US20060019088A1 - Adhesive layer composition for in-mold decoration - Google Patents
Adhesive layer composition for in-mold decoration Download PDFInfo
- Publication number
- US20060019088A1 US20060019088A1 US11/176,566 US17656605A US2006019088A1 US 20060019088 A1 US20060019088 A1 US 20060019088A1 US 17656605 A US17656605 A US 17656605A US 2006019088 A1 US2006019088 A1 US 2006019088A1
- Authority
- US
- United States
- Prior art keywords
- adhesive layer
- particulate material
- adhesive
- inorganic particulate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000012790 adhesive layer Substances 0.000 title claims abstract description 75
- 239000000203 mixture Substances 0.000 title claims abstract description 32
- 238000005034 decoration Methods 0.000 title claims abstract description 25
- 239000011236 particulate material Substances 0.000 claims description 66
- 239000000853 adhesive Substances 0.000 claims description 48
- 230000001070 adhesive effect Effects 0.000 claims description 48
- 239000007787 solid Substances 0.000 claims description 35
- 239000011230 binding agent Substances 0.000 claims description 34
- 239000002245 particle Substances 0.000 claims description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 16
- 229920002635 polyurethane Polymers 0.000 claims description 15
- 239000004814 polyurethane Substances 0.000 claims description 15
- 239000004014 plasticizer Substances 0.000 claims description 14
- 229920001577 copolymer Polymers 0.000 claims description 11
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 8
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 8
- 239000006185 dispersion Substances 0.000 claims description 6
- 239000004816 latex Substances 0.000 claims description 6
- 229920000126 latex Polymers 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 229920006397 acrylic thermoplastic Polymers 0.000 claims description 5
- 239000011324 bead Substances 0.000 claims description 5
- 239000011258 core-shell material Substances 0.000 claims description 5
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004215 Carbon black (E152) Substances 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000000440 bentonite Substances 0.000 claims description 4
- 229910000278 bentonite Inorganic materials 0.000 claims description 4
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 4
- 239000004927 clay Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 150000002430 hydrocarbons Chemical class 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 239000002174 Styrene-butadiene Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229940117958 vinyl acetate Drugs 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 76
- 238000000576 coating method Methods 0.000 description 26
- 239000011248 coating agent Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 16
- 239000010408 film Substances 0.000 description 13
- 238000001746 injection moulding Methods 0.000 description 13
- 229920003023 plastic Polymers 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 8
- -1 Polyethylene terephthalate Polymers 0.000 description 8
- 238000007639 printing Methods 0.000 description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000004926 polymethyl methacrylate Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 238000013019 agitation Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 239000011146 organic particle Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229920001567 vinyl ester resin Polymers 0.000 description 3
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229920004890 Triton X-100 Polymers 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000002924 oxiranes Chemical class 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007725 thermal activation Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 238000010023 transfer printing Methods 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- CTLDMRCJDQGAQJ-UHFFFAOYSA-N (1,1-dimethoxy-2-phenylethyl)benzene Chemical compound C=1C=CC=CC=1C(OC)(OC)CC1=CC=CC=C1 CTLDMRCJDQGAQJ-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- SJJCQDRGABAVBB-UHFFFAOYSA-N 1-hydroxy-2-naphthoic acid Chemical compound C1=CC=CC2=C(O)C(C(=O)O)=CC=C21 SJJCQDRGABAVBB-UHFFFAOYSA-N 0.000 description 1
- JWSWULLEVAMIJK-UHFFFAOYSA-N 1-phenylmethoxynaphthalene Chemical compound C=1C=CC2=CC=CC=C2C=1OCC1=CC=CC=C1 JWSWULLEVAMIJK-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- XFDQLDNQZFOAFK-UHFFFAOYSA-N 2-benzoyloxyethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOC(=O)C1=CC=CC=C1 XFDQLDNQZFOAFK-UHFFFAOYSA-N 0.000 description 1
- XCSGHNKDXGYELG-UHFFFAOYSA-N 2-phenoxyethoxybenzene Chemical compound C=1C=CC=CC=1OCCOC1=CC=CC=C1 XCSGHNKDXGYELG-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- VOWAEIGWURALJQ-UHFFFAOYSA-N Dicyclohexyl phthalate Chemical compound C=1C=CC=C(C(=O)OC2CCCCC2)C=1C(=O)OC1CCCCC1 VOWAEIGWURALJQ-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- DJOWTWWHMWQATC-KYHIUUMWSA-N Karpoxanthin Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1(O)C(C)(C)CC(O)CC1(C)O)C=CC=C(/C)C=CC2=C(C)CC(O)CC2(C)C DJOWTWWHMWQATC-KYHIUUMWSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000013504 Triton X-100 Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- NLMFVJSIGDIJBB-UHFFFAOYSA-N bis(2,2,6,6-tetramethyl-1-octoxypiperidin-3-yl) decanedioate Chemical compound CC1(C)N(OCCCCCCCC)C(C)(C)CCC1OC(=O)CCCCCCCCC(=O)OC1C(C)(C)N(OCCCCCCCC)C(C)(C)CC1 NLMFVJSIGDIJBB-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- ULOZDEVJRTYKFE-UHFFFAOYSA-N diphenyl oxalate Chemical compound C=1C=CC=CC=1OC(=O)C(=O)OC1=CC=CC=C1 ULOZDEVJRTYKFE-UHFFFAOYSA-N 0.000 description 1
- DWNAQMUDCDVSLT-UHFFFAOYSA-N diphenyl phthalate Chemical compound C=1C=CC=C(C(=O)OC=2C=CC=CC=2)C=1C(=O)OC1=CC=CC=C1 DWNAQMUDCDVSLT-UHFFFAOYSA-N 0.000 description 1
- 238000012674 dispersion polymerization Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical class C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010107 reaction injection moulding Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000007651 thermal printing Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2715/00—Condition, form or state of preformed parts, e.g. inserts
- B29K2715/006—Glues or adhesives, e.g. hot melts or thermofusible adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/002—Coloured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31554—Next to second layer of polyamidoester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31562—Next to polyamide [nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31565—Next to polyester [polyethylene terephthalate, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31598—Next to silicon-containing [silicone, cement, etc.] layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/31736—Next to polyester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
- Y10T428/3175—Next to addition polymer from unsaturated monomer[s]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
- Y10T428/31797—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31801—Of wax or waxy material
Definitions
- This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration.
- In-mold decoration processes involve decorating objects as they are formed, in mold, of a heated plastic material being injected into a mold cavity.
- a tape or strip of a decorating or protective material is automatically or manually advanced, pre-fed and positioned in the mold cavity at each molding cycle, interfacing therein with the plastic material as it is filled into the mold cavity, under heat and pressure.
- the decorating material forms on the surface of the object and becomes an integral and permanent part of the object, through thermal transfer in the in-mold decoration process.
- Other molding processes such as thermal forming, blow molding and compression molding or stamping may also be used for the transfer of the decorating or protective material.
- the process may also be called in-mold labeling or in-mold coating, and the transferable protective material may be called a thermal transfer overcoat or durable coat layer.
- the decoration tape or strip usually comprises a carrier layer, a release layer, a durable layer, an adhesive or tie-coat layer and also a layer of decorative designs (metal or ink).
- the carrier layer and the release layer are removed, leaving the durable layer as the outmost layer.
- the durable layer serves as a protective layer with scratch resistance, mar or abrasion resistance and solvent resistance to protect the decorative designs and also the molded object.
- the adhesive layer is incorporated into the decoration tape or strip to provide optimum adhesion of the decoration tape or strip to the top surface of the molded object.
- the currently available decoration tape or strip has many disadvantages.
- the durable layer cannot be cleanly separated from the release layer, especially at the edges of the molded object.
- the residual durable layer at the edges has to be removed manually.
- fragments of the residual durable layer inevitably generate debris which not only causes contamination to the production environment but also reduces the production yield. This problem is even more pronounced when the molded object has a small hollow structure, such as a speaker and ear pieces of a cell phone cover.
- the problem is most likely caused by poor fracture characteristics of the decoration tape or strip and/or the inappropriate balance between the cohesion strength of the durable and adhesive layers and the adhesion strength at the interface between, such as the durable and release layers, the durable and ink layers, the durable and metal layers, the adhesive and metal layers, the durable and adhesive layers and/or the adhesive layer and the molding plastic material.
- the first aspect of the present invention is directed to an improved adhesive layer of a decoration tape or strip or a thermal transfer printing or coating layer.
- the improved adhesive layer is coated on a decorative layer or a functional coating and/or printing layer to facilitate the transfer of the decoration or functional coating and/or printing onto an object of interest by heat, pressure or a combination thereof.
- the transfer may be accomplished by a method such as injection molding, hot stamping, heat laminator or thermal head printing.
- the adhesive layer comprises an adhesive binder and a polymeric particulate material.
- the polymeric particulate material has a Tg (glass transition temperature) higher than about 45° C., preferably higher than about 55° C. and more preferably higher than about 65° C.
- the concentration of the polymeric particulate material is preferably in the range of about 5 to about 50% by weight, more preferably in the range of about 10 to about 40% by weight.
- the polymeric particulate material is dispersed in the adhesive binder and preferably remains in a dispersed state during the thermal transfer process.
- the polymeric particulate material is preferably of small particles having an average size of ⁇ about 1 um, more preferably ⁇ about 0.2 um and most preferably ⁇ about 0.15 um and is immiscible with the adhesive binder.
- two materials are “miscible” if they form a single phase or a material of a single Tg, after the two are thoroughly blended by heat, solvent or mechanical means.
- the second aspect of the present invention is directed to an adhesive layer of the present invention wherein said polymeric particulate material is refractive index matched to the adhesive binder.
- the difference between the refractive indexes of the two materials is preferably less than about 0.1, more preferably less than about 0.05.
- the third aspect of the present invention is directed to an adhesive layer of the present invention wherein said polymeric particulate material is core-shell particles having a high Tg shell that is at least partially miscible with the adhesive binder.
- the Tg of the shell is higher than about 45° C., preferably higher than about 55° C. and more preferably higher than about 65° C.
- the core is refractive index matched to the shell or the blend of the shell and the adhesive binder.
- the fourth aspect of the present invention is directed to an adhesive layer of the present invention further comprising about 1 to about 20% by weight, preferably about 3 to about 15% by weight, of an inorganic particulate material having an average particle size of less than about 0.2 um, preferably less than about 0.1 um and more preferably less than about 0.05 um.
- the fifth aspect of the present invention is directed to an adhesive layer of the present invention further comprising about 0.2 to about 5% by weight, preferably about 1 to about 3% by weight, of an organic or inorganic particulate material having an average particle size in the range of about 0.5 to about 6 um, preferably in the range of about 1 to about 3 um.
- the sixth aspect of the present invention is direct to an adhesive layer of the present invention comprising an adhesive binder, an organic or a first inorganic particulate material having an average particle size in the range of about 0.5 to about 6 um, preferably in the range of about 1 to about 3 um, and a second inorganic particulate material having an average particle size smaller than about 0.2 um, preferably smaller than about 0.1 um and more preferably smaller than about 0.05 um.
- the total concentration of the inorganic particulate material(s) is preferably about 5 to about 50% by weight, preferably about 10 to about 35% by weight.
- the adhesive layer may comprise an adhesive binder, a polymeric particulate material, a first inorganic particulate material having an average particle size of larger than about 0.5 to about 6 um, preferably larger than about 1 to about 3 um, and a second inorganic particulate material having an average particle size smaller than about 0.2 um, preferably smaller than about 0.1 urn and more preferably smaller than about 0.05 um.
- the concentration of the polymeric particulate material is preferably in the range of about 5 to about 50% by weight, more preferably in the range of about 10 to about 40% by weight.
- the polymeric particulate material is preferably small particles having an average size of ⁇ about 1 um, preferably ⁇ about 0.2 um and more preferably ⁇ about 0.15 um.
- the seventh aspect of the present invention is direct to an adhesive layer of the present invention further comprising a solid plasticizer having a melting point between about 65 to about 130° C., preferably between about 80 to about 115° C.
- the adhesive layer may comprise an adhesive binder, a polymeric particulate material and a solid plasticizer.
- the adhesive layer of the present invention provides desirable fracture properties and as a result, cracking at the edges of the object during the transfer process such as injection molding, may be initiated and propagated efficiently during the injection molding process and the subsequent mold-part separation process. This feature enables a clean separation of the decoration or functional layer from the carrier substrate at the edges of the object, particularly at the edges of a hollow structure.
- the adhesive layer of the present invention also provides high degree of transmission, high blocking resistance, high hardness and sufficient adhesion, even for complicated three-dimensional objects.
- FIG. 1 is a cross section view of an in-mold decoration tape or strip.
- FIG. 2 shows how the in-mold decoration tape or strip is fed into a mold cavity.
- FIG. 1 is a cross-section view of an in-mold decoration tape or strip ( 10 ) which comprises a carrier layer ( 15 ), a release layer ( 11 ), a durable layer ( 12 ), a decorative design layer ( 13 ), and an adhesive layer ( 14 ).
- the tape or strip ( 10 ) is fed into a mold cavity ( 16 ) automatically or manually with the carrier layer ( 15 ) in contact with the mold surface as shown in FIG. 2 .
- the tape or strip may be thermally formed to a desirable shape before the feeding step.
- the carrier ( 15 ), release ( 11 ) and durable ( 12 ) layers may be formed by methods known in the art and all of the previously known carrier, release and durable layers may be incorporated into the present invention.
- the carrier layer ( 15 ) usually is a thin plastic film with a thickness from about 3.5 to about 100 microns, preferably about 10 to about 50 microns.
- PET polyethylene terephthalate
- PEN polyethylene naphthate
- PC polycarbonate
- the release layer ( 11 ) allows the in-mold decoration tape or strip to be released from the carrier layer in a manner that minimizes damage to the durable layer ( 12 ) and the decorative layer ( 13 ) and also enables a fully automated roll transfer process during molding.
- the release layer usually is a low surface tension coating prepared from a material such as wax, paraffin or silicone or a highly smooth and impermeable coating prepared from a material selected from the group consisting of melamine formaldehyde, metal thin film such as Al or Sn, crosslinked polyacrylates, silicone acrylates, epoxides, vinyl esters, vinyl ethers, allyls and vinyls, unsaturated polyesters or blends thereof.
- the release layer may comprise a condensation polymer, copolymer, blend or composite selected from the group consisting of epoxy, polyurethane, polyimide, polyamide, melamine formaldehyde, urea formaldehyde, phenol formaldehyde and the like.
- release layer as disclosed in U.S. Ser. No. 60/564,018 filed on Apr. 20, 2004, the content of which is incorporated herein by reference in its entirety, is also suitable.
- a release layer composition comprises an amine-aldehyde condensate and a radical inhibitor or quencher.
- the durable layer ( 12 ) serves as a protective layer for the decorative layer.
- Suitable raw materials for the durable coating may include, but are not limited to, radiation curable multifunctional acrylates including epoxy acrylates, polyurethane acrylates, polyester acrylates, silicone acrylates, glycidyl acrylates, epoxides, vinyl esters, diallyl phthalate, vinyl ethers and blends thereof.
- the durable layer may comprise a condensation polymer or copolymer, such as epoxy, polyurethane, polyamide, polyimide, melamine formaldehyde, urea formaldehyde or phenol formaldehyde.
- the durable layer may also comprise a sol-gel silicate or titanium ester.
- the durable layer may be partially or fully cured. If partially cured, a post curing step will be employed after the molding and/or transferring step to enhance the durability, particularly hardness, scratch and oil resistance.
- the raw material is preferably not permeable into the release layer.
- the durable layer is coated and cured or partially cured, it should be marginally compatible or incompatible with the release layer.
- Binders and additives such as thickeners, surfactants, dispersants, UV stabilizers or antioxidants, may be used to control the rheology, wettability, coating properties, weatherability and aging properties.
- Fillers such as silica, Al 2 O 3 , TiO 2 , CaCO 3 , microcrystalline wax or polyethylene, Teflon or other lubricating particles may also be added to improve, for example, scratch resistance and hardness of the durable layer.
- the durable layer is usually about 2 to about 20 microns, preferably about 3 to about 8 microns in thickness.
- the decorative layer ( 13 ) may be a metallic layer or an ink layer formed from a method such as vapor deposition or sputtering, optionally followed by a patterning process.
- the ink pattern may be formed by a printing process such as gravure, flexo, screen, sublimation heat transfer or the like on a substrate layer.
- the substrate layer may be a plastic layer or an insulator-coated metal or metal oxide foil formed from carbon steel, stainless steel, Al, Sn, Ni, Cu, Zn, Mg or an alloy or oxide thereof.
- the decorative designs may also be pre-shaped by thermoforming.
- the carrier layer ( 15 ) becomes part of the molded object.
- the decorative layer having raised or recessed patterns is typically in the range of about 0.2 to about 1 mm, preferably in the range of about 0.3 to about 0.7 mm, in thickness. It is usually thermoformed from an ABS (acrylonitril-butadiene-styrene), polycarbonate, acrylics, polystyrene or PVC sheet in a mold.
- the decorative layer may be also pre-shaped by high pressure forming involving the use of high-pressure air to create decorative designs on a film.
- the decorative layer may also be formed by hydroforming in which a hydrostatic bladder, rather than air, serves as the forming mechanism.
- the adhesive layer ( 14 ) disclosed herein constitutes the present invention.
- the adhesive layer comprises an adhesive binder and a polymeric particulate material.
- suitable adhesive binders may include, but are not limited to, polyurethane, acrylics, SBR (styrene-butadiene rubber), polybutadiene, polyamides, pyrrolidone copolymers, oxazolidone copolymers, vinylidene chloride copolymers, vinylacetate copolymers such as EVA (ethylene-vinylacetate or vinyl alcohol copolymers), polyesters and derivatives or blends thereof, with polyurethane, acrylics or hybrids thereof as preferred.
- Latex adhesive binders or hydrocarbon dispersion adhesives are more preferred since they generally provide a wider process window for coating onto the durable layer of a decoration tape or strip or thermal transfer coating.
- the adhesive binder is formed from a film forming polyurethane latex.
- a fugitive coalescing solvent such as toluene, xylene, ethyl acetate, butyl acetate, methyl ethyl ketone, acetone or N-methyl pyrrolidone, may be added.
- the melt flow temperature or the thermal activation temperature of the adhesive binder which is the continuous phase of the adhesive layer is preferably lower than the injection molding temperature or the transfer printing temperature.
- the thermal activation temperature is lower than about 200° C., preferably lower than about 170° C. and more preferably lower than about 140° C.
- the adhesive binder may take up about 40% to about 90%, preferably about 50% to about 85% and more preferably about 60% to about 75% by weight, of the adhesive layer.
- the polymeric particulate material preferably has a Tg (glass transition temperature) higher than about 45° C., preferably higher than about 55° C. and more preferably higher than about 65° C.
- Tg glass transition temperature
- the polymeric particulate material is dispersed in the adhesive binder and preferably remains in a dispersed state during the thermal transfer process.
- the average particle size of the polymeric particulate material is preferably less than about 1 um, more preferably less than about 0.2 um and most preferably less than about 0.15 um.
- the polymeric particulate material may be a dispersion or latex prepared by emulsion polymerization, dispersion polymerization, direct or inverse emulsification, followed by chain extension or interfacial polymerization from a monomer such as acrylates, methacrylates, styrenes or other vinyl monomers, multifunctional isocyanates and polyols, multifunctional acid chlorides or anhydrides and polyamines or polyols, and the like.
- the concentration of the polymeric particulate material is preferably in the range of about 5 to about 50% by weight, more preferably in the range of about 10 to about 40% by weight.
- the adhesive layer comprises a polymeric particulate material that is refractive index matched to the adhesive binder.
- the difference between the refractive indexes of the two materials is preferably less than about 0.1, more preferably less than about 0.05.
- a further aspect of the invention is directed to an adhesive layer wherein said
- polymeric particulate material is core-shell particles.
- Each of the core-shell particles has a shell which is at least partially miscible with the adhesive binder.
- the Tg of the shell is higher than about 45° C., preferably higher than about 55° C. and more preferably higher than about 65° C.
- the core is refractive index matched to the shell or the blend of the shell and the adhesive binder.
- the core-shell particles may be prepared by, for example, emulsion polymerization with step-wise addition of monomers.
- the adhesive layer may further comprise an inorganic particulate material.
- the inorganic particulate material may be CaCO 3 , BaSO 4 , silica, glass beads, bentonite, clay or the like.
- the adhesive layer may further comprise about 1 to about 20% by weight, preferably about 3 to about 15% by weight, of an inorganic particulate material.
- the inorganic particulate material may have an average particle size of less than about 0.2 um, preferably less than about 0.1 um and more preferably less than about 0.05 um.
- Another aspect of the present invention is directed to an adhesive layer of the present invention further comprising about 0.2 to about 5% by weight, preferably about 1 to about 3% by weight, of an organic or inorganic particulate material.
- the -organic or inorganic particulate material may have an average particle size in the range of about 0.5 to about 6 um, preferably in the range of about 1 to about 3 um.
- a further aspect of the present invention is direct to an adhesive layer of the present invention comprising an adhesive binder, an organic or a first inorganic particulate material having an average particle size in the range of about 0.5 to about 6 um, preferably in the range of about 1 to about 3 um, and a second inorganic particulate material having an average particle size smaller than about 0.2 um, preferably smaller than about 0.1 um and more preferably smaller than about 0.05 um.
- the total concentration of the inorganic particulate material(s) is preferably about 5 to about 50% by weight, preferably about 10 to about 35% by weight.
- the organic particulate material may be a latex material, organic crystals or a solid plasticizer as described below.
- the adhesive layer may comprise an adhesive binder, a polymeric particulate material, a first inorganic particulate material having an average particle size of larger than about 0.5 to about 6 um, preferably larger than about 1 to about 3 um, and a second inorganic particulate material having an average particle size smaller than about 0.2 um, preferably smaller than about 0.1 um and more preferably smaller than about 0.05 um.
- the total concentration of the inorganic particulate materials is preferably about 5 to about 50% by weight, preferably about 10 to about 35% by weight.
- the concentration of the polymeric particulate material is preferably in the range of about 5 to about 50% by weight, more preferably in the range of about 10 to about 40% by weight.
- the polymeric particulate material is preferably small particles having an average size of ⁇ about 1 um, preferably ⁇ about 0.2 um and more preferably ⁇ about 0.15 um.
- the adhesive layer may comprise a solid plasticizer having a melting temperature between about 65° C. to about 130° C., preferably between about 80° C. to about 115° C.
- solid plasticizers may include, but are not limited to, BHT (2,6-di-t-butyl-4-methylphenol), thiodiethylene hydrocinnamate (IRGANOXTM 1035 from Ciba-Geigy Corp.), tetrakis hindered phenol such as IRGANOXTM 1010 from Ciba Geigy Corp., dicyclohexyl phthalate, diphenyl phthalate, ethylene glycol dibenzoate, 2,2′-dihydroxy-4-methoxybenzophenone, 2,2′-dihydroxy-4-methoxybenzophenone, diphenyl oxalate, benzyl oxynaphthalene, 1-hydroxy-2-naphthoate, rosin and m-terphen
- the solid plasticizer may have an average particle size between about 0.05 microns to about 5 microns, preferably between 0.1 microns to about 3 microns.
- the solid plasticizer may take up between about 1% to about 10%, preferably about 2% to about 8% by weight, of the adhesive layer composition.
- the components of the adhesive layer may be dispersed in a suitable carrier solvent or solvent mixture that does not attack the underlying layers during coating and drying.
- a suitable carrier solvent or solvent mixture that does not attack the underlying layers during coating and drying.
- Water and hydrocarbon solvents are the preferred carriers for the adhesive composition, with water as the most preferred.
- the release layer ( 11 ), the durable layer ( 12 ), the decorative design layer ( 13 ) and the adhesive layer ( 14 ) of the present invention are sequentially coated or laminated onto the carrier layer ( 15 ).
- the lamination or coating may be accomplished by a coating method such as slot coating, doctor blade coating, gravure coating, roll coating, comma coating, lip coating, vacuum deposition, sputtering or the like or a printing method such as gravure printing, screen printing, flexo printing, lithographic printing, driographic printing or the like.
- the durable layer and release layer may be thermal cured during the drying of the durable layer coating step, optionally with a post cure step after the coating.
- the thermal cure can be carried out at about 50° C. to about 120° C. for various lengths of time, for example, tenths of minute to hours, depending on the curing conditions and the composition.
- the decoration or functional film may be further UV cured after the injection molding process when it has been transferred to the surface of the molded object.
- the molded object is placed on a UV conveyor that is running at, for example, 0.6 ft/min to 10 ft/min.
- the UV curing energy needed is usually in the range of from about 0.1 to about 5 J/cm 2 , preferably about 0.3 to about 1.2 J/cm 2 .
- the adhesive layer of the present invention provides desirable fracture properties and as a result, cracking at the edges of the object during the transfer process, such as injection molding, may be initiated and propagated efficiently during the injection molding process and the subsequent mold-part separation process. This feature enables a clean separation of the decoration or functional layer from the carrier substrate at the edges of the object, particularly at the edges of a hollow structure.
- the adhesive layer of the present invention also provides high degree of transmission, high blocking resistance, high hardness and sufficient adhesion, even for complicated three-dimensional objects.
- the adhesive layer of the present invention is suitable for all in-mold decoration processes for the manufacture of a plastic object.
- the material suitable for the object may include, but are not limited to, thermoplastic materials such as polystyrene, polyvinyl chloride, acrylics, polysulfone, polyarylester, polypropylene oxide, polyolefins, acrylonitrile-butadiene-styrene copolymers (ABS), methacrylate-acrylonitrile-butadiene-styrene copolymers (MABS), polycarbonate, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyurethanes and other thermoplastic elastomers or blends thereof, and thermoset materials such as reaction injection molding grade polyurethanes, epoxy resin, unsaturated polyesters, vinylesters or composites, prepregs and blends thereof.
- thermoplastic materials such as polystyrene, polyvinyl chloride, acrylics, poly
- the object may be a plastic cover of a cell phone or pager.
- the adhesive layer is useful for any plastic objects manufactured from an in-mold decoration process, such as personal accessories, toys or educational devices, plastic cover of a personal digital assistant or e-book, credit or smart cards, identification or business cards, face of an album, watch, clock, radio or camera, dashboard in an automobile, household items, laptop computer housings and carrying cases or front control panels of any consumer electronic equipments. This is clearly not exhaustive. Other suitable plastic objects would be clear to a person skilled in the art and therefore they are all encompassed within the scope of the present invention.
- the adhesive layer of the present invention is also useful in applications such as the thermal transfer protective coating for thermal printing, inkjet printing and passport and other identification applications.
- a release fluid was prepared first by mixing 2.10 gm of MF370 (methylated melamine resin, Cytec Industries) with 1.41 gm of ethylene glycol dimethyl ether (Aldrich) and 0.63 gm of DI water using a magnetic stirrer, after which 0.6 gm of 2,2′-dihydroxy-4-methoxybenzophenone (Aldrich), 0.06 gm of Silwet L7230/SL7607 (3/1 weight ratio, from Osi Specialties, Inc.) and 0.2 gm of Cycat 4040 (p-toluene sulfonic acid, from Cytec Industry) were added with agitation to ensure a homogeneous solution.
- MF370 methylated melamine resin, Cytec Industries
- This release fluid was then coated on a 1.5 mil PET film (PT1 from Mitsubishi Interfilm Holding, Inc., Easley, S.C.) with a #6.5 rod and a target dry coating thickness of 1.5 um. The coating was then placed in a 120° C. oven for 5 minutes to form a release coating.
- PT1 Mitsubishi Interfilm Holding, Inc., Easley, S.C.
- a durable layer composition consisting of 7.67 gm (15% in MEK) of CAB-553-0.4 (cellulose acetate butyrate, from Eastman Chemical Co.), 2.94 gm (50% in MEK) of Ebecryl 1290 (aliphatic polyurethane acrylate, UCB Chemicals), 1.2 gm (30% in MEK) of MEK-ST (a silica dispersion from Nissan Chemicals), 0.40 gm of (25% in MEK) 1:1 w % ratio of triethanolamine and poly-Q (aminated tetrol from Arch Chemicals, Norwalk, Conn.), 0.43 gm of a photoinitiator (PI) solution containing 1.5% of BMS (4-(p-tolylthio)benzophenone, Aldrich, Milwaukee, Wis.), 0.8% of Irgacure 651 (2,2-dimethoxy-1,2-diphenylethane, Ciba Speciality Chemicals, Tarrytown, N.Y.), 0.15% of ITX (
- the pH of each of the materials used was adjusted to 7.5 with either a diluted ammonia solution or a diluted sulfuric acid solution.
- the adhesive composition was then prepared by mixing 6.947 gm of S-2725 (water borne polyurethane) of a 40% solid content (from Neveon), 8.154 gm of AquaPress ME of a 39% solid content (from Proell Inc) and.9.611 gm of DI water together.
- the adhesive composition was then coated onto the durable layer prepared above with a #11 wired rod and dried in an 80° C. oven for 10 minutes.
- the adhesive coating thickness was targeted at ⁇ 3 um.
- the film sample was then tested using a direct injection molding method with PMMA resin ZKM (from CYRO Industries) at 480° F.
- An additional 0.184 gm, 0.209 gm and 0.516 gm of water were added into Formulations of Example 3, Example 4 and Example 5, respectively, to make up a total solid content of 20%.
- the adhesive solution was then coated on the durable layer prepared in Example 1 with a #11 wired rod and dried in an 80° C. oven for 10 minutes. The adhesive coating thickness was targeted at ⁇ 3 um.
- the film samples were then tested using a direct injection molding method with PMMA resin ZKM (from CYRO Industries) at 480° F.
- PMMA resin ZKM from CYRO Industries
- Socal S31 (CaCO 3 ) was ground to an average particle size of 0.3 um using Zrconium beads, Triton X-100 (Aldrich) and Tamol 731A (from Rohm Haas) at 12° C.
- the grinding temperature was 4° C. and grinding time was 14 hours.
- the particle size under microscope was about 1 to 2 um and the solution pH was 8.4.
- NeoCryl A-550 water borne acrylic resin
- NeoResins a 9.57% solid content
- the film sample was then tested using a direct injection molding method with PMMA resin ZKM (from CYRO Industries) at 480° F.
- PMMA resin ZKM from CYRO Industries
- the film sample was then tested using a direct injection molding method with PMMA resin ZKM (from CYRO Industries) at 480° F.
- PMMA resin ZKM from CYRO Industries
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration.
Description
- This application claims the priorities under 35 USC 119(e) of U.S. Provisional Application No. 60/589,708 filed on Jul. 20, 2004. The whole content of the priority application is incorporated herein by reference in its entirety.
- This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration.
- In-mold decoration processes involve decorating objects as they are formed, in mold, of a heated plastic material being injected into a mold cavity. Usually a tape or strip of a decorating or protective material is automatically or manually advanced, pre-fed and positioned in the mold cavity at each molding cycle, interfacing therein with the plastic material as it is filled into the mold cavity, under heat and pressure. As the object is formed, the decorating material forms on the surface of the object and becomes an integral and permanent part of the object, through thermal transfer in the in-mold decoration process. Other molding processes such as thermal forming, blow molding and compression molding or stamping may also be used for the transfer of the decorating or protective material. Sometimes the process may also be called in-mold labeling or in-mold coating, and the transferable protective material may be called a thermal transfer overcoat or durable coat layer.
- The decoration tape or strip usually comprises a carrier layer, a release layer, a durable layer, an adhesive or tie-coat layer and also a layer of decorative designs (metal or ink). After the injection molding transfer, the carrier layer and the release layer are removed, leaving the durable layer as the outmost layer. The durable layer serves as a protective layer with scratch resistance, mar or abrasion resistance and solvent resistance to protect the decorative designs and also the molded object. The adhesive layer is incorporated into the decoration tape or strip to provide optimum adhesion of the decoration tape or strip to the top surface of the molded object.
- However, the currently available decoration tape or strip has many disadvantages. For example, when the carrier and release layers are removed, the durable layer cannot be cleanly separated from the release layer, especially at the edges of the molded object. The residual durable layer at the edges has to be removed manually. As a result, fragments of the residual durable layer inevitably generate debris which not only causes contamination to the production environment but also reduces the production yield. This problem is even more pronounced when the molded object has a small hollow structure, such as a speaker and ear pieces of a cell phone cover.
- The problem is most likely caused by poor fracture characteristics of the decoration tape or strip and/or the inappropriate balance between the cohesion strength of the durable and adhesive layers and the adhesion strength at the interface between, such as the durable and release layers, the durable and ink layers, the durable and metal layers, the adhesive and metal layers, the durable and adhesive layers and/or the adhesive layer and the molding plastic material.
- The first aspect of the present invention is directed to an improved adhesive layer of a decoration tape or strip or a thermal transfer printing or coating layer. The improved adhesive layer is coated on a decorative layer or a functional coating and/or printing layer to facilitate the transfer of the decoration or functional coating and/or printing onto an object of interest by heat, pressure or a combination thereof. The transfer may be accomplished by a method such as injection molding, hot stamping, heat laminator or thermal head printing.
- The adhesive layer comprises an adhesive binder and a polymeric particulate material. The polymeric particulate material has a Tg (glass transition temperature) higher than about 45° C., preferably higher than about 55° C. and more preferably higher than about 65° C. The concentration of the polymeric particulate material is preferably in the range of about 5 to about 50% by weight, more preferably in the range of about 10 to about 40% by weight. The polymeric particulate material is dispersed in the adhesive binder and preferably remains in a dispersed state during the thermal transfer process.
- The polymeric particulate material is preferably of small particles having an average size of < about 1 um, more preferably < about 0.2 um and most preferably < about 0.15 um and is immiscible with the adhesive binder.
- In the context of the present invention, two materials are “miscible” if they form a single phase or a material of a single Tg, after the two are thoroughly blended by heat, solvent or mechanical means.
- The second aspect of the present invention is directed to an adhesive layer of the present invention wherein said polymeric particulate material is refractive index matched to the adhesive binder. The difference between the refractive indexes of the two materials is preferably less than about 0.1, more preferably less than about 0.05.
- The third aspect of the present invention is directed to an adhesive layer of the present invention wherein said polymeric particulate material is core-shell particles having a high Tg shell that is at least partially miscible with the adhesive binder. The Tg of the shell is higher than about 45° C., preferably higher than about 55° C. and more preferably higher than about 65° C. Preferably the core is refractive index matched to the shell or the blend of the shell and the adhesive binder.
- The fourth aspect of the present invention is directed to an adhesive layer of the present invention further comprising about 1 to about 20% by weight, preferably about 3 to about 15% by weight, of an inorganic particulate material having an average particle size of less than about 0.2 um, preferably less than about 0.1 um and more preferably less than about 0.05 um.
- The fifth aspect of the present invention is directed to an adhesive layer of the present invention further comprising about 0.2 to about 5% by weight, preferably about 1 to about 3% by weight, of an organic or inorganic particulate material having an average particle size in the range of about 0.5 to about 6 um, preferably in the range of about 1 to about 3 um.
- The sixth aspect of the present invention is direct to an adhesive layer of the present invention comprising an adhesive binder, an organic or a first inorganic particulate material having an average particle size in the range of about 0.5 to about 6 um, preferably in the range of about 1 to about 3 um, and a second inorganic particulate material having an average particle size smaller than about 0.2 um, preferably smaller than about 0.1 um and more preferably smaller than about 0.05 um. The total concentration of the inorganic particulate material(s) is preferably about 5 to about 50% by weight, preferably about 10 to about 35% by weight.
- In one embodiment of this aspect of the invention, the adhesive layer may comprise an adhesive binder, a polymeric particulate material, a first inorganic particulate material having an average particle size of larger than about 0.5 to about 6 um, preferably larger than about 1 to about 3 um, and a second inorganic particulate material having an average particle size smaller than about 0.2 um, preferably smaller than about 0.1 urn and more preferably smaller than about 0.05 um. The concentration of the polymeric particulate material is preferably in the range of about 5 to about 50% by weight, more preferably in the range of about 10 to about 40% by weight. The polymeric particulate material is preferably small particles having an average size of < about 1 um, preferably < about 0.2 um and more preferably < about 0.15 um.
- The seventh aspect of the present invention is direct to an adhesive layer of the present invention further comprising a solid plasticizer having a melting point between about 65 to about 130° C., preferably between about 80 to about 115° C. For example, the adhesive layer may comprise an adhesive binder, a polymeric particulate material and a solid plasticizer.
- The adhesive layer of the present invention provides desirable fracture properties and as a result, cracking at the edges of the object during the transfer process such as injection molding, may be initiated and propagated efficiently during the injection molding process and the subsequent mold-part separation process. This feature enables a clean separation of the decoration or functional layer from the carrier substrate at the edges of the object, particularly at the edges of a hollow structure.
- In addition, the adhesive layer of the present invention also provides high degree of transmission, high blocking resistance, high hardness and sufficient adhesion, even for complicated three-dimensional objects.
-
FIG. 1 is a cross section view of an in-mold decoration tape or strip. -
FIG. 2 shows how the in-mold decoration tape or strip is fed into a mold cavity. -
FIG. 1 is a cross-section view of an in-mold decoration tape or strip (10) which comprises a carrier layer (15), a release layer (11), a durable layer (12), a decorative design layer (13), and an adhesive layer (14). - In an in-mold decoration process, the tape or strip (10) is fed into a mold cavity (16) automatically or manually with the carrier layer (15) in contact with the mold surface as shown in
FIG. 2 . The tape or strip may be thermally formed to a desirable shape before the feeding step. - The carrier (15), release (11) and durable (12) layers may be formed by methods known in the art and all of the previously known carrier, release and durable layers may be incorporated into the present invention.
- For example, the carrier layer (15) usually is a thin plastic film with a thickness from about 3.5 to about 100 microns, preferably about 10 to about 50 microns. Polyethylene terephthalate (PET), polyethylene naphthate (PEN) or polycarbonate (PC) film is particularly preferred because of their low cost, high transparency and thermomechanical stability.
- The release layer (11) allows the in-mold decoration tape or strip to be released from the carrier layer in a manner that minimizes damage to the durable layer (12) and the decorative layer (13) and also enables a fully automated roll transfer process during molding. The release layer usually is a low surface tension coating prepared from a material such as wax, paraffin or silicone or a highly smooth and impermeable coating prepared from a material selected from the group consisting of melamine formaldehyde, metal thin film such as Al or Sn, crosslinked polyacrylates, silicone acrylates, epoxides, vinyl esters, vinyl ethers, allyls and vinyls, unsaturated polyesters or blends thereof. The release layer may comprise a condensation polymer, copolymer, blend or composite selected from the group consisting of epoxy, polyurethane, polyimide, polyamide, melamine formaldehyde, urea formaldehyde, phenol formaldehyde and the like.
- The release layer as disclosed in U.S. Ser. No. 60/564,018 filed on Apr. 20, 2004, the content of which is incorporated herein by reference in its entirety, is also suitable. Such a release layer composition comprises an amine-aldehyde condensate and a radical inhibitor or quencher.
- The durable layer (12) serves as a protective layer for the decorative layer. Suitable raw materials for the durable coating may include, but are not limited to, radiation curable multifunctional acrylates including epoxy acrylates, polyurethane acrylates, polyester acrylates, silicone acrylates, glycidyl acrylates, epoxides, vinyl esters, diallyl phthalate, vinyl ethers and blends thereof. The durable layer may comprise a condensation polymer or copolymer, such as epoxy, polyurethane, polyamide, polyimide, melamine formaldehyde, urea formaldehyde or phenol formaldehyde. The durable layer may also comprise a sol-gel silicate or titanium ester.
- The durable layer may be partially or fully cured. If partially cured, a post curing step will be employed after the molding and/or transferring step to enhance the durability, particularly hardness, scratch and oil resistance.
- To improve the release properties, the raw material, particularly the low molecular weight components of the durable layer, is preferably not permeable into the release layer. After the durable layer is coated and cured or partially cured, it should be marginally compatible or incompatible with the release layer. Binders and additives, such as thickeners, surfactants, dispersants, UV stabilizers or antioxidants, may be used to control the rheology, wettability, coating properties, weatherability and aging properties. Fillers such as silica, Al2O3, TiO2, CaCO3, microcrystalline wax or polyethylene, Teflon or other lubricating particles may also be added to improve, for example, scratch resistance and hardness of the durable layer.
- The durable layers as disclosed in U.S. Ser. No. 60/532,003 filed on Dec. 22, 2003, U.S. Ser. No. 60/563,997 filed on Apr. 20, 2004 and U.S. Ser. No. 60/541,797 filed on Feb. 3, 2004, the contents of all of which are incorporated herein by reference in their entirety, are also suitable.
- The durable layer is usually about 2 to about 20 microns, preferably about 3 to about 8 microns in thickness.
- The decorative layer (13) may be a metallic layer or an ink layer formed from a method such as vapor deposition or sputtering, optionally followed by a patterning process. The ink pattern may be formed by a printing process such as gravure, flexo, screen, sublimation heat transfer or the like on a substrate layer. The substrate layer may be a plastic layer or an insulator-coated metal or metal oxide foil formed from carbon steel, stainless steel, Al, Sn, Ni, Cu, Zn, Mg or an alloy or oxide thereof.
- The decorative designs may also be pre-shaped by thermoforming. In this case, the carrier layer (15) becomes part of the molded object. The decorative layer having raised or recessed patterns is typically in the range of about 0.2 to about 1 mm, preferably in the range of about 0.3 to about 0.7 mm, in thickness. It is usually thermoformed from an ABS (acrylonitril-butadiene-styrene), polycarbonate, acrylics, polystyrene or PVC sheet in a mold.
- Alternatively, the decorative layer may be also pre-shaped by high pressure forming involving the use of high-pressure air to create decorative designs on a film. The decorative layer may also be formed by hydroforming in which a hydrostatic bladder, rather than air, serves as the forming mechanism.
- The adhesive layer (14) disclosed herein constitutes the present invention. The adhesive layer comprises an adhesive binder and a polymeric particulate material.
- In the context of the present invention, suitable adhesive binders may include, but are not limited to, polyurethane, acrylics, SBR (styrene-butadiene rubber), polybutadiene, polyamides, pyrrolidone copolymers, oxazolidone copolymers, vinylidene chloride copolymers, vinylacetate copolymers such as EVA (ethylene-vinylacetate or vinyl alcohol copolymers), polyesters and derivatives or blends thereof, with polyurethane, acrylics or hybrids thereof as preferred. Latex adhesive binders or hydrocarbon dispersion adhesives are more preferred since they generally provide a wider process window for coating onto the durable layer of a decoration tape or strip or thermal transfer coating.
- In one embodiment, the adhesive binder is formed from a film forming polyurethane latex. To facilitate the film formation of the adhesive binder, a fugitive coalescing solvent, such as toluene, xylene, ethyl acetate, butyl acetate, methyl ethyl ketone, acetone or N-methyl pyrrolidone, may be added.
- The melt flow temperature or the thermal activation temperature of the adhesive binder which is the continuous phase of the adhesive layer is preferably lower than the injection molding temperature or the transfer printing temperature. Preferably the thermal activation temperature is lower than about 200° C., preferably lower than about 170° C. and more preferably lower than about 140° C.
- The adhesive binder may take up about 40% to about 90%, preferably about 50% to about 85% and more preferably about 60% to about 75% by weight, of the adhesive layer.
- The polymeric particulate material preferably has a Tg (glass transition temperature) higher than about 45° C., preferably higher than about 55° C. and more preferably higher than about 65° C. The polymeric particulate material is dispersed in the adhesive binder and preferably remains in a dispersed state during the thermal transfer process.
- The average particle size of the polymeric particulate material is preferably less than about 1 um, more preferably less than about 0.2 um and most preferably less than about 0.15 um.
- In the context of the present invention, the polymeric particulate material may be a dispersion or latex prepared by emulsion polymerization, dispersion polymerization, direct or inverse emulsification, followed by chain extension or interfacial polymerization from a monomer such as acrylates, methacrylates, styrenes or other vinyl monomers, multifunctional isocyanates and polyols, multifunctional acid chlorides or anhydrides and polyamines or polyols, and the like.
- The concentration of the polymeric particulate material is preferably in the range of about 5 to about 50% by weight, more preferably in the range of about 10 to about 40% by weight.
- In another aspect of the present invention, the adhesive layer comprises a polymeric particulate material that is refractive index matched to the adhesive binder. The difference between the refractive indexes of the two materials is preferably less than about 0.1, more preferably less than about 0.05.
- A further aspect of the invention is directed to an adhesive layer wherein said
- polymeric particulate material is core-shell particles. Each of the core-shell particles has a shell which is at least partially miscible with the adhesive binder. In one embodiment, the Tg of the shell is higher than about 45° C., preferably higher than about 55° C. and more preferably higher than about 65° C. Preferably the core is refractive index matched to the shell or the blend of the shell and the adhesive binder.
- The core-shell particles may be prepared by, for example, emulsion polymerization with step-wise addition of monomers.
- In addition to the adhesive binder and the polymeric particulate material, the adhesive layer may further comprise an inorganic particulate material. In the context of the present invention, the inorganic particulate material may be CaCO3, BaSO4, silica, glass beads, bentonite, clay or the like.
- In another aspect of the present invention, the adhesive layer may further comprise about 1 to about 20% by weight, preferably about 3 to about 15% by weight, of an inorganic particulate material. The inorganic particulate material may have an average particle size of less than about 0.2 um, preferably less than about 0.1 um and more preferably less than about 0.05 um.
- Another aspect of the present invention is directed to an adhesive layer of the present invention further comprising about 0.2 to about 5% by weight, preferably about 1 to about 3% by weight, of an organic or inorganic particulate material. The -organic or inorganic particulate material may have an average particle size in the range of about 0.5 to about 6 um, preferably in the range of about 1 to about 3 um.
- A further aspect of the present invention is direct to an adhesive layer of the present invention comprising an adhesive binder, an organic or a first inorganic particulate material having an average particle size in the range of about 0.5 to about 6 um, preferably in the range of about 1 to about 3 um, and a second inorganic particulate material having an average particle size smaller than about 0.2 um, preferably smaller than about 0.1 um and more preferably smaller than about 0.05 um. The total concentration of the inorganic particulate material(s) is preferably about 5 to about 50% by weight, preferably about 10 to about 35% by weight.
- In the context of the present invention, the organic particulate material may be a latex material, organic crystals or a solid plasticizer as described below.
- In one embodiment of this aspect of the invention, the adhesive layer may comprise an adhesive binder, a polymeric particulate material, a first inorganic particulate material having an average particle size of larger than about 0.5 to about 6 um, preferably larger than about 1 to about 3 um, and a second inorganic particulate material having an average particle size smaller than about 0.2 um, preferably smaller than about 0.1 um and more preferably smaller than about 0.05 um. The total concentration of the inorganic particulate materials is preferably about 5 to about 50% by weight, preferably about 10 to about 35% by weight. The concentration of the polymeric particulate material is preferably in the range of about 5 to about 50% by weight, more preferably in the range of about 10 to about 40% by weight. The polymeric particulate material is preferably small particles having an average size of < about 1 um, preferably < about 0.2 um and more preferably < about 0.15 um.
- In another aspect of the present invention, the adhesive layer may comprise a solid plasticizer having a melting temperature between about 65° C. to about 130° C., preferably between about 80° C. to about 115° C. Examples of such solid plasticizers may include, but are not limited to, BHT (2,6-di-t-butyl-4-methylphenol), thiodiethylene hydrocinnamate (IRGANOX™ 1035 from Ciba-Geigy Corp.), tetrakis hindered phenol such as IRGANOX™ 1010 from Ciba Geigy Corp., dicyclohexyl phthalate, diphenyl phthalate, ethylene glycol dibenzoate, 2,2′-dihydroxy-4-methoxybenzophenone, 2,2′-dihydroxy-4-methoxybenzophenone, diphenyl oxalate, benzyl oxynaphthalene, 1-hydroxy-2-naphthoate, rosin and m-terphenyl derivatives, as well as many of the heat meltable crystalline compounds disclosed in U.S. Pat. No. 4,885,271, the content of which is incorporated herein by reference in its entirety.
- The solid plasticizer may have an average particle size between about 0.05 microns to about 5 microns, preferably between 0.1 microns to about 3 microns. The solid plasticizer may take up between about 1% to about 10%, preferably about 2% to about 8% by weight, of the adhesive layer composition.
- The components of the adhesive layer may be dispersed in a suitable carrier solvent or solvent mixture that does not attack the underlying layers during coating and drying. Water and hydrocarbon solvents (such as naphtha and toluene, etc.) are the preferred carriers for the adhesive composition, with water as the most preferred.
- In the formation of the in-mold decorative tape or strip (10), the release layer (11), the durable layer (12), the decorative design layer (13) and the adhesive layer (14) of the present invention are sequentially coated or laminated onto the carrier layer (15). The lamination or coating may be accomplished by a coating method such as slot coating, doctor blade coating, gravure coating, roll coating, comma coating, lip coating, vacuum deposition, sputtering or the like or a printing method such as gravure printing, screen printing, flexo printing, lithographic printing, driographic printing or the like.
- The durable layer and release layer may be thermal cured during the drying of the durable layer coating step, optionally with a post cure step after the coating. The thermal cure can be carried out at about 50° C. to about 120° C. for various lengths of time, for example, tenths of minute to hours, depending on the curing conditions and the composition.
- To further improve the physicomechanical properties, the decoration or functional film may be further UV cured after the injection molding process when it has been transferred to the surface of the molded object. The molded object is placed on a UV conveyor that is running at, for example, 0.6 ft/min to 10 ft/min. The UV curing energy needed is usually in the range of from about 0.1 to about 5 J/cm2, preferably about 0.3 to about 1.2 J/cm2.
- The adhesive layer of the present invention provides desirable fracture properties and as a result, cracking at the edges of the object during the transfer process, such as injection molding, may be initiated and propagated efficiently during the injection molding process and the subsequent mold-part separation process. This feature enables a clean separation of the decoration or functional layer from the carrier substrate at the edges of the object, particularly at the edges of a hollow structure.
- In addition, the adhesive layer of the present invention also provides high degree of transmission, high blocking resistance, high hardness and sufficient adhesion, even for complicated three-dimensional objects.
- The adhesive layer of the present invention is suitable for all in-mold decoration processes for the manufacture of a plastic object. Examples of the material suitable for the object may include, but are not limited to, thermoplastic materials such as polystyrene, polyvinyl chloride, acrylics, polysulfone, polyarylester, polypropylene oxide, polyolefins, acrylonitrile-butadiene-styrene copolymers (ABS), methacrylate-acrylonitrile-butadiene-styrene copolymers (MABS), polycarbonate, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyurethanes and other thermoplastic elastomers or blends thereof, and thermoset materials such as reaction injection molding grade polyurethanes, epoxy resin, unsaturated polyesters, vinylesters or composites, prepregs and blends thereof.
- The object may be a plastic cover of a cell phone or pager. In fact, the adhesive layer is useful for any plastic objects manufactured from an in-mold decoration process, such as personal accessories, toys or educational devices, plastic cover of a personal digital assistant or e-book, credit or smart cards, identification or business cards, face of an album, watch, clock, radio or camera, dashboard in an automobile, household items, laptop computer housings and carrying cases or front control panels of any consumer electronic equipments. This is clearly not exhaustive. Other suitable plastic objects would be clear to a person skilled in the art and therefore they are all encompassed within the scope of the present invention. The adhesive layer of the present invention is also useful in applications such as the thermal transfer protective coating for thermal printing, inkjet printing and passport and other identification applications.
- A release fluid was prepared first by mixing 2.10 gm of MF370 (methylated melamine resin, Cytec Industries) with 1.41 gm of ethylene glycol dimethyl ether (Aldrich) and 0.63 gm of DI water using a magnetic stirrer, after which 0.6 gm of 2,2′-dihydroxy-4-methoxybenzophenone (Aldrich), 0.06 gm of Silwet L7230/SL7607 (3/1 weight ratio, from Osi Specialties, Inc.) and 0.2 gm of Cycat 4040 (p-toluene sulfonic acid, from Cytec Industry) were added with agitation to ensure a homogeneous solution. This release fluid was then coated on a 1.5 mil PET film (PT1 from Mitsubishi Interfilm Holding, Inc., Easley, S.C.) with a #6.5 rod and a target dry coating thickness of 1.5 um. The coating was then placed in a 120° C. oven for 5 minutes to form a release coating.
- A durable layer composition consisting of 7.67 gm (15% in MEK) of CAB-553-0.4 (cellulose acetate butyrate, from Eastman Chemical Co.), 2.94 gm (50% in MEK) of Ebecryl 1290 (aliphatic polyurethane acrylate, UCB Chemicals), 1.2 gm (30% in MEK) of MEK-ST (a silica dispersion from Nissan Chemicals), 0.40 gm of (25% in MEK) 1:1 w % ratio of triethanolamine and poly-Q (aminated tetrol from Arch Chemicals, Norwalk, Conn.), 0.43 gm of a photoinitiator (PI) solution containing 1.5% of BMS (4-(p-tolylthio)benzophenone, Aldrich, Milwaukee, Wis.), 0.8% of Irgacure 651 (2,2-dimethoxy-1,2-diphenylethane, Ciba Speciality Chemicals, Tarrytown, N.Y.), 0.15% of ITX (isopropyl thioxanthone, Aldrich, Milwaukee, Wis.), 0.2% of DBTDL (dibutyltin dilaurate, Aldrich, Milwaukee, Wis.), 0.1% of Irganox 1035 (thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], Ciba Speciality Chemicals, Tarrytown, N.Y.) and 0.2% of Tinuvin 123 [decanedioic acid, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl)ester, reaction products with 1,1-dimethylethylhydroperoxide and octane from Ciba Speciality Chemicals, Tarrytown, N.Y.] in MEK, was prepared. The composition was overcoated onto the release layer prepared above using a #28 Meyer bar with a target thickness of about 7 um and dried at 70° C. for 20 minutes. The dried durable coating was then exposed to 0.4 J/cm2 UV irradiation.
- Before preparing an adhesive composition of the present invention, the pH of each of the materials used was adjusted to 7.5 with either a diluted ammonia solution or a diluted sulfuric acid solution. The adhesive composition was then prepared by mixing 6.947 gm of S-2725 (water borne polyurethane) of a 40% solid content (from Neveon), 8.154 gm of AquaPress ME of a 39% solid content (from Proell Inc) and.9.611 gm of DI water together.
- To the mixture, 2.897 gm of S-50 (silica nanoparticles) of a solid content of 29% (Nissan Chemical Houston Corporation) and 2.391 gm of NeoCryl A-550 (water borne acrylic resin) of a solid content of 27.6% (Tg=100° C., from NeoResins) were added in sequence with agitation.
- The adhesive composition was then coated onto the durable layer prepared above with a #11 wired rod and dried in an 80° C. oven for 10 minutes. The adhesive coating thickness was targeted at ˜3 um.
- The film sample was then tested using a direct injection molding method with PMMA resin ZKM (from CYRO Industries) at 480° F.
- 8.154 Grams of AquaPress ME and 7.74 gm of DI water were mixed together. The resulting mixture was coated onto the durable layer prepared in Example 1 and dried in an 80° C. oven for 10 minutes. The film sample was then tested using a direct injection molding method with PMMA resin ZKM (from CYRO Industries) at 480° F.
TABLE 1 Trans- Film Blocking at Ad- Lens Edge parency of 40° C./90% hesion Cleanness the Lens RH & 60 Hours Example 1 good excellent excellent pass Example 2 good 90% film excellent fail (Comparative remaining with Example) the lens - In these examples, the pH values of all the materials used were pre-adjusted to 8.5 prior to mixing.
- 1.303 Grams of S-2725 (water borne polyurethane) of a 19% solid content (from Neveon), 4.523 gm of AquaPress ME of a 39% solid content (from Proell Inc) and 7.0 gm of DI water were mixed together. To this mixture, 0.84 gm of S-50 (silica nanoparticles) of a solid content of 29% (from Nissan Chemical Houston Corporation) was added, followed by adding 1.15 gm of B-85 (non-crosslinking acrylic emulsion) of a 31.3% solid content (Tg=73° C., Rohm & Haas) with agitation (in Example 3). In Example 4, 1.125 gm of NeoCryl A-6015 (acrylic emulsion) of a 32% solid content (Tg=63° C., NeoResins) was added. In Example 5, 0.818 gm of CL-106 (acrylic resin) of a 44% solid content (Tg=46° C., Rohm & Haas) was added. An additional 0.184 gm, 0.209 gm and 0.516 gm of water were added into Formulations of Example 3, Example 4 and Example 5, respectively, to make up a total solid content of 20%. The adhesive solution was then coated on the durable layer prepared in Example 1 with a #11 wired rod and dried in an 80° C. oven for 10 minutes. The adhesive coating thickness was targeted at ˜3 um.
- The film samples were then tested using a direct injection molding method with PMMA resin ZKM (from CYRO Industries) at 480° F. The resultant lens showed clean edges.
- Socal S31 (CaCO3) was ground to an average particle size of 0.3 um using Zrconium beads, Triton X-100 (Aldrich) and Tamol 731A (from Rohm Haas) at 12° C.
- A solid plasticizer, 1,2-diphenoxyethane (melting temperature of 95° C.), was ground in the presence of a wetting agent, Triton X100, and a dispersing agent, Tamol 731A. The grinding temperature was 4° C. and grinding time was 14 hours. The particle size under microscope was about 1 to 2 um and the solution pH was 8.4.
- 0.928 Grams of S-2725 (water borne polyurethane) of a 40% solid content (from Neveon) was mixed with 2.22 gm of AquaPress ME of a 39% solid content (from Proell Inc) and 2.831 gm of DI water. To this mixture, 0.5 gm of S-50 (silica nanoparticles) of a 40% solid content (Nissan Chemical Houston Corporation), 1.206 gm of a CaCO3 dispersion of a 31.1% solid content prepared above and 0.791 grams of the solid plasticizer dispersion of a 15.8% solid content prepared above, were added. The mixture was vortexed for 2 minutes. To this mixture, 5.876 gm of NeoCryl A-550 (water borne acrylic resin) of a 9.57% solid content (NeoResins) was added and the fluid was vortexed for 2 additional minutes. The adhesive solution was then coated on the durable layer prepared according to Example 1 with a #11 wired rod and dried in an 80° C. oven for 10 minutes. The adhesive coating thickness was targeted at ˜3 um.
- The film sample was then tested using a direct injection molding method with PMMA resin ZKM (from CYRO Industries) at 480° F. The resulted lens had clean edges.
- The use of organic particles and a solid plasticizer without inorganic particles was tested.
- 1.312 Grams of S-2725 (water borne polyurethane) of a 40% solid content (from Neveon) was mixed with 3.14 gm of AquaPress ME of a 39% solid content (from Proell Inc) and 1.38 gm of DI water. To this mixture, 0.791 gm of the solid plasticizer dispersion of a 15.8% solid content prepared in Example 6 was added. The mixture was vortexed for 2 minitues. 5.876 Grams of NeoCryl A-550 (water borne acrylic resin) of a 10.64% solid content (NeoResins) was added and the fluid was vortexed for 2 additioal minutes. The adhesive solution was coated on the durable layer prepared according to Example 1 with a #11 wired rod and dried in an 80° C. oven for 10 minutes. The adhesive coating thickness was targeted at ˜3 um.
- The film sample was then tested using a direct injection molding method with PMMA resin ZKM (from CYRO Industries) at 480° F. The lens formed had only 20% edge film removed.
- While the present invention has been described with reference to the specific embodiments thereof, it should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation, materials, compositions, processes, process step or steps, to the objective and scope of the present invention. All such modifications are intended to be within the scope of the claims appended hereto.
Claims (30)
1. An adhesive layer for in-mold decoration which comprises an adhesive binder and a polymeric particulate material.
2. The adhesive layer of claim 1 wherein said adhesive binder is selected from the group consisting of polyurethane, acrylics, SBR (styrene-butadiene rubber), polybutadiene, polyamides, pyrrolidone copolymers, oxazolidone copolymers, vinylidene chloride copolymers, vinylacetate copolymers, polyesters and derivatives or blends thereof.
3. The adhesive layer of claim 1 wherein said adhesive binder is a polyurethane, acrylic or a hybrid thereof.
4. The adhesive layer of claim 1 wherein said adhesive binder is a latex adhesive binder or a hydrocarbon dispersion adhesive.
5. The adhesive layer of claim 1 wherein said adhesive binder takes up about 40% to about 90% by weight of the adhesive layer.
6. The adhesive layer of claim 1 wherein said polymeric particulate material has a glass transition temperature higher than about 45° C.
7. The adhesive layer of claim 1 wherein said polymeric particulate material has an average particle size of less than about 1 um.
8. The adhesive layer of claim 1 wherein said polymeric particulate material takes up about 5 to about 50% by weight of the adhesive layer.
9. The adhesive layer of claim 1 wherein said polymeric particulate material is refractive index matched to said adhesive binder.
10. The adhesive layer of claim 1 wherein the difference between refractive indexes of said polymeric particulate material and said adhesive binder is less than about 0.1.
11. The adhesive layer of claim 1 wherein said polymeric particulate material is core-shell particles.
12. The adhesive layer of claim 11 wherein said shell has a glass transition temperature of higher than about 45° C.
13. The adhesive layer of claim 11 wherein said core is refractive index matched to the shell or a blend of the shell and the adhesive binder.
14. The adhesive layer of claim 1 further comprising an inorganic particulate material.
15. The adhesive layer of claim 14 wherein said inorganic particulate material is CaCO3, BaSO4, silica, glass beads, bentonite or clay.
16. The adhesive layer of claim 14 wherein said inorganic particulate material takes up about 1 to about 20% by weight of the adhesive layer.
17. The adhesive layer of claim 14 wherein said inorganic particulate material has an average particle size of less than about 0.2 um.
18. The adhesive layer of claim 1 further comprising an organic or inorganic particulate material.
19. The adhesive layer of claim 18 wherein said organic particulate material is a latex material, organic crystals or a solid plasticizer.
20. The adhesive layer of claim 18 wherein said inorganic particulate material is CaCO3, BaSO4, silica, glass beads, bentonite or clay.
21. The adhesive layer of claim 18 wherein said organic or inorganic particulate material takes up about 0.2 to about 5% by weight of the adhesive layer.
22. The adhesive layer of claim 18 wherein said organic or inorganic particulate material has an average particle size in the range of about 0.5 to about 6 um.
23. An adhesive layer for in-mold decoration which comprises an adhesive binder, a polymeric particulate material, an organic or a first inorganic particulate material and a second inorganic particulate material.
24. The adhesive layer of claim 23 wherein said first and second inorganic particulate materials are independently CaCO3, BaSO4, silica, glass beads, bentonite or clay.
25. The adhesive layer of claim 23 wherein said organic or first inorganic particulate material has an average particle size in the range of about 0.5 to about 6 um.
26. The adhesive layer of claim 23 wherein said second inorganic particulate material has an average particle size smaller than about 0.2 um.
27. The adhesive layer of claim 23 wherein the total concentration of said inorganic particulate material(s) is about 5 to about 50% by weight.
28. The adhesive layer of claim 1 which is dispersed in a carrier.
29. The adhesive layer of claim 28 wherein said carrier is water or a hydrocarbon solvent.
30. The adhesive layer of claim 1 further comprising a solid plasticizer.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/176,566 US20060019088A1 (en) | 2004-07-20 | 2005-07-06 | Adhesive layer composition for in-mold decoration |
| PCT/US2005/025893 WO2006012424A2 (en) | 2004-07-20 | 2005-07-19 | Adhesive layer composition for in-mold decoration |
| US12/337,478 US8192837B2 (en) | 2004-07-20 | 2008-12-17 | Adhesive layer composition for in-mold decoration |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58970804P | 2004-07-20 | 2004-07-20 | |
| US11/176,566 US20060019088A1 (en) | 2004-07-20 | 2005-07-06 | Adhesive layer composition for in-mold decoration |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/337,478 Continuation US8192837B2 (en) | 2004-07-20 | 2008-12-17 | Adhesive layer composition for in-mold decoration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20060019088A1 true US20060019088A1 (en) | 2006-01-26 |
Family
ID=35657541
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/176,566 Abandoned US20060019088A1 (en) | 2004-07-20 | 2005-07-06 | Adhesive layer composition for in-mold decoration |
| US12/337,478 Expired - Fee Related US8192837B2 (en) | 2004-07-20 | 2008-12-17 | Adhesive layer composition for in-mold decoration |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/337,478 Expired - Fee Related US8192837B2 (en) | 2004-07-20 | 2008-12-17 | Adhesive layer composition for in-mold decoration |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US20060019088A1 (en) |
| WO (1) | WO2006012424A2 (en) |
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070031360A1 (en) * | 2005-08-08 | 2007-02-08 | Bioderm Research | Stripless Depilatory Compositions |
| US20070069418A1 (en) * | 2005-09-28 | 2007-03-29 | Chih-Yuan Liao | In mold manufacturing of an object comprising a functional element |
| WO2007126714A1 (en) * | 2006-04-03 | 2007-11-08 | Illinois Tool Works Inc | Release sheet for decorative images |
| EP1927455A1 (en) * | 2006-11-28 | 2008-06-04 | Koninklijke Philips Electronics N.V. | Method for manufacturing a housing element having a decorative covering and a grip layer, a decorated foil and the housing element |
| US20090098362A1 (en) * | 2004-07-20 | 2009-04-16 | Xiaojia Wang | Adhesive layer composition for in-mold decoration |
| WO2009129923A1 (en) * | 2008-04-23 | 2009-10-29 | Merck Patent Gmbh | Adhesive |
| CN101659143A (en) * | 2008-08-28 | 2010-03-03 | 深圳富泰宏精密工业有限公司 | Decorating film, shell applying same and manufacturing method of shell |
| US20100098890A1 (en) * | 2008-10-17 | 2010-04-22 | Shenzhen Futaihong Precision Industry Co., Ltd. | Device housing and method for making the same |
| US20100104815A1 (en) * | 2008-10-24 | 2010-04-29 | Quanta Computer Inc. | Plastic product and method for manufacturing the same |
| US20100108343A1 (en) * | 2008-10-31 | 2010-05-06 | Shenzhen Futaihong Precision Industry Co., Ltd. | Housing and manufacturing method thereof |
| US20110014405A1 (en) * | 2009-07-14 | 2011-01-20 | Shenzhen Futaihong Precision Industry Co., Ltd. | Housing and method for making the housing |
| US20110143096A1 (en) * | 2009-12-14 | 2011-06-16 | Hong-Yi Huang | Thin film, casing with decorative pattern, thin film manufacturing method and casing manufacturing method |
| US20120055902A1 (en) * | 2010-09-07 | 2012-03-08 | Samsung Electronics Co., Ltd. | Method for finishing exterior surface of injection-molded product |
| US20120094046A1 (en) * | 2010-10-14 | 2012-04-19 | Fih (Hong Kong) Limited | Housing for electronic device and method for making same |
| US20120171399A1 (en) * | 2010-12-30 | 2012-07-05 | Hon Hai Precision Industry Co., Ltd. | Housing and method for manufacturing the same |
| US20120267989A1 (en) * | 2011-04-22 | 2012-10-25 | Fih (Hong Kong) Limited | Device housing and method for making same |
| US20130045348A1 (en) * | 2011-08-19 | 2013-02-21 | Fih (Hong Kong) Limited | Housing and method for making the same |
| US20130052376A1 (en) * | 2011-08-25 | 2013-02-28 | Fih (Hong Kong) Limited | Device housing and method for making the device housing |
| US20130048519A1 (en) * | 2011-08-29 | 2013-02-28 | Fih (Hong Kong) Limited | Housing of portable electronic devices and method for manufacturing the same |
| US20130221569A1 (en) * | 2010-04-06 | 2013-08-29 | Nolax Ag | Injection Molding Method for Modifying a Surface of an Apolar Polymer Molded Body, and Multi-layer Foil Suitable for Said Method |
| CN103373103A (en) * | 2012-04-12 | 2013-10-30 | 应宏国际股份有限公司 | Method for manufacturing transfer printing film |
| US20140231706A1 (en) * | 2013-02-20 | 2014-08-21 | Samsung Sdi Co., Ltd. | Binder for battery, and anode and lithium battery including the same |
| US20160029496A1 (en) * | 2014-07-23 | 2016-01-28 | Apple Inc. | Adaptive processes for improving integrity of surfaces |
| EP2623316A4 (en) * | 2010-09-29 | 2016-08-17 | Dainippon Printing Co Ltd | Decorative sheet and decorative molded product |
| WO2016140452A3 (en) * | 2015-03-05 | 2016-10-27 | (주)엘지하우시스 | Vacuum thermoforming adhesive composition and vacuum thermoforming decoration sheet using same |
| EP3243640A3 (en) * | 2016-03-24 | 2018-01-24 | Subaru Corporation | Composite material molding jig and related method |
| US9911979B2 (en) | 2013-02-20 | 2018-03-06 | Samsung Sdi Co., Ltd. | Binder for battery, and anode and lithium battery including the same |
| US10162343B2 (en) | 2014-07-23 | 2018-12-25 | Apple Inc. | Adaptive processes for improving integrity of surfaces |
| US20210001524A1 (en) * | 2018-03-09 | 2021-01-07 | Leonhard Kurz Stiftung & Co. Kg | Method for producing a decorated molded part |
| US11393554B2 (en) | 2018-04-11 | 2022-07-19 | Hewlett-Packard Development Company, L.P. | Device housings with glass beads |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8249825B2 (en) | 2009-05-08 | 2012-08-21 | American Power Conversion Corporation | System and method for predicting cooling performance of arrangements of equipment in a data center |
| US8863420B2 (en) * | 2012-02-24 | 2014-10-21 | Hewlett-Packard Development Company, L.P. | Three-dimensional supporting frame |
| WO2014107661A1 (en) * | 2013-01-07 | 2014-07-10 | Nite Ize, Inc. | Systems and methods for an object with a bonded adhesive strip |
| CN103278936B (en) * | 2013-05-16 | 2015-09-16 | 周国新 | A kind of high light pad pasting leg of spectacles and manufacturing process thereof |
| CA2953121A1 (en) | 2014-06-25 | 2015-12-30 | Avery Dennison Corporation | Tape with acrylic-free adhesive |
| KR101876017B1 (en) * | 2016-04-29 | 2018-07-06 | 현대자동차주식회사 | Emergency lamp switch manufacturing method |
| CN109629263B (en) * | 2018-12-24 | 2022-03-08 | 上海雅运新材料有限公司 | Active-like adhesive composition and preparation method thereof |
| CN112280416B (en) * | 2020-10-27 | 2021-12-24 | 浙江龙游道明光学有限公司 | Manufacturing method of transfer film release agent |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6040382A (en) * | 1994-02-04 | 2000-03-21 | Phillips Petroleum Company | Polymer blend clarity |
| US20020040098A1 (en) * | 2000-06-29 | 2002-04-04 | Kuraray Co., Ltd. | Aqueous dispersion |
| US20050171292A1 (en) * | 2004-02-04 | 2005-08-04 | Zang Hongmei | Polymers and composition for in-mold decoration |
| US20050181204A1 (en) * | 2003-12-22 | 2005-08-18 | Xiaojia Wang | Durable layer composition for in-mold decoration |
| US20050225314A1 (en) * | 2004-03-31 | 2005-10-13 | Teradyne, Inc. | Method of measuring duty cycle |
| US7156946B2 (en) * | 2003-04-28 | 2007-01-02 | Strasbaugh | Wafer carrier pivot mechanism |
| US7401758B2 (en) * | 2003-06-06 | 2008-07-22 | Sipix Imaging, Inc. | In mold manufacture of an object with embedded display panel |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4465728A (en) * | 1972-09-25 | 1984-08-14 | H.L.H. Corp. | Dye decorated plastic articles |
| US4597815A (en) * | 1980-11-29 | 1986-07-01 | Nissha Printing Co., Ltd. | Transfer printing |
| JPS62181181A (en) * | 1986-02-05 | 1987-08-08 | Fuji Photo Film Co Ltd | Thermal recording material |
| JPH0295893A (en) * | 1988-09-30 | 1990-04-06 | Nissha Printing Co Ltd | Metallic luster pattern transfer material |
| JP3279668B2 (en) * | 1992-09-10 | 2002-04-30 | 株式会社ユポ・コーポレーション | In-mold label with coupon |
| US5707472A (en) * | 1992-10-06 | 1998-01-13 | Decora Incorporated | Composite for in-mold transfer printing and process for in-mold printing of molded plastic or rubber articles therewith |
| US5795527A (en) * | 1994-04-29 | 1998-08-18 | Nissha Printing Co., Ltd. | Method of manufacturing decorated article using a transfer material |
| EP0933183B1 (en) * | 1997-07-22 | 2008-11-19 | Nissha Printing Co., Ltd. | Sheet for molded-in foil decoration and method of producing molded resin having molded-in foil decoration by using the sheet |
| CA2268288C (en) * | 1997-08-12 | 2009-06-09 | Nissha Printing Co., Ltd. | Transfer material, surface-protective sheet, and process for producing molded article |
| US6306242B1 (en) * | 1997-10-10 | 2001-10-23 | Peter J. Dronzek | Techniques for labeling of plastic, glass or metal containers or surfaces with polymeric labels |
| US6689474B2 (en) * | 1999-05-18 | 2004-02-10 | General Electric Company | Thermally stable polymers, method of preparation, and articles made therefrom |
| DE60025624T2 (en) * | 1999-09-10 | 2006-10-05 | General Electric Co. | COLOR-STABLE POLYARYLATE-CONTAINING COMPOSITIONS |
| US6632531B2 (en) * | 2001-02-15 | 2003-10-14 | Rohm And Haas Company | Porous particles, their aqueous dispersions, and method of preparation |
| CN1191173C (en) * | 2001-07-16 | 2005-03-02 | 太乙印刷企业股份有限公司 | A method of lithographic screen printing applied to IMD hot pressing and injection molding |
| US7156945B2 (en) | 2002-04-24 | 2007-01-02 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure for in-mold decoration |
| US20050255314A1 (en) | 2004-04-20 | 2005-11-17 | Fei Wang | Composition for release layer of in-mold decoration |
| US20060019088A1 (en) * | 2004-07-20 | 2006-01-26 | Xiaojia Wang | Adhesive layer composition for in-mold decoration |
-
2005
- 2005-07-06 US US11/176,566 patent/US20060019088A1/en not_active Abandoned
- 2005-07-19 WO PCT/US2005/025893 patent/WO2006012424A2/en not_active Ceased
-
2008
- 2008-12-17 US US12/337,478 patent/US8192837B2/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6040382A (en) * | 1994-02-04 | 2000-03-21 | Phillips Petroleum Company | Polymer blend clarity |
| US20020040098A1 (en) * | 2000-06-29 | 2002-04-04 | Kuraray Co., Ltd. | Aqueous dispersion |
| US7156946B2 (en) * | 2003-04-28 | 2007-01-02 | Strasbaugh | Wafer carrier pivot mechanism |
| US7401758B2 (en) * | 2003-06-06 | 2008-07-22 | Sipix Imaging, Inc. | In mold manufacture of an object with embedded display panel |
| US20050181204A1 (en) * | 2003-12-22 | 2005-08-18 | Xiaojia Wang | Durable layer composition for in-mold decoration |
| US20050171292A1 (en) * | 2004-02-04 | 2005-08-04 | Zang Hongmei | Polymers and composition for in-mold decoration |
| US20050225314A1 (en) * | 2004-03-31 | 2005-10-13 | Teradyne, Inc. | Method of measuring duty cycle |
Cited By (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8192837B2 (en) | 2004-07-20 | 2012-06-05 | Etansi Inc. | Adhesive layer composition for in-mold decoration |
| US20090098362A1 (en) * | 2004-07-20 | 2009-04-16 | Xiaojia Wang | Adhesive layer composition for in-mold decoration |
| US20070031360A1 (en) * | 2005-08-08 | 2007-02-08 | Bioderm Research | Stripless Depilatory Compositions |
| US20070069418A1 (en) * | 2005-09-28 | 2007-03-29 | Chih-Yuan Liao | In mold manufacturing of an object comprising a functional element |
| WO2007126714A1 (en) * | 2006-04-03 | 2007-11-08 | Illinois Tool Works Inc | Release sheet for decorative images |
| US20100055403A1 (en) * | 2006-11-28 | 2010-03-04 | Koninklijke Philips Electronics N.V. | Method for manufacturing a housing element having a decorative covering and a grip layer |
| EP1927455A1 (en) * | 2006-11-28 | 2008-06-04 | Koninklijke Philips Electronics N.V. | Method for manufacturing a housing element having a decorative covering and a grip layer, a decorated foil and the housing element |
| US9205583B2 (en) | 2006-11-28 | 2015-12-08 | Koninklijke Philips N.V. | Method for manufacturing a housing element having a decorative covering and a grip layer |
| WO2009129923A1 (en) * | 2008-04-23 | 2009-10-29 | Merck Patent Gmbh | Adhesive |
| US20110054074A1 (en) * | 2008-04-23 | 2011-03-03 | Merck Patent Gesellschaft Mit Beschrankter Haftung | Adhesive |
| US20100055417A1 (en) * | 2008-08-28 | 2010-03-04 | Shenzhen Futaihong Precision Industry Co., Ltd. | Decorative film and device housing using the same |
| CN101659143A (en) * | 2008-08-28 | 2010-03-03 | 深圳富泰宏精密工业有限公司 | Decorating film, shell applying same and manufacturing method of shell |
| US20100098890A1 (en) * | 2008-10-17 | 2010-04-22 | Shenzhen Futaihong Precision Industry Co., Ltd. | Device housing and method for making the same |
| TWI382919B (en) * | 2008-10-24 | 2013-01-21 | Quanta Comp Inc | Plastic product and method for manufacturing the same |
| US20100104815A1 (en) * | 2008-10-24 | 2010-04-29 | Quanta Computer Inc. | Plastic product and method for manufacturing the same |
| CN101730417A (en) * | 2008-10-31 | 2010-06-09 | 深圳富泰宏精密工业有限公司 | Housing and method for making same |
| US20100108343A1 (en) * | 2008-10-31 | 2010-05-06 | Shenzhen Futaihong Precision Industry Co., Ltd. | Housing and manufacturing method thereof |
| US20110014405A1 (en) * | 2009-07-14 | 2011-01-20 | Shenzhen Futaihong Precision Industry Co., Ltd. | Housing and method for making the housing |
| US20110143096A1 (en) * | 2009-12-14 | 2011-06-16 | Hong-Yi Huang | Thin film, casing with decorative pattern, thin film manufacturing method and casing manufacturing method |
| CN106217749A (en) * | 2010-04-06 | 2016-12-14 | 诺莱克斯股份公司 | For to the pressure injection method of the modifying surface of non-polar polymer profiled member and the multilamellar paper tinsel that is suitable for the method |
| US9527232B2 (en) * | 2010-04-06 | 2016-12-27 | Nolax Ag | Injection molding method for modifying a surface of an apolar polymer molded body, and multi-layer foil suitable for said method |
| US20130221569A1 (en) * | 2010-04-06 | 2013-08-29 | Nolax Ag | Injection Molding Method for Modifying a Surface of an Apolar Polymer Molded Body, and Multi-layer Foil Suitable for Said Method |
| US8828251B2 (en) * | 2010-09-07 | 2014-09-09 | Samsung Electronics Co., Ltd. | Method for finishing exterior surface of injection-molded product |
| US20120055902A1 (en) * | 2010-09-07 | 2012-03-08 | Samsung Electronics Co., Ltd. | Method for finishing exterior surface of injection-molded product |
| EP2623316A4 (en) * | 2010-09-29 | 2016-08-17 | Dainippon Printing Co Ltd | Decorative sheet and decorative molded product |
| US20120094046A1 (en) * | 2010-10-14 | 2012-04-19 | Fih (Hong Kong) Limited | Housing for electronic device and method for making same |
| US20120171399A1 (en) * | 2010-12-30 | 2012-07-05 | Hon Hai Precision Industry Co., Ltd. | Housing and method for manufacturing the same |
| US20120267989A1 (en) * | 2011-04-22 | 2012-10-25 | Fih (Hong Kong) Limited | Device housing and method for making same |
| US20130045348A1 (en) * | 2011-08-19 | 2013-02-21 | Fih (Hong Kong) Limited | Housing and method for making the same |
| US20130052376A1 (en) * | 2011-08-25 | 2013-02-28 | Fih (Hong Kong) Limited | Device housing and method for making the device housing |
| US20130048519A1 (en) * | 2011-08-29 | 2013-02-28 | Fih (Hong Kong) Limited | Housing of portable electronic devices and method for manufacturing the same |
| CN103373103A (en) * | 2012-04-12 | 2013-10-30 | 应宏国际股份有限公司 | Method for manufacturing transfer printing film |
| US20140231706A1 (en) * | 2013-02-20 | 2014-08-21 | Samsung Sdi Co., Ltd. | Binder for battery, and anode and lithium battery including the same |
| US9761879B2 (en) * | 2013-02-20 | 2017-09-12 | Samsung Sdi Co., Ltd. | Binder for battery, and anode and lithium battery including the same |
| US9911979B2 (en) | 2013-02-20 | 2018-03-06 | Samsung Sdi Co., Ltd. | Binder for battery, and anode and lithium battery including the same |
| US20160029496A1 (en) * | 2014-07-23 | 2016-01-28 | Apple Inc. | Adaptive processes for improving integrity of surfaces |
| US10162343B2 (en) | 2014-07-23 | 2018-12-25 | Apple Inc. | Adaptive processes for improving integrity of surfaces |
| US10649497B2 (en) * | 2014-07-23 | 2020-05-12 | Apple Inc. | Adaptive processes for improving integrity of surfaces |
| WO2016140452A3 (en) * | 2015-03-05 | 2016-10-27 | (주)엘지하우시스 | Vacuum thermoforming adhesive composition and vacuum thermoforming decoration sheet using same |
| JP2018512477A (en) * | 2015-03-05 | 2018-05-17 | エルジー・ハウシス・リミテッドLg Hausys,Ltd. | Adhesive composition for vacuum thermoforming and decoration sheet for vacuum thermoforming using the same |
| US10344193B2 (en) | 2015-03-05 | 2019-07-09 | Lg Hausys, Ltd. | Adhesive composition for vacuum thermoforming and decoration sheet for vacuum thermoforming using the same |
| US10416121B2 (en) | 2016-03-24 | 2019-09-17 | Subaru Corporation | Composite material molding jig, composite material molding method, ultrasonic test system, ultrasonic test method and aircraft structural object |
| EP3243640A3 (en) * | 2016-03-24 | 2018-01-24 | Subaru Corporation | Composite material molding jig and related method |
| US20210001524A1 (en) * | 2018-03-09 | 2021-01-07 | Leonhard Kurz Stiftung & Co. Kg | Method for producing a decorated molded part |
| US11613055B2 (en) * | 2018-03-09 | 2023-03-28 | Leonhard Kurz Stiftung & Co. Kg | Method for producing a decorated molded part |
| US11393554B2 (en) | 2018-04-11 | 2022-07-19 | Hewlett-Packard Development Company, L.P. | Device housings with glass beads |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090098362A1 (en) | 2009-04-16 |
| WO2006012424A3 (en) | 2006-10-26 |
| US8192837B2 (en) | 2012-06-05 |
| WO2006012424A2 (en) | 2006-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8192837B2 (en) | Adhesive layer composition for in-mold decoration | |
| US7910205B2 (en) | Release layer for in-mold decoration | |
| EP2221175B1 (en) | Process for production of transfer sheets excellent in the resistance to burr generation and transfer sheets | |
| JP5060648B1 (en) | Transfer sheet and transfer sheet manufacturing method | |
| KR101384737B1 (en) | Method for manufacturing decorative molded articles | |
| JP7404656B2 (en) | Curable resin compositions, cured resin products, laminated films, transfer films, and laminates | |
| JP2018171708A (en) | Protective film for decorative sheet | |
| JP6206712B2 (en) | Hard coat film for molding and method for producing the same | |
| US20060093813A1 (en) | Durable layer composition for in-mold decoration | |
| WO2014162956A1 (en) | Hard coat film for molding | |
| WO2013015378A1 (en) | Transcription material, active energy line curable resin constituent used in hard coat layer of transcription material, and method for manufacturing abrasion-resistant molded component using transcription material | |
| US20050171292A1 (en) | Polymers and composition for in-mold decoration | |
| JP2014069523A (en) | Hard coat film for molding | |
| JP6391963B2 (en) | Hard coat film for molding and method for producing the same | |
| JP5116900B1 (en) | Transfer sheet to suppress ink flow | |
| US20070264445A1 (en) | Process for forming durable layer for in-mold decoration | |
| CN108699414B (en) | Adhesives and Articles Using the Adhesives | |
| TWI308925B (en) | Adhesive layer composition for in-mold decoration | |
| JP2013139105A (en) | Laminate hard coat film for molding, method for manufacturing the same, and method for manufacturing resin molding | |
| TWI674970B (en) | Laminate, decorative molded article, and manufacturing method of decorative molded article | |
| WO2020179591A1 (en) | Double-sided adhesive sheet for decorative molding, laminating adhesive sheet for decorative molding and laminate for decorative molding | |
| KR20210081070A (en) | Multilayer film with improved workability and uv resistance | |
| CN115087546B (en) | Decorative film and decorative molded body | |
| JP7512646B2 (en) | Decorative film and decorative molded body | |
| JPH05269948A (en) | Base film for decorative sheet and adhesive sheet for decorative |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |