WO1999010563A3 - Verfahren und vorrichtung zum energiesparenden gleichzeitigen elektrolytischen behandeln von mehreren werkstücken - Google Patents
Verfahren und vorrichtung zum energiesparenden gleichzeitigen elektrolytischen behandeln von mehreren werkstücken Download PDFInfo
- Publication number
- WO1999010563A3 WO1999010563A3 PCT/DE1998/002501 DE9802501W WO9910563A3 WO 1999010563 A3 WO1999010563 A3 WO 1999010563A3 DE 9802501 W DE9802501 W DE 9802501W WO 9910563 A3 WO9910563 A3 WO 9910563A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpieces
- energy saving
- electrolytic treatment
- partial cells
- several workpieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP98951217A EP1015671A2 (de) | 1997-08-21 | 1998-08-19 | Verfahren und vorrichtung zum energiesparenden gleichzeitigen elektrolytischen behandeln von mehreren werkstücken |
| JP2000507865A JP2001514329A (ja) | 1997-08-21 | 1998-08-19 | 多数の被加工品を省エネで同時に電気分解的に処理するための方法と装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1997136351 DE19736351C1 (de) | 1997-08-21 | 1997-08-21 | Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken |
| DE19736351.2 | 1997-08-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO1999010563A2 WO1999010563A2 (de) | 1999-03-04 |
| WO1999010563A3 true WO1999010563A3 (de) | 1999-08-19 |
Family
ID=7839697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE1998/002501 Ceased WO1999010563A2 (de) | 1997-08-21 | 1998-08-19 | Verfahren und vorrichtung zum energiesparenden gleichzeitigen elektrolytischen behandeln von mehreren werkstücken |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1015671A2 (de) |
| JP (1) | JP2001514329A (de) |
| DE (1) | DE19736351C1 (de) |
| WO (1) | WO1999010563A2 (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10141056C2 (de) * | 2001-08-22 | 2003-12-24 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen |
| DE102005032738B3 (de) * | 2005-07-08 | 2006-11-23 | Siemens Ag | Verfahren und Vorrichtung zum Bearbeiten wenigstens zweier Werkstücke mittels elektrochemischer Behandlung |
| US8062496B2 (en) * | 2008-04-18 | 2011-11-22 | Integran Technologies Inc. | Electroplating method and apparatus |
| US11542626B2 (en) * | 2020-10-08 | 2023-01-03 | Honeywell International Inc. | Systems and methods for enclosed electroplating chambers |
| US11834752B2 (en) * | 2021-04-28 | 2023-12-05 | Honeywell International Inc. | Electroplating systems and methods for wear-resistant coatings |
| CN118856207B (zh) * | 2024-07-26 | 2025-05-23 | 沈阳欧施盾新材料科技有限公司 | 一种复合材料缠绕气瓶的金属内衬层的消除装置及消除方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3909368A (en) * | 1974-07-12 | 1975-09-30 | Louis W Raymond | Electroplating method and apparatus |
| JPS5928597A (ja) * | 1982-08-05 | 1984-02-15 | Ibiden Co Ltd | 炭素電極棒の電気メッキ方法及びそのメッキ装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1800954A1 (de) * | 1968-10-03 | 1970-06-11 | Siemens Ag | Kupferbad-Wanne |
| DE3732476A1 (de) * | 1987-09-24 | 1989-04-13 | Schering Ag | Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad |
-
1997
- 1997-08-21 DE DE1997136351 patent/DE19736351C1/de not_active Expired - Fee Related
-
1998
- 1998-08-19 JP JP2000507865A patent/JP2001514329A/ja active Pending
- 1998-08-19 EP EP98951217A patent/EP1015671A2/de not_active Withdrawn
- 1998-08-19 WO PCT/DE1998/002501 patent/WO1999010563A2/de not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3909368A (en) * | 1974-07-12 | 1975-09-30 | Louis W Raymond | Electroplating method and apparatus |
| JPS5928597A (ja) * | 1982-08-05 | 1984-02-15 | Ibiden Co Ltd | 炭素電極棒の電気メッキ方法及びそのメッキ装置 |
Non-Patent Citations (1)
| Title |
|---|
| DATABASE WPI Section Ch Week 8413, Derwent World Patents Index; Class L03, AN 84-077814, XP002107524 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001514329A (ja) | 2001-09-11 |
| DE19736351C1 (de) | 1998-10-01 |
| EP1015671A2 (de) | 2000-07-05 |
| WO1999010563A2 (de) | 1999-03-04 |
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Legal Events
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| DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
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