TW201833214A - 環氧樹脂組成物 - Google Patents

環氧樹脂組成物 Download PDF

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Publication number
TW201833214A
TW201833214A TW107100958A TW107100958A TW201833214A TW 201833214 A TW201833214 A TW 201833214A TW 107100958 A TW107100958 A TW 107100958A TW 107100958 A TW107100958 A TW 107100958A TW 201833214 A TW201833214 A TW 201833214A
Authority
TW
Taiwan
Prior art keywords
group
ring
formula
atom
carbon atoms
Prior art date
Application number
TW107100958A
Other languages
English (en)
Chinese (zh)
Inventor
福田矩章
針崎良太
山本勝政
Original Assignee
日商住友精化股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友精化股份有限公司 filed Critical 日商住友精化股份有限公司
Publication of TW201833214A publication Critical patent/TW201833214A/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW107100958A 2017-01-10 2018-01-10 環氧樹脂組成物 TW201833214A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-002212 2017-01-10
JP2017002212 2017-01-10

Publications (1)

Publication Number Publication Date
TW201833214A true TW201833214A (zh) 2018-09-16

Family

ID=62840049

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107100958A TW201833214A (zh) 2017-01-10 2018-01-10 環氧樹脂組成物

Country Status (3)

Country Link
JP (1) JP6987791B2 (ja)
TW (1) TW201833214A (ja)
WO (1) WO2018131564A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102534679B1 (ko) 2015-07-10 2023-05-19 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물, 그 제조 방법 및 해당 조성물의 용도
EP3569654B1 (en) 2017-01-10 2023-08-23 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition
KR102459583B1 (ko) 2017-01-10 2022-10-28 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
KR102512801B1 (ko) 2017-01-10 2023-03-23 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
JP6530574B2 (ja) 2017-01-10 2019-06-12 住友精化株式会社 エポキシ樹脂組成物
WO2019026822A1 (ja) * 2017-07-31 2019-02-07 住友精化株式会社 エポキシ樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL130557C (ja) * 1966-03-02
DE10001228B4 (de) * 2000-01-13 2007-01-04 3M Espe Ag Polymerisierbare Zubereitungen auf der Basis von siliziumhaltigen Epoxiden
DE10107985C1 (de) * 2001-02-19 2002-04-18 3M Espe Ag Polymerisierbare Zubereitungen auf der Basis von Siliziumverbindungen mit aliphatischen und cycloaliphatischen Epoxidgruppen und deren Verwendung
CA2573403A1 (en) * 2004-07-14 2006-01-19 3M Espe Ag Dental composition containing an epoxy functional carbosilane compound
JP5310656B2 (ja) * 2010-06-18 2013-10-09 信越化学工業株式会社 シルフェニレン含有光硬化性組成物、それを用いたパターン形成方法およびその方法により得られる光半導体素子
WO2013140601A1 (ja) * 2012-03-23 2013-09-26 株式会社Adeka ケイ素含有硬化性樹脂組成物
KR102534679B1 (ko) * 2015-07-10 2023-05-19 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물, 그 제조 방법 및 해당 조성물의 용도
EP3378897B1 (en) * 2015-11-18 2020-08-05 Sumitomo Seika Chemicals CO. LTD. Epoxy resin composition, method for producing same, and use of composition

Also Published As

Publication number Publication date
WO2018131564A1 (ja) 2018-07-19
JPWO2018131564A1 (ja) 2019-11-07
JP6987791B2 (ja) 2022-01-05

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