WO1998042169A3 - Anordnung zur abführung von wärme einer in einem gehäuse angeordneten wärmequelle - Google Patents

Anordnung zur abführung von wärme einer in einem gehäuse angeordneten wärmequelle Download PDF

Info

Publication number
WO1998042169A3
WO1998042169A3 PCT/DE1998/000670 DE9800670W WO9842169A3 WO 1998042169 A3 WO1998042169 A3 WO 1998042169A3 DE 9800670 W DE9800670 W DE 9800670W WO 9842169 A3 WO9842169 A3 WO 9842169A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
housing
source located
dissipating
heat source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1998/000670
Other languages
English (en)
French (fr)
Other versions
WO1998042169A2 (de
Inventor
Gottfried Rieger
Michael Tirpitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to EP98919048A priority Critical patent/EP0968632A2/de
Publication of WO1998042169A2 publication Critical patent/WO1998042169A2/de
Publication of WO1998042169A3 publication Critical patent/WO1998042169A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Die Anordnung weist ein innerhalb eines Gehäuses (G) angeordnetes primäres und ein außerhalb eines Gehäuses (G) angeordnetes sekundäres Kühlelement (K1, K2) auf, welche zur Abführung von Wärme aus dem Gehäuse (G) über ein Wärmeleitungselement (P) wärmeleitend und mechanisch beweglich verbunden sind. Vorteil der Anordnung zur Abführung von Wärme gemäß der Erfindung ist es, daß diese insbesondere die Gefahr von durch Vibrationen hervorgerufenen Haarrißbildungen am Wärmeleitungselement (P) drastisch verringert. Hierdurch wird vorteilhaft eine Verwendung mit industriellen Umgebungsbedingungen ermöglicht.
PCT/DE1998/000670 1997-03-19 1998-03-06 Anordnung zur abführung von wärme einer in einem gehäuse angeordneten wärmequelle Ceased WO1998042169A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP98919048A EP0968632A2 (de) 1997-03-19 1998-03-06 Anordnung zur abführung von wärme einer in einem gehäuse angeordneten wärmequelle

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE29704885.6 1997-03-19
DE29704885U DE29704885U1 (de) 1997-03-19 1997-03-19 Anordnung zur Abführung von Wärme einer in einem Gehäuse angeordneten Wärmequelle

Publications (2)

Publication Number Publication Date
WO1998042169A2 WO1998042169A2 (de) 1998-09-24
WO1998042169A3 true WO1998042169A3 (de) 1999-02-25

Family

ID=8037653

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/000670 Ceased WO1998042169A2 (de) 1997-03-19 1998-03-06 Anordnung zur abführung von wärme einer in einem gehäuse angeordneten wärmequelle

Country Status (3)

Country Link
EP (1) EP0968632A2 (de)
DE (1) DE29704885U1 (de)
WO (1) WO1998042169A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20220421U1 (de) * 2001-03-21 2003-07-31 Fritschle, Simone, 70197 Stuttgart Computergehäuse
DE10332770A1 (de) * 2003-07-17 2005-02-24 Jürgen Dr.-Ing. Schulz-Harder Kühlvorrichtung zum Abführen von Verlustwärme von einem elektrischen oder elektronischen Bauelement oder Baugruppe
DE102004030675A1 (de) * 2004-06-24 2005-11-10 Nft Nanofiltertechnik Gmbh Kühleinrichtung für elektronische Bauelemente
DE102005019437A1 (de) * 2005-01-25 2006-08-03 Axel Benner Computer
DE102013010867B4 (de) * 2013-06-28 2015-11-12 Protonet GmbH Anordnung zum Kühlen von in einem Gehäuse anordnenbaren elektrischen und/oder elektronischen Bauteilen und Rechner mit einer solchen

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852804A (en) * 1973-05-02 1974-12-03 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly
US4917173A (en) * 1988-11-15 1990-04-17 The United States Of America As Represented By The National Aeronautics And Space Administration Monogroove liquid heat exchanger
EP0401743A1 (de) * 1989-06-08 1990-12-12 The Furukawa Electric Co., Ltd. Kühlvorrichtung mit elektrisch isoliertem Wärmerohr für Halbleiter
EP0441572A2 (de) * 1990-02-07 1991-08-14 Ngk Insulators, Ltd. Leistungshalbleiter mit wärmeableitenden Eigenschaften
FR2687464A1 (fr) * 1992-02-19 1993-08-20 Bernier Jacques Caloducs a melange zeotropique de fluides.
WO1996028005A1 (en) * 1995-03-06 1996-09-12 Ast Research, Inc. A movable heat pipe apparatus for reducing heat build up in electronic devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3226602A (en) * 1962-10-29 1965-12-28 Thore M Elfving Heat transferring mounting panels for electric components and circuits
JPS568238Y2 (de) * 1976-02-14 1981-02-23
DE2801660C2 (de) * 1978-01-16 1986-01-30 kabelmetal electro GmbH, 3000 Hannover Vorrichtung zum Abführen der Verlustwärme von elektronischen Bauelementen
DE3701477A1 (de) * 1987-01-16 1988-07-28 Licentia Gmbh Einrichtung zur kuehlung von leistungswiderstaenden
JP3067399B2 (ja) * 1992-07-03 2000-07-17 株式会社日立製作所 半導体冷却装置
US5343940A (en) * 1992-10-29 1994-09-06 Amigo Jean Flexible heat transfer device
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
DE4312830A1 (de) * 1993-04-20 1994-10-27 Privates Inst Fuer Luft Und Ka Vorrichtung zur Kühlung von hochtemperatursupraleitenden, mikroelektronischen Bauelementen, vorzugsweise Sensoren
DE9312138U1 (de) * 1993-08-13 1993-10-21 Kunze, Burkhard, Dipl.-Ing., 82041 Oberhaching Kühlvorrichtung
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852804A (en) * 1973-05-02 1974-12-03 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly
US4917173A (en) * 1988-11-15 1990-04-17 The United States Of America As Represented By The National Aeronautics And Space Administration Monogroove liquid heat exchanger
EP0401743A1 (de) * 1989-06-08 1990-12-12 The Furukawa Electric Co., Ltd. Kühlvorrichtung mit elektrisch isoliertem Wärmerohr für Halbleiter
EP0441572A2 (de) * 1990-02-07 1991-08-14 Ngk Insulators, Ltd. Leistungshalbleiter mit wärmeableitenden Eigenschaften
FR2687464A1 (fr) * 1992-02-19 1993-08-20 Bernier Jacques Caloducs a melange zeotropique de fluides.
WO1996028005A1 (en) * 1995-03-06 1996-09-12 Ast Research, Inc. A movable heat pipe apparatus for reducing heat build up in electronic devices

Also Published As

Publication number Publication date
DE29704885U1 (de) 1998-04-30
EP0968632A2 (de) 2000-01-05
WO1998042169A2 (de) 1998-09-24

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