TW201833214A - 環氧樹脂組成物 - Google Patents
環氧樹脂組成物 Download PDFInfo
- Publication number
- TW201833214A TW201833214A TW107100958A TW107100958A TW201833214A TW 201833214 A TW201833214 A TW 201833214A TW 107100958 A TW107100958 A TW 107100958A TW 107100958 A TW107100958 A TW 107100958A TW 201833214 A TW201833214 A TW 201833214A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- ring
- formula
- atom
- carbon atoms
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-002212 | 2017-01-10 | ||
| JP2017002212 | 2017-01-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201833214A true TW201833214A (zh) | 2018-09-16 |
Family
ID=62840049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107100958A TW201833214A (zh) | 2017-01-10 | 2018-01-10 | 環氧樹脂組成物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6987791B2 (ja) |
| TW (1) | TW201833214A (ja) |
| WO (1) | WO2018131564A1 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102534679B1 (ko) | 2015-07-10 | 2023-05-19 | 스미토모 세이카 가부시키가이샤 | 에폭시 수지 조성물, 그 제조 방법 및 해당 조성물의 용도 |
| EP3569654B1 (en) | 2017-01-10 | 2023-08-23 | Sumitomo Seika Chemicals Co., Ltd. | Epoxy resin composition |
| KR102459583B1 (ko) | 2017-01-10 | 2022-10-28 | 스미토모 세이카 가부시키가이샤 | 에폭시 수지 조성물 |
| KR102512801B1 (ko) | 2017-01-10 | 2023-03-23 | 스미토모 세이카 가부시키가이샤 | 에폭시 수지 조성물 |
| JP6530574B2 (ja) | 2017-01-10 | 2019-06-12 | 住友精化株式会社 | エポキシ樹脂組成物 |
| WO2019026822A1 (ja) * | 2017-07-31 | 2019-02-07 | 住友精化株式会社 | エポキシ樹脂組成物 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL130557C (ja) * | 1966-03-02 | |||
| DE10001228B4 (de) * | 2000-01-13 | 2007-01-04 | 3M Espe Ag | Polymerisierbare Zubereitungen auf der Basis von siliziumhaltigen Epoxiden |
| DE10107985C1 (de) * | 2001-02-19 | 2002-04-18 | 3M Espe Ag | Polymerisierbare Zubereitungen auf der Basis von Siliziumverbindungen mit aliphatischen und cycloaliphatischen Epoxidgruppen und deren Verwendung |
| CA2573403A1 (en) * | 2004-07-14 | 2006-01-19 | 3M Espe Ag | Dental composition containing an epoxy functional carbosilane compound |
| JP5310656B2 (ja) * | 2010-06-18 | 2013-10-09 | 信越化学工業株式会社 | シルフェニレン含有光硬化性組成物、それを用いたパターン形成方法およびその方法により得られる光半導体素子 |
| WO2013140601A1 (ja) * | 2012-03-23 | 2013-09-26 | 株式会社Adeka | ケイ素含有硬化性樹脂組成物 |
| KR102534679B1 (ko) * | 2015-07-10 | 2023-05-19 | 스미토모 세이카 가부시키가이샤 | 에폭시 수지 조성물, 그 제조 방법 및 해당 조성물의 용도 |
| EP3378897B1 (en) * | 2015-11-18 | 2020-08-05 | Sumitomo Seika Chemicals CO. LTD. | Epoxy resin composition, method for producing same, and use of composition |
-
2018
- 2018-01-09 JP JP2018561362A patent/JP6987791B2/ja not_active Expired - Fee Related
- 2018-01-09 WO PCT/JP2018/000193 patent/WO2018131564A1/ja not_active Ceased
- 2018-01-10 TW TW107100958A patent/TW201833214A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018131564A1 (ja) | 2018-07-19 |
| JPWO2018131564A1 (ja) | 2019-11-07 |
| JP6987791B2 (ja) | 2022-01-05 |
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