WO1997015704A3 - Galvanikanlage - Google Patents

Galvanikanlage Download PDF

Info

Publication number
WO1997015704A3
WO1997015704A3 PCT/DE1996/001936 DE9601936W WO9715704A3 WO 1997015704 A3 WO1997015704 A3 WO 1997015704A3 DE 9601936 W DE9601936 W DE 9601936W WO 9715704 A3 WO9715704 A3 WO 9715704A3
Authority
WO
WIPO (PCT)
Prior art keywords
auxiliary
electrolyte
catholyte
electroplating
anolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1996/001936
Other languages
English (en)
French (fr)
Other versions
WO1997015704A2 (de
Inventor
Karl Hans Fuchs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials Deutschland GmbH
Original Assignee
LeaRonal GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal GmbH filed Critical LeaRonal GmbH
Priority to JP9512202A priority Critical patent/JPH10511743A/ja
Priority to EP96945489A priority patent/EP0801692A2/de
Publication of WO1997015704A2 publication Critical patent/WO1997015704A2/de
Publication of WO1997015704A3 publication Critical patent/WO1997015704A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Eine Galvanikanlage weist einen Galvanisierbehälter und einen Versorgungsbehälter auf, zwischen denen der Elektrolyt zirkuliert. Im Versorgungsbehälter erfolgt dabei die Ergänzung des Metallgehaltes des Elektrolyten durch eine lösliche Anode, der eine Hilfskathode zugeordnet ist, die sich in einem Hilfskatholyten befindet, der vom Elektrolyten über ein metallionen-undurchlässiges Diaphragma abgetrennt ist. Die unlöslichen Anoden des Galvanisierbehälters befinden sich in einem Hilfsanolyten, der vom Elektrolyten über anionen-undurchlässige Diaphragmen abgetrennt ist. Der wesentliche Vorteil dieser Lösung besteht darin, daß unlösliche Anoden eingesetzt werden können, daß aber auch die für präzise Beschichtungen beispielsweise im Leiterplattenbereich unerlässliche Prozeßorganik eingesetzt werden kann. Eine besonders vorteilhafte Weiterbildung sieht vor, daß der Hilfskatholyt und der Hilfsanolyt in einem gemeinsamen Kreislauf geführt sind, wodurch sich gegenläufige Verschiebungen des pH-Wertes von Hilfskatholyt und Hilfsanolyt durch deren kontinuierliche Vermischung weitgehend kompensieren.
PCT/DE1996/001936 1995-10-26 1996-10-11 Galvanikanlage Ceased WO1997015704A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9512202A JPH10511743A (ja) 1995-10-26 1996-10-11 メッキ設備
EP96945489A EP0801692A2 (de) 1995-10-26 1996-10-11 Galvanikanlage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19539865.3 1995-10-26
DE1995139865 DE19539865A1 (de) 1995-10-26 1995-10-26 Durchlauf-Galvanikanlage

Publications (2)

Publication Number Publication Date
WO1997015704A2 WO1997015704A2 (de) 1997-05-01
WO1997015704A3 true WO1997015704A3 (de) 1997-07-10

Family

ID=7775839

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/001936 Ceased WO1997015704A2 (de) 1995-10-26 1996-10-11 Galvanikanlage

Country Status (4)

Country Link
EP (1) EP0801692A2 (de)
JP (1) JPH10511743A (de)
DE (1) DE19539865A1 (de)
WO (1) WO1997015704A2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100877923B1 (ko) * 2001-06-07 2009-01-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 전해 구리 도금법
ITMI20011374A1 (it) * 2001-06-29 2002-12-29 De Nora Elettrodi Spa Cella di elettrolisi per il ripristino della concentrazione di ioni metallici in processi di elettrodeposizione
DE10341998A1 (de) * 2003-09-04 2005-03-31 Gramm Gmbh & Co. Kg Vorrichtung und Verfahren zur Oberflächenbehandlung von Werkstücken in einem Kreislaufsystem
EP2548998B1 (de) * 2011-07-20 2015-07-01 Enthone Inc. Vorrichtung zur elektrochemischen Abscheidung eines Metalls
DE102012024758B4 (de) 2012-12-18 2024-02-01 Maschinenfabrik Niehoff Gmbh & Co Kg Vorrichtung und Verfahren zum elektrolytischen Beschichten eines Gegenstandes und deren Verwendung
JP6079368B2 (ja) * 2013-03-28 2017-02-15 三菱マテリアル株式会社 Ｓｎ合金めっき方法及びＳｎ合金めっき液のリサイクル方法、並びにこれらの装置
US9765443B2 (en) * 2015-09-02 2017-09-19 Applied Materials, Inc. Electroplating processor with current thief electrode
CN105755510B (zh) * 2015-12-14 2018-12-07 南京航空航天大学 一种带镍离子补充装置的电铸镍系统及其工作方法
US11174564B2 (en) * 2018-10-31 2021-11-16 Unison Industries, Llc Electroforming system and method
EP3875640A1 (de) * 2020-03-04 2021-09-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Verfahren zum aufbereiten eines metallsalz-haltigen mediums aus teilströmen der leiterplatten- und/oder substrat-herstellung
CN116024634A (zh) * 2022-09-26 2023-04-28 深圳崇达多层线路板有限公司 电镀装置及应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1293648A (en) * 1969-06-06 1972-10-18 Australian Iron Steel Pty Ltd Addition of metal ions to electrolytic plating baths
US4038160A (en) * 1975-07-03 1977-07-26 Albright & Wilson Limited Method of regenerating a chromium electroplating bath
FR2479856A1 (fr) * 1980-04-04 1981-10-09 Electricite De France Installation de traitement de surface par depot metallique et procede de regeneration des bains de depot metallique par voie electrolytique
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
GB2254859A (en) * 1991-04-18 1992-10-21 Nippon Cmk Kk In printed wiring board manufacturing use of waste etchant as copper ion sourcefor electroplating bath
DE4221970A1 (de) * 1992-06-30 1994-01-05 Schering Ag Verwendung von Alkenylen und Alkinylen als Zusätze in galvanischen Metallabscheidungsbädern

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
DE4405741C1 (de) * 1994-02-23 1995-06-01 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallen aus Elektrolyten mit Prozeßorganik

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1293648A (en) * 1969-06-06 1972-10-18 Australian Iron Steel Pty Ltd Addition of metal ions to electrolytic plating baths
US4038160A (en) * 1975-07-03 1977-07-26 Albright & Wilson Limited Method of regenerating a chromium electroplating bath
FR2479856A1 (fr) * 1980-04-04 1981-10-09 Electricite De France Installation de traitement de surface par depot metallique et procede de regeneration des bains de depot metallique par voie electrolytique
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
GB2254859A (en) * 1991-04-18 1992-10-21 Nippon Cmk Kk In printed wiring board manufacturing use of waste etchant as copper ion sourcefor electroplating bath
DE4221970A1 (de) * 1992-06-30 1994-01-05 Schering Ag Verwendung von Alkenylen und Alkinylen als Zusätze in galvanischen Metallabscheidungsbädern

Also Published As

Publication number Publication date
DE19539865A1 (de) 1997-04-30
EP0801692A2 (de) 1997-10-22
WO1997015704A2 (de) 1997-05-01
JPH10511743A (ja) 1998-11-10

Similar Documents

Publication Publication Date Title
EP1458905B8 (de) Elektrolysezelle zur wiederherstellung der metallionenkonzentration im elektroplattierverfahren
US8211285B2 (en) Copper-tin electrolyte and method for depositing bronze layers
DE3167841D1 (en) Method for the electro-deposition of lead alloys
MY129999A (en) Method of copper plating.
RU2010109391A (ru) Стабилизация водных анионных смоляных дисперсий хелатирующими агентами
EP1292724A4 (de) Zink-nickel-elektroplattierung
DE59913824D1 (de) Verfahren und Zelle zur elektrochemischen Herstellung von Alkalimetall aus Alkalimetallamalgam
GB2112397A (en) Gold plating baths, and polymeric chelate for use therein
ES475996A1 (es) Un metodo de producir depositos electroliticos de zinc bri- llantes.
WO2001092604A3 (en) Electrolysis cell for restoring the concentration of metal ions in processes of electroplating
CN103806036A (zh) 一种宽电流密度无氰型铜锡合金电镀工艺
US6129858A (en) Etching solution
FR2685013B1 (de)
TW358831B (en) Process for the demetallization of highly acidic baths or use of said process in the electropolishing of stainless-steel surface
ES475680A1 (es) Procedimiento para producir depositos electroliticos de cinc lustroso a brillante.
EP0170632A3 (de) Verfahren zur kathodischen Elektrogewinnung von Metallen mit entsprechender Säurebildung aus ihren Salzlösungen
FR2919311B1 (fr) Installation et procede pour l'etamage electrolytique de bandes d'acier, mettant en oeuvre une anode insoluble.
SU823471A1 (ru) Электролит железнени
MXPA02003701A (es) Proceso para remover impurezas de hierro ferrico desde una solucion acuosa acidico usada en la extraccion electrolitica de cobre.
MY110953A (en) Method and solution for electrodeposition of a dense reflective tin or tin-lead alloy
JPS5524924A (en) Adjustment of metal ion concentration in nickel plating liquor
SU998598A1 (ru) Способ получени медной фольги
JPS5741388A (en) Cathode for electrolyzing aqueous alkali metallic halide solution and its production
EP0074431A1 (de) Gegen Korrosion beständige Elektrolysezelle
GB1247198A (en) Improvements in and relating to the electrolysis of saline solutions

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

ENP Entry into the national phase

Ref country code: US

Ref document number: 1997 860446

Date of ref document: 19970626

Kind code of ref document: A

Format of ref document f/p: F

AK Designated states

Kind code of ref document: A3

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

WWE Wipo information: entry into national phase

Ref document number: 1996945489

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWP Wipo information: published in national office

Ref document number: 1996945489

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1996945489

Country of ref document: EP