WO1996024839A3 - Method and apparatus for predicting process characteristics of polyurethane pads - Google Patents

Method and apparatus for predicting process characteristics of polyurethane pads Download PDF

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Publication number
WO1996024839A3
WO1996024839A3 PCT/US1996/001027 US9601027W WO9624839A3 WO 1996024839 A3 WO1996024839 A3 WO 1996024839A3 US 9601027 W US9601027 W US 9601027W WO 9624839 A3 WO9624839 A3 WO 9624839A3
Authority
WO
WIPO (PCT)
Prior art keywords
pad
pads
polyurethane
manufacturing
cmp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1996/001027
Other languages
French (fr)
Other versions
WO1996024839A2 (en
Inventor
Scott G Meikle
Guy F Hudson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to JP52428596A priority Critical patent/JP3203254B2/en
Priority to AU51683/96A priority patent/AU5168396A/en
Priority to EP96908448A priority patent/EP0809798B1/en
Priority to DE69635984T priority patent/DE69635984T2/en
Publication of WO1996024839A2 publication Critical patent/WO1996024839A2/en
Publication of WO1996024839A3 publication Critical patent/WO1996024839A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A measurement of polyurethane pad characteristics is used to predict performance characteristics of polyurethane pads used for chemical mechanical planarization (CMP) of semiconductor wafers, and to adjust process parameters for manufacturing polyurethane pads. In-situ fluorescence measurements of a pad that has been exposed to a high pH and high temperature environment are performed. The fluorescence characteristics of the pad are used to predict the rate of planarization of a wafer. A portion of one pad from a manufacturing lot is soaked in an organic solvent which causes the portion to swell. The relative increase in size is indicative of the performance characteristics of pads within the manufacturing lot. Statistical Process Control methods are used to optimize the CMP pad manufacturing process. Predicted pad characteristics are available for each pad.
PCT/US1996/001027 1995-02-09 1996-01-30 Method and apparatus for predicting process characteristics of polyurethane pads Ceased WO1996024839A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP52428596A JP3203254B2 (en) 1995-02-09 1996-01-30 Method and apparatus for predicting process characteristic values of polyurethane pad
AU51683/96A AU5168396A (en) 1995-02-09 1996-01-30 Method and apparatus for predicting process characteristics of polyurethane pads
EP96908448A EP0809798B1 (en) 1995-02-09 1996-01-30 Method for polishing a wafer and method for manufacturing an integrated circuit
DE69635984T DE69635984T2 (en) 1995-02-09 1996-01-30 METHOD FOR POLISHING A WATER AND METHOD FOR PRODUCING AN INTEGRATED CIRCUIT

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/386,023 US5698455A (en) 1995-02-09 1995-02-09 Method for predicting process characteristics of polyurethane pads
US08/386,023 1995-02-09

Publications (2)

Publication Number Publication Date
WO1996024839A2 WO1996024839A2 (en) 1996-08-15
WO1996024839A3 true WO1996024839A3 (en) 1996-09-26

Family

ID=23523837

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/001027 Ceased WO1996024839A2 (en) 1995-02-09 1996-01-30 Method and apparatus for predicting process characteristics of polyurethane pads

Country Status (8)

Country Link
US (3) US5698455A (en)
EP (1) EP0809798B1 (en)
JP (1) JP3203254B2 (en)
KR (1) KR100236499B1 (en)
AT (1) ATE321627T1 (en)
AU (1) AU5168396A (en)
DE (1) DE69635984T2 (en)
WO (1) WO1996024839A2 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5698455A (en) 1995-02-09 1997-12-16 Micron Technologies, Inc. Method for predicting process characteristics of polyurethane pads
US6075606A (en) 1996-02-16 2000-06-13 Doan; Trung T. Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
KR100524510B1 (en) 1996-06-25 2006-01-12 가부시키가이샤 에바라 세이사꾸쇼 Method and apparatus for dressing abrasive cloth
US6408220B1 (en) * 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques
US6361409B1 (en) 1999-09-28 2002-03-26 Rodel Holdings Inc. Polymeric polishing pad having improved surface layer and method of making same
US6560503B1 (en) * 1999-10-05 2003-05-06 Advanced Micro Devices, Inc. Method and apparatus for monitoring controller performance using statistical process control
US20020068516A1 (en) * 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6449524B1 (en) * 2000-01-04 2002-09-10 Advanced Micro Devices, Inc. Method and apparatus for using equipment state data for run-to-run control of manufacturing tools
US6498101B1 (en) 2000-02-28 2002-12-24 Micron Technology, Inc. Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
US6313038B1 (en) 2000-04-26 2001-11-06 Micron Technology, Inc. Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
US6612901B1 (en) 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6520834B1 (en) 2000-08-09 2003-02-18 Micron Technology, Inc. Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
US6838382B1 (en) 2000-08-28 2005-01-04 Micron Technology, Inc. Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates
US6736869B1 (en) 2000-08-28 2004-05-18 Micron Technology, Inc. Method for forming a planarizing pad for planarization of microelectronic substrates
US6592443B1 (en) 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6609947B1 (en) 2000-08-30 2003-08-26 Micron Technology, Inc. Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates
US6652764B1 (en) 2000-08-31 2003-11-25 Micron Technology, Inc. Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6623329B1 (en) 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US6764574B1 (en) * 2001-03-06 2004-07-20 Psiloquest Polishing pad composition and method of use
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US6866566B2 (en) 2001-08-24 2005-03-15 Micron Technology, Inc. Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
US6666749B2 (en) 2001-08-30 2003-12-23 Micron Technology, Inc. Apparatus and method for enhanced processing of microelectronic workpieces
US7341502B2 (en) 2002-07-18 2008-03-11 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
SG153668A1 (en) * 2003-03-25 2009-07-29 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
US7030603B2 (en) 2003-08-21 2006-04-18 Micron Technology, Inc. Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece
US7294049B2 (en) * 2005-09-01 2007-11-13 Micron Technology, Inc. Method and apparatus for removing material from microfeature workpieces
US8388614B2 (en) * 2009-09-29 2013-03-05 Covidien Lp Return electrode temperature prediction
JP5479189B2 (en) * 2010-03-31 2014-04-23 富士紡ホールディングス株式会社 Sheet material selection method
US11260495B2 (en) * 2018-07-27 2022-03-01 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
KR102277418B1 (en) * 2019-05-21 2021-07-14 에스케이씨솔믹스 주식회사 Polishing pad with improved crosslinking density and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5483568A (en) * 1994-11-03 1996-01-09 Kabushiki Kaisha Toshiba Pad condition and polishing rate monitor using fluorescence

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081796A (en) * 1990-08-06 1992-01-21 Micron Technology, Inc. Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
DE4102767A1 (en) * 1991-01-31 1992-08-06 Metallgesellschaft Ag METHOD FOR QUALITATIVE ANALYSIS OF PLASTIC PARTICLES
US5698455A (en) * 1995-02-09 1997-12-16 Micron Technologies, Inc. Method for predicting process characteristics of polyurethane pads

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5483568A (en) * 1994-11-03 1996-01-09 Kabushiki Kaisha Toshiba Pad condition and polishing rate monitor using fluorescence

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Selective Staining Method for Studying Polishing Pads. September 1978.", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 21, no. 4, September 1978 (1978-09-01), NEW YORK, US, pages 1433, XP002009653 *
R. JAIRATH ET AL.: "consumables for the chemical mechanical polishing (CMP) of dielectrics and conductors", MAT.REX.SOC.SYMP.PROC., vol. 337, 4 April 1994 (1994-04-04), PITTSBURGH, PA, USA, pages 121 - 131, XP000563165 *
RAJEEV BAJAJ: "effect of polishing pad material properties on chemical mechanical polishing (CMP) processes", MAT. RES. SOC. SYMP. PROC., vol. 337, 4 April 1994 (1994-04-04), PITTSBURGH, PA, USA, pages 637 - 644, XP000577630 *
S. SIVARAM ET AL.: "chemical mechanical polishing of interlevel dielectrics: models for emoval rate and planarity", MATER. RES. SOC. SYMP. PROC., vol. 260, 27 April 1992 (1992-04-27), PITTSBURGH, PA, USA, pages 53 - 64, XP000577620 *

Also Published As

Publication number Publication date
DE69635984T2 (en) 2007-01-11
KR100236499B1 (en) 2000-01-15
US5698455A (en) 1997-12-16
DE69635984D1 (en) 2006-05-18
JP3203254B2 (en) 2001-08-27
AU5168396A (en) 1996-08-27
KR19980702034A (en) 1998-07-15
ATE321627T1 (en) 2006-04-15
US6440319B1 (en) 2002-08-27
US6114706A (en) 2000-09-05
EP0809798A2 (en) 1997-12-03
WO1996024839A2 (en) 1996-08-15
JPH10508799A (en) 1998-09-02
EP0809798B1 (en) 2006-03-29

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