WO1998031041A1 - Vapour deposition coating apparatus - Google Patents
Vapour deposition coating apparatus Download PDFInfo
- Publication number
- WO1998031041A1 WO1998031041A1 PCT/GB1998/000047 GB9800047W WO9831041A1 WO 1998031041 A1 WO1998031041 A1 WO 1998031041A1 GB 9800047 W GB9800047 W GB 9800047W WO 9831041 A1 WO9831041 A1 WO 9831041A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coating
- magnetic
- field lines
- magnetic field
- zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
Definitions
- This invention relates to a vapour deposition coating apparatus. More
- the deposition apparatus is
- Magnetron sputtering is a very well established technique which is able
- the present invention overcomes such a limitation and can give rise to a novel apparatus which could be up to four meters in diameter.
- vapour deposition coating apparatus comprising a vacuum chamber (1), at least
- one coating means or ionization source (3) disposed at or about the periphery
- the apparatus is provided with one or more internal magnetic means (6) positioned such that magnetic field lines (7) are generated across the coating zone (2) and means for altering the
- a multi-station deposition unit comprising a plurality of coating stations (3,6)
- each defining a confinement volume the unit comprising a plurality of coating
- magnetic field lines (7) are generated across each coating zone (2) and means for altering the strength or position of the magnetic field lines.
- vapour deposition coating method characterised in mat magnetic field lines (7) can be regulated across a coating zone (2) by means (3) (6) which enable an ion current density to be controlled.
- the apparatus can incorporate a number of coating means of which one is preferably a magnetron cathode which will be situated around the samples to
- means generate a magnetic field.
- These means could comprise a single or plurality of magnetic polarities which could be the same or different to those of the outer magnetic array of the magnetron source.
- the magnetic strength of the magnetrons could be also varied as could the relative position of the inner and outer magnetic poles.
- Auxiliary magnetic poles could be used in the chamber surroundings in
- Magnetic confinement enhancement could be achieved by magnetic means which present opposite polarity to the central pole. Also suitable electric currents could provide adequate magnetic confinement by generating magnetic fields for this purpose, especially when
- the apparatus will enable maximum magnetic confinement
- AC AC current
- Pulsed-LF (1-1000 KHz
- MF medium frequency
- RF radiofrequencies
- the apparatus could incorporate any other number of means in order to provide
- magnetrons and additional magnetic means could be varied in order to achieve optimisation of spaces where magnetic confinement conditions are appropriate
- a large coating apparatus could comprise of one or more confinement areas or stations.
- Figure 1 shows an example of a deposition apparatus which includes the basic magnetic confinement described by the present invention
- Figure 2 illustrates a three-dimensional view of a deposition chamber described by the present invention
- Figure 3 illustrates a deposition unit described by the present invention which has additional magnetic means
- Figure 5 illustrates a cross section of a deposition unit with independent
- Figure 6 shows a multi-station deposition unit described by the present invention
- Figure 7 represents a multi-station deposition unit described by the present
- Figure 8 illustrates a system with higher levels of magnetic confinement made
- Figure 9 illustrates a system with low levels of magnetic confinement brought
- Figure 10 illustrates a system with very low levels of magnetic confinement
- Figure 11 illustrates a system with different levels of magnetic confinement for
- Figure 1 represents the top view of a cylindrically shaped chamber.
- the deposition unit includes a vacuum chamber 1, which is evacuated by means of
- the front face of the outer magnetic pole of the magnetrons 5 have opposite polarity to the magnetic means placed at the central zone of the chamber 6 so mat the magnetic field lines 7 cross the zone of elements due for
- the magnetic poles contained within the magnetron may or may not have one or several ferromagnetic elements, such as a soft iron backing plate,
- the vacuum chamber 1 could be constructed
- Figure 2 represents a deposition apparatus where the magnetrons 3 are placed
- a magnetic assembly 6 is placed within a central pole.
- FIG. 3 represents a top view of a two magnetron apparatus where the central
- magnetic means 6 has an opposite magnetic polarity to that of the outer
- Figure 4 represents a top view of a three magnetron apparatus where the
- central magnetic means 6 has an opposite polarity to mat of the outer magnetic means 5 of the magnetrons 3. Additional magnetic means 8 and 9 enhance
- Magnetic means 6 and 9 could be varied either by mechanical displacement or electronic currents so that the degree of confinement could be modulated as magnetic lines 7 are altered.
- central magnetic means 6 could be independently biased from the samples 2.
- This magnetic array could be left at a floating potential (where electronic
- samples could be biased by for example DC, AC, Pulsed-LF, MF, RF or any combination or modulation of the above.
- Figure 6 represents a multi-station coating apparatus where the deposition units comprise four different coating stations which provide four different confinement volumes. Each station, in the present example, has different
- Figure 7 represents a multi-station coatmg apparatus.
- the deposition apparatus
- magnetrons are situated on me chambers wall 1. Two series of magnetic poles
- Figure 8 represents a single station coating apparatus with the magnetrons inner magnetic means 11 being withdrawn independently of me magnetrons
- means 6 as an example, comprises a number of independently controlable magnetic means 12 each of which can independently have its polarity changed
- Figure 9 represents a single station apparatus where the central magnetic
- Figure 10 represents a single station coating apparatus where the central
- magnetrons outer magnetic means 5 with the further retraction of the magnetrons outer magnetic means 5 increasing the effect of preventing linkage
- Figure 11 represents a single station coating apparatus where the central
- magnetic means 12 have two different polarities.
- the magnetrons have two different polarities 3a and 3b, providing different
- Targets 4 could be
- three of the magnetrons present a magnetic confinement due to complementary polarity with the central magnetic means.
- One of the magnetrons presents the same
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Surface Treatment Of Glass (AREA)
- Glass Compositions (AREA)
- Power Steering Mechanism (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
- Supports For Pipes And Cables (AREA)
Abstract
Description
Claims
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP98900312A EP1016121B1 (en) | 1997-01-07 | 1998-01-07 | Vapour deposition coating apparatus |
| JP53064598A JP2001507756A (en) | 1997-01-07 | 1998-01-07 | Vapor deposition coating equipment |
| AT98900312T ATE298928T1 (en) | 1997-01-07 | 1998-01-07 | STEAM DEPOSIT COATING APPARATUS |
| US09/341,072 US6383565B1 (en) | 1997-01-07 | 1998-01-07 | Vapor deposition coating apparatus |
| DE69830736T DE69830736T2 (en) | 1997-01-07 | 1998-01-07 | STEAM PRECIPITATION COATING DEVICE |
| CN98801695A CN1243599A (en) | 1997-01-07 | 1998-01-07 | Vapour deposition coating apparatus |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB9700158.0A GB9700158D0 (en) | 1997-01-07 | 1997-01-07 | Versatile coating deposition system |
| GB9700158.0 | 1997-01-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1998031041A1 true WO1998031041A1 (en) | 1998-07-16 |
Family
ID=10805582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/GB1998/000047 Ceased WO1998031041A1 (en) | 1997-01-07 | 1998-01-07 | Vapour deposition coating apparatus |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6383565B1 (en) |
| EP (1) | EP1016121B1 (en) |
| JP (1) | JP2001507756A (en) |
| CN (1) | CN1243599A (en) |
| AT (1) | ATE298928T1 (en) |
| DE (1) | DE69830736T2 (en) |
| GB (1) | GB9700158D0 (en) |
| WO (1) | WO1998031041A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19939040B4 (en) * | 1998-08-19 | 2005-12-29 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe | Magnetronsputtergerät |
| EP1375698A4 (en) * | 2001-03-30 | 2006-09-27 | Kobe Steel Ltd | Sputter device |
| DE102006020004A1 (en) * | 2006-04-26 | 2008-01-17 | Systec System- Und Anlagentechnik Gmbh & Co.Kg | Apparatus and method for homogeneous PVD coating |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4812991B2 (en) * | 2001-09-20 | 2011-11-09 | 東京エレクトロン株式会社 | Plasma processing equipment |
| EP1999776A1 (en) * | 2006-03-28 | 2008-12-10 | NV Bekaert SA | Coating apparatus |
| TW201144462A (en) * | 2010-06-10 | 2011-12-16 | Hon Hai Prec Ind Co Ltd | Coating device |
| US10077207B2 (en) | 2011-11-30 | 2018-09-18 | Corning Incorporated | Optical coating method, apparatus and product |
| TWI661065B (en) | 2011-11-30 | 2019-06-01 | 美商康寧公司 | Magnetic substrate carrier and magnetic carrier |
| US9957609B2 (en) | 2011-11-30 | 2018-05-01 | Corning Incorporated | Process for making of glass articles with optical and easy-to-clean coatings |
| CN102912297A (en) * | 2012-10-22 | 2013-02-06 | 东莞市汇成真空科技有限公司 | Horizontal roller vacuum coating machine |
| US11615947B2 (en) * | 2020-09-01 | 2023-03-28 | Oem Group, Llc | Systems and methods for an improved magnetron electromagnetic assembly |
| CN114214596B (en) * | 2021-11-09 | 2023-09-29 | 维达力实业(深圳)有限公司 | Magnetron sputtering coating chamber, coating machine and coating method |
| CN114574830B (en) * | 2022-03-11 | 2024-03-26 | 陕西理工大学 | Magnet arrangement structure for magnetron sputtering target cathode |
| US20240206045A1 (en) * | 2022-11-19 | 2024-06-20 | Fusion Energy Associates LLC | Magnetic means for coating surfaces with liquids |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3905887A (en) * | 1973-01-12 | 1975-09-16 | Coulter Information Systems | Thin film deposition method using segmented plasma |
| JPS59172225A (en) * | 1983-03-18 | 1984-09-28 | Matsushita Electric Ind Co Ltd | Manufacture of thin film magnetic material |
| JPS63262462A (en) * | 1987-04-17 | 1988-10-28 | Ube Ind Ltd | Plasma controlled magnetron sputtering apparatus and method |
| EP0328257A2 (en) * | 1988-02-08 | 1989-08-16 | Optical Coating Laboratory, Inc. | Magnetron sputtering apparatus and process |
| US5022978A (en) * | 1990-03-22 | 1991-06-11 | Leybold Aktiengesellschaft | Apparatus for coating three dimensional substrates by means of cathode sputtering |
| US5439574A (en) * | 1992-04-09 | 1995-08-08 | Anelva Corporation | Method for successive formation of thin films |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4871433A (en) * | 1986-04-04 | 1989-10-03 | Materials Research Corporation | Method and apparatus for improving the uniformity ion bombardment in a magnetron sputtering system |
| DE4038497C1 (en) * | 1990-12-03 | 1992-02-20 | Leybold Ag, 6450 Hanau, De | |
| US5907220A (en) * | 1996-03-13 | 1999-05-25 | Applied Materials, Inc. | Magnetron for low pressure full face erosion |
-
1997
- 1997-01-07 GB GBGB9700158.0A patent/GB9700158D0/en active Pending
-
1998
- 1998-01-07 US US09/341,072 patent/US6383565B1/en not_active Expired - Fee Related
- 1998-01-07 DE DE69830736T patent/DE69830736T2/en not_active Expired - Fee Related
- 1998-01-07 CN CN98801695A patent/CN1243599A/en active Pending
- 1998-01-07 JP JP53064598A patent/JP2001507756A/en not_active Ceased
- 1998-01-07 EP EP98900312A patent/EP1016121B1/en not_active Expired - Lifetime
- 1998-01-07 WO PCT/GB1998/000047 patent/WO1998031041A1/en not_active Ceased
- 1998-01-07 AT AT98900312T patent/ATE298928T1/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3905887A (en) * | 1973-01-12 | 1975-09-16 | Coulter Information Systems | Thin film deposition method using segmented plasma |
| JPS59172225A (en) * | 1983-03-18 | 1984-09-28 | Matsushita Electric Ind Co Ltd | Manufacture of thin film magnetic material |
| JPS63262462A (en) * | 1987-04-17 | 1988-10-28 | Ube Ind Ltd | Plasma controlled magnetron sputtering apparatus and method |
| EP0328257A2 (en) * | 1988-02-08 | 1989-08-16 | Optical Coating Laboratory, Inc. | Magnetron sputtering apparatus and process |
| US5022978A (en) * | 1990-03-22 | 1991-06-11 | Leybold Aktiengesellschaft | Apparatus for coating three dimensional substrates by means of cathode sputtering |
| US5439574A (en) * | 1992-04-09 | 1995-08-08 | Anelva Corporation | Method for successive formation of thin films |
Non-Patent Citations (2)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 009, no. 027 (E - 294) 6 February 1985 (1985-02-06) * |
| PATENT ABSTRACTS OF JAPAN vol. 013, no. 069 (C - 569) 16 February 1989 (1989-02-16) * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19939040B4 (en) * | 1998-08-19 | 2005-12-29 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe | Magnetronsputtergerät |
| EP1375698A4 (en) * | 2001-03-30 | 2006-09-27 | Kobe Steel Ltd | Sputter device |
| DE102006020004A1 (en) * | 2006-04-26 | 2008-01-17 | Systec System- Und Anlagentechnik Gmbh & Co.Kg | Apparatus and method for homogeneous PVD coating |
| DE102006020004B4 (en) * | 2006-04-26 | 2011-06-01 | Systec System- Und Anlagentechnik Gmbh & Co.Kg | Apparatus and method for homogeneous PVD coating |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1016121B1 (en) | 2005-06-29 |
| DE69830736D1 (en) | 2005-08-04 |
| ATE298928T1 (en) | 2005-07-15 |
| GB9700158D0 (en) | 1997-02-26 |
| JP2001507756A (en) | 2001-06-12 |
| CN1243599A (en) | 2000-02-02 |
| US6383565B1 (en) | 2002-05-07 |
| DE69830736T2 (en) | 2006-05-18 |
| US20020050453A1 (en) | 2002-05-02 |
| EP1016121A1 (en) | 2000-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7411352B2 (en) | Dual plasma beam sources and method | |
| US7932678B2 (en) | Magnetic mirror plasma source and method using same | |
| KR890004880B1 (en) | Method and device for sputtering | |
| KR101366125B1 (en) | Microwave-assisted rotatable pvd | |
| KR100223394B1 (en) | Plasma processing equipment | |
| US4013532A (en) | Method for coating a substrate | |
| EP1016121B1 (en) | Vapour deposition coating apparatus | |
| JP4491132B2 (en) | Plasma processing equipment | |
| KR100874808B1 (en) | Coaxial Electromagnets in Magnetron Sputtering Reactors | |
| US5417834A (en) | Arrangement for generating a plasma by means of cathode sputtering | |
| US5006218A (en) | Sputtering apparatus | |
| US6599399B2 (en) | Sputtering method to generate ionized metal plasma using electron beams and magnetic field | |
| US5900284A (en) | Plasma generating device and method | |
| US6238528B1 (en) | Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source | |
| US6231725B1 (en) | Apparatus for sputtering material onto a workpiece with the aid of a plasma | |
| JP2004537825A (en) | Magnetic mirror plasma source | |
| KR20010052312A (en) | Method and apparatus for ionized physical vapor deposition | |
| JPH05202470A (en) | Device for coating part with cathode sputtering | |
| JPH06220632A (en) | Device for generating plasma by cathode sputtering and microwave irradiation | |
| WO2002092873A2 (en) | Relationship to other applications and patents | |
| US5993598A (en) | Magnetron | |
| KR100250547B1 (en) | Arrangement for coating or etching substrates | |
| US5993678A (en) | Device and method for processing a plasma to alter the surface of a substrate | |
| RU2023744C1 (en) | Cathode device for application of coatings by ion-plasma method | |
| Golan et al. | Ring etching zones on magnetron sputtering targets |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 98801695.8 Country of ref document: CN |
|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): BR CA CN JP KR MX US |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| ENP | Entry into the national phase |
Ref document number: 1998 530645 Country of ref document: JP Kind code of ref document: A |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 1998900312 Country of ref document: EP |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 09341072 Country of ref document: US |
|
| WWP | Wipo information: published in national office |
Ref document number: 1998900312 Country of ref document: EP |
|
| WWG | Wipo information: grant in national office |
Ref document number: 1998900312 Country of ref document: EP |