WO1998031041A1 - Vapour deposition coating apparatus - Google Patents

Vapour deposition coating apparatus Download PDF

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Publication number
WO1998031041A1
WO1998031041A1 PCT/GB1998/000047 GB9800047W WO9831041A1 WO 1998031041 A1 WO1998031041 A1 WO 1998031041A1 GB 9800047 W GB9800047 W GB 9800047W WO 9831041 A1 WO9831041 A1 WO 9831041A1
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WO
WIPO (PCT)
Prior art keywords
coating
magnetic
field lines
magnetic field
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB1998/000047
Other languages
French (fr)
Inventor
Dermot Patrick Monaghan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gencoa Ltd
Original Assignee
Gencoa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gencoa Ltd filed Critical Gencoa Ltd
Priority to EP98900312A priority Critical patent/EP1016121B1/en
Priority to JP53064598A priority patent/JP2001507756A/en
Priority to AT98900312T priority patent/ATE298928T1/en
Priority to US09/341,072 priority patent/US6383565B1/en
Priority to DE69830736T priority patent/DE69830736T2/en
Priority to CN98801695A priority patent/CN1243599A/en
Publication of WO1998031041A1 publication Critical patent/WO1998031041A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3266Magnetic control means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields

Definitions

  • This invention relates to a vapour deposition coating apparatus. More
  • the deposition apparatus is
  • Magnetron sputtering is a very well established technique which is able
  • the present invention overcomes such a limitation and can give rise to a novel apparatus which could be up to four meters in diameter.
  • vapour deposition coating apparatus comprising a vacuum chamber (1), at least
  • one coating means or ionization source (3) disposed at or about the periphery
  • the apparatus is provided with one or more internal magnetic means (6) positioned such that magnetic field lines (7) are generated across the coating zone (2) and means for altering the
  • a multi-station deposition unit comprising a plurality of coating stations (3,6)
  • each defining a confinement volume the unit comprising a plurality of coating
  • magnetic field lines (7) are generated across each coating zone (2) and means for altering the strength or position of the magnetic field lines.
  • vapour deposition coating method characterised in mat magnetic field lines (7) can be regulated across a coating zone (2) by means (3) (6) which enable an ion current density to be controlled.
  • the apparatus can incorporate a number of coating means of which one is preferably a magnetron cathode which will be situated around the samples to
  • means generate a magnetic field.
  • These means could comprise a single or plurality of magnetic polarities which could be the same or different to those of the outer magnetic array of the magnetron source.
  • the magnetic strength of the magnetrons could be also varied as could the relative position of the inner and outer magnetic poles.
  • Auxiliary magnetic poles could be used in the chamber surroundings in
  • Magnetic confinement enhancement could be achieved by magnetic means which present opposite polarity to the central pole. Also suitable electric currents could provide adequate magnetic confinement by generating magnetic fields for this purpose, especially when
  • the apparatus will enable maximum magnetic confinement
  • AC AC current
  • Pulsed-LF (1-1000 KHz
  • MF medium frequency
  • RF radiofrequencies
  • the apparatus could incorporate any other number of means in order to provide
  • magnetrons and additional magnetic means could be varied in order to achieve optimisation of spaces where magnetic confinement conditions are appropriate
  • a large coating apparatus could comprise of one or more confinement areas or stations.
  • Figure 1 shows an example of a deposition apparatus which includes the basic magnetic confinement described by the present invention
  • Figure 2 illustrates a three-dimensional view of a deposition chamber described by the present invention
  • Figure 3 illustrates a deposition unit described by the present invention which has additional magnetic means
  • Figure 5 illustrates a cross section of a deposition unit with independent
  • Figure 6 shows a multi-station deposition unit described by the present invention
  • Figure 7 represents a multi-station deposition unit described by the present
  • Figure 8 illustrates a system with higher levels of magnetic confinement made
  • Figure 9 illustrates a system with low levels of magnetic confinement brought
  • Figure 10 illustrates a system with very low levels of magnetic confinement
  • Figure 11 illustrates a system with different levels of magnetic confinement for
  • Figure 1 represents the top view of a cylindrically shaped chamber.
  • the deposition unit includes a vacuum chamber 1, which is evacuated by means of
  • the front face of the outer magnetic pole of the magnetrons 5 have opposite polarity to the magnetic means placed at the central zone of the chamber 6 so mat the magnetic field lines 7 cross the zone of elements due for
  • the magnetic poles contained within the magnetron may or may not have one or several ferromagnetic elements, such as a soft iron backing plate,
  • the vacuum chamber 1 could be constructed
  • Figure 2 represents a deposition apparatus where the magnetrons 3 are placed
  • a magnetic assembly 6 is placed within a central pole.
  • FIG. 3 represents a top view of a two magnetron apparatus where the central
  • magnetic means 6 has an opposite magnetic polarity to that of the outer
  • Figure 4 represents a top view of a three magnetron apparatus where the
  • central magnetic means 6 has an opposite polarity to mat of the outer magnetic means 5 of the magnetrons 3. Additional magnetic means 8 and 9 enhance
  • Magnetic means 6 and 9 could be varied either by mechanical displacement or electronic currents so that the degree of confinement could be modulated as magnetic lines 7 are altered.
  • central magnetic means 6 could be independently biased from the samples 2.
  • This magnetic array could be left at a floating potential (where electronic
  • samples could be biased by for example DC, AC, Pulsed-LF, MF, RF or any combination or modulation of the above.
  • Figure 6 represents a multi-station coating apparatus where the deposition units comprise four different coating stations which provide four different confinement volumes. Each station, in the present example, has different
  • Figure 7 represents a multi-station coatmg apparatus.
  • the deposition apparatus
  • magnetrons are situated on me chambers wall 1. Two series of magnetic poles
  • Figure 8 represents a single station coating apparatus with the magnetrons inner magnetic means 11 being withdrawn independently of me magnetrons
  • means 6 as an example, comprises a number of independently controlable magnetic means 12 each of which can independently have its polarity changed
  • Figure 9 represents a single station apparatus where the central magnetic
  • Figure 10 represents a single station coating apparatus where the central
  • magnetrons outer magnetic means 5 with the further retraction of the magnetrons outer magnetic means 5 increasing the effect of preventing linkage
  • Figure 11 represents a single station coating apparatus where the central
  • magnetic means 12 have two different polarities.
  • the magnetrons have two different polarities 3a and 3b, providing different
  • Targets 4 could be
  • three of the magnetrons present a magnetic confinement due to complementary polarity with the central magnetic means.
  • One of the magnetrons presents the same

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Surface Treatment Of Glass (AREA)
  • Glass Compositions (AREA)
  • Power Steering Mechanism (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Supports For Pipes And Cables (AREA)

Abstract

The invention relates to a vapour deposition coating apparatus. More particularly it relates to an apparatus in which the ion current density is carefully controlled to improve coating. This control enhances the versatility and enlarges the range of deposition conditions which can be achieved within a single apparatus, so that coatings with very different properties can be deposited in the same equipment. The vapour deposition apparatus includes a vacuum chamber (1), at least one coating means or ionisation source (3) disposed at or about the periphery of a coating zone (2), one or more internal magnetic means (6) positioned such that the magnetic field lines (7) are generated across the coating zone (2) and means for altering the strength or position of the magnetic field lines to aid confinement.

Description

VAPOUR DEPOSITION COATING APPARATUS
TECHNICAL FIELD
This invention relates to a vapour deposition coating apparatus. More
particularly it relates to an apparatus in which the ion current density is
carefully controlled to improve coating. This control enhances the versatility and enlarges the range of deposition conditions which can be achieved within a
single apparatus, so that coatings with very different properties can be deposited in the same equipment. Also, the present invention enables high quality coatings to be deposited in a large volume apparatus improving the coating productivity and component throughput. The deposition apparatus is
based upon magnetron sputtering sources in which the ion current driven towards the samples is carefully controlled.
BACKGROUND ART
Magnetron sputtering is a very well established technique which is able
to produce high quality vapour deposited coatings for a wide range of applications.
A number of improvements in magnetron sputtering have occurred during the last ten years. The first break through was provided by the unbalanced magnetron [B. WINDOWS, N. SAVVIDES, J. Vac. Sci. Technoi., A4 (1986) 453] which improved the ion flux escaping the magnetron surrounding so the samples to be coated were subjected to a higher ion
bombardment with beneficial effects in the structure of certain types of coatings. Variations in this principle and control modes for the degree of
unbalancing have been previously disclosed [W. MAASS, B. CORD, D. FERENBACH, T. MARTENS, P. WIRZ, Patent DE 3812379 14 April 1988].
In the case of large volume coating apparatus it has been necessary to
provide high ionisation sources in areas well away from the magnetron. This extra ionisation has been implemented by the use of supplementary excitation sources such as radio-frequency and microwave means [M. NIHEI, J. ONUKI, Y. KOUBUCHI, K. MIYAZAKI, T. ITAGAKI, Patent JP 60421/87 Priority 16 March 1988] and the provision of magnetic arrangements next to the
magnetron sources [D.G. TEER, Proceedings for the First International Symposium on Sputtering and Plasma Processing - ISSPO 91, Tokyo, Japan, February 1991; and A.FEUERSTEIN, D. HOFMANN, H. SCHUSSLER, Patent DE 4038497 .Priority 3 Dec 1990, and S. KADLEC, J. MUSIL, Patent CS4804/89, Priority 14 Aug 89; and W.D. MUNZ, F.J.M. HAUZER, B.J.A. BUIL, D. SCHULZE, R. TIETEMA, Patent DE 4017111 Priority 28 May 1990]. All described methods have had a limitation in the maximum chamber size, generally limited to 0.5 to 1 metres in diameter, that can be used for the deposition of a successful coating.
The present invention overcomes such a limitation and can give rise to a novel apparatus which could be up to four meters in diameter.
DISCLOSURE OF THE INVENTION
According to one aspect of the present invention there is provided a
vapour deposition coating apparatus comprising a vacuum chamber (1), at least
one coating means or ionization source (3) disposed at or about the periphery
of a coating zone (2), characterised in that the apparatus is provided with one or more internal magnetic means (6) positioned such that magnetic field lines (7) are generated across the coating zone (2) and means for altering the
strength or position of the magnetic field lines.
According to a further aspect of the present invention there is provided
a multi-station deposition unit comprising a plurality of coating stations (3,6)
each defining a confinement volume, the unit comprising a plurality of coating
means or ionization sources (3) disposed at or about the periphery of the
coating zone and one or more internal magnetic means (6) (10) positioned such
that magnetic field lines (7) are generated across each coating zone (2) and means for altering the strength or position of the magnetic field lines.
According to yet a further aspect of the present invention there is provided a vapour deposition coating method characterised in mat magnetic field lines (7) can be regulated across a coating zone (2) by means (3) (6) which enable an ion current density to be controlled.
The apparatus can incorporate a number of coating means of which one is preferably a magnetron cathode which will be situated around the samples to
be coated. At or towards the interior of the chamber a single or plurality of
means generate a magnetic field. These means could comprise a single or plurality of magnetic polarities which could be the same or different to those of the outer magnetic array of the magnetron source. These magnetic sources
provide a means enabling deposition under different ion bombardment conditions to be controlled in different areas of the coating apparatus and/or at
different times in me deposition process.
The magnetic strength of these poles could be controlled by different
means, e.g. by changing the current of the electromagnet units or by mechanical displacement of the permanent magnetic means or both.
Identical or different magnetron polarities could be used within the same apparatus.
The magnetic strength of the magnetrons could be also varied as could the relative position of the inner and outer magnetic poles.
Auxiliary magnetic poles could be used in the chamber surroundings in
order to optimise me plasma confinement. Magnetic confinement enhancement could be achieved by magnetic means which present opposite polarity to the central pole. Also suitable electric currents could provide adequate magnetic confinement by generating magnetic fields for this purpose, especially when
they are combined with other magnetic means.
All these magnetic variations make the apparatus versatile in its
applications.
Generally, the apparatus will enable maximum magnetic confinement
necessary in larger deposition apparatus to ensure high quality coatings.
The internal magnetic means could have independent biasing from the samples to be coated. The samples to be coated could be biased or un-biased. The bias applied to the samples to be coated could be powered by direct current (DC)
and alternative excitation means at different frequencies such as alternating
current (AC) at very low frequencies (1-1000 Hz), or pulsed voltages at low
frequencies (Pulsed-LF) (1-1000 KHz), or medium frequency (MF) waves (1-3 MHz), or radiofrequencies (RF) waves (1-1000 MHz), or any combination or
modulation of these or other excitation means.
The apparatus could incorporate any other number of means in order to
enhance the ionisation such as microwaves and/or medium and high frequency devices and means suitable for the generation of glow discharges and ion vacuum techniques such as arcs, hot filament, lasers, electron guns and ion beams.
Larger apparatus, above two metres in diameter can be produced by magnetic linkage between magnetrons and internal poles. Spatial distribution of
magnetrons and additional magnetic means could be varied in order to achieve optimisation of spaces where magnetic confinement conditions are appropriate
for coating depositions. A large coating apparatus could comprise of one or more confinement areas or stations.
Various aspects of the invention will be described, by way of example
only with reference to figures 1 to 11 below in which: Figure 1 shows an example of a deposition apparatus which includes the basic magnetic confinement described by the present invention;
Figure 2 illustrates a three-dimensional view of a deposition chamber described by the present invention;
Figure 3 illustrates a deposition unit described by the present invention which has additional magnetic means;
Figure 4 illustrates a deposition unit with additional magnetic means which could modulate the magnetic confinement as described by the present invention;
Figure 5 illustrates a cross section of a deposition unit with independent
biasing for the central magnetic mean from the samples as described by the present invention;
Figure 6 shows a multi-station deposition unit described by the present invention; Figure 7 represents a multi-station deposition unit described by the present
invention;
Figure 8 illustrates a system with higher levels of magnetic confinement made
by retracting to some degree the inner magnetron magnetic pole as described by the present invention;
Figure 9 illustrates a system with low levels of magnetic confinement brought
about by the switching of the central polarity such that it is the same as the
outer pole of the magnetron as described by the present invention;
Figure 10 illustrates a system with very low levels of magnetic confinement
which are further decreased by withdrawing the magnetrons outer magnetic pole to some degree as described by the present invention; and
Figure 11 illustrates a system with different levels of magnetic confinement for
different areas of the coating station as described by the present invention.
Referring to the figures in turn:
Figure 1 represents the top view of a cylindrically shaped chamber. The deposition unit includes a vacuum chamber 1, which is evacuated by means of
a pumping system. The elements due for coating 2 could rotate so they could
face the different magnetrons 3 or other possible coating means or ionisation sources. The sputtering process takes place on the surface of the magnetron
targets 4. The front face of the outer magnetic pole of the magnetrons 5 have opposite polarity to the magnetic means placed at the central zone of the chamber 6 so mat the magnetic field lines 7 cross the zone of elements due for
coating 2. The magnetic poles contained within the magnetron may or may not have one or several ferromagnetic elements, such as a soft iron backing plate,
at e rear of me magnetic pole. The vacuum chamber 1, could be constructed
from non-ferromagnetic or ferromagnetic material in order to either affect or not affect the magnetic circuits.
Figure 2 represents a deposition apparatus where the magnetrons 3 are placed
on the chamber wall 1. A magnetic assembly 6 is placed within a central pole.
Samples 2 are coated with the target material 4 or any other chemical compounds formed in plasma reactions during the deposition process. Figure 3 represents a top view of a two magnetron apparatus where the central
magnetic means 6 has an opposite magnetic polarity to that of the outer
magnetic means 5 of the magnetrons 3. Additional magnetic means 8 situated
around the samples, e.g. by the chamber walls, provide magnetic fields which
complement and enhance magnetic confinement within the system so magnetic field lines 7 cross the samples 2 towards me central pole.
Figure 4 represents a top view of a three magnetron apparatus where the
central magnetic means 6 has an opposite polarity to mat of the outer magnetic means 5 of the magnetrons 3. Additional magnetic means 8 and 9 enhance
confinement. Magnetic means 6 and 9 could be varied either by mechanical displacement or electronic currents so that the degree of confinement could be modulated as magnetic lines 7 are altered.
Figure 5 represents a cross sectional view of a deposition apparatus where the
central magnetic means 6 could be independently biased from the samples 2.
This magnetic array could be left at a floating potential (where electronic
current is equal to the ionic current), or biased at the same or a different potential to that of the samples with a positive or negative polarity. The
samples could be biased by for example DC, AC, Pulsed-LF, MF, RF or any combination or modulation of the above.
Figure 6 represents a multi-station coating apparatus where the deposition units comprise four different coating stations which provide four different confinement volumes. Each station, in the present example, has different
magnetrons 3 and coats different samples 2. Magnetic confinement is produced
between magnetrons 3 and a local central pole 6.
Figure 7 represents a multi-station coatmg apparatus. The deposition apparatus
comprises three different sample holders 2. In the present example all the
magnetrons are situated on me chambers wall 1. Two series of magnetic poles
6 and 10 of opposite polarity direct the magnetic field lines 7 across the
samples.
Figure 8 represents a single station coating apparatus with the magnetrons inner magnetic means 11 being withdrawn independently of me magnetrons
outer magnetic means 5 so as to further enhance the magnetic linkage 7 to the central pole 6 and the magnetrons outer magnetic means 5. Central magnetic
means 6, as an example, comprises a number of independently controlable magnetic means 12 each of which can independently have its polarity changed
by for example rotation and/or translation of their constitutive permanent
magnets.
Figure 9 represents a single station apparatus where the central magnetic
means 12 have been reversed such mat the polarity is the same as the magnetrons outer magnetic means 5, hence having the effect of preventing
linkage wim me inner magnetic pole 6.
Figure 10 represents a single station coating apparatus where the central
magnetic means 12 have been reversed such that the polarity is the same as the
magnetrons outer magnetic means 5, with the further retraction of the magnetrons outer magnetic means 5 increasing the effect of preventing linkage
with the inner magnetic pole 6.
Figure 11 represents a single station coating apparatus where the central
magnetic means 12 have two different polarities. At me same time the magnetrons have two different polarities 3a and 3b, providing different
magnetic confinement in different areas of the station. This situation allows coating deposition at different degrees of ion bombardment. Targets 4 could be
of the same or of different materials. In the present example three of the magnetrons present a magnetic confinement due to complementary polarity with the central magnetic means. One of the magnetrons presents the same
polarity as the corresponding central magnetic mean preventing linkage with
the inner magnetic pole 6.

Claims

CLAEMS
1. A Vapour deposition coating apparatus comprising a vacuum
chamber (1), at least one coating means or ionization source (3) disposed at or
about the periphery of a coatmg zone (2), characterised in that the apparatus is provided with one or more internal magnetic means (6) positioned such mat
magnetic field lines (7) are generated across the coating zone (2) and means for altering the strength or position of the magnetic field lines.
2. An apparatus as claimed in claim 1 in which the at least one coating means or ionisation source is a magnetron (3).
3. An apparatus as claimed in claim 1 or 2 in which the coating means or ionization source comprises permanent or electromagnetic arrays capable of
generating strong magnetic fields.
4. An apparatus as claimed in any of the preceding claims in which the
internal magnetic means are positioned substantially at me centre of the chamber.
5. An apparatus as claimed in any of the preceding claims wherein the internal magnetic means (6) comprises a single or plurality of polarities.
6. An apparatus as claimed in any of the preceding claims, comprising means for displacing me internal magnetic means.
7. An apparatus as claimed in any of die preceding claims in which the
coating means or ionization source (3) and/or me internal magnetic means (6) (10) have different polarities and are arranged such mat me polarities can be
altered with respect to one another.
8. A multi-station deposition unit comprising a plurality of coating
stations (3,6) each defining a confinement volume, the unit comprising a plurality of coating means or ionization sources (3) disposed at or about the periphery of the coating zone and one or more internal magnetic means (6) (10) positioned such mat magnetic field lines (7) are generated across each
coating zone (2) and means for altering the strength or position of the magnetic
field lines.
9. A multi-station coating apparatus as claimed in claim 8 in which the
one or more internal magnetic means comprise two series of magnetic poles
(6) (10) of opposite polarity which direct the magnetic field lines (7) across
each coating zone (2).
10. A vapour deposition coating method characterised in mat magnetic
field lines (7) are regulated across a coating zone (2) by altering their strength
or position.
PCT/GB1998/000047 1997-01-07 1998-01-07 Vapour deposition coating apparatus Ceased WO1998031041A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP98900312A EP1016121B1 (en) 1997-01-07 1998-01-07 Vapour deposition coating apparatus
JP53064598A JP2001507756A (en) 1997-01-07 1998-01-07 Vapor deposition coating equipment
AT98900312T ATE298928T1 (en) 1997-01-07 1998-01-07 STEAM DEPOSIT COATING APPARATUS
US09/341,072 US6383565B1 (en) 1997-01-07 1998-01-07 Vapor deposition coating apparatus
DE69830736T DE69830736T2 (en) 1997-01-07 1998-01-07 STEAM PRECIPITATION COATING DEVICE
CN98801695A CN1243599A (en) 1997-01-07 1998-01-07 Vapour deposition coating apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9700158.0A GB9700158D0 (en) 1997-01-07 1997-01-07 Versatile coating deposition system
GB9700158.0 1997-01-07

Publications (1)

Publication Number Publication Date
WO1998031041A1 true WO1998031041A1 (en) 1998-07-16

Family

ID=10805582

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1998/000047 Ceased WO1998031041A1 (en) 1997-01-07 1998-01-07 Vapour deposition coating apparatus

Country Status (8)

Country Link
US (1) US6383565B1 (en)
EP (1) EP1016121B1 (en)
JP (1) JP2001507756A (en)
CN (1) CN1243599A (en)
AT (1) ATE298928T1 (en)
DE (1) DE69830736T2 (en)
GB (1) GB9700158D0 (en)
WO (1) WO1998031041A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19939040B4 (en) * 1998-08-19 2005-12-29 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe Magnetronsputtergerät
EP1375698A4 (en) * 2001-03-30 2006-09-27 Kobe Steel Ltd Sputter device
DE102006020004A1 (en) * 2006-04-26 2008-01-17 Systec System- Und Anlagentechnik Gmbh & Co.Kg Apparatus and method for homogeneous PVD coating

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* Cited by examiner, † Cited by third party
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CN102912297A (en) * 2012-10-22 2013-02-06 东莞市汇成真空科技有限公司 Horizontal roller vacuum coating machine
US11615947B2 (en) * 2020-09-01 2023-03-28 Oem Group, Llc Systems and methods for an improved magnetron electromagnetic assembly
CN114214596B (en) * 2021-11-09 2023-09-29 维达力实业(深圳)有限公司 Magnetron sputtering coating chamber, coating machine and coating method
CN114574830B (en) * 2022-03-11 2024-03-26 陕西理工大学 Magnet arrangement structure for magnetron sputtering target cathode
US20240206045A1 (en) * 2022-11-19 2024-06-20 Fusion Energy Associates LLC Magnetic means for coating surfaces with liquids

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3905887A (en) * 1973-01-12 1975-09-16 Coulter Information Systems Thin film deposition method using segmented plasma
JPS59172225A (en) * 1983-03-18 1984-09-28 Matsushita Electric Ind Co Ltd Manufacture of thin film magnetic material
JPS63262462A (en) * 1987-04-17 1988-10-28 Ube Ind Ltd Plasma controlled magnetron sputtering apparatus and method
EP0328257A2 (en) * 1988-02-08 1989-08-16 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
US5022978A (en) * 1990-03-22 1991-06-11 Leybold Aktiengesellschaft Apparatus for coating three dimensional substrates by means of cathode sputtering
US5439574A (en) * 1992-04-09 1995-08-08 Anelva Corporation Method for successive formation of thin films

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4871433A (en) * 1986-04-04 1989-10-03 Materials Research Corporation Method and apparatus for improving the uniformity ion bombardment in a magnetron sputtering system
DE4038497C1 (en) * 1990-12-03 1992-02-20 Leybold Ag, 6450 Hanau, De
US5907220A (en) * 1996-03-13 1999-05-25 Applied Materials, Inc. Magnetron for low pressure full face erosion

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3905887A (en) * 1973-01-12 1975-09-16 Coulter Information Systems Thin film deposition method using segmented plasma
JPS59172225A (en) * 1983-03-18 1984-09-28 Matsushita Electric Ind Co Ltd Manufacture of thin film magnetic material
JPS63262462A (en) * 1987-04-17 1988-10-28 Ube Ind Ltd Plasma controlled magnetron sputtering apparatus and method
EP0328257A2 (en) * 1988-02-08 1989-08-16 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
US5022978A (en) * 1990-03-22 1991-06-11 Leybold Aktiengesellschaft Apparatus for coating three dimensional substrates by means of cathode sputtering
US5439574A (en) * 1992-04-09 1995-08-08 Anelva Corporation Method for successive formation of thin films

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 027 (E - 294) 6 February 1985 (1985-02-06) *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 069 (C - 569) 16 February 1989 (1989-02-16) *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19939040B4 (en) * 1998-08-19 2005-12-29 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe Magnetronsputtergerät
EP1375698A4 (en) * 2001-03-30 2006-09-27 Kobe Steel Ltd Sputter device
DE102006020004A1 (en) * 2006-04-26 2008-01-17 Systec System- Und Anlagentechnik Gmbh & Co.Kg Apparatus and method for homogeneous PVD coating
DE102006020004B4 (en) * 2006-04-26 2011-06-01 Systec System- Und Anlagentechnik Gmbh & Co.Kg Apparatus and method for homogeneous PVD coating

Also Published As

Publication number Publication date
EP1016121B1 (en) 2005-06-29
DE69830736D1 (en) 2005-08-04
ATE298928T1 (en) 2005-07-15
GB9700158D0 (en) 1997-02-26
JP2001507756A (en) 2001-06-12
CN1243599A (en) 2000-02-02
US6383565B1 (en) 2002-05-07
DE69830736T2 (en) 2006-05-18
US20020050453A1 (en) 2002-05-02
EP1016121A1 (en) 2000-07-05

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