TW367621B - Electronic component comprising a thin-film structure with passive elements - Google Patents
Electronic component comprising a thin-film structure with passive elementsInfo
- Publication number
- TW367621B TW367621B TW084104429A TW84104429A TW367621B TW 367621 B TW367621 B TW 367621B TW 084104429 A TW084104429 A TW 084104429A TW 84104429 A TW84104429 A TW 84104429A TW 367621 B TW367621 B TW 367621B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- thin
- resistor
- electronic component
- film structure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
- H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Integrated Circuits (AREA)
- Non-Adjustable Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP95200477 | 1995-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW367621B true TW367621B (en) | 1999-08-21 |
Family
ID=8220049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084104429A TW367621B (en) | 1995-02-27 | 1995-05-03 | Electronic component comprising a thin-film structure with passive elements |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5731747A (zh) |
| EP (1) | EP0757846B1 (zh) |
| JP (1) | JP4097694B2 (zh) |
| KR (1) | KR100395182B1 (zh) |
| CN (1) | CN1084050C (zh) |
| DE (1) | DE69616687T2 (zh) |
| TW (1) | TW367621B (zh) |
| WO (1) | WO1996027210A2 (zh) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9706154D0 (en) * | 1997-03-25 | 1997-05-14 | Philips Electronics Nv | Circuit simulator |
| US6285542B1 (en) * | 1999-04-16 | 2001-09-04 | Avx Corporation | Ultra-small resistor-capacitor thin film network for inverted mounting to a surface |
| EP1177622B1 (en) * | 2000-02-15 | 2011-11-09 | Nxp B.V. | Electronic device |
| DE10035584A1 (de) * | 2000-07-21 | 2002-01-31 | Philips Corp Intellectual Pty | Mobilfunkgerät |
| DE10039710B4 (de) * | 2000-08-14 | 2017-06-22 | United Monolithic Semiconductors Gmbh | Verfahren zur Herstellung passiver Bauelemente auf einem Halbleitersubstrat |
| US7535079B2 (en) * | 2005-06-09 | 2009-05-19 | Freescale Semiconductor, Inc. | Semiconductor device comprising passive components |
| US6919244B1 (en) | 2004-03-10 | 2005-07-19 | Motorola, Inc. | Method of making a semiconductor device, and semiconductor device made thereby |
| US7382627B2 (en) | 2004-10-18 | 2008-06-03 | E.I. Du Pont De Nemours And Company | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof |
| US7436678B2 (en) * | 2004-10-18 | 2008-10-14 | E.I. Du Pont De Nemours And Company | Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof |
| US7430128B2 (en) * | 2004-10-18 | 2008-09-30 | E.I. Du Pont De Nemours And Company | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof |
| US20060286696A1 (en) * | 2005-06-21 | 2006-12-21 | Peiffer Joel S | Passive electrical article |
| KR101593631B1 (ko) * | 2014-01-24 | 2016-02-12 | 광운대학교 산학협력단 | 발광 소자 패키지 및 그 제조 방법 |
| DE102016122923A1 (de) * | 2016-11-28 | 2018-05-30 | Karl-Alfred Schwarz | Modul zur passiven Flächenüberwachung |
| US12213243B2 (en) * | 2021-04-27 | 2025-01-28 | KYOCERA AVX Components Corporation | Transmission line capacitor and circuit board including the same embedded within |
| US12597567B2 (en) * | 2022-10-21 | 2026-04-07 | KYOCERA AVX Components Corporation | Single layer capacitor |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3569872A (en) * | 1968-11-27 | 1971-03-09 | Vitramon Inc | Electronic component |
| US3868587A (en) * | 1971-10-19 | 1975-02-25 | Amos Nathan | Constant phase distributed impedance |
| US4342143A (en) * | 1974-02-04 | 1982-08-03 | Jennings Thomas A | Method of making multiple electrical components in integrated microminiature form |
| US4410867A (en) * | 1978-12-28 | 1983-10-18 | Western Electric Company, Inc. | Alpha tantalum thin film circuit device |
| DE2903025C2 (de) * | 1979-01-26 | 1983-05-05 | Siemens AG, 1000 Berlin und 8000 München | RC-Netzwerk |
| US4410847A (en) * | 1982-09-20 | 1983-10-18 | Brunswick Corporation | Voltage regulator |
| GB2136235B (en) * | 1983-02-22 | 1986-07-09 | Philips Electronic Associated | Rc active filter device |
| JPS609220U (ja) * | 1983-06-28 | 1985-01-22 | 株式会社村田製作所 | Lc複合部品 |
| JPH0583017A (ja) * | 1991-09-24 | 1993-04-02 | Mitsubishi Electric Corp | マイクロ波集積回路装置 |
-
1995
- 1995-05-03 TW TW084104429A patent/TW367621B/zh not_active IP Right Cessation
-
1996
- 1996-02-15 DE DE69616687T patent/DE69616687T2/de not_active Expired - Lifetime
- 1996-02-15 CN CN96190301A patent/CN1084050C/zh not_active Expired - Fee Related
- 1996-02-15 EP EP96901462A patent/EP0757846B1/en not_active Expired - Lifetime
- 1996-02-15 JP JP52611996A patent/JP4097694B2/ja not_active Expired - Fee Related
- 1996-02-15 WO PCT/IB1996/000116 patent/WO1996027210A2/en not_active Ceased
- 1996-02-15 KR KR1019960706122A patent/KR100395182B1/ko not_active Expired - Fee Related
- 1996-02-23 US US08/606,324 patent/US5731747A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0757846A1 (en) | 1997-02-12 |
| JP4097694B2 (ja) | 2008-06-11 |
| WO1996027210A3 (en) | 1996-10-31 |
| JPH09512669A (ja) | 1997-12-16 |
| CN1084050C (zh) | 2002-05-01 |
| DE69616687D1 (de) | 2001-12-13 |
| US5731747A (en) | 1998-03-24 |
| KR970703047A (ko) | 1997-06-10 |
| KR100395182B1 (ko) | 2003-12-18 |
| EP0757846B1 (en) | 2001-11-07 |
| WO1996027210A2 (en) | 1996-09-06 |
| CN1149930A (zh) | 1997-05-14 |
| DE69616687T2 (de) | 2002-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |