UA54374C2 - Спосіб виготовлення модуля мікросхемної карти для безконтактних мікросхемних карт - Google Patents

Спосіб виготовлення модуля мікросхемної карти для безконтактних мікросхемних карт Download PDF

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UA54374C2
UA54374C2 UA97030971A UA97030971A UA54374C2 UA 54374 C2 UA54374 C2 UA 54374C2 UA 97030971 A UA97030971 A UA 97030971A UA 97030971 A UA97030971 A UA 97030971A UA 54374 C2 UA54374 C2 UA 54374C2
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wire
carrier
microcircuit
card module
semiconductor
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UA97030971A
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English (en)
Russian (ru)
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Йозеф Мундігл
Йозеф Мундигл
Детлеф Удо
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Сіменс Акцієнгезельшафт
Сименс Акциенгезельшафт
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Application filed by Сіменс Акцієнгезельшафт, Сименс Акциенгезельшафт filed Critical Сіменс Акцієнгезельшафт
Publication of UA54374C2 publication Critical patent/UA54374C2/uk

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

Згідно з винаходом пропонується спосіб виготовлення модуля інтелектуальної картки з котушкою індуктивності, яка розташована на підкладці модуля і виводи якої з'єднані з виводами мікросхеми, також розташованої на підкладці модуля, який полягає в тому, що при виготовленні модуля використовують термокомпресійне зварювання.

Description

Опис винаходу
В случае бесконтактньїх или несоприкасающихся микросхемньїх карт необходимая для работь! находящейся 2 в ней полупроводниковой микросхемь! знергия подводится, по меньшей мере, через одну антенную катушку, причем по большей части вьібирают трансформаторную передачу. Также и передача данньїх происходит через зту катушку.
При зтом обьічньїми являются как печатнье, вьітравленнье или гальванически нарощеннье катушки в виде полОосКовЬІх линий, так и намотаннье катушки из змалированной проволоки, причем в качестве основного 70 материала для таких катушек из змалированной проволоки используют медь.
Для соединения катушки с полупроводниковой микросхемой вначале снимают изоляцию с вьіводов катушки, например, путем нагрева, обработки щетками, химической обработкой или лужения и затем контактируют путем, например, лазерной пайки, сварки по зазору, ультразвуковой сварки, соединения накруткой или приклеивания серебрянозмалевьм клеем. Для изготовления такого соединения необходимо соответственно 72 множество рабочих операций или соответственно монтажньх шагов, которне требуют также множества машин для их вбіполнения.
Из ОЕ 37 21 822 С1 известно соединение антенной катушки с полупроводниковой микросхемой через термокомпрессионнье соединения (Вопамегріпдипдеп). Таким образом там вначале должна наматьваться катушка, концьі которой затем в ходе дальнейшей рабочей операции соединяют с полупроводниковой микросхемой через термокомпрессионнье соєдинения.
Задачей изобретения является позтому создание способа изготовления модуля микросхемной карть! для бесконтактной микросхемной карть, которьйй является простьім, зкономичнь!м с точки зрения расходов и легко автоматизируемь!м.
Зта задача решается способом согласно пункта 1 формуль! изобретения. Предпочтительная форма с 22 дальнейшего развития изобретения указана в зависимом пункте формуль! изобретения. Го)
В соответствующем изобретению способе вьіводьії катушки оприкрепляют Кк контактньм полям полупроводниковой микросхемь! непосредственно. При зтом узел термокомпрессионной сварки (Вопаег) встроен непосредственно в головку направления проволоки намоточного автомата, так что все монтажнье шаги могут вьіполняться одной машиной. Особенно предпочтительньм образом для катушки используют М алюминиевую проволоку. Она является в два раза легче меди и имеет также наполовину меньший модуль ча упругости так, что готовая карта имеет меньшую жесткость. Зтот вид толстопроволочного термокомпрессионного соединения известен, например, из техники сильноточной злектроники и хорошо освоен о так, что достигается вьісокий вьіход годньїх изделий. «І
В предпочтительной форме дальнейшего развития изобретения полупроводниковая микросхема удерживаєтся в свободно подвешенном состояний в вьіємке носителя только за счет термокомпрессионньх о контактов так, что она хорошо защищена от разламьвания при изгибной нагрузке микросхемной карти.
Изобретение описьівается ниже более подробно на примере вьіполнения с помощью одной фигурь!і. Фигура показьивает при зтом возможную форму вьіполнения соответствующего изобретению модуля микросхемной « карти. З 70 Плоский носитель 1 из гибкого, непроводящего материала имеет вьемку 2. В ней установлена с полупроводниковая микросхема 3. Полупроводниковая микросхема 3 имеет две контактньхх площадки 4, з» которье увеличеньї по сравнению с обьічньми контактньми площадками кристалла за счет, например, золотой прокладки. На контактньїх площадках 4 закрепленьі путем термокомпрессионной сварки вьіводьі б антенной катушки 5. При зтом проволоку, которая предпочтительньм образом вьіполнена из алюминия, вначале прикрепляют к одной из контактньїх площадок 4, затем посредством направляющей головки намоточного і-й автомата, в которую встроен узел термокомпрессионной сварки (Вопаег), наматьшвают катушку из нескольких «їз» витков (на фигуре представлень! только два витка, однако их может бьїіть много) и наконец снова прикрепляют к другой контактной площадке. После зтого полупроводниковую микросхему З с прикрепленной к ней о соответствующим изобретению образом катушкой 5 устанавливают в вьемке носителя 1 так, что катушка 5 -І 20 расположена на носителе 1. Носитель 1 может при зтом иметь длину и ширину готовой микросхемной карть! так, что микросхемная карта может бьть завершена путем нанесения соответствующих покрьтий носителя.
Т» Носитель 1 может однако также иметь и меньшие размерь, чем микросхемная карта так, что он может использоваться в качестве вставки (Іпіеє) в имеющей форму рамки средней части микросхемной карти. о

Claims (2)

  1. Формула винаходу о 1. Способ изготовления модуля микросхемной картьї, отличающийся тем, что присоединяют конец тонкой проволоки к первой контактной площадке полупроводниковой микросхемьі, укладьнвают проволоку посредством 60 термокомпрессионной сварочной головки в несколько витков, присоединяют проволоку ко второй контактной площадке полупроводниковой микросхемь, образующие антенную катушку витки проволоки (и полупроводниковую микросхему устанавливают на носителе.
  2. 2. Способ по пункту 1, отличающийся тем, что образующие антенную катушку витки проволоки располагают на носителе так, что полупроводниковая микросхема удерживаєтся в вьемке носителя в подвешенном бо состояниий термокомпрессионньіми соединениями концов проволоки.
UA97030971A 1994-09-05 1995-05-09 Спосіб виготовлення модуля мікросхемної карти для безконтактних мікросхемних карт UA54374C2 (uk)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4431605A DE4431605C2 (de) 1994-09-05 1994-09-05 Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
PCT/DE1995/001201 WO1996007984A1 (de) 1994-09-05 1995-09-05 Verfahren zur herstellung eines chipkartenmoduls für kontaktlose chipkarten

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UA54374C2 true UA54374C2 (uk) 2003-03-17

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Country Link
US (1) US5809633A (uk)
EP (1) EP0780006B1 (uk)
JP (1) JPH10505023A (uk)
KR (1) KR100358785B1 (uk)
CN (1) CN1105988C (uk)
AT (1) ATE173553T1 (uk)
DE (2) DE4431605C2 (uk)
ES (1) ES2125650T3 (uk)
FI (1) FI970924A7 (uk)
RU (1) RU2155379C2 (uk)
UA (1) UA54374C2 (uk)
WO (1) WO1996007984A1 (uk)

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