TWI255232B - Nozzle plate and manufacturing method of same - Google Patents

Nozzle plate and manufacturing method of same Download PDF

Info

Publication number
TWI255232B
TWI255232B TW93125877A TW93125877A TWI255232B TW I255232 B TWI255232 B TW I255232B TW 93125877 A TW93125877 A TW 93125877A TW 93125877 A TW93125877 A TW 93125877A TW I255232 B TWI255232 B TW I255232B
Authority
TW
Taiwan
Prior art keywords
nozzle
layer
hole
electrode layer
electrode
Prior art date
Application number
TW93125877A
Other languages
Chinese (zh)
Other versions
TW200523123A (en
Inventor
Haruhiko Deguchi
Hidetsugu Kawai
Shigeru Nishio
Shigeaki Kakiwaki
Kazuhiro Murata
Original Assignee
Sharp Kk
Nat Inst Of Advanced Ind Scien
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk, Nat Inst Of Advanced Ind Scien filed Critical Sharp Kk
Publication of TW200523123A publication Critical patent/TW200523123A/en
Application granted granted Critical
Publication of TWI255232B publication Critical patent/TWI255232B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1637Manufacturing processes molding
    • B41J2/1639Manufacturing processes molding sacrificial molding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/1433Structure of nozzle plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/162Manufacturing of the nozzle plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1628Manufacturing processes etching dry etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1629Manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1642Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1643Manufacturing processes thin film formation thin film formation by plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1645Manufacturing processes thin film formation thin film formation by spincoating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1646Manufacturing processes thin film formation thin film formation by sputtering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14475Structure thereof only for on-demand ink jet heads characterised by nozzle shapes or number of orifices per chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

A nozzle plate (8) has a first nozzle layer (1) and a second nozzle layer (2). The first nozzle layer (1) has a first nozzle hole (11a), and is provided on the fluid discharge side and thin. The second nozzle layer (2) is layered on the fluid supply side of the first nozzle layer (1) and thicker than the first nozzle layer (1), and has a second nozzle hole (11b) communicating with the first nozzle hole (11a) and forming a nozzle hole (11) together with the first nozzle hole (11a). A first electrode layer (25) formed on the inner wall of the first nozzle hole (11a) and a second electrode layer (26) formed on the inner wall of the second nozzle hole (11b) are electrically connected. A nozzle plate suitable for electrostatic suction-type fluid discharge device discharging an ultra-micro amount of fluid is provided. In the nozzle plate, an electrode is stably formed in the vicinity of a nozzle head portion, nozzle holes are easily made to be electrically independent from each other, and a drive signal for the electrode formed in the nozzle hole can be applied from the fluid supply side of the nozzle plate.

Description

1255232 九、發明說明: 【發明所屬之技術領域】 “本發明係關於一種用於排出墨等流體之流體排出碩之噴 鳴式平板’進一步詳細而言,係關於用於使流體帶電,二 由靜電吸引,排出流濟$料务 9 至對象物上之靜電吸引型流體排出 衣置之噴嘴式平板。 【先前技術】 一“| ’有各種將墨等流體(排出材料)排至對象物(纪 錄媒體)上之流體喷射方式。此處係、說明使用墨作為流體^ 喷墨方式。 應求型(On demand type)噴墨方式開發出:利用壓電現象 之壓電方式,㈣墨之膜沸騰現象之熱方式,及利用靜電 現象之靜電吸引方式等。特別是近年來強烈要求高解像度 之貝墨方式。為求實現高解像度之噴墨記錄,必須將排出 之墨液滴予以微小化。 此呀,自贺嘴排出之墨液滴喷灑在記錄媒體前之動作, 可藉由以下之運動方程式(公式(1))來表示。 P mk · (4/3 · 7Γ · d3) · dv/dt 〜Cd· (1/2· pair·今(7Γ · d2/4).....⑴ 上述p mk係墨之體積密度,v係液滴速度,以係抗力係 數,p air係空氣之密度,以系墨液滴半徑,Cd可藉由以下 公式(2)來表示。1255232 IX. Description of the Invention: [Technical Field of the Invention] "The present invention relates to a squirting type plate for discharging a fluid such as a fluid for discharging ink, and in further detail, relating to charging a fluid, Electrostatic attraction, discharge of the fluid to the nozzle 9 to the nozzle-type flat plate of the electrostatically attractable fluid on the object. [Prior Art] A "|" has various fluids (discharge materials) such as ink discharged to the object ( The fluid injection method on the recording medium). Here, the use of ink as a fluid injection method will be described. The On demand type inkjet method has been developed: a piezoelectric method using a piezoelectric phenomenon, (4) a thermal method of film boiling phenomenon of an ink, and an electrostatic attraction method using an electrostatic phenomenon. In particular, in recent years, the high resolution of the ink-and-ink method has been strongly demanded. In order to achieve high resolution ink jet recording, the discharged ink droplets must be miniaturized. Here, the action of the ink droplets discharged from the mouthpiece sprayed on the recording medium can be expressed by the following equation of motion (formula (1)). P mk · (4/3 · 7Γ · d3) · dv/dt ~Cd· (1/2· pair·今(7Γ · d2/4).....(1) The bulk density of the above p mk ink, v The droplet velocity, the coefficient of resistance, the density of p air, and the droplet radius of the ink, Cd can be expressed by the following formula (2).

Cd=24/Re · (1+3/16 · Re° 62) ········· (2) 上述Re係雷諾數(Reyn〇lds number),將空氣黏度設為” 95731.doc 1255232 時,可藉由以下公式(3)來表示。 d - p lnk . ν/ ............(3) 上述公式(ι)左邊之液滴半徑對墨液滴之運動能之影響 大於液滴半徑對空氣黏性阻力之影響。因❿,在相同速度 I,液滴愈小,液滴速度之減速愈快,而無法到達離開特 定距離之記錄媒體,或是即使到達,而噴灑精確度差。 j求防止此種情事’須提高液滴之排出初速,亦即須提 兩母單位體積之排出能。 、但是’先前之壓電方式及熱方式之噴墨頭,在將排出液 滴予以破小& ’亦即提高排出液滴之每單位體積之排出能 的情況下’具有以下所示之問題,因而欲使排出液滴量為 lpl以下,亦即使液滴之直徑(以下稱液滴徑)為阳以下 特別困難。 問題1:壓電方式之噴墨頭之排出能與驅動之壓電元件之 艾位里及產生壓力有關。該壓電元件之變位量與墨排出量 亦即墨液滴尺寸密切相M,為求縮小液滴尺寸,亦須降低 、艾位$。因而,提高排出液滴之每單位體積之排出能困難。 問題2 ··熱方式之喷墨頭,由於係利用墨之膜沸騰現象, 因此形成泡時之壓力有物理性界限,墨之排出能大致由加 产、、元件之面積來決定。該加熱元件之面積與產生泡之體 積,亦即與墨排出量大致成正比。因而縮小墨液滴尺寸時, 產生泡之體積變小,排出能變小。因此,提高墨之排出液 滴之每單位體積之排出能困難。 1喊3由於壓黾方式及熱方式之驅動(加熱)元件之驅動 95731.doc 1255232 量均與排出量密切相關,因此 寸時,加生丨* 引疋排出U小之液滴尺 τ、 抑制其偏差非常困難。 因此,為求解決上述各問題, ^ Μ Ψ ^ r 叨開^出猎由靜電吸引方 式排出镟小液滴之方法。 靜電吸引方式,自喷嘴排出之 丁夕八二、, 土,從/同之運動方輕式如以 下之公式(4)所示。 P mk - (4/3 · ^ . d3} . dy/dt =",,一今(〜/4)........ 2中n夜滴之電荷量,E係周圍之電場強度。 攸上述公$ (4)可知靜電吸引 、 ^ - 式,,、排出之液滴與排出 月b不同’即使在飛散中亦 _ 5又骄包力。因而可減輕每單位 體積之排出能,可適用於排出微小液滴。 此種靜電吸引方式之噴墨裝置(以下稱靜電吸引型喷墨 裝置),如在日本公開專利公報「特開平8·238774號公報(公 開曰期:1996年9月17日、Φ μ - ^ & )」中揭不有:在喷嘴更内部設置 電壓施加用之電極之嘖w驻罢 电貝墨衣置。此外,日本公開專利公報 「特開200(^27410號公報(公開曰期:2〇〇〇年5月9曰)」中 揭示有:將喷嘴形成細縫,設置自噴嘴突出之針狀電極, 而排出包含微粒子之墨之噴墨裝置。 參照圖17說明揭示於上诚日太八叫击立丨、 「 '上返日本公開專利公報Γ特開平 8-238774號公報(公開日期:月^日)」之喷墨裝置 如下。圖17係噴墨裝置之剖面模式圖。 圖中之1〇1表示墨噴射室,102表示墨,1〇3表示墨室,1〇4 表示喷嘴孔,丨05表示墨槽,1〇6表示墨供給路徑,1〇7表示 95731.doc 1255232 旋轉滾筒,108表示記錄媒體,n〇表示控制元件部,⑴表 示處理控制部。 再者,114係配置於墨喑急+ a 贺射至101之墨室103侧之靜電場施 加用電極部,11 5係設置於斿絲、办M t m 、疋軺滾《107之金屬圓筒(Drum) =相對電極部’116係在相對電極部115上施加數千V之負電 壓之偏壓電源部。117係在靜電場施加用電極部114上供仏 數百¥之_之高麼電源部,m係接地部。 ° 此時,在靜電場施加用電極部114與相冑電極部ιΐ5之 L施加於相對電極部115之數千ν之負電屋之偏·電源部 1邮數百ν之高壓電源部117之高電壓重疊,而形成重疊電 場,藉由該重疊電場來控制自喷嘴孔1〇4排出墨1〇2。 ,此外,119係藉由施加於相對電極部U5之數千ν之偏麼而 形成於喷嘴孔1〇4之凸狀彎月部。 以下說明上述構造之靜電吸引方式之喷墨裝置之動作。 首先,墨102藉由毛細管現象,經過墨供給路徑1〇6而送 賴出墨U)2之㈣孔1G4。此時,與噴嘴孔1()4相對,配置 有女I §己錄媒體1 〇 8之相對電極部115。 ]達噴紫孔1 〇4之墨1 〇2藉由施加於相對電極部i} 5之數 千v之偏壓而形成凸狀之墨、彎月部119。藉由在配置於墨室 103:之靜電場施加用電極部114上,自數百V之高磨電源部 117施加信號電壓,而與來自施加於相對電極部之偏壓 電源部U6之電虔重疊,墨1〇2藉由重疊電場排出至記_ 體1 〇 8,而形成印字圖像。 參照圖is⑷〜圖18⑷說明上述日本公開專利公報「特開 95731.doc 4 1255232 平一4號公報(公開曰期:⑽年9们7 喷墨裝置之液滴飛散前之彎月部動作如下。 晏不之 施加驅動電壓前,如圖l8(a)所示 產生之靜電力與墨之表面張力之平衡:而由= 口於墨之偏磨 成有凸起之彎月部119a之狀態。 為在墨表面形 在上述狀態下施加驅動電麼時,如圖18 119b係形成因液表面上產 隹士 # , 幻同始向液面之凸起中心 …猎此,形成液面之凸起中心提高之f月部U9b。 面:=,驅_時’如叫)所示,藉由液表 (Tal ,何進一步集中於中心,而形成所謂泰勒連線 (ayl〇r connectl〇n)之半月狀之彎月部, 勒連線頂部之電 I中於該泰 液滴分離而排出。“力超過墨之表面張力之階段, 其次’參照圖19說明上述日本公開專利公報「特開 ==。號公報(公開曰期:2, 貝‘土'衣置如下。圖19係喷墨裝置之概略構造圖。 人:圖所示’在喷墨裝置之保持構件内部收納有:以低電 "貝材料(丙稀基樹脂、陶变等)形成之線形記錄頭2ιι,作 為實墨頭;與該記錄頭211之墨排出孔相對而 :::質製之相對電㈣。;在非導電性之墨媒體内儲I* 使,料粒子分散之墨用之墨槽212;使墨在墨槽服 ⑽頭2U之間循環之墨循環系統⑷…,21处、管2⑸, 分別施加吸引形成記錄圖像之丨個像素之墨液滴用 之脈衝電壓至各排出電極211a之脈衝電壓產生裝置213;依 95731.doc -10- 1255232 據圖像貧料來控制脈衝電壓產生裝置2 1 3之驅動電路(圖上 未示)’使§己錄媒體2 3 〇通過設於記錄頭211與相對電極 門之間隙之3己錄媒體搬運機構(圖上未顯示);及控制整 個裝置之控制器(圖上未顯示)等。 上述墨循環系統係藉由:連接記錄頭211與墨槽2 1 2間之 兩ir、f 2 1 5a,2 15b,及藉由控制器之控制而驅動之兩台泵 214a,214b 而構成。 而後’上述墨循環系統區分成:供給墨至記錄頭21丨用之 墨供給系統’及自記錄頭211回收墨用之墨回收系統。 墨供給系碑以泵214a自墨槽212内吸引墨,其經由管215a 壓送至記錄頭211之墨供給部。另外,墨回收系統以泵215b 自記錄頭211之墨回收部吸引墨,其經由管215b而強制性回 收至墨槽21 2内。 此外’如圖20所示,在上述記錄頭2丨丨内設有:將自墨供 、、’e系統之笞21 5a送入之墨擴大成線寬之墨供給部,將 來自墨供給部220a之墨導引成外凸形(山形)之墨流路221, 連接墨*路22 1與墨回收系統之管21 5b之墨回收部220b,將 墨級路22 1之頂點開放於相對電極2丨〇側之適當寬度(約ο.〕 mm)之細縫狀墨排出孔222,以特定間距(約〇·2 排列於 墨排出孔222内之數個排出電極2Ua,及分別配置於各排出 電極21 la之兩側及上面之低電介質製(如陶瓷製)之隔離壁 223。 上述各排出電極21 la分別以銅、鎳等金屬形成,其表面 形成有浸潤性佳之防顏料附著用低電介質膜(如聚醯亞胺 95731.doc -11' 1255232 膜)。此外,各排出電極21 la之前端形成三角錐形狀,並分 別僅以適當長度(7〇 μιη〜8〇 μιη)自墨排出孔222向相對電極 210側突出。 义之圖上未顯示之驅動電路依據控制器之控制,僅於 依據圖像資料内所含之色調資料之時間供給控制信號至脈 衝電壓產生裝置213。藉此,脈衝電壓產生裝置213將依其 ^制佗號種頒之脈衝頂部之脈衝Vp乘載於偏壓之高電 壓信號重疊於偏壓Vb而輸出。 而後,控制器送達圖像資料時,驅動墨循環系統之兩台 泵214a,214b—。藉此,自墨供給部22〇a壓送墨,並且墨回收 部220b成為負壓,流入墨流路221之墨以毛細管現象流入各 隔離壁223之間隙,浸潤至各排出電極21U之前端。此時, 由於在各排出電極211a之前端附近之墨液面施加負麼,因 此刀別在各排出電極2丨丨a之前端形成墨彎月部。 再者藉由控制器控制記錄媒體搬運機構,而沿著圖中 :頭顯示之特定方向輸送記錄媒體23〇,並且藉由控制驅動 包路’而在與排出電極2山之間施加前述之高電壓信號。 其次,參照圖21〜圖24,說明上述曰本公開專利公報4 開騰127410號公報(公開日期··綱〇年5月9日)」所揭示 之贺墨裝置之液滴飛散前之彎月部動作如下。 於如^21所示’來自脈衝電❹生裝置⑴之脈衝電a施加 ^己、⑼2U内之排出電極21U時,產生自排出電極2lla侧 向相對電極2 1 〇側之雷揚。^人# 之电%此日守由於使用前端尖銳之排出電 才° Ha’目此其前端附近產生最強之電場。 95731.doc 1255232 產生此種電場時,如圖22所示,墨溶媒中之各個帶電顏 枓粒子·分別藉由來自該電場之力fE(圖2ι)而向墨液面 移動。藉此,墨液面附近之顏料濃度濃縮。 於顏料濃度濃縮時’如圖23所示,在墨液面附近,數個 f電顏料粒子201a開始靠近電極之相反側聚集。而後,顏 科凝聚體2G1開始球狀地成長於墨液面附近時,各個來自該 頭料&是聚體2 0 1之靜雷姑士 士 γ … 一斥力f 開始作用於各個帶電顏 料粒子201 a 〇亦即,决白衾s女丨、拉甘β此 乂、 須枓减♦體201之靜電排斥力f c〇nCd=24/Re · (1+3/16 · Re° 62) ·········· (2) Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re Re 1255232, can be expressed by the following formula (3): d - p lnk . ν / ............ (3) The radius of the droplet on the left side of the above formula (1) The effect of the motion energy is greater than the effect of the droplet radius on the air viscosity resistance. Because, at the same speed I, the smaller the droplet, the faster the droplet velocity decelerates, and cannot reach the recording medium leaving a certain distance, or Even if it arrives, the spray accuracy is poor. j. To prevent this, 'the initial velocity of the droplets must be increased, that is, the discharge capacity of the two parent units must be increased. But the 'previous piezoelectric method and the thermal type inkjet. In the case where the discharge droplet is broken and smaller, that is, when the discharge energy per unit volume of the discharged droplets is increased, the following problems are caused, and thus the amount of discharged droplets is required to be 1 pl or less, even if It is particularly difficult that the diameter of the droplet (hereinafter referred to as the droplet diameter) is below the anode. Problem 1: The discharge energy and the driving pressure of the piezoelectric ink jet head The displacement of the piezoelectric element is related to the pressure generated. The displacement of the piezoelectric element is closely related to the ink discharge amount, that is, the ink droplet size. In order to reduce the droplet size, the droplet size must also be lowered. It is difficult to discharge the droplets per unit volume. Problem 2 · The thermal type of inkjet head, because the film boiling phenomenon of the ink is used, the pressure at the time of forming the bubble has a physical limit, and the discharge of the ink can be roughly increased by the production. The area of the heating element is determined by the area of the heating element, that is, the volume of the bubble generated, that is, approximately proportional to the amount of ink discharged. Therefore, when the size of the ink droplet is reduced, the volume of the generated bubble becomes smaller, and the discharge energy becomes smaller. It is difficult to increase the discharge per unit volume of the discharged droplets of the ink. 1 Shout 3 Driven by the compression method and the thermal mode (heating) element 95731.doc 1255232 The quantity is closely related to the discharge amount, so when the inch is It is very difficult to remove the U droplet τ and suppress the deviation. Therefore, in order to solve the above problems, ^ Μ Ψ ^ r ^ ^ 由 由 由 由 由 由 由 由 由 由 由The electrostatic attraction method, which is from the nozzle discharge, is shown in the formula (4) below. P mk - (4/3 · ^ . d3} . dy/ Dt =",, one today (~/4)........ 2 The amount of charge in n night drops, the electric field strength around E. 攸 The above public $ (4) can be known as electrostatic attraction, ^ - The type, and the discharged droplets are different from the discharge month b. Even in the scattering, the _ 5 is also arrogant. Therefore, the discharge energy per unit volume can be reduced, and it can be applied to discharge minute droplets. An inkjet device (hereinafter referred to as an electrostatic attraction type inkjet device) is disclosed in Japanese Laid-Open Patent Publication No. Hei 08.238774 (Publication: September 17, 1996, Φ μ - ^ & ) No: The electrode for voltage application is placed inside the nozzle. In addition, Japanese Laid-Open Patent Publication No. H02 (Kokai No. Hei. No. Hei. No. Hei. No. Hei. An ink jet apparatus that discharges ink containing fine particles. Referring to FIG. 17, the disclosure is disclosed in "Shangshangtai Taiba", "Japanese Patent Publication No. 8-238774 (Publication Date: Month Day) Fig. 17 is a schematic cross-sectional view of the ink jet device. In the figure, 1 〇 1 indicates an ink ejection chamber, 102 indicates ink, 1 〇 3 indicates an ink chamber, and 1 〇 4 indicates a nozzle hole, 丨 05 Ink tank, 1〇6 indicates the ink supply path, 1〇7 indicates 95731.doc 1255232 rotating drum, 108 indicates the recording medium, n〇 indicates the control element, and (1) indicates the processing control unit. Further, 114 is placed in the ink cartridge.急+ a He is directed to the electrode portion for electrostatic field application on the side of the ink chamber 103 of 101, and is provided in the wire, the Mtm, and the metal cylinder (Drum) of the 107 = the opposite electrode portion. A bias power supply unit that applies a negative voltage of several thousand V to the opposite electrode portion 115. In the electrostatic field application electrode portion 114, the power supply unit is supplied with a voltage of several hundred volts, and m is a grounding portion. At this time, the electrostatic field application electrode portion 114 and the phase electrode portion ι 5 are applied to each other. The high voltage of the high voltage power supply unit 117 of the plurality of volts of the electrode unit 115 is overlapped with the high voltage power supply unit 117, and a superimposed electric field is formed, and the superimposed electric field is used to control the discharge of the ink from the nozzle hole 1〇4. Further, 119 is formed in a convex meniscus portion of the nozzle hole 1〇4 by a bias of several thousand ν applied to the opposite electrode portion U5. Hereinafter, the ink jet of the electrostatic attraction method of the above configuration will be described. The operation of the device. First, the ink 102 is sent to the (4) hole 1G4 of the ink U)2 by the capillary supply phenomenon through the ink supply path 1〇6. At this time, the counter electrode portion 115 is disposed opposite to the nozzle hole 1 () 4, and the opposite electrode portion 115 of the female recording medium 1 〇 8 is disposed. The ink of the ink jet hole 1 〇 4 is formed by the bias of the thousands of v applied to the counter electrode portion i} 5 to form a convex ink and a meniscus portion 119. By applying the signal voltage to the electrostatic field application electrode portion 114 disposed in the ink chamber 103: the voltage is applied from the high-grinding power supply unit 117 of several hundred V, and the electric power from the bias power supply unit U6 applied to the opposite electrode portion. In the overlap, the ink 1 〇 2 is discharged to the recording body 1 〇 8 by the overlapping electric field to form a printing image. The above-mentioned Japanese Laid-Open Patent Publication No. 95731.doc 4 1255232, No. 4 (Japanese Patent Publication No. Hei. No. 4, No. 4, No. 4, No. 4) Before the driving voltage is applied, the balance between the electrostatic force generated as shown in Fig. 18 (a) and the surface tension of the ink is: the state in which the ink is eccentrically grounded into the convex meniscus portion 119a. When the surface shape of the ink is applied with the driving electric power in the above state, as shown in FIG. 18, 119b is formed on the surface of the liquid, and the center of the convex surface of the liquid surface is sacred, and the center of the convex surface of the liquid surface is raised. The U9b of the month of F. The surface: =, when the _ time is called, as shown by the liquid table (Tal, what is further concentrated in the center, forming a half moon shape of the so-called Taylor connection (ayl〇r connectl〇n) In the meniscus, the electric wire I at the top of the cable is separated and discharged in the liquid droplets. "The force exceeds the surface tension of the ink. Next, the above-mentioned Japanese Laid-Open Patent Publication No.-=. Bulletin (publication period: 2, Bey's soil' clothing is as follows. Fig. 19 is a schematic structure of an inkjet device Figure: "The inside of the holding member of the ink jet device is housed with a linear recording head 2 ιι formed by a low-electric" material (acrylic resin, ceramics, etc.) as a solid ink head; The ink discharge holes of the recording head 211 are opposite to each other::: the relative electrical power of the material (4); the ink tank 212 for storing the ink in the non-conductive ink medium; the ink is used in the ink tank. (10) between the first 2U circulating ink circulation system (4) ..., 21, tube 2 (5), respectively, to apply a pulse voltage generating device 213 for attracting the pulse of the ink droplets of the pixels of the recorded image to each of the discharge electrodes 211a; According to the image poor material, the driving circuit (not shown) of the pulse voltage generating device 2 1 3 is controlled to pass the recording medium 2 3 〇 through the recording head 211 and the opposite electrode door. The gap between the three recorded media transport mechanism (not shown); and the controller that controls the entire device (not shown), etc. The ink circulation system is connected between the recording head 211 and the ink tank 2 1 2 Two ir, f 2 1 5a, 2 15b, and two pumps driven by the controller The ink circulation system is divided into: an ink supply system for supplying ink to the recording head 21 and an ink recovery system for recovering ink from the recording head 211. The ink supply is sealed by a pump 214a. The ink is sucked into the groove 212, and is fed to the ink supply portion of the recording head 211 via the tube 215a. Further, the ink recovery system sucks ink from the ink recovery portion of the recording head 211 by the pump 215b, which is forcibly recovered to the ink via the tube 215b. In the groove 21 2, as shown in Fig. 20, the ink supply unit for expanding the ink fed from the ink supply and the e21 5a of the 'e system into a line width is provided in the recording head 2''. The ink from the ink supply portion 220a is guided into an outer convex (male-shaped) ink flow path 221, and the ink path 22 1 and the ink recovery portion 220b of the ink recovery system tube 215 are connected to the ink level circuit 22 1 The slit-shaped ink discharge holes 222 having apexes open to the appropriate width (about ο. mm) of the opposite side of the electrode 2 are arranged at a plurality of discharge electrodes 2Ua arranged in the ink discharge holes 222 at a specific pitch (about 〇·2). And a low dielectric material (such as ceramic) respectively disposed on both sides and above the discharge electrodes 21 la The isolation wall 223. Each of the discharge electrodes 21 la is formed of a metal such as copper or nickel, and a low dielectric film for preventing adhesion of pigments (e.g., a polyimide film 95731.doc -11' 1255232 film) having a good wettability is formed on the surface. Further, the front end of each of the discharge electrodes 21 la is formed in a triangular pyramid shape, and protrudes from the ink discharge hole 222 toward the opposite electrode 210 side only at an appropriate length (7 〇 μη 8 8 μm). The driving circuit not shown on the map is supplied with a control signal to the pulse voltage generating means 213 only in accordance with the time of the tone data contained in the image data in accordance with the control of the controller. Thereby, the pulse voltage generating means 213 outputs the high voltage signal of the pulse Vp which is pulsed at the top of the pulse, which is exemplified by the moduli, superimposed on the bias voltage Vb. Then, when the controller delivers the image data, the two pumps 214a, 214b- of the ink circulation system are driven. Thereby, the ink is pressure-fed from the ink supply unit 22A, and the ink recovery portion 220b becomes a negative pressure, and the ink flowing into the ink flow path 221 flows into the gap between the partition walls 223 by capillary action, and is infiltrated to the front end of each discharge electrode 21U. At this time, since the ink surface near the front end of each of the discharge electrodes 211a is negative, the knife forms an ink meniscus at the front end of each of the discharge electrodes 2a. Further, by controlling the recording medium transport mechanism by the controller, the recording medium 23 is transported in a specific direction of the head display, and the aforementioned high is applied between the discharge electrode 2 and the discharge electrode 2 by controlling the drive package ' Voltage signal. Next, the meniscus before the droplet scattering of the ink-jet apparatus disclosed in the above-mentioned Japanese Laid-Open Patent Publication No. 127410 (published date, May 9th, 2011) will be described with reference to FIG. 21 to FIG. The department moves as follows. When the pulse electrode a from the pulse electric power generation device (1) is applied to the discharge electrode 21U in the (9) 2U as shown in Fig. 21, the rise from the discharge electrode 2lla side to the opposite electrode 2 1 side is generated. ^人# The electricity of this day is due to the use of the front end of the sharp discharge of electricity. Ha's eye produces the strongest electric field near its front end. 95731.doc 1255232 When such an electric field is generated, as shown in Fig. 22, each of the charged pigment particles in the ink medium is moved toward the ink surface by a force fE (Fig. 2i) from the electric field. Thereby, the concentration of the pigment near the ink surface is concentrated. When the pigment concentration is concentrated, as shown in Fig. 23, in the vicinity of the ink surface, a plurality of f electro-pigment particles 201a start to gather on the opposite side of the electrode. Then, when the Yankee agglomerate 2G1 begins to grow in a spherical shape near the ink surface, each of the headings & is a polymer of 203, and a repulsive force f starts to act on each of the charged pigment particles. 201 a 〇 即 即 决 决 决 决 衾 丨 丨 丨 丨 拉 拉 拉 拉 拉 拉 拉 乂 乂 乂 乂 ♦ ♦ ♦ 体 体 体 体 体

與來自脈衝電壓之電埸A L 电场E之力fE之合力f t o t a!分別作用於各 個贡電顏料峰子2〇ia。 因此’在帶電顏料粒子間恭 — 』又1^包排斥力未超過彼此之凝 水力之範圍内,朝向顏料 &來篮2υι之合力f total作用之帶 黾顏料粒子201 a(在連έ士姚ψ币上 加夕Λ、(連、,、°排出電極2山之前端舆顏料凝聚體 〜之直線上之帶電顏料粒子201a)上’來自電場之 力fE超過來自顏料凝聚體2 _帶電顏料粒子201化二“排斥力f__f U成長於顏料凝聚體201。 自η個帶電顏料粒子2 斤形成之顏料凝聚體201承受來 自脈衝笔壓之電場Ε之靜電 之約束力Fesc。靜電排斥& 另外承受來自墨溶媒The resultant force f t o t a! with the force fE of the electric field E from the pulse voltage is applied to each of the tributary pigment peaks 2〇ia. Therefore, 'in the charged pigment particles between the Gong- 』 and the 1 ^ package repulsive force does not exceed the range of each other's condensing power, towards the pigment & the basket 2 υ 之 之 total total total total of the total effect of the 黾 pigment particles 201 a (in the Gentleman On the Yao ψ 上 Λ ( ( ( ( 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 连 ' ' ' ' ' ' ' ' ' ' ' ' The particle 201 is deformed by the "repulsive force f__f U grown in the pigment agglomerate 201. The pigment agglomerate 201 formed from the n charged pigment particles 2 is subjected to the binding force Fesc of the electric field from the pulse pen pressure. Electrostatic repulsion & Withstand from ink solvent

,包排斥力PE與約束力F 凝聚體201以自墨液面稱微突出之狀態穩定^顏料 再者,顏料凝聚體201成長,靜電排 ⑽時,如圖24⑷〜圖24⑹戶卜 勺采力t 200a脫離。 不,顏料凝聚體2〇1自墨液面 再者,先前之靜電吸引方 式之原理,係使電荷集中於彎 95731.doc 1255232 月π之中心來產生_月部之隆起。該隆起之泰勒連線前端 敎曲率半徑係依電荷之集中量而定,集中之電荷量與電 %強度之靜電力大於此時之彎月部之表面張力時,液滴開 始分離。 …由於弓月部之最大電荷量係依墨之物性值與彎月部之曲 率半徑而定,因此最小之液滴尺寸係由墨之物性值(特別是 表面張力)與形成於彎月部之電場強度而定。 一般而言,液體之表面張力,其含溶劑者之表面張力低 於純粹之溶媒,即使在實際之墨中亦含各種溶劑,因此提 高表面張力,。因而,考慮墨之表面張力一定時,係採 取藉由提高電場強度,來縮小液滴尺寸之方法。 但是如上所述,A前之靜電吸引方式係採取藉由提高電 場強度來縮小液滴尺寸之方法,不過上述日本公開專利公 報「特開平8-238774號公報(公開曰期:1996年9月17曰)」 及上述日本公開專利公報「特開2〇〇〇-12741〇號公報(公開日 期· 2_年5月9日)」所揭示之喷墨裝置,兩者之排出原理 均係藉由在退比排出液滴之投影面積大之彎月部區域形成 強電場強度之場,使電荷集中於該彎月部之中心藉由包 含該集中之電荷與形成之電場強度之靜電力來進行排出, 因此’需要施加約2000 V之非常高之電壓,導致驅動控制 困難,亚且在操作噴墨裝置上亦存在安全性方面之問題。 針對於此種問題努力檢討結果,查明在某喷嘴徑以下, ]起與先前之流體排出模型不同之排出膜型之排出現象, 稭由縮小排出墨部分(開始排出部)之寬度或直徑,不施加高 95731.doc 1255232 電壓即可提高電場強度。 以下,使用圖25(a)及圖25(b)考察靜電吸引型之微量流體 排出之基本特性,特別是儲存於喷嘴前端之彎月部之電荷 形成之表面電位。 首先,如圖25(a)所示,將靜電吸引型流體排出裝置之單 純構造予以模型化。單純模型在前端之尖銳喷嘴250之内部 設有驅動電極25 1,排出材料252填充於整個喷嘴内部。而 後,與喷嘴前端面相對來配置基板254,並藉由背面電極255 接地。 形成此種年純構造模型時,由於自電源256流出之電荷係 通過喷嘴250内部之排出材料之流體252内部,而在喷嘴前 端具靜電電容之彎月部257上與基板254相對,因此可假定 為圖25(b)所示之電源電壓V〇與喷嘴内部之電阻R,以及彎 月部25 7與基板254間之靜電電容C之串聯電路。 V〇RC之串聯電路可使用彎月部257上之儲存電荷Q⑴表 示如下。 R dQ(t)/dt + Q(t)/C= V〇.......(5) 求解該公式(5)之微分方程式時,彎月部表面之儲存電荷Q(t) 及彎月部表面電位V(t)可表示如下。 Q⑴=CV〇[l-exp(-t/RC)].....(6) V(t)= V〇[l-exp(-t/RC)]......(7) 如上所述可知,某時刻t之彎月部表面之儲存電荷Q(t)及 彎月部表面電位V⑴取決於喷嘴250内部之電阻R以及彎月 部257與基板254間之靜電電容C。亦即,此種構造之靜電吸 95731.doc -15- 1255232 土机體排出ι置中,藉由縮小喷嘴内部之電阻&,容 易:弓月部257表面儲存電荷’可縮短排出流體252前所需 τ門亦即’可提南排出頻率,可進行高速描緣。 :低上述噴嘴250内部之電阻R之具體對策,須儘量使驅 動電極251接近於喷嘴250之墨端。 日本公開專利公報「特開平1〇_1753〇5號公報(公開日 d . 1998年6月3G日)」中揭示有在靜電吸引型噴墨喷嘴之 喷嘴孔内部形成電極之技術。圖26係顯示曰本公開專利公 報「特開平UM75305號公報(公開日期:簡料月则)」 之噴嘴式平每製程之剖面圖。使用圖26說明日本公開專利 A報特開平1〇_1753〇5號公報(公開日期:^%年6月% 之構造。 Μ 圖中之3〇1係噴嘴式平板,在噴嘴式平板3〇1内預先形成 有數個墨貯存用凹部A··.,該噴嘴式平板30丨之未形成墨貯 存用凹4A .之面上、塗敷加工不固定導電用電鑛则之光阻 層/〇2。而後,形成有貫穿喷嘴式平板3〇ι及光阻層3〇2之喷 嘴孔Β而連通於各墨貯存用凹部a後,在喷嘴内周實施導電 用电鑛303 Λ a守由於光阻層3〇2係選擇不固定導電用電鍍 3〇3之材料,因此導電用電鍍3〇3僅在f嘴式平板3〇ι内部及 喷嘴式平板3CU之未形成光阻層3G2之面上固定。如此,日 本a開專利A報特開平1〇_1753〇5號公報(公開日期:IMS 年月30日)」在貝實孔内部形成電極層(導電用電鍛如)。 此外,日本公開專利公報「特開平11-42784號公報(公開 日期 1999年2月16日)」中揭示有在靜電吸引型喷墨頭之 9573 l.doc -16 - 1255232 貝觜式平板與纪錄媒體相對面上形成電極之構造。圖27係 '、貝不日本公開專利公報「特開平u_42784號公報(公開日 1999年2月16日)」之喷墨頭構造之說明圖。使用圖27 來况明日本公開專利公報「特開平^心料號公報(公開日 期·· 1999年2月16曰)」。 賀墨頭在絕緣控制基板411之表面形成控制電極4〇1,並 且在其月面形成有控制電極4〇2,並形成有自墨槽4%貫穿 之墨排出孔413,使墨可通過控制電極4〇1或4〇2。在前述墨 排出孔413上設置突起之墨導引412,施加於控制電極術, 彻之電Μ產生之電場集中於墨導引412之前端,墨滴414, 藉由該電場向經由相對電極42〇而設置之記錄媒體々a飛 散0 但是,該日本公開專利公報「特開平(753〇5號公報(公 開日期:簡年6月30日)」及日本公開專利公報「特開平 11-42784號公報(公開日期:1999年2月16日)」所揭示之方 法存在以下之問題,而無法適用於縮小排出墨部分之寬度 或直徑之靜電吸引型流體排出裝置。 首先,係、曰本公開專利公報「特開平叫^地號公報(公 開曰期:1998年6月30曰)」之構造,藉此係在嘴嘴式平板 301之媒體相對面以外之區域形成有上述導電電鍍%因 此形成於各墨貯存用凹部A及喷嘴孔b之道命 、 V黾電鍍303彼此 電性短路。因而此種噴嘴式平板3〇丨鉦法 …古僅排出指定之1個 通道’欲提高描繪圖像之解像度,須電 |土刀離鄰接之通道 間0 95731.doc -17- 1255232 其方法如有以下所示之①②之方法。The bag repulsive force PE and the binding force F condensate 201 are stabilized in a state of micro-protrusion from the surface of the ink. Further, the pigment agglomerate 201 grows, and when the electrostatic discharge (10) is as shown in Fig. 24(4) to Fig. 24(6) t 200a is detached. No, the pigment agglomerate 2〇1 from the ink surface. Moreover, the principle of the previous electrostatic attraction method is to concentrate the charge on the center of the π to produce the ridge of the month. The tip radius of the ridge of the ridge is determined by the concentration of the charge. When the concentrated charge and the electrostatic force of the electric strength are greater than the surface tension of the meniscus at this time, the droplet starts to separate. ...Because the maximum charge amount of the lunar portion depends on the physical property value of the ink and the radius of curvature of the meniscus, the smallest droplet size is determined by the physical property value of the ink (especially the surface tension) and the electric field formed in the meniscus. Depending on the strength. In general, the surface tension of a liquid, the surface tension of a solvent-containing one is lower than that of a pure solvent, and the solvent is contained in the actual ink, thereby increasing the surface tension. Therefore, in consideration of the fact that the surface tension of the ink is constant, a method of reducing the droplet size by increasing the electric field strength is employed. However, as described above, the electrostatic attraction method before A is a method of reducing the droplet size by increasing the electric field intensity, but the above-mentioned Japanese Laid-Open Patent Publication No. 8-238774 (Publication: September 17, 1996)喷墨 」 」 及 及 及 及 及 及 及 及 及 及 及 及 及 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨 喷墨A field of strong electric field strength is formed in a meniscus region having a large projected area of the discharged droplets, and the electric charge is concentrated at the center of the meniscus by discharging the electrostatic force including the concentrated electric charge and the electric field strength formed. Therefore, it is necessary to apply a very high voltage of about 2000 V, which makes driving control difficult, and there is also a problem in terms of safety in operating the ink jet device. In order to review the results of such problems, it is found that the discharge film type is different from the previous fluid discharge model, and the width or diameter of the discharged ink portion (starting discharge portion) is reduced. The electric field strength can be increased without applying a high voltage of 95731.doc 1255232. Hereinafter, the basic characteristics of the electrostatic attraction type microfluid discharge, in particular, the surface potential of the charge formed in the meniscus at the tip end of the nozzle, will be examined using Figs. 25(a) and 25(b). First, as shown in Fig. 25 (a), the simple structure of the electrostatic attraction type fluid discharge device is modeled. The simple model is provided with a drive electrode 25 inside the sharp nozzle 250 at the front end, and the discharge material 252 is filled inside the entire nozzle. Then, the substrate 254 is disposed opposite to the front end surface of the nozzle, and is grounded by the back surface electrode 255. When such an annual pure structure model is formed, since the electric charge flowing from the power source 256 passes through the inside of the fluid 252 of the discharge material inside the nozzle 250, and is opposed to the substrate 254 on the meniscus 257 having the electrostatic capacitance at the tip end of the nozzle, it can be assumed It is a series circuit of the power supply voltage V 所示 shown in FIG. 25( b ) and the internal resistance R of the nozzle, and the electrostatic capacitance C between the meniscus portion 25 7 and the substrate 254 . The series circuit of V 〇 RC can be expressed as follows using the stored charge Q(1) on the meniscus 257. R dQ(t)/dt + Q(t)/C= V〇.......(5) When solving the differential equation of the formula (5), the stored charge Q(t) of the meniscus surface and The meniscus surface potential V(t) can be expressed as follows. Q(1)=CV〇[l-exp(-t/RC)].....(6) V(t)= V〇[l-exp(-t/RC)]......(7) As described above, the stored charge Q(t) and the meniscus surface potential V(1) at the meniscus surface at a certain time t depend on the resistance R inside the nozzle 250 and the electrostatic capacitance C between the meniscus 257 and the substrate 254. That is, the electrostatic absorption of the structure 95731.doc -15- 1255232 is discharged from the earth body, and by reducing the resistance & inside the nozzle, it is easy to: the surface of the bow 257 stores the charge 'can shorten the discharge fluid 252 before The τ gate is also required to be used to extract the frequency and to perform high-speed stroke. The specific countermeasure for lowering the resistance R inside the nozzle 250 is to make the driving electrode 251 close to the ink end of the nozzle 250 as much as possible. A technique for forming an electrode inside a nozzle hole of an electrostatic attraction type inkjet nozzle is disclosed in Japanese Laid-Open Patent Publication No. Hei. Hei. No. Hei. No. Hei. Fig. 26 is a cross-sectional view showing the nozzle-type flat process of the Japanese Laid-Open Patent Publication No. UM75305 (published date: simplification of the month). Japanese Patent Laid-Open Publication No. Hei 1 〇 〇 〇 〇 〇 〇 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造 构造In the first embodiment, a plurality of ink storage recesses A··. are formed in advance, and the surface of the nozzle plate 30 is not formed on the surface of the ink storage recess 4A, and the photoresist layer/〇 which is not fixed to the conductive electric ore is applied. 2. Then, a nozzle hole penetrating through the nozzle plate 3 and the photoresist layer 3〇2 is formed to communicate with each of the ink storage recesses a, and the conductive ore 303 is held inside the nozzle. The resist layer 3〇2 is selected such that the material for electroplating 3〇3 is not fixed, so the electroplating electroplating 3〇3 is only on the surface of the f-type flat plate 3〇1 and the nozzle type flat plate 3CU on which the photoresist layer 3G2 is not formed. In this way, the Japanese A patent pending A Kaikai 1〇_1753〇5 bulletin (publication date: IMS date 30th)” forms an electrode layer inside the Beshole (electrical forging). The publication of the Japanese Patent Publication No. Hei 11-42784 (published on February 16, 1999) discloses Type 9553 l.doc -16 - 1255232 of the type of inkjet head The structure of the electrode is formed on the opposite side of the recording medium from the recording medium. Fig. 27 is a publication of the Japanese Patent Publication No. JP-A-42784 (publication date 1999) (December 16) The description of the structure of the ink jet head is described in Japanese Laid-Open Patent Publication No. Hei-Ping No. (Publication Date, February 16, 1999). The control electrode 4〇1 is formed on the surface of the insulation control substrate 411, and the control electrode 4〇2 is formed on the moon surface thereof, and the ink discharge hole 413 penetrating through the ink tank 4% is formed so that the ink can pass through the control electrode 4〇. 1 or 4 〇 2. A protruding ink guide 412 is disposed on the ink discharge hole 413, and is applied to the control electrode. The electric field generated by the electric concentrating is concentrated on the front end of the ink guide 412, and the ink droplet 414 is The electric field is scattered to the recording medium 々a which is provided through the counter electrode 42A. However, the Japanese Laid-Open Patent Publication No. 753-5 (publication date: June 30) and Japanese Laid-Open Patent Publication Japanese Patent Publication No. 11-42784 (publication date: 1999) The method disclosed in the "February 16" has the following problems, and cannot be applied to the electrostatic attraction type fluid discharge device which reduces the width or diameter of the discharged ink portion. First, the Japanese Patent Laid-Open Publication No. In the structure of the publication No. (June 30, 1998), the conductive plating is formed in a region other than the medium facing surface of the nozzle plate 301, and is formed in each of the ink storage recesses A and The nozzle hole b and the V 黾 plating 303 are electrically short-circuited with each other. Therefore, the nozzle type plate 3 method is only used to discharge only one channel designated to improve the resolution of the image to be drawn. From the adjacent channel 0 95731.doc -17- 1255232 The method is as follows.

將喷嘴式平板301之形成有墨貯 予以加工,每通道分斷導電電鍍 亦在喷嘴式平板3〇1之墨流 ②於形成導電電鍍303前,亦/ 側形成與排出面相同之光阻層 ,而作成不增添導電電鍍3〇3 絲但是,①之形成導電電鍍3〇3層後進行分斷之方法,於分 斷加工上使用_械加工時’切削屑等塵埃進入喷嘴孔B内造 成喷嘴堵塞,:利用雷射等之熱之分斷加工,因熱殘留應二 贺嘴式平板3〇 1因上述應力而變形。 此外亦考慮藉由蝕刻進行分斷加工,不過使用蝕刻時, 頁在形成於上述噴嘴式平板之墨流入面側之導電電鍍3〇3 上形成光阻圖案。如上所述,為應用於縮小排出墨部分之 見度或直徑之靜電吸引型流體排出裝置之喷嘴式平板時, 由於係成為具有10 Mm以下之喷嘴孔者,因此為求提高喷嘴 孔拴之加工精確度,須使用約5〇 之喷嘴式平板母材。但 是’如此薄之喷嘴式平板之剛性低,於作成光阻圖案時, 在處理贺嘴式平板中容易變形,而無法形成高精確度之圖 就此上述②之方法亦同,因噴嘴式平板本身薄,即使在 形成導電電鍍3〇3之前,同樣地存在喷嘴式平板變形之問 題’而無法形成精確度佳之光阻圖案,而無法進行良好之 通道分離。 95731.doc -18 - 1255232 再者,日本公開專利公報「特 開日竹開十1〇_1753〇5號公報(公 開日期· 1998年6月3〇日)」之方法, 以 於貝鳴孔梭小達10 μηι 守,電鍍液供給不足,亦有在 導雷条# & & 仕贺鳥孔内部穩定地形成 :二响困難之問題。此時,電錢液供給最不足處係 如此:;:。亦如前述,須儘量使電極接近噴嘴之前端, ]热法在最重要之喷嘴前端部穩定地形成電極。 提r,p,t嘴徑愈小愈可排出微量之流體,崎解像度雖 门但疋反而電極之形成不穩定。因而,久、s、# 前护却4 + h u向,各通运之喷嘴 月J立而邛之賀嘴内部之電阻R變化, 變化,H & 稭此各通道之反應頻率 夜適切量。亦即描繪 圖像之印字品質顯著降低。 另外,相當於日本公開專利公報「 鉬卩八„ ^ 知開平11-42784號公 報“開日期:1999年2月16日)」巾所揭示之嗔 ^緣控制基板411,由於在與記錄媒體421之相對二上形成 有控制電極彻,因此可以非常高之精確度設定電極對彎月 部之位置。因而並無日本公開專利公報「特開平叫7侧 號公報(公開日期:1998年6㈣日)」之構造存在 通道間之排出穩定性高,與鄰接通道之電性分離充分。 但是,如圖28所示,日本公開專利公報「特開平⑴彻4 唬公報(公開日期:1999年2月16 ) < 構造,係在絕緣控 :基板4U與記錄媒體421之相對面上,亦同時形成有自電 壓施加手段施加電壓於控制電極4〇丨用 ^力出配線405,此 時亦自引出配線405產生電場。特別是自弓|出配線他之彎 曲部分405a容易產生集中之電場,如在電氣零件上描緣時 95731.doc -19- 1255232 等’極可能因該電場而損壞電子零件。 【發明内容】 本發明之目的在提供一種喷嘴式平板及其製造方法,該 噴嘴式平板可適用於排出超微量流體之靜電吸引型流體排 出裝置,且可在喷嘴前端部近旁穩定地形成電極,並且亦 容易使數個噴嘴孔部間電性獨立,且可自噴嘴式平板之流 體供給側施加驅動信號至形成於噴嘴孔部之電極。 為了達成上述目的,本發明之噴嘴式平板係設於靜電吸 :型流體排出裝置,其係自噴嘴前端之流體排出孔藉由靜 電吸引而排出藉由施加電壓而帶電之流體,並具有數個喷 :孔部’其構造為:具備薄層之第—喷嘴層,其係具有第 :噴嘴孔,並配置於流體排出側,並且至少具備一層第二 =嘴層,其係、層疊於該第—噴嘴層之流體供給侧,比上述 弟-贺嘴層厚,且與上述第—噴嘴孔連通,並且具有盘第 一噴嘴孔構成喷嘴孔部之第二噴,帝 '、 ^ + 貝肖孔弘性連接成膜於該 弟-贺嘴孔内壁之第一電極層與成膜於第二噴嘴孔内壁 第二電極層。 土 根據上述構造,喷嘴式平板係在薄層之第—噴嘴芦上至 少層疊-層厚層之第二噴嘴層,因此可以第二: 噴嘴式平板本身之強度及剛性, ^ ’、 亚可使弟一噴嘴層之厚产 十分薄。I!由使層厚變薄’形成於第一噴嘴層之第一: 孔可將孔徑形成例如10 _以下之超微細,並且可二” 微細之第一噴嘴孔内壁,在層〜 超 a ^ 〇思疋地將第—電極 層予以成膜,將流體排出面之第—喷 貝為孔之開口部作為流 95731.doc -20、 1255232 體排出孔時,可將第一電極成膜至該流體排出孔近旁。此 結果,可比先前大幅降低噴嘴内部《電阻R,謀求提高流體 之排出頻率,可對記錄媒體高速描緣。 而且,如此形成之第一電極層與形成於與第一喷嘴孔連 通之第二喷嘴孔之第二電極層電性連接,因此,可經由第 一電極層,自喷嘴式平板之流體供給側供給驅動信號。因 此’供給驅動信號至第-電極層用之引出酉己線不致接近媒 體’記錄媒體亦不致因自引出配線產生之電場而遭受電性The nozzle plate 301 is formed with an ink reservoir for processing, and the conductive plating is separated for each channel. The ink flow layer of the nozzle plate 3〇1 is formed before the conductive plating 303, and the same photoresist layer is formed on the side. However, the method of forming the conductive plating 3〇3 wire is not added, but the method of forming the conductive plating 3〇3 layer and then breaking is performed, and when the machining is used, the dust such as chips is entered into the nozzle hole B. The nozzle is clogged, and the heat is broken by the laser, and the heat is left to be deformed by the above-mentioned stress. Further, it is also considered to perform the breaking process by etching, but when etching is used, the page forms a photoresist pattern on the conductive plating 3〇3 formed on the ink inflow surface side of the nozzle type flat plate. As described above, in order to apply to a nozzle type flat plate of an electrostatic attraction type fluid discharge device that reduces the visibility or diameter of the discharged ink portion, since it is a nozzle hole having a nozzle hole of 10 Mm or less, in order to improve the processing accuracy of the nozzle hole 拴A nozzle type base material of about 5 inches must be used. However, the thinness of the nozzle type flat plate is low, and when the photoresist pattern is formed, it is easily deformed in the processing of the mouthpiece type plate, and the high precision image cannot be formed. The method of the above 2 is also the same, because the nozzle type plate itself Thin, even before the formation of the conductive plating 3〇3, there is a problem that the nozzle type flat plate is deformed', and a photoresist pattern with good precision cannot be formed, and good channel separation cannot be performed. 95731.doc -18 - 1255232 In addition, the method of the Japanese Laid-Open Patent Publication No. JP-A-110, 171, 753 (publication date, June 3, 1998) Shuttle small 10 μηι shou, insufficient supply of electroplating solution, also in the guide bar # & & Shi Shi bird hole stable formation: two problems are difficult. At this point, the most insufficient supply of electricity money is like this: ;:. As also mentioned above, the electrode must be as close as possible to the front end of the nozzle, and the thermal method stably forms the electrode at the front end of the most important nozzle. The smaller the r, p, and t nozzle diameters, the more the trace fluid can be discharged. Although the image is not resolved, the formation of the electrode is unstable. Therefore, the long, s, # front protection but 4 + h u direction, the nozzle of each transport month J and the internal resistance R change, change, H & straw response frequency of each channel night cut amount. That is, the quality of the printed image is significantly reduced. In addition, it is equivalent to the rim control substrate 411 disclosed in the Japanese Laid-Open Patent Publication No. Hei No. Hei No. Hei No. 11-42784 (opening date: February 16, 1999). The control electrode is formed on the opposite side, so that the position of the electrode to the meniscus can be set with a very high degree of precision. Therefore, there is no structure in the Japanese Laid-Open Patent Publication No. Hei No. 7 (Publication Date: 6 (4) (1998).) The discharge stability between the channels is high, and the electrical separation from the adjacent channels is sufficient. However, as shown in FIG. 28, Japanese Laid-Open Patent Publication No. Hei-Ping (1) Tsin 4 (Publication Date: February 16, 1999) < Structure is on the opposite side of the insulation control: the substrate 4U and the recording medium 421, At the same time, a voltage is applied from the voltage application means to the control electrode 4, and the wiring 405 is used. At this time, an electric field is generated from the lead wiring 405. In particular, the bent portion 405a of the wire is easy to generate a concentrated electric field. For example, when searching for electric parts, 95731.doc -19- 1255232, etc., it is very likely that the electronic parts are damaged by the electric field. SUMMARY OF THE INVENTION An object of the present invention is to provide a nozzle type flat plate and a method of manufacturing the same The flat plate can be applied to an electrostatic attraction type fluid discharge device that discharges a very small amount of fluid, and can stably form an electrode near the front end portion of the nozzle, and can also easily electrically separate a plurality of nozzle holes, and can be fluid from the nozzle plate. The supply side applies a drive signal to the electrode formed in the nozzle hole portion. To achieve the above object, the nozzle type plate of the present invention is provided in an electrostatic suction type fluid discharge device. The fluid discharge hole from the tip end of the nozzle discharges the fluid charged by the application of voltage by electrostatic attraction, and has a plurality of sprays: the hole portion is configured to have a thin layer of the first nozzle layer, which has the following: a nozzle hole disposed on the fluid discharge side and having at least one layer of a second nozzle layer laminated on the fluid supply side of the first nozzle layer, thicker than the above-mentioned scorpion layer, and the first nozzle The holes are connected, and the first nozzle hole of the disk constitutes a second spray of the nozzle hole portion, and the first electrode layer of the inner wall of the die-shaped hole is formed and formed on the second nozzle. The second electrode layer of the inner wall of the hole. According to the above configuration, the nozzle type flat plate is laminated on at least the second nozzle layer of the layer-nozzle reed of the thin layer, so that the second: the strength and rigidity of the nozzle type plate itself , ^ ', Ya can make the thickness of a nozzle layer very thin. I! is made thin by the thickness of the layer formed on the first nozzle layer: the hole can form an aperture of, for example, 10 _ or less ultrafine, and Can be two" fine first nozzle hole inner wall, Layer ~ Super a ^ 〇 疋 将 将 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第The electrode is filmed to the vicinity of the fluid discharge hole. As a result, the recording medium can be drawn at a high speed by lowering the internal resistance R of the nozzle and increasing the discharge frequency of the fluid. Moreover, the first electrode layer thus formed is electrically connected to the second electrode layer formed in the second nozzle hole communicating with the first nozzle hole, and therefore can be supplied from the fluid supply side of the nozzle plate via the first electrode layer. Drive signal. Therefore, the supply of the driving signal to the first electrode layer is not close to the medium. The recording medium does not suffer from the electric field generated by the self-extracting wiring.

損傷。damage.

為了達成冬述目的,本發明之喷嘴式平板之製造方法^ :以:步驟:在基板上形成犧牲層;在上述犧牲層上則 第喷紫層,在上述第一噴嘴層上形成數個第一喷嘴孔; ^上述第—喷嘴層上’包含各第-噴嘴孔之内壁面,形启 第书極層,以殘留於各第一嘴嘴孔内壁與各第一喷嘴子I 周圍部之方式,加工上述第一電極層;在上述第一喷嘴肩 上’亦包含殘留之各第—電極層部分,形成第二噴嘴層; 在上述第一贺嘴層上將數個第二噴嘴孔以各第二噴嘴孔之 流體排出側之開π部收納於殘留於上述第—噴嘴層上之夕 第:電極層部分之方式形成;在上述第二喷嘴層上,包: 二弟—貝嘴孔之内壁面,形成第二電極層;及以在鄰接之 第:噴嘴孔間電性分離之方式,加卫第二電極層。 +藉此於剛性馬之基板上,經由犧牲層依序層疊— 賀嘴層、第-電極層、第二噴嘴層、第二電極層。因而, 利用微影技術形成光阻圖案後,可藉由乾式㈣加工成所 95731.doc -21 · 1255232 需形狀,因此可以非常高之形狀精確度形成第—噴嘴孔、 第二喷嘴孔、第一電極層、第二電極層。 、 此外,由於喷嘴式平板之流體排出面係藉由犧牲層保護 至步驟之最㈣段n在喷嘴式平板製程中一有因 ㈣排出孔受到損傷而流體排出孔變形的危險。因=噴嘴 式平板之製造良率提高。 本發明之另外目的 可充分瞭解。此外, 中即可明瞭。 义⑽稚田以下所示之記載 本發明之好處從參照附圖之以下說 【實施方式^ 以下,藉由實施例及比較例來進一步詳細說明本發明, 不過本發明可更確實地形成電壓之低電壓化。 以下,藉由實施例及比較例來進一步詳細說明本發明, 不過本發明並不限定於此等。 [前提技術] 百先,使用圖1〜圖6說明應用本發明之喷嘴式平板之屬於 本發明前提構造之靜電吸引型流體排出裝置。 成為本發明之前提構造之靜電吸引型流體排出裝置,其 贺嘴徑為0·01 〜25 μπι,且可以1000 V以下之驅 制流體之排出。 匕 先則之流體排出模型中,由於喷嘴徑縮小連帶引起驅動 弘壓上昇,因此50〜70 μηι以下之喷嘴徑,若不進行對排出 墨賦予背壓等之其他措施,即無法以1〇〇〇 V以下之驅動電 I排出墨。但是探討出在某個喷嘴徑以下,引起與先前之 9573l.doc -22- 1255232 流體排出模型不同之排山 出杈型之排出現象。本發明即 據此種流體排出模型之新見解。 〃又 首先,說明新的流體排出模型。 在直徑d(以下說明巾, 〃要未預先說明,係指喷嘴孔 内徑)之喷嘴内注入導雷料、六 、,,〜 、 、包性",L體,亚假疋垂直地設於距無限 平板導體h之高度。圖1屋§ 一 ㈡”、、員不此種狀恶。此時,被喷嘴前端 嘴孔)激勵之電荷Q假定隹由μ #丄+ & 、 W疋集中於猎由喷嘴前端之流體而形成 之半球部,並以以下公式類似表示。 Q = 2 7Γ ε 〇 a V〇d ··· (8) 其中Q .被喷嘴前端部激勵之電荷(c),ε 〇 :冑空之介電 常數(F/m)’ d··噴嘴之直徑⑽,Vq:施加於噴嘴之總電壓。 此外,α係取決於噴嘴形狀等之比例常數,且係取約 之值’特別是d«h(h:噴嘴(正確而言係指喷嘴孔)_基板間 距離(m))時大致為1。 此外,基板使用導電基板時,與喷嘴相對,在基板内之 對稱位置上感應具有與上述電荷Q相反極性之鏡像電荷 Q’。基板為絕緣體時,與藉由介電常數而決定之對稱位置 上同樣地感應與電荷Q反極性之影像電荷q,。 喷嚆兩ί而部之集中電場強度Eloc,假定前端部之曲率半徑 為R時,則為 …(9) 其中,k係取決於喷嘴形狀等之比例常數,並取約1.5〜8 5 之值’通常約為5(P.J· Birdseye and D.A. Smith,SurfaceIn order to achieve the purpose of winter description, the method for manufacturing a nozzle type flat plate according to the present invention is as follows: a step of: forming a sacrificial layer on the substrate; and a first sprayed purple layer on the sacrificial layer, forming a plurality of layers on the first nozzle layer a nozzle hole; ^ on the first nozzle layer 'including the inner wall surface of each of the first nozzle holes, forming the book surface layer to remain in the inner wall of each of the first nozzle holes and the periphery of each of the first nozzles I Processing the first electrode layer; the first nozzle shoulder further includes a remaining portion of each of the first electrode layers to form a second nozzle layer; and the plurality of second nozzle holes are respectively formed on the first layer The opening portion π of the fluid discharge side of the second nozzle hole is formed in a manner of remaining on the first nozzle layer: the electrode layer portion; on the second nozzle layer, the package: the second brother-bean mouth The inner wall surface forms a second electrode layer; and the second electrode layer is reinforced by electrically separating between adjacent nozzle holes. + Thereby, on the substrate of the rigid horse, the nozzle layer, the first electrode layer, the second nozzle layer, and the second electrode layer are sequentially stacked via the sacrificial layer. Therefore, after the photoresist pattern is formed by the lithography technique, it can be processed into a shape of 95731.doc -21 · 1255232 by dry (four), so that the nozzle hole, the second nozzle hole, and the second nozzle hole can be formed with very high shape accuracy. An electrode layer and a second electrode layer. In addition, since the fluid discharge surface of the nozzle type plate is protected by the sacrificial layer to the most (four) section of the step n, there is a risk in the nozzle type flat plate process. (4) The discharge hole is damaged and the fluid discharge hole is deformed. Because of the improved manufacturing yield of the nozzle type flat plate. Additional objects of the invention will be fully appreciated. In addition, the middle can be understood. (10) The following is a description of the advantages of the present invention from the following description with reference to the accompanying drawings. [Embodiment] Hereinafter, the present invention will be further described in detail by way of examples and comparative examples, but the present invention can more reliably form a voltage. Low voltage. Hereinafter, the present invention will be described in more detail by way of examples and comparative examples, but the invention is not limited thereto. [Prerequisite Technology] An electrostatic attraction type fluid discharge device belonging to the premise structure of the present invention to which the nozzle type flat plate of the present invention is applied will be described with reference to Figs. The electrostatic attraction type fluid discharge device having the structure of the present invention has a nozzle diameter of 0·01 to 25 μm and can be discharged by a driving fluid of 1000 V or less. In the fluid discharge model of the first step, the nozzle pressure is reduced by the nozzle diameter reduction. Therefore, the nozzle diameter of 50 to 70 μηι or less cannot be 1 若 unless other measures such as back pressure are applied to the discharged ink. The driving power I below 〇V discharges the ink. However, it has been explored that it is below a certain nozzle diameter, causing a discharge phenomenon similar to the previous 9573l.doc -22- 1255232 fluid discharge model. The present invention is based on new insights into this fluid discharge model. 〃First, explain the new fluid discharge model. In the nozzle of the diameter d (hereinafter, the description of the towel, which is not previously described, refers to the inner diameter of the nozzle hole), the guide material is injected into the nozzle, six, , , , , , , , , , , , , , , , , , , , , , , , , , , At a height from the infinite plate conductor h. In Figure 1, the house §1 (2), and the member does not have such a shape. At this time, the charge Q excited by the nozzle tip nozzle is assumed to be μ by μ #丄+ &, W疋 concentrated on the fluid from the front end of the nozzle. The hemisphere is formed and is similarly represented by the following formula: Q = 2 7Γ ε 〇a V〇d · (8) where Q is the charge excited by the front end of the nozzle (c), ε 〇: hollow dielectric Constant (F/m)' d··The diameter of the nozzle (10), Vq: the total voltage applied to the nozzle. In addition, α depends on the proportional constant of the shape of the nozzle, etc., and takes the approximate value 'especially d«h( h: the nozzle (correctly referred to as the nozzle hole) _ the distance between the substrates (m) is approximately 1. In addition, when the substrate is used as the substrate, the substrate is opposed to the nozzle, and the charge Q is induced at a symmetrical position in the substrate. The mirror charge Q' of the opposite polarity. When the substrate is an insulator, the image charge q of the reverse polarity of the charge Q is induced in the same manner as the symmetrical position determined by the dielectric constant. The concentrated electric field strength Eloc of the sneeze , assuming that the radius of curvature of the front end portion is R, then (9) where k is determined by the nozzle shape Proportionality constant, etc., and takes a value of about 1.5~8 5 'is typically about 5 (P.J · Birdseye and D.A. Smith, Surface

Science,23(1970),Ρ·198-210)。此外,此處為求簡化流體排 95731.doc -23- 1255232 出模型,而假定R=d/2。其相當於在噴嘴前端部,流體藉 由表面張力而凸起成具有與噴嘴徑d相同曲率押〃心曰 狀之狀態。 *之半球形 考慮作用於噴嘴前端之流體之壓力的平衡。首 壓力pe於喷嘴前端部之液面積為8時,則為 貫先 靜電Science, 23 (1970), Ρ 198-210). In addition, here is a simplified model of the fluid row 95731.doc -23- 1255232, assuming R = d/2. This corresponds to a state in which the fluid is raised by the surface tension at the tip end portion of the nozzle to have the same curvature as the nozzle diameter d. * Hemispherical Consider the balance of the pressure of the fluid acting on the front end of the nozzle. When the first pressure pe is 8 at the front end of the nozzle, it is the first static electricity.

PePe

S E __ loc loc (10) 依據公式(8)〜(10),壓力pe於α = 1時, ^ .4,Λ 2F0.8^ 丁幻表不成 d H …(11) 另外,喷嘴前端部之流體之# 一(12)SE __ loc loc (10) According to the formula (8) ~ (10), when the pressure pe is α = 1, ^ .4, Λ 2F0.8 ^ 幻 表 表 d d ... (11) In addition, the front end of the nozzle Fluid #一(12)

。夂心之表面張力之壓力匕為 d 其中,r :表面張力。藉由靜電力引起排出之條件,由 靜電力提高表面張力,因此靜電之壓力h與表面張力之 力Ps之關係為. The pressure of the surface tension of the heart is d d where r: surface tension. The surface tension is increased by the electrostatic force caused by the electrostatic force, so the relationship between the electrostatic pressure h and the surface tension force Ps is

Pe>P, (13)Pe>P, (13)

圖2顯示賦予某個直徑d之喑喈 ^ <貝鳥時之表面張力之壓力PSJ 靜電之壓力pe之關伤。沪w +士Figure 2 shows the pressure of the surface tension of a certain diameter d ^ < the pressure of the surface tension of the shellfish PSJ static pressure pe. Shanghai w + Shi

— ’、,,L體之表面張力假定流體為水(, —72 mN/m)時。施加於噴嘴之兩茂 、 貝角 < 私壓為700 V時,於喷嘴直徑 為25 μχη時,顯示靜電之壓力p _ &刀^棱咼表面張力之壓力Ps。£ 此求出V〇與d之關係,為 F〇>]l^ …(14) 供給排出之最低電壓。 此外’此時之排出壓力△ P為 Δ P= pe-ps …(15) 95731.doc -24- 1255232 因此 ΔΡ :8ε〇ν〇2 4/ kd2 d (16) 對於某個直徑d之喷嘴’藉由局部電場強度滿足排出停件 時之與排出塵力ΔΡ之關連性顯示於圖3,此外,盘排出奸 界電雜即產生排出之最低卿c之關連性顯示於圖4: 從圖3可知藉由局部電場強度滿足排出條件時(假定 L = 700 V,r =72 mN/咖夺)之喷嘴徑之上限為乃厂爪。 —圖4之計算係假設流體為水(r=72 涵/m)及有機溶劑卜 ^20,N/m) ’假定k=5之條件。從該圖瞭解考慮微細喷嘴之 包麥本t效果% ’#出臨界電麼Ve隨嗔嘴徑縮小而降低, 亚瞭解流料水時,於喷嘴徑為25卿時,排出臨界電㈣ 約為700 V。 先前排出模型之電場考慮方 + # 々I丨里V把猎由知加 貝^之私壓V〇與喷嘴_相對電極間距離“定義之電場時 酼著貝觜徑微小,排出所需之驅動電壓增加。 立,如使用上述局部電場之新的排出模型,著眼於局 h %強度時’藉由微細噴嘴化即可降低排出時之驅動電 昼°士此種驅動電壓之降低在裝置之小型化及喷嘴之高密度 α為有利。當然,藉由降低驅動電壓,亦可使用成本 效益高之低電壓驅動驅動器。 ,者i逑排出模型,由於排出所需之電場強度取決於 口、义市中包%強度,因此無須存在相對電極。亦即,由 ;,排出杈型係在喷嘴一基板間施加電場,因此對於 絕緣體之某妃π > P 、 肩在與噴嘴相反側配置相對電極,或是將基 95731.doc -25- 1255232 板幵y成$電性。而配置相對電極時,亦即基板為絕緣體時, 可使用之基板厚度受限。 反之,本發明之排出模型不需要相對電極,即使對於絕 緣性基板等仍可進行印字,裝置構造之彈性增加。此外, 即使對厚絕緣體仍可進行印字。 此外,圖5顯示作用於與基板間之鏡像力之大小與距基板 之距離h之關係。從圖上可知,基板與噴嘴間之距離愈近該 鏡像力愈顯著,且於h為20 μπι以下時特別顯著。 其-人,考慮排出流Κ之精密控制。圓筒狀流路之流量卩 於黏性流時,:係藉由以下之Hagen-p〇iseuille公式來表示。 此時假定圓筒形之喷嘴,流入該噴嘴之流體之流量q由以下 公式表示 πΑΡ— The surface tension of the ',,, L body is assumed to be water (, -72 mN/m). When the private pressure is 700 V, the pressure of static electricity p _ & the pressure Ps of the surface tension of the knife edge is displayed when the nozzle pressure is 25 μχ. £ This finds the relationship between V〇 and d, and supplies the lowest voltage for discharge to F〇>]l^ (14). In addition, the discharge pressure Δ P at this time is Δ P = pe - ps ... (15) 95731.doc -24 - 1255232 Therefore ΔΡ : 8ε〇ν〇2 4 / kd2 d (16) For a nozzle of a diameter d The correlation between the discharge intensity and the discharge dust force ΔΡ by the local electric field strength is shown in Fig. 3. In addition, the correlation between the disc discharge and the lowest output of the discharge is shown in Fig. 4: It can be seen that the upper limit of the nozzle diameter when the local electric field strength satisfies the discharge condition (assuming L = 700 V, r = 72 mN/g) is the factory claw. - The calculation in Fig. 4 assumes that the fluid is water (r = 72 cul / m) and organic solvent (20, N / m) apos assuming k = 5. From this figure, we can see that the effect of the micro-nozzle is as follows: %E is the critical electric power, and Ve is reduced with the diameter of the nozzle. When the flow of water is known, when the nozzle diameter is 25, the critical electric power is discharged (4). 700 V. The electric field of the previous discharge model considers the side + # 々I丨里V, the private pressure V〇 of the hunting and the nozzle _ the distance between the opposite electrodes, the distance between the electrodes is defined by the small electric field, and the driving force required for discharging The voltage is increased. If a new discharge model using the above partial electric field is used, focusing on the local h% intensity, the driving force can be reduced by the fine nozzle, and the driving voltage is reduced in the device. The high density α of the nozzle and the nozzle are advantageous. Of course, by lowering the driving voltage, it is also possible to use a cost-effective low-voltage driving driver. The output of the electric field required for the discharge depends on the mouth and the city. The medium is included in the % strength, so there is no need to have a counter electrode. That is, the discharge type is applied between the nozzle and the substrate. Therefore, for the insulator π > P , the shoulder is disposed on the opposite side of the nozzle. Or the base 95731.doc -25 - 1255232 board is $ y into electric. When the opposite electrode is arranged, that is, when the substrate is an insulator, the thickness of the substrate that can be used is limited. Conversely, the discharge model of the present invention does not need to be For the counter electrode, the printing can be performed even for an insulating substrate or the like, and the elasticity of the device structure is increased. Further, printing can be performed even for a thick insulator. Further, Fig. 5 shows the magnitude of the mirror force acting on the substrate and the distance from the substrate. The relationship between the distance h. As can be seen from the figure, the closer the distance between the substrate and the nozzle is, the more pronounced the image power is, and it is particularly remarkable when h is 20 μπι or less. It is considered to be a precise control of the discharge flow. When the flow rate of the flow path is viscous, it is expressed by the following Hagen-p〇iseuille formula. At this time, a cylindrical nozzle is assumed, and the flow rate q of the fluid flowing into the nozzle is expressed by the following formula:

Q dl (17) 其中,θ ··流體之黏性係數(Pa· s),L:流路亦即噴嘴 之長度(m),d :流路亦即噴嘴孔之直徑(m),△ p :壓力差 (Pa)。從上述公式可知,由於流量Q與流路半徑之*次方成 正比,因此可採用微細之喷嘴來限制流量。將公式(16)求出 之排出壓力△ P代入該公式(丨7)中而獲得以下公 2£Λ kdQ dl (17) where θ ·· fluid viscosity coefficient (Pa· s), L: flow path, ie the length of the nozzle (m), d: flow path, ie the diameter of the nozzle hole (m), Δ p : Pressure difference (Pa). It can be seen from the above formula that since the flow rate Q is proportional to the power of the flow path radius, a fine nozzle can be used to limit the flow rate. Substituting the discharge pressure Δ P obtained by the formula (16) into the formula (丨7) to obtain the following information:

Q (18) 47ld3i^^2 ^ -rQ (18) 47ld3i^^2 ^ -r

該公式表不在直徑d、長度L之噴嘴上施加電壓v時,自 嘴嘴流出之流體的流出量。圖6顯示該狀態。計算時係使用 L=10mm,n(mPa· s),r = 72(mN/m)之值。此時,噴 嘴之直徑假定為先前技術之最小值5〇 μηι。逐漸施加電壓V 95731.doc -26- 1255232 日守,於電壓v= 1000 v時開始排出。該電壓相當於圖4中說 明之開始排出電壓。此時自喷嘴之流量顯示於y軸。在開始 排出電壓VC正上方,流量急速增加。 該模型計算上,藉由使電壓稍高於Vc來進行精密控制, …彳‘仔彳放小之流ΐ,不過從半對數顯示之圖亦可知實際 上不可能,特別是不易實現1(rl〇m3/s以下之微小量。此外, 2用某個直彳里之噴嘴時,如公式(1 4)所示,係決定最小驅動 甩壓。因而如先前技術,若使用直徑為50 以上之喷嘴 日守,不易達到l〇-i〇m3/s以下之微小排出量及1〇〇〇 V以下之 驅動電壓。 從圖中可知,直徑為25 Mm之喷嘴只須700 V以下之驅動 电壓’直控為1〇 μηΐ2噴嘴,5〇〇 v以下即可控制。此外, 直徑為1 μιη之噴嘴只須3〇〇 ν以下。 如以上所述’本實施形態之靜電吸引型流體排出裝置, ;係依據著眼於局部電場強度而新提出之排出模型,因 匕可幵/成多、鳥控為〇 〇1 〜25 之微細喷嘴,且以1〇〇〇 ν 以下之驅動電廢即可進行排出流體之排出控制。另外,依 據上述模型進行考察結果,直徑為25 ^❿之喷嘴時,以700 V 以下之驅動弘壓;直徑為1〇 以下之喷嘴時,以V以 下之驅動私壓’直徑為1 Mm以下之喷嘴時,以3〇〇 V以下之 驅動電壓,即可進行排出控制。 本貝施形恶之靜電吸引型流體排出裝置如上述,可同時 、、、但1貝紫t及驅動電壓,不過此時與先前之靜電吸引型流 體排出裝置比較,以下之情形顯著。 95731.doc -27- 1255232 ’為上述之靜電吸引型流體排出裝置時,其排出特 山土上係取決於自流體排出頭内部之驅動電極至喷嘴前 端:排出流體流路内之電阻值,纟電阻值愈低,排出反: 性愈高。/亦即,藉由降低排出流體流路内之電阻值,可提 南驅動頻率’亦可排出更高電阻之排出流體㈣,而可擴 大排出流體材料之選擇。 ΚThis formula shows the amount of fluid flowing out of the nozzle when the voltage v is applied to the nozzle of diameter d and length L. Figure 6 shows this state. The calculation uses L = 10 mm, n (mPa·s), and r = 72 (mN/m). At this time, the diameter of the nozzle is assumed to be the minimum value of the prior art 5 〇 μηι. The voltage V 95731.doc -26- 1255232 is gradually applied, and the discharge starts when the voltage is v=1000 v. This voltage corresponds to the discharge voltage at the beginning of the description in Fig. 4. At this time, the flow rate from the nozzle is displayed on the y-axis. At the beginning of the discharge voltage VC, the flow rate increases rapidly. In the calculation of the model, precise control is performed by making the voltage slightly higher than Vc, ... 彳 彳 彳 彳 彳 彳 ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ 半 半 半 半 半 半 半 半 半 半 半 半 半 半 半微小m3/s or less. In addition, when using a nozzle in a straight boring, as shown in the formula (1 4), the minimum driving pressure is determined. Therefore, as in the prior art, if a diameter of 50 or more is used, The nozzle is defensive, and it is difficult to achieve a small discharge amount below 1〇-i〇m3/s and a drive voltage below 1〇〇〇V. It can be seen from the figure that a nozzle with a diameter of 25 Mm only needs a drive voltage of 700 V or less. The direct control is 1〇μηΐ2 nozzle, and can be controlled below 5〇〇v. In addition, the nozzle having a diameter of 1 μηη only needs to be 3〇〇ν or less. As described above, the electrostatic attraction type fluid discharge device of the present embodiment; Based on the new discharge model based on the local electric field strength, it can be discharged by a small nozzle with a diameter of 1 to 25, and can be discharged with a drive of 1 〇〇〇 ν or less. Fluid discharge control. In addition, according to the above model As a result, when the nozzle has a diameter of 25 μ❿, the pressure is driven by 700 V or less; when the nozzle has a diameter of 1 〇 or less, when the nozzle is less than V, the nozzle having a diameter of 1 Mm or less is 3 〇. The discharge voltage can be controlled by the driving voltage below 〇V. The electrostatic attraction type fluid discharge device of the Benbe is as follows, but at the same time, but 1 b purple and the driving voltage, but at this time and the previous electrostatic attraction Compared with the type of fluid discharge device, the following situation is remarkable. 95731.doc -27- 1255232 'When the above electrostatic attraction type fluid discharge device is used, the discharge on the special mountain depends on the drive electrode from the inside of the fluid discharge head to the nozzle front end. : The resistance value in the discharge fluid flow path, the lower the 纟 resistance value, the higher the discharge reverse: the higher the performance. That is, by lowering the resistance value in the discharge fluid flow path, the south drive frequency can be discharged higher. The discharge of the resistor (4) expands the choice of the fluid material to be discharged.

一、“氐上述电阻值,可縮短驅動電極一噴嘴前 之距離。 U1. “The above resistance value can shorten the distance before the drive electrode and the nozzle. U

[第一種實施形態] 使用圖7〜Η 12說明本發明一種實施形態如下。 (噴嘴式平板) 圖7⑷係本實施形態之喷嘴式平板8之一部分立體圖,圖 7(b)係圖7⑷之Α·Α,線剖面圖。喷嘴式平板8上形成有2個以 上之流體排出孔9’圖7⑷中顯示有2個流體排出孔9。此外, 圖7(c)係自流體供給側觀察噴嘴式平板8之一部分之立體 如圖7⑷〜⑷所示,噴嘴式平板8具傷:第—喷嘴層上、第 貝觜層2第一電極層25、第二電極層26及喷嘴孔(噴嘴 孔部)11。 、 弟-贺嘴層1之流體排出側之面構成喷嘴式平板8之流體 ㈣面^並形成拒液層4,在其相反側之流體供給側配置 有第二喷嘴層2。此時’第一喷嘴層Ud形成…至8 _之 非常薄之厚度,層厚之第二喷嘴層2可確保噴嘴式平板8之 強度及剛性。此時確保強度及剛性用之第二喷嘴層以系採用 95731.doc -28- 1255232 1層,不過亦可為2層以上。 噴嘴孔11係由貫穿第一喷嘴層丨之第一噴嘴孔丨丨a,與貫 牙第二喷嘴層2之第二喷嘴孔11 b構成。此時第一喷嘴孔i丄a 之壁面係垂直於喷嘴式平板8之流體排出面8a之大致圓筒 形狀,形成有拒液層4之流體排出面8a之大致圓形之開口部 成為流體排出孔9。另外,第二喷嘴孔i lb係自與圓筒形狀 之第一喷嘴孔1 la連通之側之開口部扇形擴大之錐角形狀 (圓錐台形狀),並通過第二喷嘴層2,在與第一喷嘴層丨相反 側之流體供給面8b上開口。形成於該第二喷嘴層2之表面亦 有之流體供%面8b之第二噴嘴孔丨lb之大致圓形之開口部 成為流體供給孔12。 在第一喷嘴孔11a之内壁之大致全面,及第一喷嘴孔lla 與第二喷嘴孔1 lb連通之連通孔(連通部)丨1χ周邊,形成有第 一電極層25。該第一電極層25包含:圓筒部25a及延伸部 25b。上述圓筒部25a形成於上述喷嘴孔Ha之内壁大致全 面。上述延伸部25b在第一噴嘴孔Ua與第二喷嘴孔m連通 之連通孔11X周邊,形成以連通孔11χ作為大致中心之圓環 形狀。延伸部25b形成有圓錐台形狀之第二噴嘴孔nb之上 底liy。亦即,第一喷嘴孔lla與第二喷嘴孔llb之連通孔 Πχ(大致圓形)之口控為di時,di小於第二喷嘴孔iib之上 底(流體排出側之開口部)lly之口徑D2。而形成圓環形狀之 第一電極層25之延伸部25b之外徑D3大於口徑D2。 此外,在第二喷嘴孔:Hb内壁形成有與上述第一電極層25 黾(連接之第一電極層26。該第二電極層26之一部分亦配 95731.doc 1255232 置於噴嘴式平板8之流體供給面肋上,其—部分如圖7⑷所 丁形成引出配線26a ’並連接於排出信號電壓施加手段(圖 上未顯示)。 另外,圖7(a)及圖 於構成噴嘴孔丨丨之第 之第一電極層25及第 27(c)中,為求簡化圖式,而省略形成 一喷嘴孔1 la及第二噴嘴孔丨lb各内壁 一電極層2 6。 以下說明各部之尺寸及材質之具體例,不過本發明並不 限定於其具體例。 第一噴嘴層1使用厚度約1 μπι之聚醯亞胺膜,第二喷嘴層 使用厚度、、、勺go 之聚酸亞胺膜。第一電極層之厚度為 〇·5 μιη,並包含以鈦為主要成分之金屬材料,其中之圓筒 部25a形成至第一噴嘴孔Ua内壁之流體排出侧端部。另 外L伸邛25b之外徑D3約20 gm。形成於第一喷嘴層i與第 二喷嘴層2之界面之電極層等形成於整個界面時,雖會造成 因整個喷嘴式平板之應力而產生翹曲,不過此種延伸部25b 採用各喷嘴孔U局部設置之構造,則可降低此種應力造成 之魅曲。 另外,第二電極層26之厚度為〇·5 Mm,同樣地包含以鈦 為主要成分之金屬。而第二電極層26之與第一電極層以之 連接部分26b,如圖8所示,係以面與第一電極層乃之延伸 部25b接觸’來確保高度之連接可靠性。 第一唷嘴孔11 a之成為流體排出孔9之開口部之口徑約為 3 μιη,由於其中形成有厚度為〇·5 之第一電極層Μ,因 此流體排出孔9之實際徑(直徑)約為2/xm。此外,第二喷嘴 95731.doc -30- 1255232 孔lib之上底lly之口徑D2為10 /mi’成為流體供給孔12之開 口部之口徑為30 μηι。 本構造之喷嘴式平板8中,為求可排出超微量流體而形成 微細點,須使流體排出孔9為__以下,更宜為㈣_以 下。藉由形成此種孔徑(直徑),可縮小形成廣範圍所需之電 場’可大幅降低移動電荷所需之電壓,亦即賦予該流體靜 電吸引流體所需帶電量用之所需電壓。藉此,由於無須如 先前需要2000 V之高電壓,因此可謀求提高使用流體噴射 裝置時之安全性。 . 特別是形—8/m以下時,電場強度分布冑效集中於該流 體排出孔之排出面近旁,並且自相對電極至喷嘴之流體突 出孔之距離變動不影響電場強度分布。藉此,不受相對電 極之位置精確度、§己錄媒體之材料特性偏差及厚度偏差之 影響,而可穩定排出流體。 此外,如上述,藉由可將電場強度分布集中於流體排出 孔9之排出面近旁’即可在窄區域内形成強電場,如此可將 可排出之流體量形成超微量。藉此,於流體為墨時,印字 圖像可形成高解像度。 此外,第一贺嘴層i上之拒液層4係藉由厚度約〇 敗聚合或料、高分子膜而形成。上述拒液層4如後述,係 由乾^餘刻除去階躍式覆蓋於流體排出孔9内之多餘區域 本Λ化形‘%由於對噴灑精確度影響重大之噴嘴式平由 之流體排出孔9之形I係由上述> 之聚醯亞胺膜之加 精t度來决定,因此流體排出孔9之加工精確度非常高, 95731.doc 1255232 時可確保非常高之喷灑精確度。 此外,為求提高流體排出孔9之加工精確唐,^ 1 & 阳减少露出 於喷嘴式平板8之流體排出面之第一喷嘴層1之 〜嗎厚時,可 獲得更高之加工精確度。此時,藉由減少第_味 貝馬層1之膜 厚,雖第一喷嘴層1之剛性降低,流體排出孔9之妗構丨生、 可罪性降低’不過藉由與第一喷嘴層1接觸 Μ I直罘二噴嘴 層2,來補強第一喷嘴層丨,則不致降低第一噴嘴層1之妹 性之可靠性,而可提高流體排出孔9之形狀精確度。亦^, 作成具有微細之流體排出孔9之喷嘴式平板8時,須採取此 種構造。 此外,由於第一電極層25係在噴嘴孔丨丨之各形成位置局 部設置,因此與配置於鄰接之喷嘴孔丨丨之第一電極層乃電 性絕緣。因此,可在各個通道單獨施加排出信號,9串: (Crosstalk)少,藉此可提高描繪圖像之解像度。 此外,由於第二喷嘴孔llb係錐角形狀,因此在第二喷嘴 孔lib内部不易產生流體之亂流,可提高流體之排 性’並且’由於喷嘴孔Ub之内壁與流體供給面扑之邊緣變 寬,因此可有效抑制延伸至流體供給面朴之第二電極層% 之斷線。此外,藉由形成於喷嘴式平板8之流體排出面二之 拒液層4可防止流體附著於流體排出孔9近旁。 另外’用於第一電極層25之材料並不限定於以鈦為主要 成分,金屬材料。只要係在第二噴嘴層2之姓刻加工及階躍 式覆蓋於後述之犧牲層5及流體排出孔9内之拒液層4之蝕 刻%’對该银刻具有高耐性之材料,,亦即對敍刻氣體(含氧 95731.doc -32- 1255232 之電漿及含氟之電繁 曰 等)对性高之材料即可。=㈣劑(硝酸、氫氧化卸水溶液 鐵、錄、金、麵、知;體而s’如以欽、銘、鋼、错、 可藉由與上述二二銳等為主要成分之金屬材料, 同樣地,;=:糊劑之組合來選擇。 要成八之入严層26之材料亦不限定於以鈦為主 要成刀之金屬材料。只要係在階躍式覆苗為主 及流體排出孔9内之拒液層4之钱 ^犧牲層5 性之材料,, ' + W亥普虫刻具有高耐 七e / ^ P對蝕刻氣體(含氧之電漿及含氟之恭將箄) 或疋钱刻劑(硝酸奇童 屯水寻) 旦體而▲ 氧卸水溶液等)耐性高之材料即可。 具體而s,以鈦、銘、銅、銘、鐵、錄、全、勤7 鎢、銳等為主要成分之金屬材料, 飾、组、 或蝕刻劑之組合來選擇。 〜上述蝕刻氣體 可於f 一喷嘴層1之材料並不限定於聚酿亞胺。亦 …“服亞胺以外之高分子有機材料,亦可 :?化卿狗化合物材料,或是亦可二/ 用於…嘴層2之材料亦不限定於聚 SI同樣地,亦可為聚酿亞胺以外之高分子有機材Π 可為乳化石夕、氮切等石夕化合物材料,或是亦可為石夕。、 乂:外’本實施形態之第二噴嘴孔m並不限定於在與第— 貝孔1U之連通部分變窄之圓錐台形狀(錐角 所示之喷嘴式平板8,,第二喷嘴孔Ub,之内壁亦 二9 嘴式平板8 ’之流體排出面8 a及流體供給面8 b垂直^二貝 直(Straight)形狀(圓筒形狀)。 明筆 此時,可將第二喷嘴孔llb,之流體供給孔…使叫)〜⑷ 95731.doc -33- 1255232 12二^嘴嘴孔111?小於圓錐台形狀構成之流體供給孔 ^1—步提高喷嘴之積體度。此夕卜,如圖7⑻所示, 二^式平板8時,依其製造上之情況,第二電極層26 第二嘴嘴孔llb内壁之1個側面,不過如圖9所示, 亦可形成於第二噴嘴孔Ub之整個内壁面。 糟由形成本實施形態構造之噴嘴式平板8(8,),可發揮以 下①〜⑤之作用。 ① 流體排出孔9即使是口徑為8師以下之維繫喷嘴式平板 8(8 ),仍可形成可施加排出信號電磨至喷嘴孔11前端之結 構性穩定之零極。 ② 在第二噴嘴層2之流體供給側,藉由分離第二電極層26成 I免,接通逼間電性短路’可輕易地對各個通道單獨施加 g出L唬串9少,藉此可提高描繪圖像之解像度。 ③ 由於可以第二噴嘴層2維持噴嘴式平板咐,)之剛性,因此 整個喷嘴式平板8(8,)之剛性提高,容易處理。 ④ 在膜厚較厚之第二噴嘴層2上加工之第二喷嘴孔m之加 ^精確度即使較差’由於第二喷嘴孔i化加工時,係以第— 電極層25之延伸部25b停止餘刻,因此不影響控制流體排出 量之流體排出孔9。 ⑤ 由於第一電極層25與形成於與第一喷嘴孔Ua連通之第 二喷嘴孔m之第二電極層26電性連接,因此可經由第二電 極層26,自噴嘴式平板8之流體供給側供給驅動信號,不致 因供給驅動k號至第—電極層25用之引出配線—產生之 電場使記錄媒體受到電性損傷。 95731 .doc -34- 1255232 (喷嘴式平板之製造方法) 其次說明本實施形態之嘴嘴式平板8之_種製造方法。圖 10(a)〜(i)係喷嘴式平板8製程之說明圖。 首先,在包含矽及玻璃等之任意厚度之暫時保持用之基 板6上,藉由使用鎳之濕式電鑛(電鑛)而形成犧牲層5。進: 步在犧牲層5上,藉由自旋式塗敷來塗敷聚醯亞胺樹脂,在 350°C下燒成2小時而形成第一噴嘴層丨。此時犧牲層^之厚 度為ΙΟμιη,第一喷嘴層i之厚度為丨^^。 其次,在上述第一噴嘴層匕以光阻形成第一喷嘴孔^ 之開口圖案藉由使用以氧為主要成分之氣體之乾式敍 刻,將第一噴嘴孔lla予以加工(參照圖1〇(心)。 本钱刻方法可高速且精確度佳地加卫聚醯亞胺樹脂等之 有機物,並且與犧牲層5之鎳之姓刻選擇性高(録幾乎未被 蝕刻)。因此,犧牲層5不致因上述加工而受到重大損傷, :維持犧牲層5表面之平坦性,因此形成於犧牲層$表面之 貝貧式平板8之流體排出面之平坦性不致惡化。此外,由於 本加工係以非常高之精禮度進行’因此係使用各向異性高 之钱刻條件。此外,如上所述,由於第一噴嘴層丨極薄僅為 ,因此可高精確度加工排出超微量流體用之第一喷嘴 孔 11 a。 ' 二、在加工第一賀嘴孔U a之第一喷嘴層1上,以濺射 =成包31太為主要成分之金屬材料之第一電極層25。進 —步在上述第—電極層25上形成對應於喷嘴孔開口部形狀 之先阻圖案27(參照圖剛)。此時,由於上述第一電極層 95731.doc -35- 1255232 25需要形成於第一噴嘴孔Ua内壁,因此,為求提高第一電 極層25之階躍式覆蓋性,在3〇 mT〇rr2氬氣壓條件下,第 一喷嘴層1上之膜厚係形成〇·5 μηι。 其次,以使用氬為主要成分之氣體之電漿之乾式蝕刻, 將第一電極層25加工成在第一喷嘴層!上殘留直徑約2〇 之成為上述延伸部25b之大致圓形形狀,並除去光阻(參照 圖10(c))。該加工步驟為求抑制形成於上述第一喷嘴孔 内壁之第一電極層25(圓筒部25a)之損傷,及除去形成於成 為第一贺嘴孔11 a之底之犧牲層5上之第一電極層25,而採 用各向異性g之蝕刻條件。 另外’局部殘留於上述第一喷嘴層丨上之上述延伸部 25b,此時係形成大致圓形形狀,不過在加工步驟上不需要 為大致圓形形狀,如後述,只要是第二喷嘴孔丨lb之上底^ & 係配置於在第一喷嘴層丨上自第一喷嘴孔Ua延伸而形成之 延伸部25b内之形狀即可。 但是’本喷嘴式平板係應用於靜電吸引型流體排出裝置 之贺鳴式平板8,由於係經由第一電極層25而在喷嘴前端部 施加排出號,因此在弟一電極層2 $中,除喷嘴前端部之 外’電場亦集中於第一喷嘴層1上之形狀之端部。因而,為 求使集中於上述第一喷嘴層1上之延伸部25b端部之電場均 化,延伸部25b之形狀須加工成接近各向同性高之圓形形 狀。 其次’在上述第一喷嘴層i及第一電極層25上,以2〇 μχη 之厚度形成第二喷嘴層2(參照圖i〇(d))。第二喷嘴層2與第 95731.doc -36· 1255232 :鳴層1同樣地係以自旋式塗敷法塗敷塗敷型聚酿亞胺 j月曰’亚在35(TC下燒成2小時而形成2〇,之厚度。此時第 一賀嘴孔Ua亦被聚酸亞胺㈣掩埋。第二喷嘴層 補強南精確度加工之膜厚薄之第—喷嘴層!之目的而形 成,具有提高整個喷嘴式平板8之剛性之效果。 7 2次、,:上述第二喷嘴層2上,藉由光钱刻而形成光阻圖 ::一 订使用以氧為主要成分之氣體之乾式蝕刻,而在 “贺嘴層2上形成圓錐台形狀之第二喷嘴孔叫袁昭圖 叫))。另外’上述乾式敍刻可以形成於第一噴嘴以上之 ^ -電㈣25之延伸部25a(25b)停止。㈣,由於使用以氧 為主要成分之氣體之乾式蝕刻幾 A·成手不钱刻以鈦為主要成分 之孟屬材料所形成之第一噴嘴 + 貝馬層1因此在第一電極層25 :出之部位’乾式钱刻不再繼續進行,而可輕易除去在前 :個步驟埋入第一噴嘴孔山之第二噴嘴層2。此外,上述 弟一贺嘴孔lib之加工,力盘笛 + ^ 在與弟一噴嘴層1之接合部,第二 1噶孔11 b之上底11 v [si安几J、 底Uy圖案化成配置於第-電極層25之延伸 部25b内。 日〜、开 弟一育嘴孔11 b之錐肖形壯a 士 狀加工日守,上述蝕刻係採用使光 圖木28之韻刻率與第二喷嘴 卞λ 貝角層2之聚醯亞胺樹脂之蝕刻 率大致相等,藉由將該光 口木28在150 C下事後烘烤60 刀知’將光阻圖案28作為錐角 ,π ^ 月Φ狀稭由蝕刻將該形狀轉 印於第二噴嘴層2之方法。 # 亦即’如圖Π (a)所示,餘― 」羊舁構成弟二噴嘴層2之聚醯 亞月女樹脂大致相等,形成且古 /、有錐角j面28a之光阻圖案28, 9573 l.doc - 37- 1255232 亚以與第二喷嘴層2之钱刻㈣速度來㈣光阻圖㈣,擴 光阻圖木28之邊緣。此時,如圖} i⑻所示,第二喷嘴層2 亦同時被㈣,結果在第二喷嘴層2上,如圖H⑷所示,曰形 成具2與具有形成於光阻圖案28之錐角之壁面28A相同形 狀之第一贺嘴孔11 b。此外,此時由於光阻圖案28與第二喷 紫層2之钱刻率大致相等’因此須形成光阻圖案^之厚度比 第貝紫層2之厚度更厚。另外,圖u中省略形成於第一喷 嘴層1之第一喷嘴孔Ua部分之記載。 其次,在上述第二噴嘴層2上形成包含以鈦為主要成分之 金屬材料之!二電極層26。此時係使用離子束濺射法,在 0.2 mTon·之風氣壓下,抑制鈦粒子因氬原子而散射,並傾 斜基板使鈦粒子自箭頭κ之方向射達,而僅形成於第二喷嘴 -内土面之側,且第二電極層26之一部分形成與第一電 極層25電性短路(參照圖i 〇(f))。膜厚係〇·5。 /、" 匕藉由自斜方向入射鈦粒子來形成第二電極層26, 可防止第二電極層26附著於第一喷嘴孔11a内,藉此,可防 止第一喷嘴孔11 a之形狀變化及堵塞。 其-人,在上述第二電極層26上形成光阻圖案29來覆蓋第 二喷嘴孔1 lb與形成於第二喷嘴層2上之第二電極層%之一 部分(參照圖10(g))。該光阻圖案29只須形成覆蓋第二喷嘴 孔lib與形成於第二噴嘴層2上之第二電極層%之一部分即 可,不過本實施例中,形成於第二喷嘴層2上之第二電極層 26為可加工成大致5〇/^111徑之圓形形狀的形狀。此時,由於 光阻圖案29係形成埋入第二噴嘴孔ub,因在匕在第二喷嘴孔 95731.doc -38- 1255232[First Embodiment] An embodiment of the present invention will be described below with reference to Figs. 7 to 12 . (Nozzle type flat plate) Fig. 7 (4) is a partial perspective view of the nozzle type flat plate 8 of the present embodiment, and Fig. 7 (b) is a line cross-sectional view of Fig. 7 (4). Two or more fluid discharge holes 9' are formed in the nozzle plate 8, and two fluid discharge holes 9 are shown in Fig. 7 (4). Further, Fig. 7(c) is a perspective view of a portion of the nozzle plate 8 viewed from the fluid supply side as shown in Figs. 7(4) to (4), and the nozzle plate 8 is wounded: the first electrode of the first nozzle layer and the first beak layer 2 The layer 25, the second electrode layer 26, and the nozzle hole (nozzle hole portion) 11. The surface on the fluid discharge side of the mouthpiece layer 1 constitutes the fluid of the nozzle plate 8 (4) and forms the liquid repellent layer 4, and the second nozzle layer 2 is disposed on the fluid supply side on the opposite side. At this time, the first nozzle layer Ud forms a very thin thickness of ... to 8 _, and the second nozzle layer 2 of the layer thickness ensures the strength and rigidity of the nozzle plate 8. In this case, the second nozzle layer for ensuring strength and rigidity is one layer of 95731.doc -28- 1255232, but it may be two or more layers. The nozzle hole 11 is constituted by a first nozzle hole 丨丨a penetrating the first nozzle layer , and a second nozzle hole 11b penetrating the second nozzle layer 2 of the second nozzle layer. At this time, the wall surface of the first nozzle hole i丄a is substantially perpendicular to the fluid discharge surface 8a of the nozzle plate 8, and the substantially circular opening of the fluid discharge surface 8a of the liquid repellent layer 4 is formed as a fluid discharge. Hole 9. Further, the second nozzle hole i lb is formed in a taper shape (cone shape) in which the opening portion on the side communicating with the first nozzle hole 1 la of the cylindrical shape is fan-shaped, and passes through the second nozzle layer 2, and The fluid supply surface 8b on the opposite side of the nozzle layer is open. The substantially circular opening portion of the second nozzle hole 丨1b of the fluid supply % surface 8b formed on the surface of the second nozzle layer 2 serves as the fluid supply hole 12. A first electrode layer 25 is formed on the periphery of the inner wall of the first nozzle hole 11a and the communication hole (communication portion) 连通1χ where the first nozzle hole 11a and the second nozzle hole 11b communicate with each other. The first electrode layer 25 includes a cylindrical portion 25a and an extending portion 25b. The cylindrical portion 25a is formed on substantially the entire inner wall of the nozzle hole Ha. The extending portion 25b has a ring shape in which the communication hole 11A is substantially the center around the communication hole 11X through which the first nozzle hole Ua and the second nozzle hole m communicate. The extending portion 25b is formed with a second nozzle hole nb in the shape of a truncated cone. That is, when the mouth of the first nozzle hole 11a and the second nozzle hole 11b is substantially di, the di is smaller than the bottom of the second nozzle hole iib (the opening of the fluid discharge side) lly Caliber D2. The outer diameter D3 of the extending portion 25b of the first electrode layer 25 forming the annular shape is larger than the diameter D2. In addition, a second electrode hole: Hb inner wall is formed with the first electrode layer 25 黾 (the first electrode layer 26 is connected. One part of the second electrode layer 26 is also provided with 95731.doc 1255232 placed on the nozzle plate 8 The fluid supply surface rib is partially formed as shown in Fig. 7 (4) and connected to the discharge signal voltage applying means (not shown). In addition, Fig. 7 (a) and Fig. 7 constitute a nozzle hole In the first electrode layer 25 and the second (c), in order to simplify the drawing, the inner wall-electrode layer 26 of each of the nozzle hole 1 la and the second nozzle hole 丨 lb is omitted. Specific examples of the material, but the present invention is not limited to the specific examples. The first nozzle layer 1 is a polyimide film having a thickness of about 1 μm, and the second nozzle layer is made of a polyimide film having a thickness and a spoon. The first electrode layer has a thickness of 〇·5 μm and contains a metal material mainly composed of titanium, wherein the cylindrical portion 25a is formed to the fluid discharge side end portion of the inner wall of the first nozzle hole Ua. The outer diameter D3 is about 20 gm. It is formed on the first nozzle layer i and the first When the electrode layer or the like at the interface of the nozzle layer 2 is formed over the entire interface, warpage may occur due to the stress of the entire nozzle plate. However, such an extension portion 25b is partially disposed in each nozzle hole U, thereby reducing this. In addition, the second electrode layer 26 has a thickness of 〇·5 Mm, and similarly includes a metal containing titanium as a main component, and the second electrode layer 26 is connected to the first electrode layer by a portion 26b. As shown in FIG. 8, the surface is in contact with the extension portion 25b of the first electrode layer to ensure the connection reliability of the height. The aperture of the first nozzle hole 11a which becomes the opening portion of the fluid discharge hole 9 is about 3 μιη, since the first electrode layer 厚度 having a thickness of 〇·5 is formed therein, the actual diameter (diameter) of the fluid discharge hole 9 is about 2/xm. Further, the second nozzle 95731.doc -30- 1255232 hole lib The diameter D2 of the upper bottom lly is 10 /mi', and the diameter of the opening of the fluid supply hole 12 is 30 μηι. In the nozzle type flat plate 8 of the present configuration, a fine point is formed in order to discharge an ultra-micro fluid, and the fluid is required to be made. The discharge hole 9 is __ or less, more preferably (four) _ By forming such a pore size (diameter), it is possible to reduce the electric field required to form a wide range, which can greatly reduce the voltage required to move the charge, that is, the voltage required to charge the fluid to electrostatically attract the fluid. Therefore, since it is not necessary to require a high voltage of 2000 V as before, it is possible to improve the safety when using the fluid ejection device. In particular, when the shape is 8/m or less, the electric field intensity distribution is concentrated on the fluid discharge hole. The change in the distance from the opposite electrode to the fluid protruding hole of the nozzle does not affect the electric field intensity distribution. Therefore, it is not affected by the positional accuracy of the opposite electrode, the material property deviation of the recorded media, and the thickness deviation. The fluid can be discharged steadily. Further, as described above, a strong electric field can be formed in a narrow region by concentrating the electric field intensity distribution in the vicinity of the discharge surface of the fluid discharge hole 9, so that the amount of fluid that can be discharged can be formed into an extremely small amount. Thereby, the printed image can form a high resolution when the fluid is ink. Further, the liquid repellent layer 4 on the first layer of the mouthpiece is formed by a thickness of about ruined polymer or material or a polymer film. The liquid-repellent layer 4 is as described later, and is removed from the excess area in the fluid discharge hole 9 by the dry etching. The % of the liquid-repellent layer is a nozzle-type fluid discharge hole which has a great influence on the spray accuracy. The shape I of 9 is determined by the addition t degree of the polyimine film of the above > Therefore, the processing accuracy of the fluid discharge hole 9 is very high, and the spray precision of 95731.doc 1255232 is ensured. In addition, in order to improve the processing precision of the fluid discharge hole 9, the processing accuracy is improved when the first nozzle layer 1 exposed to the fluid discharge surface of the nozzle plate 8 is reduced to a greater thickness. . At this time, by reducing the film thickness of the first smear layer, the rigidity of the first nozzle layer 1 is lowered, and the structure of the fluid discharge hole 9 is reduced and the sinfulness is reduced, but by the first nozzle layer. 1 Contact Μ I directly aligns the two nozzle layers 2 to reinforce the first nozzle layer 丨, so that the reliability of the first nozzle layer 1 is not lowered, and the shape accuracy of the fluid discharge hole 9 can be improved. Also, when the nozzle type flat plate 8 having the fine fluid discharge holes 9 is formed, such a configuration is required. Further, since the first electrode layer 25 is partially provided at each of the formation positions of the nozzle holes, it is electrically insulated from the first electrode layer disposed adjacent to the nozzle holes. Therefore, the discharge signal can be separately applied to each channel, and 9 strings: (Crosstalk) are small, whereby the resolution of the drawn image can be improved. In addition, since the second nozzle hole 11b has a taper shape, turbulent flow of the fluid is less likely to occur inside the second nozzle hole lib, and the fluid discharge property can be improved 'and 'because the inner wall of the nozzle hole Ub and the edge of the fluid supply surface The width is widened, so that the disconnection of the second electrode layer % extending to the fluid supply level can be effectively suppressed. Further, by the liquid repellent layer 4 formed on the fluid discharge surface 2 of the nozzle plate 8, the fluid can be prevented from adhering to the vicinity of the fluid discharge hole 9. Further, the material used for the first electrode layer 25 is not limited to a metal material mainly composed of titanium. As long as the etching of the liquid-repellent layer 4 of the sacrificial layer 5 and the fluid discharge hole 9 which is described in the second nozzle layer 2 and stepped over the sacrificial layer 5 and the fluid discharge hole 9 described later is high-resistance material, That is to say, the material with high polarity for the gas (oxygen 95731.doc -32- 1255232 and the fluorine-containing electric power) can be used. = (4) agent (iron, water, iron, water, surface, know; body and s' such as Qin, Ming, steel, wrong, metal materials with the main components of the above two or two sharp, Similarly, ; =: the combination of paste to choose. The material to be into the strict layer 26 is not limited to the metal material with titanium as the main tool. As long as it is based on step-type seedling-based and fluid discharge The material of the liquid repellent layer 4 in the hole 9 ^ sacrificial layer 5 material, ' + W Hep insect engraved with high resistance to seven e / ^ P on the etching gas (oxygenated plasma and fluorine-containing gong 箄) Or the money-engraving agent (Nitrate, Nitrogen, Water, and Water), and the material with high resistance. Specifically, s, titanium, Ming, copper, Ming, iron, recorded, full, Qin 7 tungsten, sharp and other metal materials as the main component, a combination of decoration, group, or etchant. The material of the above-mentioned etching gas which can be used in the nozzle layer 1 is not limited to the polyacrylonitrile. Also... "The high-molecular organic materials other than the imine may also be: the chemical compound of the dog compound, or the material of the second layer / for the mouth layer 2 is not limited to the poly-SI, but also The polymer organic material other than the brewed imine may be an emulsified stone or a nitrogen-cut compound material, or may be a stone eve. 乂: ': The second nozzle hole m of the present embodiment is not limited to The shape of the truncated cone which is narrowed in the communication portion with the first hole 1U (the nozzle plate 8 shown by the taper angle, the second nozzle hole Ub, and the inner wall of the second nozzle plate 8' And the fluid supply surface 8 b is perpendicular to the shape of the Straight (cylindrical shape). At this time, the second nozzle hole 11b, the fluid supply hole can be called... (4) 95731.doc -33- 1255232 12 2 nozzle mouth 111? The fluid supply hole is smaller than the shape of the truncated cone. The step is to increase the total volume of the nozzle. In this case, as shown in Fig. 7 (8), when the flat panel 8 is used, it is manufactured. In the case where the second electrode layer 26 has one side surface of the inner wall of the second nozzle hole 11b, as shown in FIG. 9, it may be formed in the second nozzle hole U. The entire inner wall surface of b. The nozzle type flat plate 8 (8) which is constructed in this embodiment can function as the following 1 to 5. 1 The fluid discharge hole 9 is a continuous nozzle type plate 8 having a diameter of 8 or less. (8), it is still possible to form a structurally stable zero electrode which can be applied to the front end of the nozzle hole 11 by applying a discharge signal. 2 On the fluid supply side of the second nozzle layer 2, by separating the second electrode layer 26, Turning on the inter-electrode short-circuit ' can easily apply a separate L-string 9 to each channel, thereby improving the resolution of the rendered image. 3 Since the nozzle layer can be maintained by the second nozzle layer 2, Rigidity, so the rigidity of the entire nozzle plate 8 (8,) is improved, and it is easy to handle. 4 The accuracy of the second nozzle hole m processed on the second nozzle layer 2 having a thick film thickness is even worse 'because of the second When the nozzle hole is processed, the remaining portion 25b of the first electrode layer 25 is stopped, so that the fluid discharge hole 9 for controlling the discharge amount of the fluid is not affected. 5 Since the first electrode layer 25 is formed in the first nozzle hole The second electrode layer 2 of the second nozzle hole m connected by Ua Since the electrical connection is made, the drive signal is supplied from the fluid supply side of the nozzle plate 8 via the second electrode layer 26, and the recording medium is not caused by the electric field generated by the supply of the lead wires for driving the k to the first electrode layer 25. 95731 .doc -34- 1255232 (Manufacturing method of nozzle type flat plate) Next, a method of manufacturing the nozzle type flat plate 8 of the present embodiment will be described. Fig. 10 (a) to (i) are nozzle type flat plates. Description of the 8 process. First, a sacrificial layer 5 is formed on a substrate 6 for temporary holding of any thickness such as tantalum and glass by using a wet electric ore (electric ore) of nickel. On the layer 5, a polyimide resin was applied by spin coating, and fired at 350 ° C for 2 hours to form a first nozzle layer. At this time, the thickness of the sacrificial layer ^ is ΙΟμιη, and the thickness of the first nozzle layer i is 丨^^. Next, in the first nozzle layer, the opening pattern of the first nozzle hole is formed by photoresist, and the first nozzle hole 11a is processed by using a dry pattern of a gas containing oxygen as a main component (refer to FIG. The method of engraving can enhance the organic matter of the polyimide resin and the like with high speed and precision, and has high selectivity to the nickel of the sacrificial layer 5 (recording is almost not etched). Therefore, the sacrificial layer 5 It is not subject to significant damage due to the above processing, and the flatness of the surface of the sacrificial layer 5 is maintained, so that the flatness of the fluid discharge surface of the bay-depleted flat plate 8 formed on the surface of the sacrificial layer is not deteriorated. The high precision is carried out 'Therefore, the anisotropic high engraving conditions are used. In addition, as described above, since the first nozzle layer is extremely thin, the first one for processing ultra-micro fluid can be processed with high precision. Nozzle hole 11 a. '2. On the first nozzle layer 1 for processing the first mouth hole U a , the first electrode layer 25 of the metal material which is sputtered as the main component of the package 31 is as follows. Formed on the first electrode layer 25 The first resist layer 27 is formed in the shape of the opening of the nozzle hole (refer to the figure). At this time, since the first electrode layer 95731.doc - 35 - 1255232 25 needs to be formed on the inner wall of the first nozzle hole Ua, in order to improve The step coverage of the first electrode layer 25 is such that the film thickness on the first nozzle layer 1 is 〇·5 μηι under the argon gas pressure of 3 〇mT 〇 rr 2 . Next, a gas containing argon as a main component is used. Dry etching of the plasma, the first electrode layer 25 is processed to have a substantially circular shape having a diameter of about 2 Å which is the extension portion 25b on the first nozzle layer!, and the photoresist is removed (refer to FIG. 10(c)). The processing step is for suppressing damage of the first electrode layer 25 (the cylindrical portion 25a) formed on the inner wall of the first nozzle hole, and removing the sacrificial layer 5 formed on the bottom of the first nozzle hole 11a. The first electrode layer 25 is an etching condition of anisotropic g. Further, the extension portion 25b partially remaining on the first nozzle layer , is formed into a substantially circular shape at this time, but is not required in the processing step. Is a substantially circular shape, as described later, as long as it is a second spray The upper surface of the aperture lb is disposed in the shape of the extension portion 25b formed on the first nozzle layer 延伸 from the first nozzle hole Ua. However, the nozzle type is applied to the electrostatic attraction type. Since the slap type plate 8 of the fluid discharge device applies the discharge number to the tip end portion of the nozzle via the first electrode layer 25, the electric field is concentrated on the first electrode layer 2 $ except the nozzle tip end portion. The end portion of the shape on the nozzle layer 1. Therefore, in order to homogenize the electric field concentrated at the end portion of the extending portion 25b on the first nozzle layer 1, the shape of the extending portion 25b has to be processed into a circle close to the isotropic height. Secondly, the second nozzle layer 2 is formed on the first nozzle layer i and the first electrode layer 25 by a thickness of 2 〇 μχ (see Fig. i (d)). The second nozzle layer 2 is coated with a coating type of polyamidene in the same manner as the sound layer 1 by the spin coating method in the same manner as the ninth layer of the ninth layer. In the hour, a thickness of 2 〇 is formed. At this time, the first mouth hole Ua is also buried by the polyimine (four), and the second nozzle layer is formed by the purpose of reinforcing the film thickness of the south-precision processed film-nozzle layer, having The effect of increasing the rigidity of the entire nozzle plate 8 is obtained. 7 2 times, on the second nozzle layer 2, a photoresist pattern is formed by etching: a dry etching using a gas containing oxygen as a main component And the second nozzle hole forming the shape of the truncated cone on the layer of the mouthpiece is called Yuan Zhaotu.) In addition, the above dry stencil can be formed on the extension 25a (25b) of the electric (four) 25 which is formed above the first nozzle. (d), due to the dry etching using a gas containing oxygen as a main component, the first nozzle + the Bama layer 1 formed by the Meng material which is not mainly made of titanium as a main component is thus in the first electrode layer 25 : The part of the 'dry type of money is no longer going on, but can be easily removed before: one step is buried first The second nozzle layer 2 of the mouth hole mountain. In addition, the processing of the above-mentioned brother one mouth hole lib, force disk flute + ^ at the joint portion with the nozzle layer 1, the second 1 hole 11 b upper bottom 11 v [Si An J, the bottom Uy is patterned to be disposed in the extension portion 25b of the first electrode layer 25. The day ~, the Kaidi, the mouth of the mouth of the nozzle 11 b is a sharp shape, and the above etching is adopted. The engraving rate of the light wood 28 is substantially equal to the etching rate of the polyimine resin of the second nozzle 卞λ berlin layer 2, and the glazing 28 is post-baked at 150 C for 60 knives. The photoresist pattern 28 is used as a taper angle, and the π ^ month Φ-like straw is transferred by etching to the second nozzle layer 2. # 即 ' Π Π Π Π a 」 」 」 」 」 」 」 」 」 」 」 」 」 」 」 」 The two nozzle layers of the second nozzle layer 2 are approximately equal, forming an ancient /, photoresist pattern with a taper angle j face 28a 28, 9573 l.doc - 37- 1255232 and the second nozzle layer 2 Engraved (four) speed to (four) photoresist diagram (four), the edge of the expansion of the light block 28 wood. At this time, as shown in Fig. i(8), the second nozzle layer 2 is also simultaneously (4), and as a result, on the second nozzle layer 2, as shown in Fig. H(4), the crucible is formed 2 and has a taper angle formed on the photoresist pattern 28. The wall surface 28A has the same shape of the first hole 11b. Further, at this time, since the resist pattern 28 and the second spray layer 2 are substantially equal in cost, the thickness of the photoresist pattern to be formed is thicker than the thickness of the beehive layer 2. Further, the description of the portion of the first nozzle hole Ua formed in the first nozzle layer 1 is omitted in Fig. u. Next, a metal material containing titanium as a main component is formed on the second nozzle layer 2 described above! Two electrode layer 26. In this case, ion beam sputtering is used to suppress scattering of titanium particles by argon atoms under a wind pressure of 0.2 mTon·············· A side of the inner soil surface, and a portion of the second electrode layer 26 is electrically short-circuited with the first electrode layer 25 (refer to FIG. 〇(f)). The film thickness is 〇·5. /, " 形成 By forming the second electrode layer 26 by injecting titanium particles from an oblique direction, the second electrode layer 26 can be prevented from adhering to the first nozzle hole 11a, whereby the shape of the first nozzle hole 11a can be prevented Change and blockage. a person, a photoresist pattern 29 is formed on the second electrode layer 26 to cover the second nozzle hole 11b and a portion of the second electrode layer % formed on the second nozzle layer 2 (refer to FIG. 10(g)) . The photoresist pattern 29 only needs to form a portion covering the second nozzle hole lib and the second electrode layer % formed on the second nozzle layer 2, but in the embodiment, the second nozzle layer 2 is formed. The two-electrode layer 26 has a shape that can be processed into a circular shape of approximately 5 〇 / ^ 111 diameter. At this time, since the photoresist pattern 29 is formed to be buried in the second nozzle hole ub, it is in the second nozzle hole 95731.doc -38 - 1255232

Ub之最深㈣,光阻層之厚度非常厚。因而光阻圖案29 須使用曝光之部分殘留作為圖案之正型光阻。 此外,此時須使用上述光阻圖案29而在第二喷嘴層2上使 用弟一電極層26形成引出配線26a。此時,由於無須以另外 步驟作成引出配線26a’因此可簡化步驟。此外,如上述, 由於可經由喷嘴式平板8將引出配線%配置於記錄媒體之 相反側,因此可自記錄媒體離開充分距離,避免該引出配 線產生之電場對記錄媒體造成嚴重之電性損傷。 其次,依據上述光阻圖案29,藉由使用以氬氣為主要成 分之^漿之轉式#刻來加卫第二電極層%,除去光阻圖案 29(參照圖10⑻)。㈣該加工步驟需要將第二電極層%加 工成所需之形狀,因此係在具有高度各向異性之㈣條件 下進行钱亥]此外,係使用光阻剝離液來除去光阻圖案2 9。 其次,除去上述光阻圖案29後,浸潰於以硝酸與水為主 要成分之水溶液,僅蝕刻犧牲層5,自基板6取出喷嘴式平 板8(圖l〇(i))。如前述,由於形成第一喷嘴層工、第二喷嘴 層2之聚醯亞胺樹脂,及形成停止層3或排出孔層μ之鈦幾 乎不被上述犧牲層5之蝕刻液蝕刻,因此可避免因犧牲層$ 之餘刻導致形狀變化及結構性之可靠性降低。 其次,在除去犧牲層5之第一喷嘴層1表面形成拒液層 4(圖ι〇ω)。此時基於考慮塗敷便利性之宗旨而使用氟聚合 物’並藉由沖壓(Stamp)等方法將其塗敷於第一噴嘴層1表 面’以鬲分子膜形成厚度為〇· 〇5 μηι之拒液層4。另外,就 階躍式覆蓋於第一喷嘴孔11a内之拒液層4,係於形成拒液 95731.doc -39- 1255232 層4後,使用含氧之電漿,藉由自第二喷嘴孔丨11}側乾式飿 刻來將其除去。藉此,可使噴嘴式平板8之損傷程度達到最 小限度。 如以上所述,本實施形態藉由在加工步驟中實施光蝕刻 與乾式I虫刻,可在排出超微量流體之靜電吸引型流體排出 裝置之喷嘴式平板8上,將各通道分離之第一及第二電極層 25, 26精確度佳地形成於喷嘴孔丨丨内。藉此,由於各個通道 可單獨地施加排出信號,因此串音少,藉此可提高描繪圖 像之解像度。 此外,由於一可形成薄之第一喷嘴層丨,因此,藉由控制將 形成於第一噴嘴孔Ua内壁之第一電極層25予以成膜時之 氣壓,可穩定地成膜至流體排出孔9近旁。藉此,自電極供 給贺嘴前端之電阻R穩定,通道間之排出特性穩定。 另外,本實施形態之犧牲層5係使用鎳,第一噴嘴層工及 弟二贺嘴層2係使用聚醯亞胺樹脂,第—及第二電極層^ 26係使用鈦,不過並不限定於該組合。 曰’ 敷法等 犧牲層5内,除鎳之外,依據與用於第一喷嘴層1、第二 喷嘴層2、第一電極層25及第二電極層%之材料之组人,可 使用銘、銅等之可溶於硝酸或K〇H水溶液之材料是取 酿亞”可藉由氧電漿_之材料。此外犧牲層5之形成: 法,除電鑛之外,依據材料而可使用蒸鑛法、職射法及汝 95731.doc -40- 1255232 可使用對於犧牲層5之蝕刻及第二噴嘴孔Ub之蝕刻,耐性 向之材料。 此處,圖12中顯示使用材料(犧牲層、第一噴嘴層、第一 電極層、第二喷嘴層、第二電極層)及加工方法(第一喷嘴 孔、第-電極層、第二喷嘴孔、第二電極層、除去犧牲層) 之較佳之組合例。 如圖12所示,第一噴嘴層丨及第二噴嘴層2並不限定於聚 醯亞胺樹脂等高 > 子有機材料,亦可選擇石夕或氧化石夕等益 機石夕化合物。不過為求乾式姓刻氧化石夕及石夕,需要使用 氟之反應氣聲,由於本實施形態中使用之欽之耐性低,因 此,利用金、翻等具有姓刻耐性之材料作為第一電極層Μ 或弟—電極層2 6。 此外,第-電極層25或第二電極層%,除鈦之外,亦可 依據圖12所示之組合而使用該表中記载之材料。 第-電極㈣材料之鈦’即使是使用四⑽ Γ二體之電襞,仍可以較快之-刻速度進行- ^ 但疋,形成於鈦下之第一喷嚆居彳f t 體之電漿層(㈣亞胺)被上述氣 …Κ蝕亥J速度比鈦快,而受到較大損傷。因杳 施形恶在第一電極声2 5乃笛-恭4 ^ ^ ^ "及罘一电極層26之圖案化時,係採 用虱離子之乾式蝕刻法。 知如 如此,藉由採用第一電極層25 + 與第一噴嘴;li? ^ . 飞弟一电極層26之蝕刻率 乾式钱刻法,日之钱刻率差異小之氯離子之 在最小限度,而將第日1或乐―噴嘴層2之損傷抑制 、 弘極層25或第二電極層26予以圖案 95731.doc -41 - 1255232 化0 此外,本實施形態係藉由蝕刻完全除去犧牲層$,不過亦 無須完全除去犧牲層5,而藉由僅蝕刻除去犧牲層5 _與第 一喷嘴層1接觸之部分,即可自基板6取出噴嘴式平板8。 此外,拒液層4並不限定於氟聚合物,亦可使用矽系高八 子膜及DLC(類似鑽石碳)等。 藉由使用以上之加工步驟,可製造發揮上述①〜⑤項作用 之喷嘴式平板8。 [第二種實施形態] 使用圖13〜圖16說明本發明其他實施形態如下。另外,為 求便於說明,具有與第一種實施形態之圖式所示構件相同 功月b之構件,係注記相同符號,而省略其說明。 (喷嘴式平板) 圖13(a)係本實施形態之喷嘴式平板8〇之一部分立體圖, 圖13(b)係圖13(a)之B-B,線剖面圖。喷嘴式平板8〇上形成有 2個以上之流體排出孔9,圖13⑷中顯示有2個流體排出孔 9。此外,圖13(c)係自流體供給側觀察噴嘴式平板8〇之—部 分之立體圖。 ° ,喷嘴式平板80之形成於第一噴 與第二噴嘴孔1 lb同樣地係錐角 如圖13(a)〜圖13(c)所示 嘴層10之第一噴嘴孔11 c, 形狀,並且在噴嘴式平板8〇之流體排出面8〇a上,形成有表 面電極層8卜來堵塞第一喷嘴孔"c之流體排出側之開: 部,形成於該表面電極層81之貫穿孔…成為流體排出孔 9。而後,上述表面電極層81與形成於第一喷嘴孔山内壁 95731.doc -42- 1255232 之第一電極層25電性連接,可經由第一電極層25及第二電 極層2 6 ’自喷嘴式平板8 〇之流體供給侧施加驅動信號。此 日寸’第二喷嘴層20亦係採用!層,不過亦可為2層以上。 另外’圖13(a)(c)中,亦係為求簡化圖式,而省略形成於 構成噴嘴孔11之第一喷嘴孔Uc及第二喷嘴孔1讣各内壁之 第一電極層25及第二電極層26。 以下’說明各部之尺寸及材質之具體例,不過本發明並 不限定於其具體例。The deepest Ub (4), the thickness of the photoresist layer is very thick. Therefore, the photoresist pattern 29 must use a portion of the exposed portion as a positive photoresist of the pattern. Further, at this time, the above-described photoresist pattern 29 is used to form the lead wiring 26a on the second nozzle layer 2 using the electrode layer 26. At this time, since it is not necessary to make the lead wiring 26a' in another step, the steps can be simplified. Further, as described above, since the lead wiring % can be disposed on the opposite side of the recording medium via the nozzle type flat plate 8, the recording medium can be separated from the recording medium by a sufficient distance, and the electric field generated by the lead-out wiring can be prevented from causing severe electrical damage to the recording medium. Next, in accordance with the above-described photoresist pattern 29, the second electrode layer % is removed by using a pattern of argon gas as the main component, and the photoresist pattern 29 is removed (see Fig. 10 (8)). (4) This processing step requires the second electrode layer % to be processed into a desired shape, so that it is carried out under the condition of (4) having high anisotropy. Further, a photoresist stripping liquid is used to remove the photoresist pattern 29. Next, after removing the photoresist pattern 29, it is immersed in an aqueous solution containing nitric acid and water as a main component, and only the sacrificial layer 5 is etched, and the nozzle plate 8 is taken out from the substrate 6 (Fig. 1 (i)). As described above, since the polyimide layer forming the first nozzle layer, the second nozzle layer 2, and the titanium forming the stop layer 3 or the discharge hole layer μ are hardly etched by the etching liquid of the sacrificial layer 5, it can be avoided. The shape change and structural reliability are reduced due to the sacrifice of the sacrificial layer $. Next, a liquid repellent layer 4 (Fig. 〇 ω) is formed on the surface of the first nozzle layer 1 from which the sacrificial layer 5 is removed. At this time, the fluoropolymer is used based on the purpose of considering the convenience of coating, and is applied to the surface of the first nozzle layer 1 by a method such as stamping, and the thickness of the bismuth molecular film is 〇·〇5 μηι. Repellent layer 4. In addition, the liquid repellent layer 4 which is stepped over the first nozzle hole 11a is formed after the liquid layer 95731.doc -39-1255232 is formed, and the oxygen-containing plasma is used, from the second nozzle hole.丨11} Side dry engraving to remove it. Thereby, the degree of damage of the nozzle plate 8 can be minimized. As described above, in the present embodiment, by performing photolithography and dry I insect engraving in the processing step, the first channel can be separated on the nozzle type flat plate 8 of the electrostatic attraction type fluid discharge device that discharges the ultra-micro fluid. And the second electrode layers 25, 26 are formed with good precision in the nozzle holes. Thereby, since the discharge signals can be individually applied to the respective channels, the crosstalk is small, whereby the resolution of the rendered image can be improved. Further, since a thin first nozzle layer 可 can be formed, the gas pressure at the time of film formation of the first electrode layer 25 formed on the inner wall of the first nozzle hole Ua can be stably formed into the fluid discharge hole. 9 is near. Thereby, the resistance R supplied from the electrode to the tip end of the mouthpiece is stabilized, and the discharge characteristics between the channels are stabilized. Further, in the sacrificial layer 5 of the present embodiment, nickel is used, and the first nozzle layer and the second layer 2 are made of a polyimide resin, and the first and second electrode layers 26 are made of titanium, but are not limited thereto. In this combination. In the sacrificial layer 5 such as the coating method, in addition to nickel, it can be used according to a group of materials for the first nozzle layer 1, the second nozzle layer 2, the first electrode layer 25, and the second electrode layer. The material of Ming, copper, etc. which is soluble in nitric acid or K〇H aqueous solution is a material which can be made from oxygen plasma. In addition, the formation of sacrificial layer 5: method, in addition to electric ore, can be used according to materials Steaming method, occupational method and 汝95731.doc -40- 1255232 can be used for the etching of the sacrificial layer 5 and the etching of the second nozzle hole Ub, the material is resistant to the material. Here, the material used (sacrificial layer is shown in FIG. , the first nozzle layer, the first electrode layer, the second nozzle layer, and the second electrode layer) and the processing method (the first nozzle hole, the first electrode layer, the second nozzle hole, the second electrode layer, and the sacrificial layer are removed) A preferred combination example. As shown in Fig. 12, the first nozzle layer 第二 and the second nozzle layer 2 are not limited to a high organic material such as a polyimide resin, and may also be selected as a stone or an oxidized stone. Machine Shi Xi compound. However, in order to find the dry type of engraved oxide stone and Shi Xi, the reaction gas of fluorine is needed. Since the sound used in the present embodiment is low in patience, a material having a resistance of a surname such as gold or a turn is used as the first electrode layer or the electrode layer 26. Further, the first electrode layer 25 or the first The second electrode layer %, in addition to titanium, may also be used according to the combination shown in Fig. 12. The first electrode (four) material of titanium 'even if using four (10) Γ two body electric 襞, still It can be carried out at a faster rate - ^ 疋 疋 疋 疋 疋 疋 疋 形成 形成 形成 形成 形成 形成 钛 钛 钛 钛 钛 钛 钛 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电Large damage. Because of the formation of the first electrode, the first electrode sounds 2 5 is the pattern of the 电极-electrode layer 26, and the dry etching method using 虱 ions. By using the first electrode layer 25 + and the first nozzle; li? ^. The etch rate of the electrode layer 26 is an etching rate, and the chloride ion having a small difference in the rate of the day is minimized. The damage suppression of the first day 1 or the music nozzle layer 2, the polar layer 25 or the second electrode layer 26 is patterned 95731.doc -41 - 1255232. In this embodiment, the sacrificial layer $ is completely removed by etching, but the sacrificial layer 5 is not completely removed, and the sacrificial layer 5_the portion in contact with the first nozzle layer 1 is removed by etching only, and the nozzle can be taken out from the substrate 6. In addition, the liquid repellent layer 4 is not limited to a fluoropolymer, and a lanthanum-eight octahedron film and DLC (similar to diamond carbon) may be used. By using the above processing steps, the above-mentioned 1 to 5 can be produced. The nozzle type flat plate 8 of the present invention. [Second embodiment] Another embodiment of the present invention will be described below with reference to Figs. 13 to 16. Further, for convenience of explanation, it has the same configuration as that of the first embodiment. The components of the power month b are denoted by the same reference numerals, and the description thereof is omitted. (Nozzle type flat plate) Fig. 13 (a) is a partial perspective view of a nozzle type flat plate 8 of the present embodiment, and Fig. 13 (b) is a line cross-sectional view taken along line B-B of Fig. 13 (a). Two or more fluid discharge holes 9 are formed in the nozzle plate 8 and two fluid discharge holes 9 are shown in Fig. 13 (4). Further, Fig. 13 (c) is a perspective view of a portion of the nozzle plate 8 from the fluid supply side. °, the nozzle type flat plate 80 is formed in the first spray and the second nozzle hole 1 lb, and the taper angle is the first nozzle hole 11 c of the mouth layer 10 as shown in FIGS. 13( a ) to 13 ( c ). And on the fluid discharge surface 8〇a of the nozzle plate 8〇, the surface electrode layer 8 is formed to block the opening of the fluid discharge side of the first nozzle hole "c: a portion formed on the surface electrode layer 81 The through hole ... becomes the fluid discharge hole 9. Then, the surface electrode layer 81 is electrically connected to the first electrode layer 25 formed on the inner wall 95731.doc - 42 - 1255232 of the first nozzle hole, and can be self-nozzed via the first electrode layer 25 and the second electrode layer 2 6 ' A drive signal is applied to the fluid supply side of the flat plate 8 . This second inch 'second nozzle layer 20 is also used! Layer, but it can also be 2 or more layers. In addition, in FIG. 13(a) and (c), the first electrode layer 25 formed on the inner walls of the first nozzle hole Uc and the second nozzle hole 1 that constitute the nozzle hole 11 is omitted, and the first electrode layer 25 is formed. Second electrode layer 26. Specific examples of the dimensions and materials of the respective portions will be described below, but the present invention is not limited to the specific examples.

表面電極層81使用以鉑為主要成分之金屬材料,為求減 )整個噴嘴冬平板8〇之應力,而形成5 ^㈤徑之大致圓形形 狀。此外’表面電極層81之厚度為〇.5 μηι。 本實施形態之第一喷嘴層1〇包含以氧化矽為主要成分之 媒機材料,厚度形成2 μηι。第二喷嘴層2〇包含以聚醯亞胺 才十月曰為主要成分之有機材料,並形成20 μιη之膜厚。第一電 極層25及第二電極層26使用以鈦為主要成分之金屬材料, 並形成0·5 μχη之膜厚。The surface electrode layer 81 is made of a metal material containing platinum as a main component, and is formed into a substantially circular shape of 5 ^ (five) diameter in order to reduce the stress of the entire nozzle. Further, the thickness of the surface electrode layer 81 is 〇.5 μηι. The first nozzle layer 1A of the present embodiment contains a dielectric material containing ruthenium oxide as a main component, and has a thickness of 2 μm. The second nozzle layer 2 〇 contains an organic material mainly composed of polyamidimide and octagonal oxime, and forms a film thickness of 20 μm. The first electrode layer 25 and the second electrode layer 26 are made of a metal material containing titanium as a main component, and a film thickness of 0.5 μm is formed.

、形成於表面電極層81之貫穿孔81a之流體排出孔9之口徑 為2 Mm,對膜面垂直加工至與第一喷嘴孔nc之連通部(連 通孔Wb日夺,流體排出孔9之口徑基於與第一種實施形態 相同之理纟,須為φ 10 以下,更宜為Φ 8 以下。 此外第一贺嘴孔11 c之與流體排出孔9之連通部,亦 流體:出側開口部加工成4㈣之口徑,並加工成扇形擴 至與第二噴嘴孔Ub之連通部之錐角形狀(圓錐台形狀)。、 此外,第二喷嘴孔llb與第一喷嘴孔Uc之連通部,亦 95731.doc -43- 1255232 流體排出側開口部加工成2〇 /xm之口徑,係扇形擴大之錐角 形狀(圓錐台形狀),並通過第二喷嘴層2〇,在喷嘴式平板8〇 之流體供給面8 0 b上開口。 另外,圓錐台形狀之第一喷嘴孔llc之上底丨丨叮係以流體 排出孔9為大致中心之圓環形狀,表面電極層81之一部分形 成該上底1 Icy而露出。因此,流體排出孔9與第一喷嘴孔Ik 之連通孔Ilex(大致圓形)之口徑,比第一噴嘴孔Uc之上底 llcy之外口徑(在上述連通孔丨丨以之第一噴嘴孔iic之外形) 小 〇 再者,圓錐—台形狀之第二喷嘴孔llb之上底丨丨^係以第一 喷嘴孔lie為大致中心之圓環形狀,第一電極層之一部分形 成该上底llby而露出。因此,第一噴嘴孔Uc與第二喷嘴孔 lib之連通孔iibx(大致圓形)之口徑,比第二噴嘴孔11^之上 底llby之外口徑(在上述連通孔丨丨以之第二噴嘴孔nb之外 形)小。 此外,除第一喷嘴孔llc内壁之至少一部分,在第一喷嘴 孔1 lc與第二喷嘴孔丨lb連通之周邊部形成有成為延伸部 25b之第一電極層25。此時,由於構成第一噴嘴層⑺之氧化 石夕在後述之第二喷嘴孔llb加工時,對含氧之電漿之乾式钱 刻顯示高耐性,因此不形成第一電極層乃之延伸部2%,第 -噴嘴層1G或第-喷嘴孔lle即使暴露在第二喷嘴孔爪之 蝕刻情況下’幾乎不被蝕刻,第—噴嘴孔uc之形狀不致變 形。 反之,第一噴嘴層10使用第二噴嘴孔Ub加工時耐性低之 95731.doc -44- Ϊ255232 材料時(如第一種實施形態之情況,第一噴嘴層10與第二喷 嘴層20為相同材料),第一電極層25須形成覆蓋第一噴嘴孔 Uc之内壁全部。亦即,第一電極層25在第二噴嘴孔之 加工步驟中,係發揮保護第一噴嘴孔Uc或第一噴嘴層1〇, 避免被蝕刻之保護層之功能。 此外,在第二喷嘴孔丨lb内壁形成有與上述第一電極層Μ 包性連接之第二電極層26。此外,第二電極層%之一部分 亦配置於形成喷嘴式平板80之流體供給面8〇b之第二喷嘴 層2〇之,體供給側表面,如圖13⑷所示,藉由形成於該表 面之將第二電極層26加工後之引出配線26&,而連接於圖上 未顯示之驅動信號電壓施加手段。拒液層4係由具有厚度為 0-05 之氟聚合物之高分子材料形成。 此外,由於表面電極層81對於第一喷嘴孔山之姓刻手段 二有高耐性’因此’流體排出孔9之形狀不致因上述第一喷 f孔而變形。此外’由於對噴灑精確度影響重 大之喷嘴式平板之流體排出孔9之形狀,係依成為表面電極 迟· 5 # m之鈦膜之加工精確度來決定,因此流體 :出孔9之加工精確度非常高,如此可確保非常高之喷灑精 再者’為求提高流體排出孔9之加工精確度,而減少表面 電極層81之膜厚時,雖可獲得更高之加4確度,不過, 因減v表面電極層81之臈厚導致表面電極層。之剛性降 低^體排出孔9之結構性之可#性降低。 疋士此II由與表面電極層81接觸來配置第一喷嘴層 95731.doc -45- 1255232 即了㈣表面電極層81,殘降低表©電極層81之結 構性之可靠性,而可提高流體排出孔9之形狀精確度。 此外’由於第一電極声 B ▲ 層25對於弟:喷嘴孔111)之#刻手段 :、南耐性,因此第-喷嘴孔Uc之形狀不致因第二喷嘴孔 工而大巾田’交形,亚且第—噴嘴層10不致因第二喷嘴 1 b加工之過度钱刻而被完全除去。 :外’用於表面電極層81之材料並不限定於以鉑為主要 =之金屬材料。只要是於第—噴嘴孔uc之敍刻及第二喷 2 lib之㈣及後述之犧牲⑽之㈣與階躍式覆蓋於 &排出孔9:内之拒液層4之餘刻時,對該银刻具有高耐性 之亦即只要是可耐含氟之電漿、含氧之電漿、硝酸 ::乳:鉀水溶液等高之材料即可,可依與犧牲層蝕刻、 贺嘴孔加工及第二喷嘴孔加工方法之組合來使用。具 如以紹、銅、銘、鐵、錄、金、銘等為主要成分 至蜀材枓,可藉由與上述敍刻氣體或敍刻劑之組合來選 擇。 j他第—喷嘴層10、第二喷嘴層20、第-電極層25及第 一電極層26等之材料亦均不限定於上述者,其材料與製造 方法之較佳組合於後述。 此外,本實施形態之第二噴嘴孔nb係與第一噴嘴孔Η。 、,連通孔(連通部)"!^變窄之圓錐台形狀(錐角形狀),不過 口不限:於此。如圖14所示之變形例之噴嘴式平板80,,亦 口、。第 貞鳥孔1丨6之側壁與停止層3垂直之所謂筆直形 狀(圓冋形狀)。此時,可使第:噴嘴孔11b之流體供給孔12 95731.doc -46- 1255232 更小,可進一步提高噴嘴 、之積體度。此外,如圖14所千, 第二電極層26亦可形成於第一 ” 吊一貝為孔lib之整個内壁面 時第二電極層26關於電傳導之可靠性提高。 此外,此時係對對應於丨個 貝馬孔1 1之1個表面電極屛 形成1個貫穿孔8 1 a,不禍—Γ 曰 、 〜亦可採用在1個表面電極層8 1上妒 成數個貫穿孔,對於1個喷 ^ 丨口貝為孔1 1具有數個流體排出孔9之 構造。 汾此外’亦可如第一種實施形態之噴嘴式平板8之情況,并The diameter of the fluid discharge hole 9 formed in the through hole 81a of the surface electrode layer 81 is 2 Mm, and the film surface is vertically processed to the communication portion with the first nozzle hole nc (the diameter of the communication hole Wb, the diameter of the fluid discharge hole 9) The same principle as in the first embodiment is required to be φ 10 or less, more preferably Φ 8 or less. Further, the communication portion of the first balloon hole 11 c and the fluid discharge hole 9 is also fluid: the outlet opening portion The diameter is 4 (4), and is processed into a taper shape (cone shape) in which the fan shape is expanded to a portion communicating with the second nozzle hole Ub. Further, the communication portion between the second nozzle hole 11b and the first nozzle hole Uc is also 95731.doc -43- 1255232 The fluid discharge side opening is machined to a diameter of 2〇/xm, which is a fan-shaped enlarged taper shape (conical shape), and passes through the second nozzle layer 2〇 in the nozzle type plate 8 The fluid supply surface 80b is opened. Further, the upper nozzle hole of the truncated cone shape is a circular ring shape in which the fluid discharge hole 9 is substantially centered, and a part of the surface electrode layer 81 forms the upper bottom. 1 Icy is exposed. Therefore, the fluid discharge hole 9 and the first The diameter of the communication hole Ilex (substantially circular) of the nozzle hole Ik is smaller than the diameter of the first nozzle hole Uc above the bottom llcy (in the shape of the first nozzle hole iic outside the communication hole), The top surface of the second nozzle hole 11b having a conical-stage shape is a ring shape having a first nozzle hole lie as a center, and one of the first electrode layers forms the upper bottom 11by to be exposed. Therefore, the first nozzle The diameter of the communication hole iibx (substantially circular) of the hole Uc and the second nozzle hole lib is smaller than the diameter of the bottom surface of the second nozzle hole 11^ (in the above-mentioned communication hole and the second nozzle hole nb) Further, in addition to at least a part of the inner wall of the first nozzle hole 11c, a first electrode layer 25 serving as an extending portion 25b is formed at a peripheral portion of the first nozzle hole 1lc and the second nozzle hole 丨lb. Since the oxidized stone constituting the first nozzle layer (7) is processed in the second nozzle hole 11b described later, the dry-type plasma of the oxygen-containing plasma exhibits high resistance, so that the first electrode layer is not formed as an extension portion of 2%. The first nozzle layer 1G or the first nozzle hole lle is exposed even in the second nozzle hole In the case of etching, it is hardly etched, and the shape of the first nozzle hole uc is not deformed. Conversely, when the first nozzle layer 10 is processed with the second nozzle hole Ub, the resistance is low, 95731.doc -44- Ϊ255232 material (such as In one embodiment, the first nozzle layer 10 and the second nozzle layer 20 are the same material, and the first electrode layer 25 is formed to cover all of the inner walls of the first nozzle hole Uc. That is, the first electrode layer 25 is in the first In the processing step of the two nozzle holes, the first nozzle hole Uc or the first nozzle layer 1 is protected from the function of the etched protective layer. Further, the inner wall of the second nozzle hole 丨1b is formed with the first electrode Layer 2 is connected to the second electrode layer 26. Further, a portion of the second electrode layer % is also disposed on the second nozzle layer 2 that forms the fluid supply surface 8〇b of the nozzle plate 80, and the body supply side surface is formed on the surface as shown in FIG. 13(4). The lead wires 26 & after processing the second electrode layer 26 are connected to a driving signal voltage applying means not shown. The liquid repellent layer 4 is formed of a polymer material having a fluoropolymer having a thickness of 0-05. Further, since the surface electrode layer 81 has high resistance to the first nozzle hole, the shape of the fluid discharge hole 9 is not deformed by the first nozzle hole. In addition, the shape of the fluid discharge hole 9 of the nozzle type plate which has a great influence on the spray accuracy is determined by the processing precision of the titanium film which is the surface electrode late 5 # m, so the fluid: the hole 9 is processed accurately. The degree is very high, so as to ensure a very high degree of spray precision, in order to improve the processing accuracy of the fluid discharge hole 9, while reducing the film thickness of the surface electrode layer 81, although a higher degree of accuracy can be obtained, The surface electrode layer is caused by the thickness of the surface electrode layer 81 being reduced. The rigidity of the body discharge hole 9 is reduced. The gentleman II is placed in contact with the surface electrode layer 81 to arrange the first nozzle layer 95731.doc -45 - 1255232, that is, the (four) surface electrode layer 81, which reduces the structural reliability of the surface electrode layer 81, and improves the fluid. The shape accuracy of the discharge hole 9. In addition, 'Because the first electrode sound B ▲ layer 25 for the brother: nozzle hole 111) means: south resistance, so the shape of the first nozzle hole Uc is not caused by the second nozzle hole and the large towel field 'cross shape, The sub-first nozzle layer 10 is not completely removed by the excessive processing of the second nozzle 1 b. The material used for the surface electrode layer 81 is not limited to a metal material mainly composed of platinum. As long as it is the etch of the first nozzle hole uc and the second spray 2 lib (4) and the sacrifice (10) (4) described later and the step of covering the liquid-repellent layer 4 in the & discharge hole 9: The silver inscription is highly resistant, that is, as long as it is a material resistant to fluorine-containing plasma, oxygen-containing plasma, nitric acid::milk:potassium aqueous solution, it can be processed according to sacrificial layer etching and hemp hole processing. And a combination of the second nozzle hole processing methods are used. Such as Esau, Bronze, Ming, Iron, Record, Gold, Ming, etc. as the main component to the coffin, can be selected by combining with the above-mentioned gas or narration agent. The material of the first nozzle layer 10, the second nozzle layer 20, the first electrode layer 25, and the first electrode layer 26 is not limited to the above, and a preferred combination of the material and the manufacturing method will be described later. Further, the second nozzle hole nb of the present embodiment is connected to the first nozzle hole. , the connecting hole (communication part) "!^ narrowing the shape of the truncated cone (cone shape), but the mouth is not limited to this. The nozzle type flat plate 80 of the modification shown in Fig. 14 is also a mouth. The so-called straight shape (circular shape) of the side wall of the first bird hole 1丨6 perpendicular to the stop layer 3. At this time, the fluid supply hole 12 95731.doc - 46 - 1255232 of the first nozzle hole 11b can be made smaller, and the degree of integration of the nozzle can be further improved. In addition, as shown in FIG. 14, the second electrode layer 26 may also be formed when the first "hanger" is the entire inner wall surface of the hole lib, and the reliability of the second electrode layer 26 with respect to electrical conduction is improved. One surface electrode 对应 corresponding to one of the Bama holes 1 1 is formed into one through hole 8 1 a, and it is also possible to form a plurality of through holes on one surface electrode layer 8 1 for One nozzle is a structure in which the hole 1 1 has a plurality of fluid discharge holes 9. In addition, 'the same can be the case of the nozzle type plate 8 of the first embodiment, and

弟-噴嘴孔11c形成側壁對於噴嘴式平板表面垂直之所+ 筆直形狀Ή形狀)。此時由於第—噴嘴孔之加工精確度二 尚’因此可縮小表面電極層81之形狀,可減少表面電㈣ 81產生之應力。 藉由形成本實施形態構造之喷嘴式平板零,),除前述 ①〜⑤項之外,還可發揮以下的作用。 匕由於第―贺嘴孔Ue係形成錐角形狀,因此形成於第一喷 觜孔lie内之第一電極層25之敷層性邛幻加關於導電 性之可靠性提高。 屯 ⑦由於形成於薄膜之表面電極層81之貫穿孔81a成為流體 排出孔9’目此加工精確度非常高,並且流體排出孔9之形 狀不致因形成第一電極層25而變化,因此排出可靠性提 (噴嘴式平板之製造方法) 其-人3兒明本實施形態之喷嘴式平板8〇之一種製造方法。 圖15(a)〜(g)係噴嘴式平板8〇製程之說明圖。 9573l.d0< -47- 1255232 f先’在基板6上與第一種實施形態同樣地形成犧牲層 5〇(圖15(·此時,犧牲層5〇之厚度為。進一步在上 述犧牲層5G上’以讀等方法形成厚度狀之始膜, 使用光蝕刻形成將表面電極層以局部形成於喷嘴孔"形成 4刀之外形形狀,及成為流體排出孔9之貫穿孔化之形狀 之光阻圖案。而後,使用乾式钮刻法同時加工上述表面電 極層8 1之外形形狀與流體排出孔9。 由於翻膜係、化學性較鈍性之材料,因此,此時上述乾式 1 虫刻係採用使用氬之__,物理性之加工藉由支配性 之方法進行加工。此外 山 、— 7 由於本加工係以非常高之精確度 進订’因此係使用各向異性高之餘刻條件。此時,上述表 面包極層81之形狀加卫成5 _徑之大致圓形形狀。此外, 置於上述表面電極層81内部之流體排出孔9係形成㈤ 徑之大致圓形形狀。 、其次’在上述犧牲層50及表面電極層81上,藉由P_CVD ^形成包含氧切膜之第_喷嘴層丨q。採用本法 時’由於可藉由用於成膜之氣體組成、氣壓、產生電漿用 之灯功率來控制成膜之氧化石夕膜具有之應力,並且階差部 成膜㈣性佳’因此上述表面電極⑽之階差部不致產生 龜裂等,膜之結構性之可土一 了罪性鬲。因此喷嘴式平板整體結 構性之可靠性提高(參照圖15(&))。 安其;^在上述第—喷嘴層10上’藉由光㈣作成光阻圖 木亚猎由含氣氣與氧氣之反應性離子姓刻(RIE)加工,加 工後’藉由光阻剝離㈣去光阻(參照圖⑽))。本钱刻方 95731.doc -48- 1255232 法,由於藉由電漿而活化之氟選擇性與矽原子反應,因此 氧化矽之蝕刻速度非常高。反之,如上述,由於鉑係化學-性穩定之材料,因此幾乎不與前述活化之氟反應。因而鉑 . 之蝕刻速度慢,藉此,本蝕刻可精確地在前述表面電極層 81與第一喷嘴層1〇之界面停止。 "此外,本加工步驟係藉由使用含氟氣與氧氣之電漿,將 氧化石夕與光阻之姓刻速度設定成相同程度,採用第一種實 施形態在加工第二喷嘴層2G之步驟中使用之反映光阻形狀 之方法來加工氧化矽,而將第一噴嘴孔Uc加工成錐角形| 狀。此時’第-喷嘴孔llc之位於與表面電極層81之接合部 之形狀,係形成4 徑之大致圓形形狀,與第二喷嘴層2〇 之界面之開口徑形成6师。此外,第一噴嘴孔山之形狀係 加工成大於流體排出孔9,並在第—噴嘴孔之圖案内配 置流體排出孔9。 此外’由於上述第—喷嘴孔Uc只須接合於表面電極層8The nozzle-nozzle hole 11c forms a + straight shape 侧壁 shape in which the side wall is perpendicular to the surface of the nozzle plate. At this time, since the processing precision of the first nozzle hole is doubled, the shape of the surface electrode layer 81 can be reduced, and the stress generated by the surface electric (four) 81 can be reduced. By forming the nozzle type plate zero of the structure of the present embodiment, in addition to the above items 1 to 5, the following effects can be exhibited. Since the U-shaped hole Ue forms a taper shape, the reliability of the coating property of the first electrode layer 25 formed in the first ejection hole lie is improved. Since the through hole 81a formed in the surface electrode layer 81 of the film becomes the fluid discharge hole 9', the processing accuracy is very high, and the shape of the fluid discharge hole 9 does not change due to the formation of the first electrode layer 25, so that the discharge is reliable. (Manufacturing Method of Nozzle Plate) A method for manufacturing a nozzle type plate 8 of the embodiment of the present invention. Fig. 15 (a) to (g) are explanatory views of a nozzle type flat plate 8 〇 process. 9573l.d0<-47- 1255232 f First, a sacrificial layer 5 is formed on the substrate 6 in the same manner as in the first embodiment (Fig. 15 (in this case, the thickness of the sacrificial layer 5 is further. Further, in the sacrificial layer 5G described above) The upper layer is formed by a method such as reading, and the surface electrode layer is partially formed in the nozzle hole by photolithography, and the shape of the through hole is formed into a shape of a through hole. Then, the shape of the surface electrode layer 8 1 and the fluid discharge hole 9 are simultaneously processed by a dry button engraving method. The above-mentioned dry type insect engraving system is at this time due to the reticle system and the chemically blunt material. With the use of argon __, the physical processing is processed by the dominant method. In addition, the mountain, - 7 because the processing system is ordered with very high precision 'is therefore using the high anisotropy condition. At this time, the shape of the surface cladding layer 81 is added to a substantially circular shape of 5 mm. Further, the fluid discharge hole 9 placed inside the surface electrode layer 81 is formed into a substantially circular shape of (5) diameter. 'At the sacrifice above On the surface electrode layer 81 and the surface electrode layer 81, the first nozzle layer 丨q including the oxygen cut film is formed by P_CVD ^. When the method is used, the lamp can be used for the gas composition, the gas pressure, and the plasma for film formation. The power is used to control the stress of the oxidized oxide film formed by the film, and the step portion is formed into a film (four). Therefore, the step portion of the surface electrode (10) does not cause cracks, etc., and the structural property of the film is sinful. Therefore, the reliability of the overall structurality of the nozzle type flat plate is improved (refer to FIG. 15 (&)). On the above-mentioned first nozzle layer 10, 'the light is made by light (four). Gas and oxygen reactive ion etch (RIE) processing, after processing 'by photoresist stripping (four) to photoresist (refer to Figure (10))). The cost of the square 95731.doc -48- 1255232 method, due to the plasma The activated fluorine selectivity reacts with the deuterium atom, so the etching rate of the antimony oxide is very high. Conversely, as described above, since the platinum-based chemically stable material, it hardly reacts with the activated fluorine. The speed is slow, whereby the etching can be accurately performed on the aforementioned surface The interface between the pole layer 81 and the first nozzle layer 1 is stopped. "In addition, the processing step is to set the speed of the oxidized stone eve and the photoresist to the same degree by using a plasma of fluorine-containing gas and oxygen. The ruthenium oxide is processed by the method of reflecting the shape of the photoresist used in the step of processing the second nozzle layer 2G in the first embodiment, and the first nozzle hole Uc is processed into a tapered shape. At this time, the 'first nozzle hole The shape of the joint portion of the base electrode layer 81 and the base electrode layer 81 is formed into a substantially circular shape having a diameter of four, and the opening diameter of the interface with the second nozzle layer 2 is formed into six divisions. Further, the shape of the first nozzle hole mountain is The fluid discharge hole 9 is processed to be larger than the fluid discharge hole 9, and the fluid discharge hole 9 is disposed in the pattern of the first nozzle hole. Further, since the above-mentioned first nozzle hole Uc only has to be bonded to the surface electrode layer 8

即可’因此除錐角形狀之外’亦可為對噴嘴面垂直之所 筆直形狀。 其次,藉由離子束賤射,自箭頭方向⑼第㈣1Q 表面开^成18 )形成鈦膜,在上述表面電極層。與第—噴嘴 孔He之一部分及第一喷嘴層1〇上形成厚度為師之第 -電極層25。此時,須考慮第—嘴嘴孔&之㈣及第1 嘴層1〇之厚度,來決定鈦粒子之人射方向,避免上述鈦膜 在形成於上述表面電極層81之流體排出孔9内部成膜。此 外’此時係固定基板來形成第一電極層25,不' 95731.doc -49- 1255232 上述入射角度後 旋轉,可在第一 此形成之附著於第一 後述之第二喷嘴孔加 之功能。 ’藉由以喷嘴面之法線方向為中心使基板 喷嘴孔lie側壁全面形成第一電極層25。如 噴嘴孔側壁全面之第_電極層25,在 工時,可發揮第一噴嘴孔llc之保護層 +其久’使用乾^刻法來加卫上述第_電極層25在第一 貝驚層10上之外形形狀。本加工係採用第_種實施形態中 加工第二電極層26時實施之加工方法來進行。亦即,以正 型之光阻形成所需之圖案後,藉由使用以氬氣為主要成分 之^聚之乾⑭刻來進行加工。此時配置於第一喷嘴層1〇 與第二噴嘴層2〇界面之筐—兩 少一 曲之罘私極層25之形狀係形成16 /m 徑之大致圓形形狀(參照圖15(c))。 其次,在上述第—噴嘴層10上,以厚度20 _形成塗敷型 之聚酿亞胺樹脂膜,而形成第二噴嘴層20(參照圖15⑷)。 此時’上述塗敷型聚西夜亞 來^亞胺树脂猎由自旋式塗敷法而塗敷 於第一喷嘴層10上,並為 〇 C下k成2小時。此時流體排 出孔9及第一喷嘴《丨1 1 p +、上財— 、 亦被水^亞胺樹脂掩埋。 其次,在上述第二噴嘴層,^ ^ ^ ^ ^ ^ ^ ^ ^ 稭由光蝕刻而形成光阻 圖㈣,進行使用以氧為主要成分之氣體之乾式㈣,而 在弟二喷嘴層20上形成錐角形狀(圓錐台形狀)之第二㈣ 孔1 lb(參照圖15(e))。 、 另外,上述乾式蝕刻可以一 示 貝為層10、弟一電極層25 或表面'極層81停止。亦即,除第-喷嘴孔UC之外,第一 噴嘴層10或第一電極声山 s 5路出之部位不進行過度之乾式蝕 95731.doc -50- 1255232 到。此外 1机菔徘出孔9之外 表面電極層81露出之部位不進行過度之乾式則。亦即, 在第二喷嘴孔lib之加卫製程中,於先前步驟被聚酸亞胺接 脂掩埋之第-喷嘴孔llc及流體排出孔9,藉由除去聚酸亞 胺樹脂而重現,流體排出孔9以藉由形成於表面電極層8] 之圖案所決定之形狀而存在之第二喷嘴層2〇材料被除去, 而重現在先前步驟被聚醯亞胺樹脂掩埋之形狀。 其次,使用光阻剝離液除去上述光阻圖案7〇, 二噴嘴層20上形成包含以鈦為主要成分之金屬材料之:二 電極層26。吨時係使用離子束濺射法’在〇·2 mT〇汀之氬氣 壓下抑制鈦粒子因氬原子而散射,並且傾斜基板,使欽粒 子自箭駄2之方向射達’而僅形成於第二噴嘴層2〇内壁面 之一側,第二電極層26之一部分形成與第一電極層乃電性It can be 'so that in addition to the shape of the taper angle', it can also be a straight shape perpendicular to the nozzle face. Next, a titanium film is formed on the surface electrode layer by ion beam sputtering from the (4)th (4th) 1Q surface of the arrow direction. A first electrode layer 25 having a thickness is formed on a portion of the first nozzle hole He and the first nozzle layer 1A. At this time, the thickness of the first nozzle layer (4) and the first nozzle layer 1〇 must be considered to determine the direction of the human particles of the titanium particles, and the titanium film is prevented from being formed in the fluid discharge hole 9 of the surface electrode layer 81. Internal film formation. Further, in this case, the first electrode layer 25 is fixed by the substrate, and the above incident angle is not rotated, and the first nozzle layer is formed to be attached to the second nozzle hole to be described later. The first electrode layer 25 is formed entirely by the side wall of the substrate nozzle hole lie centering on the normal direction of the nozzle surface. For example, the first electrode layer 25 of the nozzle hole side wall can play the protective layer of the first nozzle hole llc during the working hours, and the _ electrode layer 25 is applied to the first shell layer 25 by using the dry etching method. 10 on the shape of the outer shape. This processing is carried out by a processing method performed when the second electrode layer 26 is processed in the first embodiment. That is, after forming a desired pattern with a positive photoresist, processing is performed by using a dry film of argon gas as a main component. At this time, the basket disposed at the interface between the first nozzle layer 1〇 and the second nozzle layer 2 is formed into a substantially circular shape having a diameter of 16 / m (see FIG. 15 (c). )). Next, a coating type polyimide resin film is formed on the first nozzle layer 10 by a thickness of 20 Å to form a second nozzle layer 20 (see Fig. 15 (4)). At this time, the above-mentioned coated type of polyimine resin was applied to the first nozzle layer 10 by a spin coating method, and was k for 2 hours. At this time, the fluid discharge hole 9 and the first nozzle "丨1 1 p +, Shangcai" are also buried by the water imine resin. Next, in the second nozzle layer, ^ ^ ^ ^ ^ ^ ^ ^ ^ is formed by photolithography to form a photoresist pattern (4), and a dry type (4) using a gas containing oxygen as a main component is performed, and on the second nozzle layer 20 The second (four) hole 1 lb of the taper shape (cone shape) is formed (refer to Fig. 15 (e)). Further, the above dry etching may be stopped as the layer 10, the electrode layer 25 or the surface electrode layer 81. That is, except for the first nozzle hole UC, the portion of the first nozzle layer 10 or the first electrode acoustic s 5 is not excessively dry etched 95731.doc -50 - 1255232. Further, the portion where the surface electrode layer 81 is exposed outside the one-outlet hole 9 is not excessively dry. That is, in the curing process of the second nozzle hole lib, the first nozzle hole llc and the fluid discharge hole 9 buried in the previous step by the polyimine grease are reproduced by removing the polyimide resin. The fluid discharge hole 9 is removed in a shape in which the second nozzle layer 2 is present in a shape determined by the pattern formed in the surface electrode layer 8], and the shape in which the previous step is buried by the polyimide resin is reproduced. Next, the photoresist pattern 7 is removed by using a photoresist stripping solution, and a two-electrode layer 26 is formed on the second nozzle layer 20 to contain a metal material containing titanium as a main component. In the case of tons, the ion beam sputtering method is used to suppress the scattering of titanium particles by argon atoms under the argon gas pressure of 〇·2 mT, and the substrate is tilted so that the granules are emitted from the direction of the arrow 2 and only formed in One side of the inner wall surface of the second nozzle layer 2, and a portion of the second electrode layer 26 is electrically formed with the first electrode layer

短路(參照圖15⑴)。膜厚為〇.5μπιβ如此 藉由自斜方向入 射鈦粒子,來开^成第二電極層26,可防止第二電極層26附 著於流體排出孔9内’藉此可防止流體排出孔9之形:變化 及堵塞。Short circuit (refer to Figure 15 (1)). The film thickness is 〇.5μπιβ, so that the second electrode layer 26 is opened by injecting the titanium particles from the oblique direction, so that the second electrode layer 26 can be prevented from adhering to the fluid discharge hole 9, thereby preventing the fluid discharge hole 9 from being formed. Shape: change and blockage.

-、人灵%上述苐一電極層26加工,該步驟與第一種實 軛幵八 %相g,因此省略。形成於第二喷嘴層上之第二電極 層26之形狀為大致徑之圓形形狀。 其夂’藉由浸潰於硝酸與水為主要成分之水溶液中僅蝕 刻犧牲層50 ’而自基板6取下噴嘴式平板80(圖15(g))。如前 =,形成第一噴嘴層10之氧化矽,形成第二喷嘴層20之聚 1亞胺树知與形成表面電極層8 1之鉑,以及形成第一電極 95731.doc • 51 - 1255232 層25與第二電極層26之鈦,幾乎不被上述犧牲層咒之蝕刻 液蝕刻,因此不致因犧牲層5〇之蝕刻而導致形狀變化及結 構性之可靠性降低。 其次,在第一喷嘴層1〇表面形成拒液層4(圖15(g))。此時 基於考慮塗敷便利性之宗旨而使用氟聚合物,並藉由沖壓 寺方法將其塗敷於第一噴嘴層1〇表面,以高分子膜形成拒 液層4。另外,就階躍式覆蓋於第一噴嘴孔丨“内之拒液層, 係於形成拒液層後,使用含氧之電漿,藉由自第二喷嘴孔 1 lb側乾式蝕刻來將其除去。藉此,可使喷嘴式平板之損 傷程度達到最小限度。 本實施形態藉由使用含氧之電漿之乾式蝕刻來蝕刻除去 上述階躍式覆蓋。但是,本實施形態中,如上所述,流體 排出面上存在對使用含氧之電漿之乾式蝕刻具有高耐性之 表面電極層81,由於該表面電極層81決定流體排出孔9之形 狀,因此流體排出孔9之形狀不致因上述乾式蝕刻而變化。 因而可形成非常高精確度之喷嘴孔。 具體而言,評估具有使用本實施形態之步驟作成之2〇〇 個流體排出孔9之喷嘴式平板8〇之各流體排出孔9之形狀 時,可以非常高精確度地進行加工,偏差僅為± 〇 .丨5 一❿。 此外,噴嘴式平板80非常平坦,其翹曲亦在1〇μιη以下。 另外,本貝—形怨之犧牲層5 〇係使用鎳,表面電極層$ ^ 使用鉑,第一喷嘴層10使用氧化矽,第二噴嘴層2〇使用聚 醯亞胺樹脂,第一電極層25使用鈦,第二電極層26使用鈦, 不過並不限定於該組合。 95731.doc -52- 1255232 犧牲層50除錄之外,亦可依與用於表面電極層η、第一 噴嘴層10、第二噴嘴層20上之材料之組合,而使用鋁、銅 等可溶於硝酸或KOH水溶液之材料。此外,犧牲層5〇之形 成方法,除電鍍之外,亦可依材料而使用蒸鍍法、濺射法、 塗敷法等。 第一贺嘴層20及第二電極層26可使用因犧牲層5〇之蝕刻 而損傷輕微之材料。不過,考慮與後述之第一喷嘴層或表 面電極層8丨之蝕刻選擇性時,須為可進行使用含氧之電漿 之蝕刻之有機樹脂。再者,使用具有各分子鏈橋接反應之 分子構造之有機樹脂時,第二噴嘴層2〇之耐熱性及耐環境 性高,可提高喷嘴式平板之可靠性。 此外,第一喷嘴層1〇及第一電極層25可使用對犧牲層5〇 之蝕刻及第二喷嘴孔lib之蝕刻耐性高之材料。再者,表面 電極層8!可使用對犧牲層5〇之_、第二喷嘴孔ub之姓刻 及第一喷嘴孔11C之蝕刻耐性高之材料。 圖16顯示使用材料(犧牲層、表面電極層、第一喷嘴層、 第二噴嘴層、第-電極層、第一電極層之形成區域、第二 電極層)及加工方法(流體排出孔、第—喷嘴孔、第二喷嘴 孔、除去犧牲層)之較佳組合例。 如圖所示’第-噴嘴層1G或第二噴嘴層2G藉由聚酿亞 胺等有機樹脂及氧化石夕等石夕化合物之無機材料之组合,可 構成喷嘴層。不過,如氧化石夕/氧化石夕之組合,及聚醒亞胺 /聚醢亞胺之組合,在第二噴嘴孔加工時,係第—噴嘴層10 會受到損傷之組合時,須在第_噴嘴孔lle之内壁全面形成 95731.doc -53- 1255232 第-電極層25,來保護第一喷嘴孔iu。 、二:卜:Ϊ實施形態係藉由蝕刻而完全除去犧牲層5〇,不 員完全除去犧牲層5〇,藉由钱刻僅除去犧牲層对 之與弟一噴嘴層H)接觸之部分時,即可自基板6取下喷嘴式 平板8 0。 亦可使用矽系高分 此外,拒液層4並不限定於氟聚合物 子膜及DLC(類似鑽石碳)等。 藉由使用以上之加工步驟 之喷嘴式平板80。 可製造發揮上述①〜⑦項作用 此外’如占述各實施形態’可採用不形成拒液層4之構 造。藉由不在表面電極層81或第—噴嘴層^形成拒液層 4,流體排出孔9之形狀精確度進一步提高。 此外,如上述各實施形態,亦可為由具有表面電極層81、 第一電極層25、第二電極層26及以上述材料為主要成分之 金屬膜之數個薄膜構成之所謂疊層膜。 此外,上述各實施形態係說明藉由在基板6上形成犧牲層 5 . 50,並蝕刻該犧牲層5 . 5〇,而製造噴嘴式平板8 . 8〇 之方法,不過除此之外,如亦可在鎳板等包含可以與犧牲 層5. 50之蝕刻相同方法進行蝕刻之材料之基板上直接形成 第一噴嘴層1 · 10。 另外’本發明並不限定於上述各種實施形態,在申請專 利範圍内可作各種變更,適切組合分別揭示於不同實施形 態之技術性手段而獲得之實施形態,亦包含在本發明之技 術性範圍内。 9573 l.doc -54- 1255232-, the human spirit % of the above-mentioned electrode layer 26 is processed, this step is the same as the first type of yoke 幵, so it is omitted. The shape of the second electrode layer 26 formed on the second nozzle layer is a circular shape having a substantially radial shape. Then, the nozzle plate 80 is removed from the substrate 6 by etching only the sacrificial layer 50' in an aqueous solution containing nitric acid and water as a main component (Fig. 15(g)). As before =, the ruthenium oxide of the first nozzle layer 10 is formed, the polyimine layer of the second nozzle layer 20 is formed and the platinum forming the surface electrode layer 81, and the first electrode 95731.doc • 51 - 1255232 layer is formed. The titanium of the second electrode layer 25 and the second electrode layer 26 is hardly etched by the etching liquid of the sacrificial layer, so that the shape change and the reliability of the structural property are not deteriorated by the etching of the sacrificial layer 5〇. Next, a liquid repellent layer 4 is formed on the surface of the first nozzle layer 1 (Fig. 15 (g)). At this time, a fluoropolymer is used in consideration of the convenience of coating, and it is applied to the surface of the first nozzle layer 1 by a stamping method, and the liquid repellent layer 4 is formed of a polymer film. In addition, in the step of covering the first nozzle hole 丨 "in the liquid repellent layer, after forming the liquid repellent layer, using an oxygen-containing plasma, by dry etching from the second nozzle hole 1 lb side Therefore, the degree of damage of the nozzle type flat plate can be minimized. In the present embodiment, the step cover is removed by dry etching using an oxygen-containing plasma. However, in the present embodiment, as described above There is a surface electrode layer 81 having high resistance to dry etching using an oxygen-containing plasma on the fluid discharge surface. Since the surface electrode layer 81 determines the shape of the fluid discharge hole 9, the shape of the fluid discharge hole 9 is not caused by the above dry type. It is changed by etching. Thus, a nozzle hole of a very high precision can be formed. Specifically, each of the fluid discharge holes 9 of the nozzle type plate 8 having the two fluid discharge holes 9 formed by the procedure of the embodiment is evaluated. In the shape, the machining can be performed with very high precision with a deviation of only ± 〇. 丨 5 ❿. In addition, the nozzle plate 80 is very flat and its warpage is also below 1 〇 μηη. The sacrificial layer of the grievance 5 uses nickel, the surface electrode layer $ ^ uses platinum, the first nozzle layer 10 uses yttrium oxide, the second nozzle layer 2 醯 uses polyimide resin, and the first electrode layer 25 uses titanium, The second electrode layer 26 is made of titanium, but is not limited to the combination. 95731.doc -52- 1255232 The sacrificial layer 50 can be used in addition to the surface electrode layer η, the first nozzle layer 10, and the second nozzle. A combination of materials on the layer 20, and a material which is soluble in an aqueous solution of nitric acid or KOH, such as aluminum or copper, and a method of forming the sacrificial layer 5, in addition to electroplating, may also use an evaporation method or a splash depending on the material. Injection method, coating method, etc. The first layer 20 and the second electrode layer 26 may be damaged by etching by the sacrificial layer 5 。. However, the first nozzle layer or the surface electrode layer 8 to be described later is considered. The etching selectivity of the crucible must be an organic resin which can be etched using an oxygen-containing plasma. Further, when an organic resin having a molecular structure of a molecular chain bridging reaction is used, the heat resistance of the second nozzle layer 2 And high environmental resistance, can improve the nozzle type Further, the first nozzle layer 1 and the first electrode layer 25 may be made of a material having high etching resistance to the etching of the sacrificial layer 5 and the second nozzle hole lib. Further, the surface electrode layer 8 can be used for sacrifice. The material of the layer 5 _, the second nozzle hole ub and the first nozzle hole 11C have high etching resistance. Fig. 16 shows the materials used (sacrificial layer, surface electrode layer, first nozzle layer, second nozzle layer, A preferred combination example of the first electrode layer, the first electrode layer formation region, and the second electrode layer) and the processing method (fluid discharge hole, first nozzle hole, second nozzle hole, and sacrificial layer). The first nozzle layer 1G or the second nozzle layer 2G can constitute a nozzle layer by a combination of an organic resin such as a polyimide and an inorganic material such as a cerium oxide compound. However, if the combination of oxidized stone sulphate/oxidized sulphur stone and the combination of polydamine and polyimine is used in the second nozzle hole processing, the first nozzle layer 10 will be damaged when combined. The inner wall of the nozzle hole lle is integrally formed with a 95731.doc -53 - 1255232 first electrode layer 25 to protect the first nozzle hole iu. 2: Bu: The implementation form is to completely remove the sacrificial layer 5 by etching, without completely removing the sacrificial layer 5〇, by removing only the portion of the sacrificial layer that is in contact with the nozzle layer H) The nozzle plate 80 can be removed from the substrate 6. It is also possible to use a lanthanum high score. Further, the liquid repellency layer 4 is not limited to a fluoropolymer film and DLC (like diamond carbon). The nozzle plate 80 is used by using the above processing steps. The above-described 1 to 7 functions can be produced. Further, the structure in which the liquid repellent layer 4 is not formed can be employed as described in the respective embodiments. By not forming the liquid repellent layer 4 on the surface electrode layer 81 or the first nozzle layer, the shape accuracy of the fluid discharge hole 9 is further improved. Further, each of the above embodiments may be a so-called laminated film comprising a plurality of thin films including a surface electrode layer 81, a first electrode layer 25, a second electrode layer 26, and a metal film containing the above-mentioned material as a main component. In addition, each of the above embodiments describes a method of manufacturing a nozzle type flat plate by using a sacrificial layer 5 . 50 on the substrate 6 and etching the sacrificial layer 5. 5 ,, but otherwise The first nozzle layer 1·10 may be directly formed on a substrate such as a nickel plate or the like which may be etched in the same manner as the etching of the sacrificial layer 5.50. In addition, the present invention is not limited to the above-described various embodiments, and various modifications can be made without departing from the scope of the invention, and the embodiments obtained by separately combining the technical means of the different embodiments are also included in the technical scope of the present invention. Inside. 9573 l.doc -54- 1255232

如以上所述,本發明之喷嘴式平板係設於藉由靜電吸引 而自喷嘴前端之流體排出孔排出藉由施加電壓而帶電之流 體之靜電吸引型流體排出裝置内,且具有數個喷嘴孔部, 其構造具有:薄層之第一噴嘴層,其係具有第一嘖嘴孔, 並酉:置於流體排幻則;及至少具備—層第二噴嘴層,其係 7豐於該第一噴嘴層之流體供給側,比上述第一噴嘴層 厚:且與上述第-噴嘴孔連通,並且具有與第一喷嘴孔構 1噴嘴孔部之第二噴嘴孔;並且電性連接形成於該第一喷 觜孔内壁之第一電極層,與形成於第二喷嘴孔内壁之第二 電極層。 由於上述構造之噴嘴式平板係在薄層之第一f嘴層上至 夕堆$ -層厚層之第二喷嘴層,因此可藉由第二喷嘴層確 保喷嘴式平板本身之強度及剛性,可使第一噴嘴層之厚度 充分薄。藉由減少層厚,形成於第—噴嘴層之第—喷嘴孔 可=微細地形成如1〇/xm以下之孔徑,並且可在此種超微細As described above, the nozzle type flat plate of the present invention is provided in an electrostatic attraction type fluid discharge device that discharges a fluid charged by application of a voltage from a fluid discharge hole at the tip end of the nozzle by electrostatic attraction, and has a plurality of nozzle holes. a structure having: a first layer of a thin layer having a first nozzle hole, and 酉: placed in a fluid row; and at least a second nozzle layer, the system 7 is abundant a fluid supply side of a nozzle layer, thicker than the first nozzle layer: and communicating with the first nozzle hole, and having a second nozzle hole with a nozzle hole portion of the first nozzle hole; and electrically connected thereto a first electrode layer on the inner wall of the first nozzle hole and a second electrode layer formed on the inner wall of the second nozzle hole. Since the nozzle type plate of the above configuration is on the first nozzle layer of the thin layer to the second nozzle layer of the thickness layer of the stack, the strength and rigidity of the nozzle plate itself can be ensured by the second nozzle layer. The thickness of the first nozzle layer can be made sufficiently thin. By reducing the layer thickness, the first nozzle hole formed in the first nozzle layer can form a pore diameter of, for example, 1 〇/xm or less, and can be ultrafine

第A夤孔内壁’在層厚方向上穩定地形成第一電極 1 ’將流體排出面之第一喷嘴孔之開口部作為流體排出孔 ^可形成第弘極至該流體排出孔近旁。結果可比先前 大幅降低噴嘴内部之電阻R,謀求提高流體之排出頻率,可 對記錄媒體高速描繪。 且由於如此形成之 通之第二噴嘴孔之第 第一電極層與形成於與第一喷嘴孔連 二電極層電性連接,因此可經由第二 電極層自噴嘴式平板之流體排出 側供給驅動信號 因此, 供給驅動信號至第一電極層用 之引出配線不致接近媒體, 95731.doc -55 « 1255232 記錄媒體亦不致因引出配線產生一 本發明之喷脅式平板進一步亦可構:上:::,傷。 第-噴嘴層與第二噴嘴-弟-電極層在 -嘴嘴層上,上…: 自第一喷嘴孔延伸至第 八盘第曰 、弟一电極層在延伸至第-噴嘴層上之部 刀與弟一電極層電性連接。 上述構造,由於第一電極声孫 氏^ 層係在弟一賀嘴層與第二喷嘴 面,自第一喷嘴孔延伸至第—喷嘴層上,第二電極 層係在該延伸部分與第一電 盾甩性連接,因此第一雷榀 層與第二電極層之連接並非在 a ^ 包仏嘈之剖面,而係在電 ^之表面钟。因此,雖亦有連接各㈣電極層之構造, 不過各電極層之電性連接可靠性高,可大幅降低因斷線等 而然法有效施加驅動信號至第—電極層之危險性 排出可靠性。 回 此外’本發明之噴嘴式平板進—步亦可構成上述第—電 極層形成於上述第一喷嘴孔之内壁全面。 甩 由於上述構造係在第一喷嘴孔之内壁全面形成有第一電 極層’因此可施加均一之電場至流體排出孔内之流體。如 為在贺嘴式平板之流體排出面具有數個流體排出孔之構造 時,各流體排出孔於泰勒連線之形成位置不 = 峨,不過藉此各流體排出孔之泰勒連線之形成= 定,而可提高噴灑精確度。 此外,本發明之喷嘴式平板進一步亦可構成上述第一電 極層在上述第一喷嘴層與第二喷嘴層之界面,自第一噴嘴 孔延伸至第一噴嘴層上,上述第二喷嘴孔之與第一喷嘴孔 95731.doc -56- 1255232 連通側之開口部,係設於延伸至該第一噴嘴層上之第一電 極層部分内。 —由於上述構造在第一噴嘴層與第二喷嘴層之界面,於第 电:層延伸至第—喷嘴層上之部分,配置有第二喷嘴孔 =與弟-喷嘴孔連通側之開口部,因此於敍刻加卫第二喷 嘴孔時’該第-電極層之延伸部分發揮钱刻停止部之功 成,而避免第一嘴嘴孔或第-喷嘴層因形成第二喷嘴孔時 之钱刻遭受損傷而變形。 如上所述,在第一電極層之延伸部分外側之第一喷嘴層 ^刻時’ m層會舆噴嘴式平板分離 過藉由上述構造則可穩定地製造噴嘴式平板。〃 本發明之噴嘴式平板亦可進一步構成上述第一喷嘴孔及 由\一 形成流體排出側之開口部大於流體供給側。 、上述構造係形成第—噴嘴孔及/或第二喷嘴孔且有 ▲體排出側擴大之錐角狀, /、 ^ 口此貝嗝孔之内壁面盥第一喰 嘴層或第二喷嘴層之各表 〃 、 一喷嘴孔或笛+纟面之構成肖係鈍角。藉此,自第 一或第一^實嘴孔之内壁面至各噴嘴層表面,形成第 或弟…層時,因内壁面與噴嘴層 電極層斷線之危險性低 #成角仏成 lL ^ , 心烕^包可靠性高之電極声。 卜,供給排出液體至喷嘴 曰 危怜性π 貝鳥則知日^ ’在噴嘴内產生亂流之 巳險性】、,可穩定地供給排出液體。 此外’本發明之噴嘴式 喷嘴孔之、、ώ顺板亦可進一步構成在上述第一 貝為孔之机肢排出侧配且 第-,嘴孔之、w/ 牙孔之表面電極層,堵塞 之^排出側開口部,該貫穿孔與第—喷嘴孔 95731.doc -57- 1255232 l,並且上述表面電極層與第一電極層電性連接。 上述構造,由於設於噴嘴式平板之流體排出面之表面電 極層之貫穿孔成為流體排出& ’因此可以表面電極層之蝕 刻來加工對排出流體之噴麗精確度影響重大之流體排出 孔。藉此,比構成在内壁成膜之第一電極層之第—喷嘴孔 之流體排出側開口部作為流體排出孔,其流體排出孔之形 狀精確度更加穩定,同時錢精確度更加穩定化。 y 此外,本發明之噴嘴式平板亦可進—步構成最靠近 供給側之上述第二噴嘴層之第二電極層,在該第二喷嘴層 之流體供給倒,鄰接之喷嘴孔部間電性分離。 上述構造由於具有數個喷嘴孔部之噴嘴式平板中 近流體供給側之上述第二喷嘴層之第二電極層,在該第二 噴嘴層之流體供給側,鄰接之喷嘴孔部間電性分離,因此 可獨立驅動數個噴嘴孔部,可進行高解像度之描繪。 此外’本發明之噴嘴式平板亦可進—步構成最靠近流體 供給側之上述第二噴嘴層之第二電極層,亦於 噴嘴層之流體供认相丨丨矣而,卢兮主 弟一 配線。 表面以表面被圖案化而形成引出 _上述構造由於利用最靠近流體供給側之第二喷嘴層之第 —電極層,在第二噴嘴層之 線’因此可以弓|+_ Λ本 側表面作為引出配 電性分離第二電枉工〔驟同時在鄰接噴嘴孔部間 步驟成為-個步驟::製:=與引出配_ 喷嘴孔内壁之第_ *於形成於第二 弟-电極層與引出配線係加工相同電極層而 95731.doc -58- 1255232 形成,因此第二電極層與引出配線之連接可靠性非常高。 此外’本發明之噴嘴式平板亦可進—步構成上述第:喷 嘴孔之流體排出側之開口部之直徑或是形成於上述表面兩 極層之貫穿孔之直徑為8 pm以下。 =前述,藉由將噴嘴之排出孔直徑形成〇〇1〜25 Am之微 細徑’產生局部電場,#由微細喷嘴化可降低排出時之驅 動電壓。此種驅動電壓之降低對裝置之小型化及噴嘴之高 密度化極為有利。當然,藉由使驅動電壓降低,亦可使: 成本效益高之低電壓驅動驅動器,亦可謀求提高使用上之 安全性。 再者,上述排出模型,由於排出所需之電場強度取決於 局部集中電場強度,因此無須存在相對電極。#即,不需 要相對電極而亦可對絕緣性基板等進行印字,裝置構造之 彈性增加,對於厚之絕緣體亦可進行印字。 其中,如上述構造藉由將喷嘴之流體排出孔之直徑如上 述地设定為φ8 μιη以下,電場強度分布有效集中於該流體排 出孔之排出面近旁,並且自相對電極至流體排出孔之距離 之交動不影響電場強度分布,因此不受相對電極之位置精 確度、記錄媒體之材料特性之偏差及厚度偏差之影響,^ 可進行穩定之流體排出。 此外,藉由可將電場強度分布有效集中於該流體排出孔 之排出面近旁,而在狹窄區域穩定形成強電場,可確實排 出超微量之流體,可使印字圖像達到高解像度。 如以上所述,本發明之喷嘴式平板之製造方法係具備以 95731.doc -59- 1255232 在基板上形成犧牲層;在上 -噴嘴層;在上ϋ +此 ㈣I上形成第 ,+ 这弟一贳嘴層上形成數個第一喷嘴孔.^ 上述第一嘖嘴居卜,^ 貝為孔,在 -、.、3…各第—喷嘴孔之内壁面而形成第 以層’以殘留於各第— 圍部之方式加工上述第………1嘴孔周 亦包含殘留之各第一 f E曰,在上述弟—喷嘴層上, 述第二嗔嘴心“…部分而形成第二噴嘴層;在上 、*體排屮、 個第二噴嘴孔,使各第二噴嘴孔在 :體排出側之開口部收納於殘留於上述第—喷嘴層上1: 弟—電極層部分;在上 之各 孔之内壁面,形成第—層上,包含各第二喷嘴 ^ :弟-电極4;及以在鄰接之第二嘖嘴孔 '電性分離之方式,加工第二電極層。 贺鳥孔 噴::、ί剛性w之基板上’經由犧牲層,依序堆疊第- 負為層 '弟一電極声、笛-+ ^不層弟一贺嘴層及第二電極層。 利:光钱刻技術形成光阻圖案後,由於可藉由乾式敍刻加 工成所需形狀,因此可& # f f 嘴孔、笛+些之形狀精確度形成第-噴 弟—贺鳴孔、第一電極層及第二電極層。 :外’由於喷嘴式平板之流體排出面係藉由 至步驟之最後階段,因此在喷嘴式平板製造步驟中,流體又 =孔不致遭受損傷而變形。因而噴嘴式平板之製造良率 此外’本發明之噴嘴式平板之製造方法進一步亦 於在基板上形成犧牲層之步驟與在犧牲層上形成第—喷 層之步驟之間’在上述犧牲層上形成表面電極層,對應 赁嘴孔部形成部位來分離該表面電極層,並且在各分離部 95731.doc -60- 1255232 形成貫穿孔之步驟;形成犧牲層上一〜 亦包含分離之表面+朽 貝鳴層之步驟, 之表面$極層上而形成第_ 。 本構造之噴嘴式平板之製 、a 層上之表面電極μ上力 ',由於可在形成於犧牲 體排出孔之形狀不致因形成於第: = 因此流 之不均勾性(如膜厚分布)而變形,而了::内之弟-電極層 之流體排出孔之嘖嘴式 &造具有更高精確度 ㈣二發明之二之製造方法,進一步亦可 1 二二一電極層之步驟,對噴嘴式平板表面,自钭ί 向入射成膜麵子。 ^叫目計方 此外本發明之噴嘴式平板之 成上述第-電極;之牛- &方法,進-步亦可在形 “玉層之步驟,對噴嘴式平板表面,自 入射成膜粒子。 即目斜方向 :斜方向入射成膜粒子而形成之電極 :嘴孔之側壁的附著性佳。再者,對於崎或二;):: 影之區域不形成電極層,因此,可將如形成第二^極 層時之第一喷嘴孔内部, 屯極 面電極層之貫穿孔…/成弟一 %極層時之形成於表 陰影之部分而成膜。夢在寺匕不希望形成電極層之區域作為該 與不形成電極層之區:可間便設定形成電極層之區域 &或,亚且可提高形成電極層之 内部之電極層之附著性。 、 、、卜纟^明 < 贺嘴式平板之製造方法進一纟亦可 迹之形成第二噴嘴孔之步驟,選擇使㈣刻對上述第 極層之_之耐性,比對第二喷嘴層之㈣之耐性高之2 9573 l.doc -61 - I255232 件 糟此,由於可以第一電極層精度良好地停止第二噴嘴孔 形t用之蝕刻,因此第一噴嘴孔及第一喷嘴層不致因第二 贺嘴孔加工之過度钱刻而遭受損傷,可製造形狀精確度高 之噴嘴式平板。 X河 此外,本發明之噴嘴式平板之製造方法進-步亦可在形 成第-喷嘴孔之步驟及形成第二喷嘴孔之步驟,選擇使用 蝕刻對上逃表面電極層之钱刻之耐性,比對第一及第二之 各賀嘴層之蝕刻之耐性高之條件。 藉此’表以極層不致因第—喷嘴孔形成時之過度敍刻 或第二噴嘴孔形成時之過度钮刻而遭受損傷。因而,包含 表面電極層之貫穿孔之流體排出孔不致因過度㈣而變 形:導致喷灑精確度惡化,而可穩定地製造喷灑精確度高 之育嘴式平板。 此外’本發明之噴嘴式平板之製造方法,進—步♦上述 電: 生分離第二電極層之步驟使用乾式餘刻來進行。 猎此由於以乾式姓刻進行第二電極層之分離加工’因 此Γ之形狀精續度高’並且由於以氣態除去被加工區域 之:極層材料’因此避免如切肩等隨伴加工產生之塵埃侵 第i嘴嘴孔内而堵塞喷嘴孔。因而可穩定地製造 排出可罪性鬲之噴嘴式平板。 貝施方式項中之且轉给 — 一 - 戶、鈿j樣或貫施例,僅係說明本發 :::術内奋者’不應狹義解釋成僅限定於該具體例 付合本發明之精神及以下記載之申請專利範圍内,可作各 95731.doc -62- 1255232 種變更來實施。 【圖式簡單說明】 中計算喷嘴之電場強度 圖1係在本發明之基本排出模型 之說明圖。 圖2係顯示表面張力壓力及靜電性壓力與喷嘴徑之關連 性之模型計算結果圖。 圖3係顯示排出壓力與喷嘴徑之關連性之模型計算結果 圖4係顯示排出界限電壓與噴嘴徑之關連性之模型計算 結果圖 〇 °二’員示在何笔液滴與基板間作用之鏡像力與喷嘴一 基板間距離之關係圖。 圖6係顯示自噴嘴流出之流量與施加電壓之相關關係之 模型計算結杲圖。 圖7(a)及圖7(c)係顯示本發明一種實施形態之喷嘴式平 板之立肢圖’圖7(b)係圖7(a)之A-A,線剖面圖。 圖8係,、、、員示上述喷嘴式平板之第一電極層與第二電極層 之連接部分之說明圖。 圖9係頒不本實施形態之噴嘴式平板之變形例者,且係相 當於圖7(c)之剖面圖。 '、 Θ 10(a)〜圖1〇⑴係藉由剖面構造顯示本實施形態之上述 喷嘴式平板製造方法之說明圖。 圖11(a)〜圖11(c)係藉由噴嘴式平板之剖面構造進一步詳 細說明圖l〇(e)所示步驟之圖。 95731.doc -63- 1255232 圖12係顯示製造本實施形態之喷嘴式平板時,各層之使 用材料與加工方法之較佳組合之說明圖。 圖13(a)及圖13 (C)係顯示本發明其他實施形態之喷嘴式 平板之立體圖,圖13(b)係圖13(a)之B-B,線剖面圖。 圖14係顯示其他實施形態之喷嘴式平板之變形例者,且 係相當於圖13(c)之剖面圖。 圖15(a)〜圖15(g)係藉由剖面之構造顯示其他實施形態之 上述噴嘴式平板之製造方法之說明圖。 圖16係顯示製造其他實施形態之喷嘴式平板時,各層之 使用材料與力σ…工方法之較佳組合之說明圖。 圖17係先前之靜電吸引型喷墨裝置之概略構造剖面圖。 圖18(a)〜圖18(c)係圖Η所示之噴墨梦晉 之說明圖。 …置之墨形成-月部 圖19係先前之其他靜 月包汉π i貝墨叙置之 圖20係圖19所示之喑里狀罢—+ 岭稱以圖。 圖。 貝為口p刀之概略剖面立體 圖21係圖19所 圖22係圖19所 示之噴墨裝置之墨排出 t 不之噴墨裝置在噴嘴部分施加 子之狀恶之說明圖。 圖23係圖19所 原理之說明圖。 原理之說明圖。 電壓時微粒 示之噴墨裝置於噴嘴部分形成微粒子體之 圖24(a)〜圖24(c)係m 10仏— + Μ糸圖19所不之噴墨裝f 之說明圖。 置之w形成彎月部 圖2 5 (a)係靜雷明 造圖,圖 引聖k體排出裝置之概略構 95731.doc -64- 1255232 25(b)係其等價電路。 圖26係用於靜電吸引型喷墨裝置之先前之喷嘴式平板之 側面剖面圖。 圖27係顯示先前之靜電吸引型喷墨裝置之記錄頭部分構 造之剖面圖。 圖28係顯示圖27之靜電吸引型喷墨裝置之記錄頭部分之 墨排出孔之部分放大剖面平面圖。 【主要元件符號說明】 1 第一喷嘴層 2 第_二噴嘴層 4 拒液膜 5 犧牲層 8 喷嘴式平板 9 流體排出孔 10 第一噴嘴層 11 喷嘴孔(喷嘴孔部) 11a 第一喷嘴孔 11c 第一喷嘴孔 lib 第二喷嘴孔 20 第二喷嘴層 25 第一電極層 25b 延伸部(延伸之第一電極層部分) 26 第二電極層 50 犧牲層 95731.doc -65- 801255232 81 喷嘴式平板 表面電極層The first inner wall of the first bore has a first electrode 1' formed stably in the layer thickness direction. The opening of the first nozzle hole of the fluid discharge surface is used as a fluid discharge hole to form a first pole to the vicinity of the fluid discharge hole. As a result, the resistance R inside the nozzle can be greatly reduced, and the discharge frequency of the fluid can be increased, and the recording medium can be drawn at a high speed. And the first electrode layer of the second nozzle hole formed in this way is electrically connected to the second electrode layer formed on the first nozzle hole, so that the driving can be supplied from the fluid discharge side of the nozzle plate via the second electrode layer. Therefore, the lead-out wiring for supplying the driving signal to the first electrode layer does not approach the medium, and the recording medium is not caused by the lead-out wiring of the present invention. :,hurt. The first nozzle layer and the second nozzle-electrode-electrode layer are on the nozzle layer, upper...: extending from the first nozzle hole to the eighth disk, and the electrode layer is extended to the first nozzle layer The knife is electrically connected to the electrode layer of the brother. In the above configuration, since the first electrode acoustic Sun's layer is on the dice layer and the second nozzle surface, extending from the first nozzle hole to the first nozzle layer, the second electrode layer is in the extension portion and the first The electric shield is electrically connected, so the connection between the first lightning layer and the second electrode layer is not in the section of the a ^ package, but is in the surface clock of the electricity. Therefore, although the structure of each (four) electrode layer is also connected, the electrical connection reliability of each electrode layer is high, and the dangerous discharge reliability of effectively applying the driving signal to the first electrode layer due to disconnection or the like can be greatly reduced. . Further, the nozzle type step of the present invention may constitute that the first electrode layer is formed on the inner wall of the first nozzle hole.甩 Since the above structure is integrally formed with the first electrode layer on the inner wall of the first nozzle hole, a uniform electric field can be applied to the fluid in the fluid discharge hole. In the case of a structure having a plurality of fluid discharge holes on the fluid discharge surface of the mouthpiece plate, the formation positions of the fluid discharge holes in the Taylor wire are not = 峨, but the formation of the Taylor connection of each fluid discharge hole is The spray accuracy can be improved. In addition, the nozzle plate of the present invention may further comprise an interface of the first electrode layer at the interface between the first nozzle layer and the second nozzle layer, extending from the first nozzle hole to the first nozzle layer, and the second nozzle hole An opening portion on the side communicating with the first nozzle hole 95731.doc - 56 - 1255232 is provided in a portion of the first electrode layer extending to the first nozzle layer. - because the above-mentioned structure is at the interface between the first nozzle layer and the second nozzle layer, and the portion of the second electrode hole that extends to the first nozzle layer is disposed, and the second nozzle hole is disposed at the opening side of the communication side with the nozzle-nozzle hole, Therefore, when the second nozzle hole is reinforced, the extension portion of the first electrode layer functions as a stop portion, and the first nozzle hole or the first nozzle layer is prevented from being formed by the second nozzle hole. It is deformed and damaged. As described above, when the first nozzle layer outside the extended portion of the first electrode layer is formed, the 'm layer is separated from the nozzle type flat plate. By the above configuration, the nozzle type flat plate can be stably manufactured. The nozzle plate of the present invention may further comprise the first nozzle hole and the opening portion on the fluid discharge side being larger than the fluid supply side. The above structure forms a first nozzle hole and/or a second nozzle hole and has a tapered shape in which the body discharge side is enlarged, and the inner wall surface of the bellows hole is the first nozzle layer or the second nozzle layer. Each of the forms, a nozzle hole or a flute + 纟 face constitutes an obtuse angle. Thereby, when the first or first layer of the inner wall surface of the nozzle hole is formed to the surface of each nozzle layer, the risk of disconnection of the inner wall surface and the nozzle layer electrode layer is low. ^ , Heart 烕 ^ package high reliability electrode sound.卜, supply of liquid to the nozzle 曰 危 危 π 则 则 则 则 ^ ^ ^ ^ ^ ^ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ Further, the nozzle nozzle hole of the present invention and the boring plate may further comprise a surface electrode layer of the first, the nozzle hole, and the w/hole in the discharge side of the first shell hole. The discharge side opening portion, the through hole and the first nozzle hole 95731.doc - 57 - 1255232 l, and the surface electrode layer is electrically connected to the first electrode layer. In the above configuration, since the through hole provided in the surface electrode layer of the fluid discharge surface of the nozzle type plate becomes the fluid discharge &>, the surface discharge layer can be etched to process the fluid discharge hole which greatly affects the accuracy of the discharge fluid. Thereby, the fluid discharge side opening portion of the first nozzle hole constituting the first electrode layer formed on the inner wall serves as a fluid discharge hole, and the shape accuracy of the fluid discharge hole is more stable, and the money accuracy is more stabilized. y In addition, the nozzle plate of the present invention may further comprise a second electrode layer closest to the second nozzle layer on the supply side, wherein the fluid supply in the second nozzle layer is reversed, and the adjacent nozzle holes are electrically connected. Separation. In the above configuration, the second electrode layer of the second nozzle layer on the near fluid supply side of the nozzle plate having a plurality of nozzle holes is electrically separated from the adjacent nozzle holes on the fluid supply side of the second nozzle layer. Therefore, several nozzle holes can be driven independently, and high resolution can be drawn. In addition, the nozzle plate of the present invention can further form the second electrode layer of the second nozzle layer closest to the fluid supply side, and the fluid supply in the nozzle layer is opposite to that of the nozzle layer. . The surface is patterned by the surface to form the lead-out. The above structure is utilized because the first electrode layer closest to the second nozzle layer on the fluid supply side is used, and the line on the second nozzle layer can be taken as the lead-side surface. Distribution Separation of the second electrician [steps simultaneously in the process of adjoining the nozzle hole section becomes a step:: system: = and the distribution of the nozzle _ the inner wall of the nozzle hole _ * formed in the second di-electrode layer and the extraction Since the wiring system is formed by the same electrode layer and 95731.doc -58 - 1255232 is formed, the connection reliability between the second electrode layer and the lead wiring is very high. Further, the nozzle type flat plate of the present invention may further comprise a diameter of the opening of the fluid discharge side of the nozzle hole or a diameter of the through hole formed in the surface electrode layer of 8 pm or less. = As described above, a local electric field is generated by forming the diameter of the discharge hole of the nozzle to a fine diameter of 〜1 to 25 Am, and # is finely nozzleed to lower the driving voltage at the time of discharge. Such a reduction in driving voltage is extremely advantageous for miniaturization of the device and high density of the nozzle. Of course, by lowering the driving voltage, it is also possible to: drive a low-voltage drive driver with high cost efficiency, and also improve the safety of use. Further, in the above discharge model, since the electric field intensity required for discharge depends on the intensity of the local concentrated electric field, it is not necessary to have the opposite electrode. That is, the insulating substrate or the like can be printed without the need of the counter electrode, the elasticity of the device structure is increased, and the thick insulator can be printed. Wherein, as described above, by setting the diameter of the fluid discharge hole of the nozzle to be φ8 μm or less as described above, the electric field intensity distribution is effectively concentrated in the vicinity of the discharge face of the fluid discharge hole, and the distance from the opposite electrode to the fluid discharge hole The interaction does not affect the electric field intensity distribution, and therefore is not affected by the positional accuracy of the opposing electrode, the deviation of the material properties of the recording medium, and the thickness deviation, so that stable fluid discharge can be performed. Further, by effectively concentrating the electric field intensity distribution in the vicinity of the discharge surface of the fluid discharge hole, a strong electric field is stably formed in the narrow region, and an extremely small amount of fluid can be surely discharged, so that the printed image can be made to have a high resolution. As described above, the nozzle plate manufacturing method of the present invention has a sacrificial layer formed on the substrate by 95731.doc -59 - 1255232; on the upper nozzle layer; on the upper ϋ + this (four) I, the + A plurality of first nozzle holes are formed on a mouth layer. The first nozzle is a hole, and the shell is a hole, and a first layer is formed on the inner wall surface of each of the first nozzle holes of -, . Processing the above-mentioned first ... - 1 mouth hole circumference also includes the remaining first f E 曰, on the above-mentioned brother-nozzle layer, the second 嗔 mouth "... part is formed to form a second a nozzle layer; the second nozzle hole is arranged in the upper and the second nozzle holes, and the second nozzle holes are housed in the opening portion on the body discharge side and remain on the first nozzle layer: the electrode layer portion; The inner wall surface of each of the upper holes is formed on the first layer, and includes the second nozzles: the second electrode layer; and the second electrode layer is processed by electrically separating the adjacent second nozzle holes. He bird hole spray::, ί rigid w on the substrate 'via the sacrificial layer, sequentially stacking the first - negative layer" brother an electrode sound, flute - + ^ no layer brother The mouth layer and the second electrode layer. After the formation of the photoresist pattern by the light engraving technique, since it can be processed into a desired shape by dry quoting, it can be &# ff mouth hole, flute + some shape accuracy Forming the first-spraying-heming hole, the first electrode layer and the second electrode layer. : Externally, since the fluid discharge surface of the nozzle plate is passed to the final stage of the step, in the nozzle plate manufacturing step, the fluid In addition, the hole is not deformed and deformed. Therefore, the manufacturing rate of the nozzle plate is further improved. The method for manufacturing the nozzle plate of the present invention further forms a sacrificial layer on the substrate and a first spray layer on the sacrificial layer. Forming a surface electrode layer on the sacrificial layer between the steps, separating the surface electrode layer corresponding to the formation portion of the nozzle hole portion, and forming a through hole in each of the separation portions 95731.doc - 60 - 1255232; forming a sacrificial layer The first step also includes the step of separating the surface + the blast layer, and the surface of the surface is formed on the pole layer to form the first _. The nozzle of the structure is made of a flat plate, and the surface electrode on the a layer is on the force ', because it can be formed The shape of the sacrificial body discharge hole is not deformed by the unevenness (such as the film thickness distribution) formed in the first: = flow, and: the internal cavity - the fluid discharge hole of the electrode layer The manufacturing method has the higher precision (4) and the second invention. Further, the step of the electrode layer can be applied to the surface of the nozzle plate from the 钭 to the incident film forming surface. The nozzle-type flat plate is formed into the above-mentioned first electrode; the bovine- & method, the step-in step can also be in the step of forming the jade layer, on the surface of the nozzle-type flat plate, from the incident film-forming particles. That is, the oblique direction of the object is an electrode formed by incident film-forming particles in an oblique direction: the adhesion of the side wall of the nozzle hole is good. Furthermore, for the Saki or the second;):: The electrode layer does not form an electrode layer. Therefore, the inside of the first nozzle hole when forming the second electrode layer, and the through hole of the electrode surface of the bungee electrode can be formed. A part of the pole layer is formed in the shadow of the surface to form a film. It is dreamed that the region where the electrode layer is not desired to be formed in the temple is the region where the electrode layer is not formed: the region where the electrode layer is formed can be set and the adhesion of the electrode layer forming the inside of the electrode layer can be improved. ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, (4) The high resistance is 2 9573 l.doc -61 - I255232. In this case, since the first electrode layer can accurately stop the etching of the second nozzle hole shape t, the first nozzle hole and the first nozzle layer do not A nozzle-type flat plate having a high shape accuracy can be manufactured by being damaged by excessive money processing of the second heel hole processing. In addition, the manufacturing method of the nozzle type flat plate of the present invention may further select the etching resistance to the surface electrode layer to be used in the step of forming the first nozzle hole and the step of forming the second nozzle hole. The conditions for the high resistance to etching of the first and second layer of the mouthpiece are compared. In this way, the surface layer is not damaged by the excessive nicking when the first nozzle hole is formed or the excessive buttoning when the second nozzle hole is formed. Therefore, the fluid discharge hole including the through hole of the surface electrode layer is not deformed by excessive (four): the spray precision is deteriorated, and the nipple type plate having high spray accuracy can be stably manufactured. Further, the manufacturing method of the nozzle type flat plate of the present invention is further carried out by the step of: the step of separating the second electrode layer by using a dry type. Because of the separation process of the second electrode layer by the dry type, the shape of the crucible is high, and since the processed layer is removed in a gaseous state: the crucible material is thus prevented from being processed by the accompanying processing such as cutting shoulders. The dust invades the nozzle hole and blocks the nozzle hole. Therefore, it is possible to stably manufacture a nozzle type plate which discharges a sinful sputum. In the case of the Besch method, it is transferred to - a - household, 钿j-like or consistent example, which merely indicates that the present invention::: intra-surgical" should not be interpreted narrowly to be limited to the specific example. The spirit and the scope of the patent application described below can be implemented as various changes in each of the singularities of the s. BRIEF DESCRIPTION OF THE DRAWINGS The electric field intensity of the nozzle is calculated. Fig. 1 is an explanatory view of the basic discharge model of the present invention. Fig. 2 is a graph showing the results of model calculation showing the relationship between the surface tension pressure and the electrostatic pressure and the nozzle diameter. Fig. 3 is a model calculation result showing the correlation between the discharge pressure and the nozzle diameter. Fig. 4 is a model calculation result showing the correlation between the discharge limit voltage and the nozzle diameter. Fig. 2 shows the relationship between the droplet and the substrate. A diagram showing the relationship between the image power and the distance between the nozzle and the substrate. Fig. 6 is a graph showing a model calculation of the correlation between the flow rate from the nozzle and the applied voltage. Fig. 7 (a) and Fig. 7 (c) are diagrams showing a limb of a nozzle type plate according to an embodiment of the present invention. Fig. 7 (b) is a cross-sectional view taken along line A-A of Fig. 7 (a). Fig. 8 is an explanatory view showing a portion where the first electrode layer and the second electrode layer of the nozzle type flat plate are connected. Fig. 9 is a cross-sectional view corresponding to the modification of the nozzle type flat plate of the embodiment, and is equivalent to Fig. 7(c). ', Θ 10 (a) to Fig. 1 (1) are explanatory views showing a method of manufacturing the nozzle-type flat plate of the present embodiment by a cross-sectional structure. Figs. 11(a) to 11(c) are views for further explaining the steps shown in Fig. 10(e) by the cross-sectional structure of the nozzle type flat plate. 95731.doc -63- 1255232 Fig. 12 is an explanatory view showing a preferred combination of materials for use in each layer and a processing method when the nozzle type flat plate of the present embodiment is manufactured. Fig. 13 (a) and Fig. 13 (C) are perspective views showing a nozzle type flat plate according to another embodiment of the present invention, and Fig. 13 (b) is a line sectional view taken along line B-B of Fig. 13 (a). Fig. 14 is a cross-sectional view showing a modification of the nozzle type flat plate of another embodiment, and corresponds to Fig. 13 (c). Fig. 15 (a) to Fig. 15 (g) are explanatory views showing a method of manufacturing the above-described nozzle type flat plate according to another embodiment by a cross-sectional structure. Fig. 16 is an explanatory view showing a preferred combination of materials and force σ of each layer in the manufacture of a nozzle type flat plate according to another embodiment. Figure 17 is a schematic cross-sectional view showing a conventional electrostatic attraction type ink jet apparatus. Fig. 18 (a) to Fig. 18 (c) are explanatory diagrams of the ink jet dream shown in Fig. 18 . ...The ink is formed - the moon is shown in Fig. 19 is the other static moon π 贝 贝 贝 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 + + + + + + + + + Figure. Fig. 21 is a schematic cross-sectional view of Fig. 21, Fig. 19 is a diagram showing the ink discharge of the ink jet apparatus shown in Fig. 19, and an illustration of the application of the ink jet apparatus to the nozzle portion. Figure 23 is an explanatory view of the principle of Figure 19. An illustration of the principle. In the case of a voltage, the ink jet device forms a fine particle body in the nozzle portion. Figs. 24(a) to 24(c) are explanatory diagrams of the ink jet device f shown in Fig. 19. Set w to form the meniscus. Figure 2 5 (a) is the static Lei Ming drawing, the schematic diagram of the St. k body discharge device 95731.doc -64- 1255232 25 (b) is its equivalent circuit. Figure 26 is a side cross-sectional view showing a prior art nozzle plate for an electrostatic attraction type ink jet device. Figure 27 is a cross-sectional view showing the construction of a recording head portion of a conventional electrostatic attraction type ink jet device. Figure 28 is a partially enlarged cross-sectional plan view showing the ink discharge hole of the recording head portion of the electrostatic attraction type ink-jet device of Figure 27; [Description of main component symbols] 1 First nozzle layer 2 No. 2 nozzle layer 4 Liquid repellent film 5 Sacrificial layer 8 Nozzle plate 9 Fluid discharge hole 10 First nozzle layer 11 Nozzle hole (nozzle hole portion) 11a First nozzle hole 11c first nozzle hole lib second nozzle hole 20 second nozzle layer 25 first electrode layer 25b extension (extended first electrode layer portion) 26 second electrode layer 50 sacrificial layer 95731.doc -65- 801255232 81 nozzle type Flat surface electrode layer

95731.doc -66 ™95731.doc -66 TM

Claims (1)

1255232 十、申請專利範圍: 1· -種噴嘴式平板,係設於靜電吸引型 係自噴嘴前端之泣體I出 ^ 出裝置,其 而之机體排出孔藉由靜電吸 加電壓而帶電t ^# 而排出藉由施 -之机體,亚具有數個噴嘴 具備薄層之第一嗆喈厣 ^ 其知·被為·· 置於流體排出側;並且 貝島孔,並配 至少具備一層第二喷嘴層,其係層最 之流體供給側,比上述篦+ θ且、Μ弟—喷嘴層 嘴孔連通,、’ 贺嘴層厚,且與上述第-嘖 =通亚且具有與第-喷嘴孔構成”孔部之第: 電性連接成臈於該第一喷嘴 膜於第二喷嘴孔内壁之第二電極層。"%極層與成 2.如請求項丨之噴嘴 嘴層與第二噴❹了述弟一電極層在第-喷 嘴層上τ 界面,自第-嘴嘴孔延設至第-喷 述第二電極層在延伸至第一脅嘴層 與弟—電極層電性連接。 3-如請求項丨之噴嘴式 述第 十扳/、中上“―電極層形成於上 贺鳥孔之内壁全面。 4.如請求項1之噴嘴式 苴 一 /、中上述弟一電極層在上述第 、鳥層與第二嗔嘴;只 # 一 、馬層之界面,自弟一噴嘴孔延設至第 A 3 1,上述第二喷嘴孔之與第一噴嘴孔連通側之 内 位於延σ又至该第一喷嘴層上之第一電極層部分 I如4求項1之噴嘴式平板,其中上述第一噴嘴孔及/或第二 95731.doc 1255232 喷嘴孔係比流體排出側大地形成流體供給側之開口部。 6。如請求項丨之喷嘴式平板,其中在上述第一喷嘴孔之流體 排出側’以堵塞第一噴嘴孔之流體排出側開口部之方 式,配置具有貫穿孔之表面電極層,該貫穿孔與第一噴 嘴孔連通’並且上述表面電極層與第一電極層電性連接。 7·如請求項1之喷嘴式平板,其中最在流體供給側之上述第 一賀嘴層之第二電極層係在該第二喷嘴層之流體供給 側,於鄰接之噴嘴孔部間電性分離。 8·如明求項7之贺嘴式平板,其中最在流體供給側之上述第 二喷嘴層之J二電極層亦形成於該第二噴嘴層之流體供 給側表面,在該表面被圖案化而形成引出配線。 9·如明求項1之喷嘴式平板,其中上述第一喷嘴孔之流體排 J之開口邓之直徑或是形成於上述表面電極層之貫穿 孔之直#係8 // m以下。 ι〇· 一種喷嘴式平板之製造方法,其特徵為具備以下步驟: 在基板上形成犧牲層; 在上述犧牲層上形成第一喷嘴層; 在上述第一喷嘴層±形成數個第一喷嘴孔; 在上述第一喷嘴層上,包含 + 匕3各弟一喷嘴孔之内壁面, 形成第一電極層; :“於各第一贺嘴孔内壁與各第一喷嘴孔周圍部之 方式,加工上述第一電極層; 在上述第一噴嘴層上,^ 、 亦包含殘留之各第一電極層部 分,形成第二喷嘴層; 95731.doc -2 - 1255232 、爲層上將數個第二喷嘴孔以各第二喷嘴 孔之流體排出你丨 ' 之開口部收納於殘留於上述第一喷嘴層 上之各第一電極層部分之方式形成; /在土述第二喷脅層上,包含各第二喷嘴孔之内壁面, $成弟一電極層;及 以在鄰接之第二喷嘴孔間電性分離之方式,加工第二 電極層。 11.如請求項H)之噴嘴式平板之製造方法,其中於在基板上 、犧才層之步知與在犧牲層上形成第-喷嘴層之步驟 之間,具有―在上述犧牲層上形成表面 嘴孔部形成部位而分離該表面、,曰产f應於貝 发衣面包極層,亚且在各分離部 形成貫穿孔之步驟; 形成犧牲層上之第一喑喈爲 、嚏層之步驟中,亦包含分離之 表面電極層上而形成第一噴嘴層。 12. 如請求項_ Η之噴嘴式平板之製造方法,其中上述形 成第二電極層之步驟中,對噴嘴式平板表面自斜方向入 射成膜粒子。 13. 如請求項U之喷嘴式平板之製造方法,其中上述形成第 一電極層之步驟中,對噴嘴式 式十板表面自斜方向入射成 月冥粒子。 14. 如請求項⑺或丨丨之噴嘴式平板之製造 杰皆 + 法其中上述幵> 成弟二贺嘴孔之步驟中,使用蝕刻, 、擇上返弟一電極 層對蝕刻之耐受性比第二噴嘴層 件。 十_之耐雙性高之條 95731.doc 1255232 15. 二請求項11之喷嘴式平板之製造方法,其尹形成第一喷 b之步知及形成第二喷嘴孔之步驟中,使用蝕刻,選 。擇上述表面電極層對蝕刻之耐受性比第一及第二之各喷 16. 嘴層對蝕刻之耐受性高之條件。 如4求項1 〇或丨丨之噴嘴式 甘士 L 方法,其中上述電 刀“二電極層之步驟中使用乾式钱刻進行。 95731.doc1255232 X. Patent application scope: 1. The nozzle type flat plate is set in the electrostatic suction type from the front end of the nozzle, and the body discharge hole is charged by the electrostatic absorption voltage. ^# And the body that has been discharged by the application, the first one having a plurality of nozzles having a thin layer is known as being placed on the fluid discharge side; and the shell hole is provided with at least one layer The two nozzle layer, the most fluid supply side of the layer, is more than the above 篦+ θ, and the Μ — nozzle layer mouth is connected, the 'Hou mouth layer is thick, and the above-mentioned 啧 啧 = pass and have the same - The nozzle hole constitutes a "hole portion": electrically connected to the second electrode layer of the first nozzle film on the inner wall of the second nozzle hole. "% pole layer and into 2. The nozzle layer of the request item The second sneezes the τ interface of the electrode layer on the first nozzle layer, and extends from the first nozzle hole to the second electrode layer to electrically connect to the first nozzle layer and the electrode layer. 3- If the request item is in the nozzle type, the tenth pull/, middle and upper "-electrode layer is formed in Shanghe The inner wall of the hole of the round. 4. The nozzle type of the request item 1 /, the middle electrode layer of the above-mentioned first, the bird layer and the second mouth; the interface of the #1, the horse layer, the extension from the nozzle hole to the A 3 1 a nozzle-type flat plate having a first electrode layer portion I and a first electrode layer portion I on the first nozzle layer, wherein the first nozzle hole is in contact with the first nozzle hole, wherein the first nozzle hole is And/or the second 95731.doc 1255232, the nozzle hole is formed larger than the fluid discharge side by the opening on the fluid supply side. 6. a nozzle-type flat plate according to claim 1, wherein a surface electrode layer having a through hole is disposed on a fluid discharge side of the first nozzle hole to block a fluid discharge side opening portion of the first nozzle hole, the through hole and the A nozzle hole communicates ' and the surface electrode layer is electrically connected to the first electrode layer. 7. The nozzle plate of claim 1, wherein the second electrode layer of the first layer of the nozzle layer on the fluid supply side is on the fluid supply side of the second nozzle layer, and is electrically connected between adjacent nozzle holes. Separation. 8. The mouthpiece type plate of claim 7, wherein the J electrode layer of the second nozzle layer most on the fluid supply side is also formed on a fluid supply side surface of the second nozzle layer, and the surface is patterned The lead wiring is formed. 9. The nozzle plate of claim 1, wherein the diameter of the opening Deng of the fluid row J of the first nozzle hole is less than or equal to 8 / m of the through hole formed in the surface electrode layer. 〇 a method for manufacturing a nozzle type flat plate, comprising: forming a sacrificial layer on a substrate; forming a first nozzle layer on the sacrificial layer; forming a plurality of first nozzle holes in the first nozzle layer And forming, on the first nozzle layer, an inner wall surface of each of the nozzle holes of the + 匕3, forming a first electrode layer; and: “processing the inner wall of each first nozzle hole and the periphery of each first nozzle hole The first electrode layer; on the first nozzle layer, the first electrode layer portion is also formed to form a second nozzle layer; 95731.doc -2 - 1255232, a plurality of second nozzles on the layer The hole is formed by exposing the fluid of each of the second nozzle holes to the opening of each of the first electrode layers remaining in the first nozzle layer; and on the second spray layer of the earth The inner wall surface of the second nozzle hole is made up of an electrode layer; and the second electrode layer is processed by electrically separating between the adjacent second nozzle holes. 11. Manufacture of the nozzle plate according to claim H) Method, in which Between the step of forming the sacrificial layer on the substrate and the step of forming the first nozzle layer on the sacrificial layer, the surface of the sacrificial layer is formed on the sacrificial layer to separate the surface, and the surface is separated. a step of forming a through-hole in each of the separation portions; and forming a first nozzle layer in the step of forming the first layer of the sacrificial layer and the layer of tantalum, and also including the separated surface electrode layer. 12. The method according to claim 1, wherein in the step of forming the second electrode layer, the film-forming particles are incident on the surface of the nozzle-type flat plate from the oblique direction. 13. The nozzle-type flat plate of claim U In the manufacturing method, in the step of forming the first electrode layer, the surface of the nozzle-type ten-plate is incident into the moon-shaped particle from the oblique direction. 14. The manufacturing method of the nozzle-type flat plate of claim (7) or 丨丨 + + + In the above step 成> in the step of the second brother's mouth, the etching is used, and the electrode layer of the returning electrode is more resistant to etching than the second nozzle layer. The ten-high resistance strip is 95731.doc 1255232 1 5. The method for manufacturing a nozzle type flat plate according to claim 11, wherein the step of forming the first spray b and the step of forming the second nozzle hole are performed by etching, and the surface electrode layer is resistant to etching. Compared with the first and second sprays 16. The condition that the mouth layer is highly resistant to etching. For example, the method of the nozzle type Gans L of the item 1 or the ,, the step of the electro-blade "two-electrode layer" Use dry money to engrave. 95731.doc
TW93125877A 2003-08-29 2004-08-27 Nozzle plate and manufacturing method of same TWI255232B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003209840A JP3892423B2 (en) 2003-08-29 2003-08-29 Nozzle plate and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200523123A TW200523123A (en) 2005-07-16
TWI255232B true TWI255232B (en) 2006-05-21

Family

ID=34263978

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93125877A TWI255232B (en) 2003-08-29 2004-08-27 Nozzle plate and manufacturing method of same

Country Status (3)

Country Link
JP (1) JP3892423B2 (en)
TW (1) TWI255232B (en)
WO (1) WO2005021269A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109910435A (en) * 2015-12-29 2019-06-21 意法半导体股份有限公司 Improved manufacturing method and fluid ejection apparatus for fluid ejection apparatus

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007050636A (en) * 2005-08-19 2007-03-01 Fujifilm Corp Liquid discharge head, image recording apparatus, and method of manufacturing liquid discharge head
JP4706850B2 (en) * 2006-03-23 2011-06-22 富士フイルム株式会社 Nozzle plate manufacturing method, droplet discharge head, and image forming apparatus
JP4407686B2 (en) 2006-10-16 2010-02-03 セイコーエプソン株式会社 Droplet discharge head, method for manufacturing droplet discharge head, and droplet discharge apparatus
WO2008155986A1 (en) * 2007-06-20 2008-12-24 Konica Minolta Holdings, Inc. Method for manufacturing liquid ejection head nozzle plate, liquid ejection head nozzle plate and liquid ejection head
GB0919744D0 (en) 2009-11-11 2009-12-30 Queen Mary & Westfield College Electrospray emitter and method of manufacture
JP5418283B2 (en) * 2010-02-18 2014-02-19 ブラザー工業株式会社 Liquid ejection device
JP6048794B2 (en) 2012-07-31 2016-12-21 株式会社リコー Nozzle plate, nozzle plate manufacturing method, inkjet head, and inkjet printing apparatus
JP6609977B2 (en) * 2015-04-27 2019-11-27 株式会社リコー NOZZLE PLATE, INKJET HEAD, INKJET DEVICE, AND NOZZLE PLATE MANUFACTURING METHOD
CN108311305A (en) * 2018-04-11 2018-07-24 黑龙江八农垦大学 Stage type static nozzle induction electrode
TWI736949B (en) * 2019-04-16 2021-08-21 南韓商恩傑特股份有限公司 Induced electrohydrodynamic jet printing apparatus
IT201900007196A1 (en) 2019-05-24 2020-11-24 St Microelectronics Srl MICROFLUID DEVICE FOR CONTINUOUS EXPULSION OF FLUIDS, IN PARTICULAR FOR INK PRINTING, AND RELATED MANUFACTURING PROCEDURE
EP4396002A1 (en) * 2021-10-12 2024-07-10 Gaeastar GmbH Nozzle and system for three-dimensional ink printing

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3114634B2 (en) * 1996-12-20 2000-12-04 村田機械株式会社 Nozzle manufacturing method for multi-nozzle inkjet
JP2002154210A (en) * 2000-11-20 2002-05-28 Canon Inc Method for manufacturing inkjet recording head, inkjet recording head, and inkjet recording apparatus
JP2003127386A (en) * 2001-10-22 2003-05-08 Ricoh Co Ltd Droplet discharge head and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109910435A (en) * 2015-12-29 2019-06-21 意法半导体股份有限公司 Improved manufacturing method and fluid ejection apparatus for fluid ejection apparatus
CN109910435B (en) * 2015-12-29 2022-04-05 意法半导体股份有限公司 Nozzle plate, fluid ejecting apparatus, and method of manufacturing the same

Also Published As

Publication number Publication date
JP3892423B2 (en) 2007-03-14
TW200523123A (en) 2005-07-16
WO2005021269A1 (en) 2005-03-10
JP2005074635A (en) 2005-03-24

Similar Documents

Publication Publication Date Title
TWI255232B (en) Nozzle plate and manufacturing method of same
JP5728795B2 (en) Nozzle plate manufacturing method and droplet discharge head manufacturing method
JP5332275B2 (en) Silicon nozzle substrate manufacturing method, droplet discharge head manufacturing method, and droplet discharge apparatus manufacturing method
JP5218164B2 (en) Nozzle substrate manufacturing method and droplet discharge head manufacturing method
JP2005059215A (en) Electrostatic suction type fluid discharge device
JP2009113351A (en) Silicon nozzle substrate, droplet discharge head equipped with a silicon nozzle substrate, droplet discharge apparatus equipped with a droplet discharge head, and method for manufacturing a silicon nozzle substrate
TWI296575B (en) Method for manufacturing droplet ejection head, droplet ejection head, and droplet ejection apparatus
CN107399166A (en) A kind of shearing piezoelectric ink jet printing heads of MEMS and preparation method thereof
JP4660683B2 (en) Nozzle plate manufacturing method and droplet discharge head manufacturing method
JP2008273079A (en) Nozzle substrate manufacturing method, droplet discharge head manufacturing method, and droplet discharge apparatus manufacturing method
WO2016158917A1 (en) Method for manufacturing liquid ejection head nozzle plate, liquid ejection head nozzle plate, and liquid ejection head
JP2007326231A (en) Method for manufacturing nozzle plate, method for manufacturing droplet discharge head, and method for manufacturing droplet discharge apparatus
JP2007175992A (en) Nozzle plate manufacturing method and nozzle plate, droplet discharge head manufacturing method and droplet discharge head, droplet discharge device manufacturing method and droplet discharge device
US9427953B2 (en) Method of manufacturing liquid ejection head
JP6099891B2 (en) Dry etching method
JP2009274415A (en) Nozzle plate and liquid discharge head
JP2010149375A (en) Method for manufacturing nozzle substrate, and method for manufacturing liquid droplet delivering head
JP2008094018A (en) Nozzle plate manufacturing method and droplet discharge head manufacturing method
JP2010214923A (en) Method for manufacturing nozzle substrate, nozzle substrate manufactured by manufacturing method thereof, method for manufacturing liquid droplet discharging head, liquid droplet discharging head manufactured by manufacturing method there of, and liquid droplet discharging device
JP2009029018A (en) Nozzle substrate manufacturing method, nozzle substrate, droplet discharge head, and droplet discharge apparatus
JP2007261152A (en) Nozzle substrate manufacturing method, droplet discharge head manufacturing method, and droplet discharge apparatus manufacturing method
JP2010125704A (en) Method of manufacturing nozzle substrate, method of manufacturing liquid droplet ejecting head, and method of manufacturing liquid droplet ejecting apparatus
JP4489637B2 (en) Ink jet head and manufacturing method thereof
JP2927083B2 (en) Inkjet recording head
JP2007320254A (en) Nozzle plate manufacturing method, nozzle plate, droplet discharge head manufacturing method, droplet discharge head, droplet discharge device manufacturing method, and droplet discharge device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees