TWI850144B - Automatic plate de-capping equipment and automatic plate de-capping method - Google Patents

Abstract

The present disclosure provides: an automatic plate de-capping equipment and an automatic plate de-capping method. The equipment at least includes: a plate conveying mechanism, a plate de-capping mechanism, and a plate detecting mechanism. The plate conveying mechanism is used for conveying at least one circuit plate along a first direction. The plate de-capping mechanism includes at least one de-capping punch that can de-cap the circuit plate along a second direction different from the first direction. The plate detection mechanism can detect the circuit plate after the de-capping operation, to detect whether the circuit plate is successfully de-capped.

Description

Automatic plate cover opening equipment and automatic plate cover opening method

The present invention relates to a cover opening device, and in particular to an automatic plate cover opening device and an automatic plate cover opening method.

The existing technology often relies on manual work for the de-capping of printed circuit boards (PCBs).

However, manual work on printed circuit board cover removal often results in quality control issues.

For example, different operators often use different forces to open the cover of a printed circuit board. Or, the same operator may use different forces to open the cover of a printed circuit board under different physical conditions.

Based on this, the existing technology for the uncapping operation of printed circuit boards has the problem that the quality of the uncapping operation cannot be controlled or the yield is reduced (for example: the problem of residue left after uncapping).

Furthermore, the opening operation based on existing technology mainly relies on manual work, so it is difficult to carry out mass production, and thus it is difficult to meet customer needs.

Therefore, the inventor felt that the above defects could be improved, so he conducted intensive research and applied scientific principles, and finally proposed an invention with a reasonable design that effectively improves the above defects.

The technical problem to be solved by the present invention is to provide an automatic plate cover opening device in view of the shortcomings of the prior art, which includes: a plate feeding mechanism, which is located at the front end of the automatic plate cover opening device, the plate feeding mechanism provides at least one circuit plate to be placed thereon, and can be used to raise the position of the circuit plate; a plate conveying mechanism, which is connected to the rear side of the plate feeding mechanism and is configured to convey the circuit plate along a first direction; a plate transfer mechanism, which is located above the plate conveying mechanism and is arranged adjacent to the plate feeding mechanism, the plate transfer mechanism is used to transfer the circuit plate from the plate feeding mechanism to the plate conveying mechanism, so that the plate conveying mechanism can convey the circuit plate; a plate A sheet decapping mechanism, which is located above the sheet conveying mechanism and is arranged behind the sheet transfer mechanism along the first direction; wherein the sheet decapping mechanism includes at least one decapping punch; wherein, when the sheet conveying mechanism conveys the circuit sheet to the position of the sheet decapping mechanism, the sheet decapping mechanism is configured to perform a decapping operation on the circuit sheet along a second direction different from the first direction through the decapping punch; and a sheet detection mechanism, which is arranged on the sheet conveying mechanism and is arranged behind the sheet decapping mechanism along the first direction; wherein the sheet detection mechanism is configured to perform a detection operation on the circuit sheet that has undergone the decapping operation, thereby detecting whether the circuit sheet is successfully decapped.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide an automatic plate cover opening method, which includes: providing the above-mentioned automatic plate cover opening equipment; performing a plate loading operation, including: placing the at least one circuit plate on the plate loading mechanism, and lifting the circuit plate to a position adjacent to the plate transfer mechanism; performing a plate transfer operation, including: transferring the at least one circuit plate from the plate loading mechanism to the plate conveying mechanism through the plate transfer mechanism; performing a plate conveying operation, including: transferring the at least one circuit plate through the plate conveying mechanism along the first direction The circuit board is transported to the position of the sheet decapping mechanism; and a sheet decapping operation is performed, including: the at least one decapping punch of the sheet decapping mechanism is used to perform the decapping operation on the circuit board along the second direction, so that the circuit board forms a decapping opening, and the decapped portion of the circuit board is formed as a sheet waste; and a sheet inspection operation is performed, including: the circuit board that has undergone the decapping operation is transported to the position of the sheet inspection mechanism through the sheet transport mechanism, and the sheet inspection mechanism is used to perform the inspection operation on the circuit board to detect whether the decapping of the circuit board is successful.

The beneficial effect of the present invention is that the automated plate opening equipment and the automated plate opening method provided by the present invention can realize mechanized and automated opening operations for circuit boards, so as to solve the problems of uncontrollable quality and inability to mass produce in the manual opening operations of printed circuit boards in the prior art.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not used to limit the present invention.

E: Automated plate opening equipment

1: Plate feeding mechanism

11: Feeding guide components

12: Loading and placing the board on the platform

13: Feeding sensor unit

14: Loading and fixing panels

2: Plate transfer mechanism

21: Transfer drive motor

22: Transfer and rotate components

22a: Transfer and swing components

22b: Transfer and fix components

23: Transfer vacuum components

24: Transfer suction cup components

25: Transfer sensing unit

3: Plate conveying mechanism

31: Feeding vertical plate components

31a: Feeding guide rail components

32: Feeding sensor unit

33: Transport drive motor

33a: Conveyor drive shaft

34: First transport sensing unit

35: Second transport sensing unit

36: Transporting cross-plate components

37: Conveyor belt components

38: Dimension measurement components

39: Handwheel fixing component

310: Pressure wheel fixing component

311: Plate support platform

312: The third transmission sensing unit

4: Plate cover removal mechanism

41: Horizontal guide member

41a: Guidance scale

41b: Supporting columns

42: Longitudinal guide component

43: Connecting and fixing components

44: Remove the cover from the mold components

44a: Mold body

44b: Remove the cap punch

44c: Telescopic pressure plate

44d: Mould measuring ruler

44e: Fixing screw

5: Plate detection mechanism

51: Remove the cover of the sensing unit

52:Sensor unit base

6: Plate receiving mechanism

61: First guide component

62: Second guide component

63: Material receiving and board placement platform

64: Material collection vacuum component

65: Material collecting suction cup component

66: Material receiving sensing unit

7: Waste collection agency

71: Waste material discharge components

72: Waste collection components

M: Monitoring screen

P: Circuit board

P1: Remove the cover and open the mouth

P’: sheet waste

D1: First direction

D2: Second direction

R: Transport platform area

Figure 1 is a three-dimensional schematic diagram of the automated plate opening device of an embodiment of the present invention.

Figure 2 is a side view schematic diagram of the automated plate opening device of an embodiment of the present invention.

Figure 3 is a schematic diagram of the structure of the plate feeding mechanism of an embodiment of the present invention.

Figure 4 is a schematic diagram of the structure of the plate transfer mechanism of an embodiment of the present invention.

Figure 5 is a schematic diagram of the rear side view of the plate conveying mechanism of the embodiment of the present invention.

Figure 6 is a schematic diagram of the front side view of the plate conveying mechanism of the embodiment of the present invention.

Figure 7 is a partial enlarged schematic diagram of area VII in Figure 5.

Figure 8 is a schematic diagram of the structure of the plate cover removal mechanism of an embodiment of the present invention.

Figure 9 is a partial enlarged schematic diagram of area IX in Figure 8.

Figure 10 is a schematic diagram of the first operating state of the plate cover removal mechanism of the embodiment of the present invention.

Figure 11 is a schematic diagram of the second operating state of the plate cover removal mechanism of the embodiment of the present invention.

Figure 12 is a schematic diagram of the structure of the plate detection mechanism of an embodiment of the present invention.

Figure 13 is a schematic diagram of the structure of the plate receiving mechanism of an embodiment of the present invention.

Figure 14 is a schematic diagram of the structure of the waste collection mechanism of an embodiment of the present invention.

Figure 15 is a flow chart of the steps of the automated opening method of the plate in the embodiment of the present invention.

The following is a specific and concrete example to illustrate the implementation method disclosed by the present invention. Technical personnel in this field can understand the advantages and effects of the present invention from the content disclosed in this specification.

The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without deviating from the concept of the present invention.

In addition, the attached drawings of the present invention are only for simple illustration and are not depicted according to actual size. Please note in advance. The following implementation method will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

It should be understood that although the terms "first", "second", "third" and so on may be used in this article to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this article may include any one or more combinations of the related listed items depending on the actual situation.

[Automatic plate opening equipment]

Please refer to FIG. 1 and FIG. 2 , an embodiment of the present invention provides an automatic PCB board de-capping equipment E. The automatic PCB board de-capping equipment E can be used to perform a de-capping operation on at least one circuit board P. In an embodiment of the present invention, the circuit board P can be a printed circuit board, in particular a bendable flexible printed circuit board (Flexible Printed Circuit, FPC), but the present invention is not limited thereto.

The automated plate opening device E comprises a plate loading mechanism 1, a plate transfer mechanism 2, a plate conveying mechanism 3, a plate removing mechanism 4, a plate detection mechanism 5, a plate receiving mechanism 6, and a waste material collecting mechanism 7.

The plate loading mechanism 1 is arranged at the front end of the automated plate opening device E. The plate loading mechanism 1 is configured to provide the circuit plate P to be placed thereon, and is used to raise the height of the circuit plate P to be loaded to a position adjacent to the plate transfer mechanism 2.

The sheet conveying mechanism 3 is connected to the rear side of the sheet feeding mechanism 1. The sheet transfer mechanism 2, the sheet uncovering mechanism 4, and the sheet detection mechanism 5 are sequentially arranged on or above the sheet conveying mechanism 3 from the direction close to the sheet feeding mechanism 1 to the direction far away from the sheet feeding mechanism 1. The sheet receiving mechanism 6 is arranged at the tail end of the automatic sheet uncovering device E, that is, the sheet receiving mechanism 6 is arranged adjacent to the rear side of the sheet detection mechanism 5. Furthermore, the waste material collection mechanism 7 is located at the lower side of the sheet conveying mechanism 3 and corresponds to the lower side of the sheet uncovering mechanism 4 in the vertical position, but the present invention is not limited thereto.

The plate transfer mechanism 2 is disposed adjacent to the plate feeding mechanism 1, and the plate transfer mechanism 2 is configured to transfer the circuit plate P from the plate feeding mechanism 1 (e.g., by vacuum-sucking the circuit plate P) and transfer it to the plate conveying mechanism 3.

The plate conveying mechanism 3 is configured to convey the circuit plate P along a first direction D1 (e.g., conveying direction), and enables the circuit plate P to pass through the plate removing mechanism 4 and the plate detecting mechanism 5 in sequence, and then, the plate receiving mechanism 6 is configured to collect the circuit plate P.

The sheet material decapping mechanism 4 includes at least one decapping punch 44b (two are shown in FIG. 2 ).

As shown in Figures 10 and 11, when the sheet conveying mechanism 3 conveys the circuit sheet P to the position of the sheet decapping mechanism 4, the sheet decapping mechanism 4 is configured to perform a decapping operation on the circuit sheet P along a second direction D2 (e.g., decapping direction) through its decapping punch 44b, so that the circuit sheet P is formed with a decapping opening P1, and the decapped portion of the circuit sheet P is formed as a sheet waste P'.

The second direction D2 (e.g., the cover removal direction) is different from the first direction D1 (e.g., the transport direction). The second direction D2 is substantially perpendicular to the first direction D1 (e.g., the angle between the second direction D2 and the first direction D1 is substantially 80 to 100 degrees), but the present invention is not limited thereto.

After the decapping operation is completed, the plate conveying mechanism 3 is configured to convey the circuit plate P to the position of the plate detection mechanism 5, and the plate detection mechanism 5 is configured to perform a detection operation on the circuit plate P that has undergone the decapping operation to detect whether the circuit plate P has been decapped successfully.

If the plate detection mechanism 5 detects that the circuit plate P has been successfully decapped, the plate receiving mechanism 6 will perform a receiving operation on the circuit plate P that has been successfully decapped.

On the contrary, if the plate detection mechanism 5 detects that the circuit plate P is not successfully decapped, the plate receiving mechanism 6 stops receiving the circuit plate P, and a monitoring screen M of the automatic plate decapping device E can issue a warning message of unsuccessful decapping according to the detection result of the plate detection mechanism 5, but the present invention is not limited thereto.

As described above, the sheet receiving mechanism 6 is configured to transfer the uncovered circuit sheet P from the sheet conveying mechanism 3 and perform a receiving operation. The sheet receiving mechanism 6 is used to collect and stack a certain number of circuit sheets P to complete the uncovering operation of a batch of circuit sheets P.

In addition, the waste collection mechanism 7 is configured to collect the sheet waste P’ to prevent the sheet waste P’ from being randomly scattered on the ground around the equipment.

The above is a general introduction to the location settings and operating functions of each mechanism in the automated plate opening equipment E.

Below, the above mechanisms, such as: plate feeding mechanism 1, plate transfer mechanism 2, plate conveying mechanism 3, plate uncovering mechanism 4, plate detection mechanism 5, plate receiving mechanism 6, and waste material collection mechanism 7, will be described in more detail, and the connection relationship between the plates of each of the above mechanisms will be described when necessary.

Please refer to Figure 3, which is a schematic diagram of the structure of the plate feeding mechanism 1.

The plate feeding mechanism 1 includes: a feeding guide member 11, a feeding plate carrier 12, at least one feeding sensing unit 13, and a feeding fixing plate 14.

The feeding guide member 11 is an electric cylinder in a long strip shape with a guide rail. The feeding guide member 11 is arranged on the feeding fixed plate 14. The feeding guide member 11 is arranged on the feeding fixed plate 14 at an inclined angle (e.g., 5 to 45 degrees) relative to a vertical normal vector of the ground plane.

The feeding guide member 11 can be, for example, a servo cylinder, and preferably a linear reciprocating servo cylinder. The feeding fixing plate 14 is, for example, a sheet-shaped metal plate or a plastic plate having a plurality of fixing holes, for providing the feeding guide member 11 to be set thereon through the fixing holes, but the present invention is not limited thereto.

The loading board carrier 12 is movably (e.g., slidably) disposed on a track guide groove (not numbered in the figure) of the loading guide member 11. The loading board carrier 12 can provide at least one circuit board P to be disposed thereon, and the loading guide member 11 is used to drive the loading board carrier 12 to move up and down along an inclined direction of the inclined angle, for example, to move away from the ground, so that the circuit board P can be lifted and loaded to a position adjacent to the board transfer mechanism 2.

It is worth mentioning that, since the material loading guide member 11 is arranged along an inclined direction, the circuit board P placed on the surface of the material loading board carrier 12 is also arranged inclined to the ground plane. Therefore, if multiple circuit boards P are stacked on the material loading board carrier 12, it is not easy for the boards to stick to each other.

The at least one loading sensing unit 13 is disposed on the loading guide member 11, located on one side of the track guide groove, and is configured to position the lifting height of the loading plate carrier 12.

In this embodiment, the number of the at least one feeding sensing unit 13 is multiple (e.g., two), and the two feeding sensing units 13 are respectively disposed at the upper end and the lower end of the feeding guide member 11, so as to respectively define a material placement height (e.g., when the feeding sensing unit 13 is disposed at the lower end of the feeding guide member 11) and a feeding height (e.g., when the feeding sensing unit 13 is disposed at the upper end of the feeding guide member 11), but the present invention is not limited thereto.

Please refer to Figure 4, which is a schematic diagram of the structure of the plate transfer mechanism 2.

The plate transfer mechanism 2 includes: a transfer drive motor 21, a transfer wheel component 22, a transfer swing component 22a, at least one transfer vacuum component 23, at least one transfer suction cup component 24, and at least one transfer sensing unit 25.

In this embodiment, the transfer drive motor 21 may be, for example, a servomotor, the transfer wheel drive component 22 may be, for example, a pulley drive component, and the transfer swing component 22a may be, for example, a horizontal reciprocating swing component in a rectangular shape. Furthermore, the transfer vacuum component 23 may be, for example, a vacuum generator, the transfer suction cup component 24 may be, for example, a vacuum suction cup, and the transfer sensing unit 25 may be, for example, a photoelectric sensor (sensor), but the present invention is not limited thereto.

One end of the transfer wheel component 22 is connected (pivoted) to the transfer drive motor 21, and the other end of the transfer wheel component 22 is connected to the transfer swing component 22a. The transfer drive motor 21 is configured to drive the transfer wheel component 22 to rotate, and the transfer wheel component 22 is configured to further drive the transfer swing component 22a to move approximately in the horizontal direction during rotation.

Furthermore, a transfer and fixing member 22b having a long strip shape and a narrow fixed groove is provided on one side of the transfer and swing member 22a. The at least one transfer vacuum member 23 is provided on a vacuum pipeline (not numbered in the figure). One end of the vacuum pipeline is fixed to the narrow fixed groove (not numbered in the figure) of the transfer and fixing member 22b by a fixing screw to be connected to the transfer and fixing member 22b. The at least one transfer vacuum member 23 is linked to the transfer and swing member 22a through the transfer and fixing member 22b.

The other end of the vacuum pipeline connected to the at least one transfer vacuum component 23 (i.e., the end far away from the transfer swing component 22a or the transfer fixed component 22b) is connected to the at least one transfer suction cup component 24, and the transfer suction cup component 24 is set downward (toward the ground).

The operation of the plate transfer mechanism 2 is described as follows.

When the sheet feeding mechanism 1 feeds at least one circuit sheet P to a position adjacent to the sheet transfer mechanism 2, the sheet transfer mechanism 2 is configured to drive the transfer wheel component 22 to rotate through the transfer drive motor 21, thereby driving the transfer swing component 22a to move toward the sheet feeding mechanism 1, and the transfer swing component 22a drives the transfer vacuum component 23 and the transfer suction cup component 24 to move synchronously through the transfer fixed component 22b, and makes the at least one transfer suction cup component 24 located above the circuit sheet P (at this time, the suction cup hardware of the transfer suction cup component 24 faces the surface of the circuit sheet P).

Then, the transfer vacuum component 23 is configured to generate vacuum, so that the transfer suction cup component 24 generates a vacuum suction through the connected vacuum pipeline to adsorb the circuit board P onto the transfer suction cup component 24. Then, the plate transfer mechanism 2 is configured to drive the transfer wheel component 22 through the transfer drive motor 21 to drive the transfer swing component 22a to move toward the plate conveying mechanism 3 to transfer the adsorbed circuit board P onto the plate conveying mechanism 3. After completing the above operation, the transfer vacuum component 23 breaks the vacuum to place the circuit board P on the plate conveying mechanism 3.

According to the above configuration, the plate transfer mechanism 2 can accurately and quickly transfer the circuit plate P from the plate loading mechanism 1 to the plate conveying mechanism 3.

It is worth mentioning that in this embodiment, the number of the at least one transfer vacuum component 23 is preferably four, and the number of the at least one transfer suction cup component 24 corresponds to the number of the transfer vacuum component 23 is also four, and the position configuration of the suction cups of the four transfer suction cup components 24 can adsorb four points of the circuit board P, so that the four transfer suction cup components 24 can stably adsorb the circuit board P.

Furthermore, the transfer sensing unit 25 is disposed on one side of the transfer wheel component 22 to detect the operating status of the transfer wheel component 22. The specific configuration can be adjusted according to the needs.

Please refer to Figures 5 to 7, which show schematic diagrams of the structure of the plate conveying mechanism 3.

The plate conveying mechanism 3 includes: a feed vertical plate component 31, at least one feed guide rail component 31a, at least one feed sensing unit 32, a conveying drive motor 33, a first conveying sensing unit 34 (located at a feed position), a second conveying sensing unit 35 (located at a cover removal position), at least one conveying horizontal plate component 36, at least one conveying belt component 37, a dimension measuring component 38, at least one hand wheel fixing component 39, at least one pressure wheel fixing component 310, at least one plate supporting platform 311, and a third conveying sensing unit 312 (located at a discharge position).

The feed vertical plate member 31 is plate-shaped and is arranged adjacent to the plate feeding mechanism 1 and against the feeding fixed plate 14. The feed vertical plate member 31 is arranged at an inclination angle (e.g., 5 to 45 degrees) corresponding to a vertical normal vector of the feeding guide member 11 relative to the ground plane. In other words, the inclination direction of the feed vertical plate member 31 is consistent with the inclination direction of the feeding guide member 11, and the inclination angles of the two members are the same, but the present invention is not limited thereto.

The at least one feed guide rail component 31a is a long strip guide rail. In this embodiment, the number of the at least one feed guide rail component 31a is two, and the length direction of the two feed guide rail components 31a is arranged along the above-mentioned inclined direction and is arranged at intervals on a side surface of the feed vertical plate component 31 (such as: the side surface of the feed vertical plate component 31 facing the feed guide component 11).

The two feeding guide rail components 31a are configured to provide the loading plate carrier 12 to be movably arranged thereon, so that when the feeding guide component 11 drives the loading plate carrier 12 to move upward along the inclined direction, the feeding vertical plate component 31 and the two feeding guide rail components 31a can stabilize the moving state of the loading plate carrier 12, thereby preventing the loading plate carrier 12 from shaking during movement.

The at least one feed sensing unit 32 can be a contrast sensor. The at least one feed sensing unit 32 is two in number. The two feed sensing units 32 are arranged on the side surface of the feed vertical plate component 31, and are respectively located on the outer sides of the two feed guide rail components 31a, and are arranged close to the top edge of the feed vertical plate component 31 to determine whether the circuit board P is sent to the feed position.

Furthermore, the number of the at least one conveying plate member 36 is two, and the number of the at least one conveying belt member 37 is also two. The two conveying plate members 36 are spaced and vertically arranged along the first direction D1 (i.e., the conveying direction), and the two conveying belt members 37 are respectively arranged on the inner sides of the two conveying plate members 36 to jointly define a conveying platform area R. In this embodiment, the two conveying belt members 37 are spaced from each other to form a gap, which can provide the sheet waste P' formed by the decapping operation to fall into the waste collection mechanism 7.

The conveying drive motor 33 can be, for example, a servo motor and is arranged adjacent to the plate feeding mechanism 1. A conveying drive shaft 33a of the conveying drive motor 33 passes through two conveying cross-plate components 36 and is respectively linked to two conveying belt components 37. The plate transfer mechanism 2 can transfer the circuit plate P to the conveying platform area R through the transfer suction cup component 24 and is arranged on the two conveying belt components 37, thereby, the two conveying belt components 37 can transport the circuit plate P.

When the conveying drive motor 33 drives the conveying drive shaft 33a to rotate, the two conveying belt components 37 can drive the circuit board P to be transported along the first direction D1 (conveying direction) and sequentially pass through a feeding position, a cover removal position, and a discharging position in the conveying platform area R.

In addition, the sheet conveying mechanism 3 can calculate the moving distance of the circuit sheet P by the rotation speed of the conveying driving motor 33 and a computer unit, but the present invention is not limited to this.

The first conveying sensing unit 34 can be a reflective sensor. The first conveying sensing unit 34 is set at the feeding position of the conveying platform area R and is located on the inner side of the two conveying belt components 37 to determine whether the circuit board P moves on the two conveying belt components 37 and is located at the feeding position.

The second transport sensing unit 35 can be a contrast sensor. The second transport sensing unit 35 is set at the uncovering position of the transport platform area R and is located on the outer side of at least one of the transport crossbar components 36. The second transport sensing unit 35 is configured to determine whether the circuit board P is transported to the uncovering position and positioned to facilitate the subsequent uncovering operation.

The dimension measuring member 38 can be, for example, a scale. The dimension measuring member 38 can be, for example, disposed transversely at the bottom of the two conveying cross-plate members 36, and the length thereof is greater than the width of the conveying platform area R defined by the two conveying cross-plate members 36. The width of the conveying platform area R defined by the two conveying cross-plate members 36 can be adjusted according to the width of the circuit board P, and the dimension measuring member 38 can be used as a basis for the adjustment index.

The number of the handwheel fixing components 39 can be, for example, at least two, and they are respectively arranged on the outer sides of the two conveying cross-plate components 36. When the width of the conveying platform area R defined by the two conveying cross-plate components 36 has been properly adjusted according to the width of the circuit board P, the two handwheel fixing components 39 can be used to fix the positions of the two conveying cross-plate components 36, thereby fixing the width of the conveying platform area R.

The number of the pressure roller fixing members 310 can be two, and they are located at the uncovering position. The two pressure roller fixing members 310 can be respectively arranged on the two conveying transverse plate members 36, and are arranged inwardly to protrude in the direction of the conveying platform area R. In addition, the ends of the two pressure roller fixing members 310 protruding in the direction of the conveying platform area R are respectively located above the two conveying belt members 37, and are respectively spaced apart from the two conveying belt members 37 by a distance. Accordingly, when the sheet conveying mechanism 3 conveys the circuit sheet P to the decapping position where the sheet decapping mechanism 4 is located, the two pressure roller fixing members 310 are arranged to be located on (or pressed against) the top surface of the circuit sheet P, thereby preventing the circuit sheet P from being displaced when the sheet decapping mechanism 4 performs the decapping operation.

The number of the sheet support platforms 311 can be two, and they are located at the uncovering position. The two sheet support platforms 311 can be respectively arranged at the inner side walls of the two conveying cross plate components 36 and respectively located under the two conveying belt components 37. The two sheet support platforms 311 are arranged at intervals from each other and correspond to the two pressure roller fixing components 310 in position. When the decapping punch 44b of the sheet decapping mechanism 4 decaps the circuit sheet P, the two sheet support platforms 311 can be supported on the bottom surface of the circuit sheet P to prevent the circuit sheet P from bending and deforming.

The third conveying sensing unit 312 can be, for example, a reflective sensor (sensor) disposed at the tail of the discharge position of the conveying platform area R. When the sheet conveying mechanism 3 conveys the circuit sheet P to the discharge position behind the sheet removing mechanism 4, the third conveying sensing unit 312 can sense whether the circuit sheet P is indeed delivered to the discharge position.

Please refer to Figures 8 and 9, which show schematic diagrams of the structure of the plate decapping mechanism 4. The plate decapping mechanism 4 is located at the decapping position of the conveying platform area R.

More specifically, the sheet material removing mechanism 4 comprises: a transverse guiding member 41, a longitudinal guiding member 42, a connecting and fixing member 43, and a removing mold member 44.

The transverse guide member 41 may be a linear slider. The top surface of the transverse guide member 41 may be provided with a guide scale 41a, and the transverse guide member 41 may be arranged transversely above the two conveying transverse plate members 36 and the two conveying belt members 37 through two supporting columns 41b respectively located on the outer sides of the two conveying transverse plate members 36 (please refer to Figures 1 and 2 together).

The longitudinal guide member 42 may be a slide cylinder, the connecting and fixing member 43 may be a fixed clamp, and the longitudinal guide member 42 may be movably (e.g., slidably) disposed on the transverse guide member 41 via the connecting and fixing member 43.

Accordingly, the longitudinal guide member 42 can move back and forth along the length direction of the transverse guide member 41 (i.e., the width direction of the transport platform area R).

When the longitudinal guide member 42 moves along the length direction of the transverse guide member 41, the position of the longitudinal guide member 42 can be confirmed by the guide ruler 41a, thereby confirming whether the longitudinal guide member 42 is located above the uncovering portion of the circuit board P, but the present invention is not limited thereto.

The decapping mold component 44 is used to perform decapping operations on the part to be decapped of the circuit board P. The decapping mold component 44 includes: a mold body 44a, at least one decapping punch 44b, and at least one retractable pressing plate 44c. In this embodiment, the decapping mold component 44 further includes: a mold ruler 44d and at least one fixing screw 44e, but the present invention is not limited thereto.

In this embodiment, the mold body 44a is roughly in the shape of a hexahedron (such as a cuboid or a cube), but the present invention is not limited thereto. The mold body 44a can be movably (such as slidably) arranged on the longitudinal guide member 42 through a fixed plate (not numbered in the figure), and can move up and down along the second direction (uncovering direction). When the plate conveying mechanism 3 conveys the circuit board P to the uncovering position, the uncovering mold member 44 can be driven by the longitudinal guide member 42 to move toward the uncovering portion of the circuit board P.

The at least one decapping punch 44b is disposed on the bottom surface of the mold body 44a, and the decapping punch 44b is configured to perform decapping operations on the part of the circuit board P to be decapped (such as: Figure 10), so that the circuit board P forms a decapping opening P1, and also produces a board waste P' (such as Figure 11).

In this embodiment, the number of the at least one decapping punch 44b is two (FIG. 9 shows only one of them, and the other is symmetrically arranged with the punch but is blocked due to the viewing angle). The two decapping punches 44b are arranged at intervals on the bottom surface of the mold body 44a, and a virtual extension line connecting the ends of the two decapping punches 44b is substantially perpendicular to the virtual extension surface connecting the transverse guide member 41 and the two supporting columns 41b. Accordingly, the decapping mold member 44 can stably perform decapping operations on the portion to be decapped of the circuit board P through the configuration of the two decapping punches 44b. From another perspective, the virtual extension line connecting the ends of the two decapping punches 44b is consistent with the first direction (transportation direction).

Furthermore, the at least one retractable pressing plate 44c is roughly in the shape of a rectangular plate, and is retractably disposed on the bottom surface of the mold body 44a and located on one side of the decapping punch 44b.

When the decapping punch 44b performs decapping operation on the part to be decapped of the circuit board P, the at least one retractable pressing plate 44c is retractably secured to the top surface of the circuit board P and secured to the non-decapping part on the top surface of the circuit board P (as shown in Figures 10 and 11).

In this embodiment, the number of the at least one retractable pressing plate 44c is two, and the two retractable pressing plates 44c are disposed at intervals on the bottom surface of the mold body 44a and located on both sides of the virtual extension line connected to the two decapping punches 44b, so as to roughly form a rectangular area around the two decapping punches 44b.

Furthermore, as shown in FIG11 , when the decapping punch 44b performs decapping operation on the part to be decapped of the circuit board P, the positions of the two retractable pressing plates 44c correspond to the two plate support platforms 311 of the plate conveying mechanism 3. At this time, the two retractable pressing plates 44c are supported on the top surface of the circuit board P, and the two plate support platforms 311 are supported on the bottom surface of the circuit board P to clamp the circuit board P. In this way, the decapping punch 44b can stably perform decapping operation on the part to be decapped of the circuit board P, and prevent the circuit board P from bending, deforming or displacing.

The operation of the plate removing mechanism 4 is described in more detail as follows.

Please refer to FIG. 8 and FIG. 10 . After the transverse guide member 41 drives the longitudinal guide member 42 to move horizontally to the top of the circuit board P by connecting the fixing member 43, the longitudinal guide member 42 can drive the decapping mold member 44 to move along the second direction D2 (decapping direction) toward the circuit board P through the mold body 44a, and make the two decapping punches 44b be aligned in position above the part of the circuit board P to be decapped. At this time, the two retractable pressing plates 44c are secured to the non-covered portion on the top surface of the circuit board P, and the two board support platforms 311 are supported on the bottom surface of the circuit board P to respectively clamp the circuit board P together with the two retractable pressing plates 44c.

Next, please refer to FIG. 11 . The longitudinal guide member 42 drives the mold body 44a to continuously move downward toward the circuit board P along the second direction D2 (decapping direction), and punches out and removes the uncovering portion of the circuit board P through two decapping punches 44b, thereby forming a decapping opening P1 at the decapping portion of the circuit board P, and the decapping portion is formed into a sheet waste P', which can fall through the gap between the two sheet support platforms 311.

It is worth mentioning that in this embodiment, the punching depth of the two decapping punches 44b punching downward from the top surface of the circuit board P during the decapping operation is equal to the depth of the two retractable pressing plates 44c retracting toward the inside of the mold body 44a (as shown in FIG. 11 ), but the present invention is not limited thereto.

It should be noted that only one of the decapping punches 44b can be shown in Figures 10 and 11, and the other decapping punch 44b is visually blocked by the previous decapping punch 44b (Figure 2 shows two).

Please continue to refer to Figures 8 and 9. The mold ruler 44d is set on the top surface of the mold body 44a, and the length direction of the mold ruler 44d is roughly consistent with the direction of the virtual extension line connecting the ends of the two decapping punches 44b.

It is worth mentioning that in this embodiment, the two decapping punches 44b can move toward or away from each other along the virtual extension line to adjust the distance between the two decapping punches 44b. More specifically, the two decapping punches 44b can adjust the distance between the two decapping punches 44b according to the width of the portion to be decapped of the circuit board P and the indicator of the mold ruler 44d, but the present invention is not limited thereto.

For example, in an embodiment of the present invention not shown, the number of the decapping punch 44b may be, for example, only one. In this case, there is no need to set the mold ruler 44d.

Furthermore, the at least one fixing screw 44e is disposed on the top surface of the mold body 44a and located on one side of the mold ruler 44d.

In this embodiment, the at least one fixing screw 44e is two in number, which are disposed at intervals on the top surface of the mold body 44a and are used to lock the two decapping punches 44b respectively.

In one embodiment, when the distance between the two decapping punches 44b needs to be adjusted, the two fixing screws 44e can be loosened first so that the two decapping punches 44b can move away from or towards each other, thereby adjusting the distance between the two decapping punches 44b. Then, the two fixing screws 44e can be locked again to fix the positions of the two decapping punches 44b respectively.

Please refer to FIG. 12 together with FIG. 1 and FIG. 2, FIG. 12 shows a schematic diagram of the mechanism structure of the plate detection mechanism 5. The plate detection mechanism 5 is arranged on the plate conveying mechanism 3 and is located at the rear side of the plate decapping mechanism 4 to detect the circuit plate P after the decapping operation by the plate decapping mechanism 4, and then confirm whether the circuit plate P is successfully decapped.

The plate detection mechanism 5 includes: at least one uncovering sensing unit 51 and a sensing unit base 52 on which the uncovering sensing unit 51 is disposed.

The sensing unit base 52 is larger than a flat rectangular shape and is vertically disposed between the two conveyor belt components 37, and its height does not exceed the height of the conveyor belt components 37.

The decapping sensing unit 51 may be, for example, a reflective sensor (sensor). In this embodiment, the number of the at least one decapping sensing unit 51 is multiple (e.g., three), and the three decapping sensing units 51 may be arranged on the sensing unit base 52 at intervals along the first direction D1 (e.g., the conveying direction), and the sensing parts of the three decapping sensing units 51 are all arranged upward.

In terms of operation, after the sheet decapping mechanism 4 completes the decapping operation on the circuit sheet P, the sheet conveying mechanism 3 continues to convey the decapped circuit sheet P to the sheet detection mechanism 5 at the rear side of the sheet decapping mechanism 4, and the decapping sensing unit 51 is configured to detect the circuit sheet P, thereby detecting whether the decapping of the circuit sheet P is successful (e.g., whether there is a decapping opening P1). The three decapping sensing units 51 of this embodiment can detect three circuit sheets P respectively, but are not limited to this.

If the decapping sensing unit 51 detects that the circuit board P does have a decapping opening P1 (e.g., the detection signal of the decapping sensing unit 51 can pass through the decapping opening P1 without being reflected), the decapping sensing unit 51 will return a decapping success signal to a computer unit of the automatic board decapping device E. On the contrary, if the decapping sensing unit 51 detects that the circuit board P does not have a decapping opening P1 (e.g., the detection signal of the decapping sensing unit 51 cannot pass through the decapping opening P1 and is reflected), the decapping sensing unit 51 will return a decapping failure signal to the computer unit of the automatic board decapping device E. At this time, the automated sheet opening device E will stop the circuit sheet P that has failed to be opened and enter the sheet receiving mechanism 6, but the present invention is not limited to this.

It is worth mentioning that in this embodiment, the sheet detection mechanism 5 is arranged before the third conveying sensing unit 312 (discharging position) of the sheet conveying mechanism 3 to ensure that the sheet detection mechanism 5 indeed detects the successful decapping signal of the circuit sheet P, and the sheet conveying mechanism 3 can continue to convey the successfully decapped circuit sheet P to the third conveying sensing unit 312. Then, when the third conveying sensing unit 312 senses the circuit sheet P, the sheet receiving mechanism 6 receives the circuit sheet P.

Please refer to Figure 13, and please refer to Figure 1 and Figure 2 together. Figure 13 shows a schematic diagram of the structure of the plate receiving mechanism 6. The plate receiving mechanism 6 is located at the rear side of the plate conveying mechanism 3 and the plate detection mechanism 5, that is, located at the tail section of the automatic plate opening device E.

The sheet material receiving mechanism 6 includes a first guide member 61, a second guide member 62, a receiving plate carrier 63, at least one receiving vacuum member 64, at least one receiving suction cup member 65, and a receiving sensing unit 66.

The first guide member 61 can be, for example, a linear servo cylinder arranged horizontally. The first guide member 61 is configured to provide a horizontal guide function. As shown in FIG13 and FIG1 together, the first guide member 61 is arranged horizontally at the tail section of the automated sheet metal cover opening device E along the first direction D1 (transport direction), and is partially located above the sheet metal detection mechanism 5, while the other part extends above the sheet metal detection mechanism 5.

In addition, the second guide member 62 can be, for example, another linear servo cylinder arranged longitudinally. The second guide member 62 is configured to provide a longitudinal guide function. The second guide member 62 is arranged at the rear side of the plate detection mechanism 5, and the second guide member 62 and the first guide member 61 can be, for example, sandwiched at an angle of about ninety degrees (e.g., 80 degrees to 100 degrees, and preferably 90 degrees).

The receiving and placing board platform 63 is roughly in the shape of a rectangular plate. The length direction of the second guide member 62 is roughly perpendicular to the top surface of the receiving and placing board platform 63. The top surface of the receiving and placing board platform 63 can provide at least one circuit board P (especially the circuit board P that has been successfully removed) for placement thereon.

Furthermore, one side of the receiving plate carrier 63 is movably (e.g., slidably) disposed on the second guide member 62, so that the receiving plate carrier 63 can reciprocate up and down along the length direction of the second guide member 62.

The at least one receiving vacuum member 64 can be, for example, a vacuum generator, and can be, for example, movably disposed on the first guide member 61 through a fixed back plate (not numbered in the figure), and can reciprocate left and right along the length direction of the first guide member 61 (i.e., the first direction D1).

The at least one receiving suction cup component 65 can be, for example, a hardware with a suction cup. The at least one receiving suction cup component 65 can be, for example, disposed on the fixed back plate through a vacuum pipeline and a transfer and fixing component (not numbered in the figure) with a narrow fixed groove, and connected to the at least one receiving vacuum component 64. The at least one receiving suction cup component 65 can move back and forth left and right along the length direction of the first guide component 61 along with the connected receiving vacuum component 64. The suction cup of the at least one receiving suction cup component 65 is disposed in the direction of the ground plane. In this embodiment, the number of the at least one receiving vacuum component 64 and the at least one receiving suction cup component 65 is four, but the present invention is not limited thereto.

In addition, the receiving sensing unit 66 can be, for example, a reflective sensor. The receiving sensing unit 66 can be, for example, disposed on one side of the second guide member 62 and adjacent to the first guide member 61. In other words, the receiving sensing unit 66 is approximately located on one side of the top of the second guide member 62, but the present invention is not limited thereto. The receiving sensing unit 66 is used to sense whether the circuit board P stacked and placed on the receiving board carrier 63 is in a full state.

Furthermore, the operation of the plate receiving mechanism 6 is described as follows.

After the plate detection mechanism 5 detects that the circuit plate P is successfully uncovered and sends a successful uncovering signal, the first guide component 61 can drive the material receiving vacuum component 64 and the material receiving suction cup component 65 connected thereto to move to the top of the circuit plate P.

Then, the receiving vacuum component 64 can draw a vacuum, and the receiving suction cup component 65 can suck up the circuit board P. Then, the first guide component 61 drives the receiving vacuum component 64 and the receiving suction cup component 65 connected thereto to move the sucked circuit board P to the top of the receiving board loading platform 63, and the receiving board loading platform 63 can move along the length direction of the second guide component 62 and toward the circuit board P. Then, the receiving vacuum component 64 breaks the vacuum, so that the receiving suction cup component 65 places the circuit board P on the receiving board loading platform 63. When the number of circuit boards P stacked on the receiving board loading platform 63 increases, the receiving board loading platform 63 can move downward. When the receiving sensing unit 66 senses that the stacked circuit boards P are full, the board receiving mechanism 6 stops operating.

Please refer to FIG. 14 , which shows a schematic diagram of the mechanism structure of the waste collection mechanism 7. The waste collection mechanism 7 is located below the sheet conveying mechanism 3 and corresponds to the bottom of the sheet decapping mechanism 4 in a vertical position, but the present invention is not limited thereto. The waste collection mechanism 7 includes: a waste discharge component 71 and a waste collection component 72. The waste discharge component 71 can be a waste discharge pipe. In this embodiment, the waste discharge component 71 can be a square tube with a length of 60 to 90 mm and a width of 60 to 90 mm, but the present invention is not limited thereto. The waste discharge component 71 can discharge sheet waste P' generated by the circuit sheet P after the decapping operation. It is worth mentioning that the sheet waste P' can, for example, fall into the waste material discharge member 71 through the gap between the two opposite conveyor belt members 37 and the gap between the two sheet material support platforms 311, but the present invention is not limited thereto. In addition, the waste material collection member 72 can, for example, be a collection basket or a collection bucket, which is arranged below the discharge port of the waste material discharge member 71 and is used to collect the sheet waste P' discharged by the waste material discharge member 71.

According to the above configuration, the automated sheet opening device E provided by the embodiment of the present invention can automatically remove the cover of the circuit sheet P and properly collect the sheet waste P'.

It is worth mentioning that in some embodiments of the present invention, the length dimension of the automatic plate opening device E may be, for example, between 2,000 and 2,500 millimeters (mm), the width dimension may be, for example, between 800 and 1,200 millimeters, and the height dimension may be, for example, between 1,500 and 1,900 millimeters. Furthermore, the length dimension of the circuit board P may be, for example, between 100 and 400 millimeters, and the width dimension may be, for example, between 80 and 300 millimeters, but the present invention is not limited thereto.

[Automated opening method of sheet metal]

The above is a description of the mechanism design of the automatic plate opening device E of the embodiment of the present invention. The following will continue to introduce the automatic plate opening method of the embodiment of the present invention. Referring to Figure 15, the embodiment of the present invention also provides an automatic plate opening method, which includes: step S110, step S120, step S130, step 140, step S150, step S160, and step S170. However, the order of the above steps can be adjusted or additional steps can be inserted according to needs, and the present invention is not limited.

As shown in FIG. 15 and FIG. 2 , step S110 is to implement a plate loading operation, including: placing a circuit board P on a plate loading mechanism 1, and lifting the circuit board P to a position adjacent to a plate transfer mechanism 2.

The step S120 is to implement a plate transfer operation, including: transferring the circuit plate P from the plate loading mechanism 1 to a plate conveying mechanism 3 through the plate transfer mechanism 2.

The step S130 is to implement a plate conveying operation, including: conveying the circuit plate P through the plate conveying mechanism 3 along a first direction D1 (e.g., conveying direction), and allowing the circuit plate P to pass through a plate removing mechanism 4 and a plate detecting mechanism 5 in sequence.

The step S140 is to implement a sheet decapping operation, including: transporting the circuit sheet P through the sheet conveying mechanism 3 along the first direction D1 to the sheet decapping mechanism 4, and performing a decapping operation on the circuit sheet P along a second direction D2 (such as a decapping direction) perpendicular to the first direction D1 (such as a conveying direction) through at least one decapping punch 44b of the sheet decapping mechanism 4, so that the circuit sheet P is formed with a decapping opening P1, and the decapped portion of the circuit sheet P is formed into a sheet waste P' (such as Figures 2, 10, and 11).

The step S150 is to implement a plate inspection operation, including: transporting the circuit plate P that has undergone the decapping operation to the position of the plate inspection mechanism 5 through the plate conveying mechanism 3, and performing an inspection operation on the circuit plate P through the plate inspection mechanism 5 to detect whether the circuit plate P is successfully decapped. If the plate inspection mechanism 5 detects that the circuit plate P is successfully decapped, the subsequent material collection operation is performed. Otherwise, the subsequent material collection operation is stopped.

The step S160 includes: performing a plate material collection operation, including: collecting the circuit plate P that has been successfully decapped through a plate material collection mechanism 6 from the plate conveying mechanism 3.

The step S170 includes: collecting the sheet waste P' formed by the decapping operation through a waste collection mechanism 7 to prevent the sheet waste P' from being randomly scattered on the ground around the equipment.

[Beneficial effects of the embodiment]

The beneficial effect of the present invention is that the automated plate opening equipment and the automated plate opening method provided by the present invention can realize mechanized and automated opening operations for circuit boards, thereby solving the problems of uncontrollable quality and inability to mass produce in the manual opening operations in the prior art.

The above disclosed contents are only the preferred feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the contents of the description and drawings of the present invention should be included in the scope of the patent application of the present invention.

E: Automated plate opening equipment

1: Plate feeding mechanism

2: Plate transfer mechanism

3: Plate conveying mechanism

4: Plate cover removal mechanism

44a: Mold body

44b: Remove the cap and punch head

44c: Telescopic pressure plate

5: Plate detection mechanism

6: Plate receiving mechanism

7: Waste collection agency

M: Monitoring screen

P: Circuit board

D1: First direction

D2: Second direction

Claims (10)

An automated sheet material opening device, comprising: A sheet material loading mechanism, which is located at the front end of the automated sheet material opening device, the sheet material loading mechanism provides at least one circuit sheet to be placed thereon, and is used to load the circuit sheet; A sheet material conveying mechanism, which is connected to the rear side of the sheet material loading mechanism, and can be used to convey the circuit sheet along a first direction; A sheet material transfer mechanism, which is located above the sheet material conveying mechanism and is arranged adjacent to the sheet material loading mechanism, the sheet material transfer mechanism is used to transfer the circuit sheet from the sheet material loading mechanism to the sheet material conveying mechanism, so that the sheet material conveying mechanism can convey the circuit sheet; A sheet decapping mechanism, which is located above the sheet conveying mechanism and is arranged behind the sheet transfer mechanism along the first direction; wherein the sheet decapping mechanism includes at least one decapping punch; wherein, when the sheet conveying mechanism conveys the circuit sheet to the position of the sheet decapping mechanism, the sheet decapping mechanism is configured to perform a decapping operation on the circuit sheet along a second direction different from the first direction through the decapping punch; and A sheet detection mechanism, which is arranged on the sheet conveying mechanism and is arranged behind the sheet decapping mechanism along the first direction; wherein the sheet detection mechanism is configured to perform a detection operation on the circuit sheet that has undergone the decapping operation, thereby detecting whether the circuit sheet is successfully decapped. The automatic sheet material opening device as described in claim 1 further comprises: A sheet material receiving mechanism, which is arranged at the rear side of the sheet material detection mechanism and located at the tail end of the automatic sheet material opening device; wherein, when the sheet material detection mechanism detects that the circuit sheet material is successfully opened, the sheet material receiving mechanism receives the circuit sheet material from the sheet material conveying mechanism. The automated sheet metal cover removal device as described in claim 1 further comprises: A waste material collection mechanism, which is located at the lower side of the sheet metal conveying mechanism and vertically corresponds to the lower side of the sheet metal cover removal mechanism; wherein the waste material collection mechanism is configured to collect sheet metal waste generated by the circuit sheet metal after the cover removal operation. An automated sheet opening device as described in claim 1, wherein the sheet loading mechanism comprises a loading guide member and a loading plate carrier; the loading guide member has a guide rail, and a length direction of the loading guide member is set at an inclined angle relative to a vertical normal vector of the ground plane; the loading plate carrier is movably set on the guide rail of the loading guide member, the loading plate carrier provides the circuit board for placement thereon, and the circuit board placed on the loading plate carrier is also inclined relative to the ground plane, and the loading guide member is used to drive the loading plate carrier to move along the length direction of the loading guide member so that the height of the circuit board can be lifted to a position adjacent to the sheet transfer mechanism. The automated sheet opening device as described in claim 1, wherein the sheet transfer mechanism comprises: a transfer drive motor, a transfer wheel component, a transfer swing component, at least one transfer vacuum component, and at least one transfer suction cup component; wherein one end of the transfer wheel component is connected to the transfer drive motor, the other end of the transfer wheel component is connected to the transfer swing component, and the at least one transfer vacuum component and the at least one transfer suction cup component are The transfer drive motor is indirectly connected to the transfer swing component; wherein, the transfer drive motor can drive the transfer wheel component to rotate, and when the transfer wheel component rotates, it can drive the transfer swing component to move roughly along a horizontal direction, and further drive the at least one transfer vacuum component and the at least one transfer suction cup component to move along the horizontal direction, so that the circuit board is adsorbed by the board loading mechanism and transferred to the board conveying mechanism. The automated sheet opening device as described in claim 1, wherein the sheet conveying mechanism comprises: a conveying drive motor, at least one conveying transverse plate component, and at least one conveying belt component; wherein the at least one conveying transverse plate component is vertically arranged along the first direction, and the at least one conveying belt component is arranged on one side of the at least one conveying transverse plate component to jointly define a conveying platform area, and the conveying platform area crosses the sheet transfer mechanism, the plate removing mechanism, and the plate detecting mechanism; wherein a conveying drive shaft of the conveying drive motor passes through the at least one conveying cross plate component and is linked to the at least one conveying belt component; wherein the plate transferring mechanism is used to transfer the circuit plate to the conveying platform area and is arranged on the at least one conveying belt component so that the at least one conveying belt component can transport the circuit plate. An automated sheet metal cover opening device as described in claim 6, wherein the sheet metal conveying mechanism further comprises: at least one sheet metal support platform, which is located at the lower side of the at least one conveying belt member; wherein, when the at least one decapping punch on the sheet metal cover removing mechanism performs the decapping operation on the circuit board, the at least one sheet metal support platform supports the bottom surface of the circuit board. An automated sheet metal cover removal device as described in claim 1, wherein the sheet metal cover removal mechanism comprises: a cover removal mold component, and the cover removal mold component comprises a mold body and the at least one cover removal punch; wherein the at least one cover removal punch is disposed on the bottom surface of the mold body, and the cover removal punch is configured to perform the cover removal operation on a portion of the circuit board to be removed, so that the circuit board forms a cover removal opening, and a sheet metal waste is generated. The automated sheet uncovering device as described in claim 8, wherein the sheet decapping mechanism further comprises: at least one retractable pressing plate, which is retractably disposed on the bottom surface of the mold body and located on one side of the decapping punch; wherein when the decapping punch performs a decapping operation on the to-be-decapped portion of the circuit board, the at least one retractable pressing plate is retractably secured to a non-to-be-decapped portion on the top surface of the circuit board, and the at least one retractable pressing plate and at least one sheet supporting platform of the sheet conveying mechanism can jointly clamp the circuit board. A method for automatically opening a plate, comprising: Providing an automated plate opening device as described in any one of claims 1 to 9; Implementing a plate loading operation, comprising: placing the at least one circuit plate on the plate loading mechanism, and moving the circuit plate to a position adjacent to the plate transfer mechanism; Implementing a plate transfer operation, comprising: transferring the at least one circuit plate from the plate loading mechanism to the plate conveying mechanism through the plate transfer mechanism; Implementing a plate conveying operation, comprising: conveying the at least one circuit plate along the first direction through the plate conveying mechanism to the position of the plate decapping mechanism; and Implementing a sheet decapping operation, including: performing the decapping operation on the circuit board along the second direction through the at least one decapping punch of the sheet decapping mechanism, so that the circuit board forms a decapping opening, and the decapped portion of the circuit board forms a sheet waste; and Implementing a sheet inspection operation, including: transporting the circuit board that has undergone the decapping operation to the position of the sheet inspection mechanism through the sheet conveying mechanism, and performing the inspection operation on the circuit board through the sheet inspection mechanism to detect whether the circuit board is successfully decapped.

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