ticona Llc | Polymer composition for laser direct structuring |
| US11555113B2 (en) | 2019-09-10 | 2023-01-17 | Ticona Llc | Liquid crystalline polymer composition |
| US12294185B2 (en) | 2019-09-10 | 2025-05-06 | Ticona Llc | Electrical connector formed from a polymer composition having a low dielectric constant and dissipation factor |
| US12209164B2 (en) | 2019-09-10 | 2025-01-28 | Ticona Llc | Polymer composition and film for use in 5G applications |
| US12142820B2 (en) | 2019-09-10 | 2024-11-12 | Ticona Llc | 5G system containing a polymer composition |
| US11646760B2 (en) | 2019-09-23 | 2023-05-09 | Ticona Llc | RF filter for use at 5G frequencies |
| US11917753B2 (en) | 2019-09-23 | 2024-02-27 | Ticona Llc | Circuit board for use at 5G frequencies |
| US11721888B2 (en) | 2019-11-11 | 2023-08-08 | Ticona Llc | Antenna cover including a polymer composition having a low dielectric constant and dissipation factor |
Family Cites Families (21)
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| JP2884362B2 (ja) * | 1990-04-20 | 1999-04-19 | 日本石油化学株式会社 | 電磁調理器用調理台 |
| JPH04213354A (ja) * | 1990-11-29 | 1992-08-04 | Toray Ind Inc | 液晶ポリエステル樹脂組成物 |
| JP3387766B2 (ja) * | 1997-02-03 | 2003-03-17 | 住友化学工業株式会社 | 液晶ポリエステル樹脂組成物 |
| DE69717433T2 (de) | 1997-02-14 | 2003-07-17 | Mitsubishi Denki K.K., Tokio/Tokyo | Polyesterharzzusammensetzung, daraus hergestellte schalter, und verfahren zur herstellung |
| JP3633199B2 (ja) | 1997-04-21 | 2005-03-30 | 三菱エンジニアリングプラスチックス株式会社 | ポリエステル樹脂組成物 |
| JP3697087B2 (ja) | 1998-10-20 | 2005-09-21 | 株式会社カネカ | 強化難燃性ポリエステル樹脂組成物 |
| TWI256959B (en) | 2000-07-31 | 2006-06-21 | Sumitomo Chemical Co | Aromatic liquid-crystalline polyester solution composition |
| JP4798856B2 (ja) * | 2001-02-23 | 2011-10-19 | 上野製薬株式会社 | 流動性が改良された全芳香族耐熱液晶ポリエステル樹脂組成物 |
| JP2003171538A (ja) * | 2001-12-07 | 2003-06-20 | Dainippon Ink & Chem Inc | 液晶ポリエステル樹脂組成物 |
| JP4169322B2 (ja) * | 2002-06-25 | 2008-10-22 | 新日本石油株式会社 | 全芳香族液晶ポリエステル樹脂成形体 |
| CN1694941A (zh) * | 2002-09-03 | 2005-11-09 | 索尔维先进聚合物有限责任公司 | 导热液晶聚合物组合物及其制品 |
| JP4463637B2 (ja) * | 2004-07-30 | 2010-05-19 | ポリプラスチックス株式会社 | 液晶性ポリエステル樹脂組成物 |
| JP2007254717A (ja) * | 2006-02-27 | 2007-10-04 | Toray Ind Inc | 液晶性樹脂組成物およびそれからなる成形品 |
| US20080061919A1 (en) * | 2006-03-22 | 2008-03-13 | Marek Richard P | Insulators for transformers |
| JP5280669B2 (ja) * | 2006-12-08 | 2013-09-04 | 帝人株式会社 | 難燃性ポリカーボネート樹脂組成物 |
| CN101205345B (zh) * | 2006-12-19 | 2010-11-10 | 东丽纤维研究所(中国)有限公司 | 一种abs组合物用相容剂及含有这种相容剂的abs组合物 |
| JP5325442B2 (ja) * | 2008-03-28 | 2013-10-23 | Jx日鉱日石エネルギー株式会社 | カメラモジュール用液晶ポリエステル樹脂組成物 |
| JP5308800B2 (ja) * | 2008-12-09 | 2013-10-09 | Jx日鉱日石エネルギー株式会社 | 液晶ポリエステル樹脂組成物 |
| KR20120009705A (ko) * | 2010-07-20 | 2012-02-02 | 삼성정밀화학 주식회사 | 방향족 액정 폴리에스테르 수지의 제조방법 및 방향족 액정 폴리에스테르 수지 컴파운드의 제조방법 |
| KR20120052647A (ko) * | 2010-11-16 | 2012-05-24 | 삼성정밀화학 주식회사 | 유동성이 향상된 전방향족 액정 폴리에스테르 수지 컴파운드 |
| JP5730704B2 (ja) * | 2011-07-27 | 2015-06-10 | 上野製薬株式会社 | 液晶ポリマー組成物 |
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- 2011-06-14 US US13/808,883 patent/US8894880B2/en active Active
- 2011-06-14 WO PCT/KR2011/004324 patent/WO2012005452A2/ko not_active Ceased
- 2011-06-14 CN CN201180033504.8A patent/CN102971804B/zh active Active
- 2011-06-14 EP EP11803738.1A patent/EP2592630B1/en active Active
- 2011-07-06 TW TW100123872A patent/TWI513750B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012005452A2 (ko) | 2012-01-12 |
| TWI513750B (zh) | 2015-12-21 |
| US20130112917A1 (en) | 2013-05-09 |
| CN102971804A (zh) | 2013-03-13 |
| EP2592630A4 (en) | 2017-01-18 |
| CN102971804B (zh) | 2015-06-03 |
| JP5934199B2 (ja) | 2016-06-15 |
| EP2592630B1 (en) | 2019-08-21 |
| JP2013530291A (ja) | 2013-07-25 |
| WO2012005452A3 (ko) | 2012-05-03 |
| EP2592630A2 (en) | 2013-05-15 |
| US8894880B2 (en) | 2014-11-25 |
| KR20120004782A (ko) | 2012-01-13 |
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