WO1996010797A1 - Procede d'application d'un code a barres - Google Patents

Procede d'application d'un code a barres Download PDF

Info

Publication number
WO1996010797A1
WO1996010797A1 PCT/SE1995/001117 SE9501117W WO9610797A1 WO 1996010797 A1 WO1996010797 A1 WO 1996010797A1 SE 9501117 W SE9501117 W SE 9501117W WO 9610797 A1 WO9610797 A1 WO 9610797A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal layer
printed circuit
lines
bar code
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/SE1995/001117
Other languages
English (en)
Inventor
Sven-Tore Kristiansen
Mats Rune RÖNNBERG
Victoria Eva-Britt Larsson
Björn Anders BERGLUND
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Priority to AU36908/95A priority Critical patent/AU3690895A/en
Publication of WO1996010797A1 publication Critical patent/WO1996010797A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
    • G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
    • G06K1/121—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by printing code marks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Definitions

  • the present invention relates primarily to a method of applying and constructing a bar code on a surface of a printed circuit board.
  • printed circuit board is meant a board which includes "printed" circuits but which has not yet been loaded with necessary electronic devices.
  • loaded printed circuit boards are referred to as loaded PCB's.
  • Bar codes are normally used to distinguish one printed circuit board of one particular structure from another printed circuit board of another particular structure, such as differences in the number of conductive layers or conduc ⁇ tive fields and in the conductor patterns chosen for each conductor pattern layer.
  • the bar code can be applied to an outer surface of a printed circuit board and structured so as to be easily read and detected by light receiving means adapted to receive from light transmitting means sections of light reflected by bar-code sections of high luminosity that are delimited laterally by bar-code sections of low luminosity.
  • the printed circuit board may include a base unit having a number of electrically conductive layers and a number of electrically insulating layers in mutually superimposed relationship.
  • EMC Electro Magnetic Compatibili- ty
  • EMC-protected printed circuit boards which are comprised of a base unit which is provided on each side with a thin electrically conductive layer or metal layer. These layers may be connected together electrically by edge-related and earth-potential related sections.
  • a board of predetermined structure can be provided with a number of discrete compo ⁇ nents which are soldered to the board through the medium of connection pads.
  • each printed circuit board to include some form of identification, preferably an individual identification number and a category number.
  • the printed circuit board used may be either an EMC-protected circuit board or a circuit board which is not EMC-protected, the invention is described in the following primarily with regard to the former type of board.
  • printed circuit boards that are not EMC-protected may be used.
  • This patent specification also teaches a method and a system for producing loaded circuit board modules, by combining and soldering components on printed circuit boards and by feeding specified printed circuit boards from a store of printed circuit boards.
  • the method and the system are based on reading the identification code on respective printed circuit boards and therewith obtain information relating thereto, so that the printed circuit board can be transported through selected treatment stations in accordance with said identifi ⁇ cation information and there provided with selected compo ⁇ nents, so as to gradually form a complete loaded printed circuit board.
  • This patent specification discloses the possibility of allowing the laser beam to be reflected directly onto a projection surface from the bright or highly luminous sections of the bar code, and of reading the bar code on said surface with the aid of a light receiving device or a detector.
  • the publication teaches a number of various methods of marking a printed circuit board. One is to generate an identification in the same wa as the circuit where the other, wherefore great precautions are required in order to not generate electrical and magnetical disturbances.
  • An other described method is to apply the identification through not electric conductive screen printing.
  • a method to identify every semi conductor wafer is presented in the publication EP-A3-0 311 087.
  • the identifying code is here applied on or across a front surface and a light beam is directed towards an opposite bottom surface, whereby the light beam is to pass through the wafer.
  • the publication DE-A1-4 308 890 teaches a system intended to bring an identification to the top surface of a printed circuit board by defining the identifying symbols to correspond to recesses in the solder mask and to thereby achieve a good contrast between the illumination of the top surface of the base plate and the solder mask.
  • a technical problem also resides in realizing the necessity of and the advantages afforded by allowing each EMC-protect- ing metal layer to be intact and to form the bar-code printed circuit initially through the medium of the solder mask layer and thereafter washing away the solder mask layer to form a printed circuit-board identifying bar-code, and therewith provide conditions for obtaining bright or highly luminous bar-code lines and bar-code lines of low luminosity related to dark solder mask layers, wherein said bright lines can be created either by working (organic passivation) an exposed metal surface or coating said surface with a time-durable metal, where the surface structure will not be changed deleteriously with time to any appreciable extent, i.e. will not oxidize.
  • Another technical problem is to choose in this stage of manufacture a development path which utilizes a bright surface structure for the bar-code sections of high luminosi ⁇ ty, and therewith be forced to use a special detection or sensing method when the bar code is to be detectable in a transmitter/receiver unit.
  • a technical problem is one of creating simple conditions which enable a bar code belonging to the printed circuit board to be produced at the same time as a further metal layer adapted for soldering discrete components is applied to an existing metal layer, such as an EMC-protecting metal layer.
  • the present invention is based on a method of applying and constructing a bar code with the provisions given in the introduction.
  • the inventive method is based on choosing the lowly luminous or dark marking lines of the bar code to represent lines in a solder mask, selecting the highly luminous marking lines of the bar code to represent metal lines such as lines formed when applying a further metal laycir or the like such as a further metal layer on said EMC-protecting metal layer wherein said highly luminous marking lines are represented by bright metal surfaces or metal line ⁇ all of which is achieved while leaving an EMC-protected metal layer intact.
  • solder mask layer is applied to the upper surface and hardened and/or dried so as to fasten to said surface to form dark lines of the bar code in a bar-code section, and that the remainder of the solder mask layer in said section is then removed in a known manner.
  • Said further metal layer is then applied to the exposed surface in said section of the bar code.
  • Those advantages primarily significant to the present invention reside in the creation of conditions which enable a bar code to be provided on an upper surface of a printed circuit board without additional working operations, where the sections of low luminosity of th bar code can be included as part of a solder mask, so that the printed circuit-board bar code and identification are effected simultaneously with the forming of chosen surface parts that are intended to expose corresponding surface parts on a metal layer, and that said exposed surface parts shall be treated, such as by organic passivation, or covered by a further metal layer on to which discrete components can be soldered.
  • the highly luminous marking lines of the bar code are chosen to represent bright lines, for instance formed when applying said further metal layer.
  • Figure 1 is a perspective sectional view of an EMC-protected printed circuit board on which a bar code which has been provided in accordance with the present invention, and which shows an appropriate beam path;
  • Figure 2 is a sectional view of a printed circuit board according to Figure 1 provided with the bar code.
  • Figure 2 is a sectional view of an EMC-protected printed circuit board, and shows a bar code A which can be read and detected by a light receiving device.
  • the printed circuit board 1 includes a base unit 10 having a number of electrically conductive layers and a number of electrically insulating layers, arranged in superimposed relationship.
  • the first metal layer 11 is normally given a thickness far smaller than 0.5 ⁇ m and a second meal layer 12 is applied to the surface 11a with the intention of thickening the metal or copper layer.
  • the combined thickness of the two metal layers 11 and 12 may be 5 ⁇ m or thicker, to create a satisfactory EMC-protection.
  • the copper layer is comprised of two EMC-protective layers 11 and 12 which are applied on each side of the printed circuit-board base unit 10 (only one copper layer (11, 12) is shown) .
  • the second copper layer 12 For the purpose of creating connection islands and the like, there is applied to the second copper layer 12 a further, a third, copper layer 15 whose thickness exceeds the thickness of the first layer 11.
  • the surface 15a will then comprise a highly luminous code-bar section in the bar code A and the surfaces 13a, 14a will comprise adjacent dark or lowly luminous bars 13, 14 related to the solder mask.
  • the metal surface 12a between the solder-mask related sections 13, 14 comprises a bright line-code related bar.
  • the surface is subjected to an organic passivation process.
  • EMC-protective metal layer 11 and 12 may consist of a metal other than copper, and that the further metal layer 15 may also consist of a metal other than copper.
  • the metallic layer may consist of a metal other than tin/- lead, such as nickel/gold.
  • the uppermost surface 15a (15a ' ) of the metal layer 15 may be subjected to an organic passiva ⁇ tion process.
  • the metal layers (11, 12) will preferably have a total thickness of about 5 ⁇ m. In practice, there can be accepted a thickness of up to 200-300 ⁇ m, although preferably between 10 and 30 ⁇ m.
  • the printed circuit-board base unit 10 may have a thick- ness between 0.2-10 mm, normally between 0.4-7 mm.
  • the present invention fully satisfies the desire to construct a surface orientated printed circuit-board identification in a simple manner, without deleteriously affecting the EMC- protection, by ensuring that the metal layers 11 and 12 or the necessary bar code remain completely intact.
  • the aforesaid highly luminous marking lines are able to be represented by bright metal lines with measurement accuracy, while leaving the EMC-protective first and second metal layers 11, 12 intact.
  • the invention also relates to a system according to Figure 1.
  • a light generat ⁇ ing device 15 whose light beam is reflected directly on said bright lines 2a and with which a mirror image is projected onto a projection surface 4 that has a dull surface structure 4a.
  • the directly reflected bright lines 2a are projected onto the projection surface 4, 4a and a light receiving device 7 detects the thus projected diffuse image 2a ' of the bar code.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé permettant d'appliquer un code à barres sur une carte à circuit imprimé, qui consiste à utiliser un masque de soudage pour former les lignes sombres du code à barres ainsi que les lignes très lumineuses de ce dernier à partir de surfaces métalliques brillantes. A cet effet, on recourt à un procédé de détection spécial qui permet aux rayons lumineux d'être réfléchis directement par les parties brillantes de la surface sur une surface de projection à structure mate, et à une unité de détection dans laquelle l'image du code à barres projetée sur la surface de projection est détectée.
PCT/SE1995/001117 1994-10-03 1995-10-02 Procede d'application d'un code a barres Ceased WO1996010797A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU36908/95A AU3690895A (en) 1994-10-03 1995-10-02 A method for applying a barcode

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9403324-8 1994-10-03
SE9403324A SE503738C2 (sv) 1994-10-03 1994-10-03 Sätt att bilda en streckkod

Publications (1)

Publication Number Publication Date
WO1996010797A1 true WO1996010797A1 (fr) 1996-04-11

Family

ID=20395448

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE1995/001117 Ceased WO1996010797A1 (fr) 1994-10-03 1995-10-02 Procede d'application d'un code a barres

Country Status (3)

Country Link
AU (1) AU3690895A (fr)
SE (1) SE503738C2 (fr)
WO (1) WO1996010797A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2343059A (en) * 1998-10-21 2000-04-26 Jerseyfield Limited A method for tracking printed circuit boards on multi-board panels through a production process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0311087A2 (fr) * 1987-10-09 1989-04-12 Fujitsu Limited Identification de plaquettes semi-conductrices
DE4308890A1 (de) * 1993-03-19 1994-09-22 Siemens Ag Verfahren zur Herstellung einer Leiterplatte

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0311087A2 (fr) * 1987-10-09 1989-04-12 Fujitsu Limited Identification de plaquettes semi-conductrices
DE4308890A1 (de) * 1993-03-19 1994-09-22 Siemens Ag Verfahren zur Herstellung einer Leiterplatte

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, Vol. 11, No. 264, P-610; & JP,A,62 069 377, (NEC CORP), 30 March 1987. *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2343059A (en) * 1998-10-21 2000-04-26 Jerseyfield Limited A method for tracking printed circuit boards on multi-board panels through a production process

Also Published As

Publication number Publication date
AU3690895A (en) 1996-04-26
SE9403324L (sv) 1996-04-04
SE9403324D0 (sv) 1994-10-03
SE503738C2 (sv) 1996-08-19

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