WO1999058338A1 - Thermal printhead manufacture - Google Patents

Thermal printhead manufacture Download PDF

Info

Publication number
WO1999058338A1
WO1999058338A1 PCT/US1999/010080 US9910080W WO9958338A1 WO 1999058338 A1 WO1999058338 A1 WO 1999058338A1 US 9910080 W US9910080 W US 9910080W WO 9958338 A1 WO9958338 A1 WO 9958338A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
leads
liquid
heat
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1999/010080
Other languages
French (fr)
Inventor
Bruce David Gibson
Jeanne Marie Saldanha Singh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lexmark International Inc
Original Assignee
Lexmark International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lexmark International Inc filed Critical Lexmark International Inc
Priority to AU39763/99A priority Critical patent/AU3976399A/en
Priority to EP99922862A priority patent/EP1098767B1/en
Priority to JP2000548164A priority patent/JP2002514534A/en
Priority to KR1020007012269A priority patent/KR20010043305A/en
Priority to DE69923455T priority patent/DE69923455T2/en
Publication of WO1999058338A1 publication Critical patent/WO1999058338A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Definitions

  • TECHNICAL FIELD This invention relates to the manufacture of inkjet printheads in which semiconductor chips having heaters are mounted so as to dissipate excess heat.
  • the accumulation of excess heat is a major constraint in the design of thermal inkjet printheads capable of high speed printing.
  • the printheads have semiconductive silicon chips in which a large number of heaters are embedded elements in the chips.
  • the heaters are selectively driven with electric current to vaporize water in the inkjet ink and thereby expel drops of ink by the force of such vapor action. As the number and speed of repetition of such operations is increased, removal of excess heat from the printhead becomes a major design objective.
  • This invention removes excess heat by attaching the chip to a radiator body using a thermally conductive adhesive.
  • electrical leads of an electrical circuit tape (commonly known as a TAB circuit, for tape automated bonding) are also connected to the chip. Since a thermally conductive adhesive is typically electrically conductive to a significant extent, the TAB leads are first undercoated along their entire length with an insulative material.
  • the electrical semiconductive chip 1 may be an entirely standard thermal inkjet heater chip. As such it is a body which is primarily silicon which has a number of cavities in which a heater resistor is incorporated on the chip and which has external aluminum electrical contacts for receiving electrical signals from off the chip. As is standard, the electrical contacts are connected through the chip to select and provide heating current to selected resistors.
  • An illustrative chip of this kind is described in technical detail in U.S. Patent Application Serial No. 08/545,126, filed November 19, 1995, now allowed with issue fee paid. The disclosure of this application is incorporated herein by reference.
  • the electrical leads 3 shown in the drawing are similarly standard in that they are thin metal elements mounted on a tape 5 and extending away from tape 5.
  • the tape 5 is commonly known as a TAB circuit for tape automated bonding.
  • the tape 5 has a hole in the center to receive chip 1, and the leads 3 are then connected to aluminum contacts on the surface of chip 1.
  • TAB Tape Automated Bonding
  • the connection of leads 3 to contacts on chip 1 is typically by ultrasonic Tape Automated Bonding (TAB) welding.
  • TAB Tape Automated Bonding
  • the support body 7, on which chip 1 is mounted is made of heat conductive material to carry heat away from chip 1.
  • Chip 1 is connected to support 7 by an adhesive 9, which also must be heat conductive.
  • the heat conductive adhesive 9 is also inherently and significantly electrically conductive or semiconductive. This invention prevents contact between adhesive 9 and leads 3 as such contact would be a bypass or short circuit which would disable operation of chip 1. Accordingly, the product shown in the drawing is manufactured as follows: chip 1 is located within tape 5 and leads 3 are welded to chip 1 ; this assembly is then located so the side of TAB beam leads 3 which reach the contacts faces up and a curable material liquid, such as heat curable or ultraviolet curable liquid, which cures to form an electrically insulative solid 11 , is applied to the entire exposed under surfaces of leads 3; this coated assembly is then cured using heat, ultraviolet radiation, or other treatment suitable for the liquid used; a heat conductive adhesive 9 is then applied between chip 1 and support 7, preferably by positioning support 7 so that its surface which supports chip 1 faces upward and applying a mobile (liquid or paste) adhesive 9 to that surface of support 7 and then moving the assembly of chip 1 and tape 5 downward so that chip 1 contacts the adhesive 9. After any necessary curing to harden adhesive 9, the assembly in accordance
  • the coating to form solid 11 is applied to the leads 3 by applying a bead of the coating material from a needle tip or by brush coating by brushing along the length of each side of chip 1 where exposed leads 3 are present.
  • the brush advantageously may be a small, pointed watercolor paintbrush.
  • the curable liquid which cures to form solid 11 must have good adhesion to the TAB beam leads 3; it must cure without deforming TAB beam leads; it must have good resistance to the water, dyes, organic cosolvents and other components of ink in the printhead; and it must bond to chip 1.
  • One material as the liquid which cures to form solid 11 is FLUORAD FC-725, a heat curable product of 3M Corp.
  • TAB leads 3 and chip 1 are baked at 70° C for 15 minutes.
  • Other possible ultraviolet curable systems are UV9000, a product of Emmerson and Cummings, Specialty Polymers, a Division of National Starch and Chemicals Company, and EMCAST 7000 series, a product of EMI, Inc.
  • Various modifications, including the use of a wide range of suitable adhesives, will be apparent and can be anticipated. Patent protection is sought as provided by law with particular reference to the following claims. We claim:

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Die Bonding (AREA)

Abstract

Thermal heater chip (1) is located within an opening of TAB circuit tape (5) and the TAB leads (3) are welded to the chip. This assembly is turned so that the underside of the leads face upward, and a curable, electrically insulative liquid is applied and cured to form a solid (11). The bottom of the chip is then attached to a heat radiating support (7) using heat conductive adhesive. The cured solid on the leads prevents any adhesive reaching the leads from causing an electrical shunt. The resulting printhead dissipates excess heat from the chip well from the support.

Description

DESCRIPTION THERMAL PRINTHEAD MANUFACTURE
TECHNICAL FIELD This invention relates to the manufacture of inkjet printheads in which semiconductor chips having heaters are mounted so as to dissipate excess heat.
BACKGROUND OF THE INVENTION
The accumulation of excess heat is a major constraint in the design of thermal inkjet printheads capable of high speed printing. The printheads have semiconductive silicon chips in which a large number of heaters are embedded elements in the chips. The heaters are selectively driven with electric current to vaporize water in the inkjet ink and thereby expel drops of ink by the force of such vapor action. As the number and speed of repetition of such operations is increased, removal of excess heat from the printhead becomes a major design objective.
This invention removes excess heat by attaching the chip to a radiator body using a thermally conductive adhesive. However, electrical leads of an electrical circuit tape (commonly known as a TAB circuit, for tape automated bonding) are also connected to the chip. Since a thermally conductive adhesive is typically electrically conductive to a significant extent, the TAB leads are first undercoated along their entire length with an insulative material.
DISCLOSURE OF THE INVENTION
Electrical leads from a circuit tape are connected to their terminal point on the chip, as by standard ultrasonic welding or other connecting technique. The entire, exposed underside of these leads are then painted with a curable material which is electrically insulative when cured. The side of the chip opposite the lead connections is then attached to a heat conductive radiator body through by a heat conductive adhesive applied between the chip and the radiator body. BRIEF DESCRIPTION OF THE DRAWING
Details of this invention will be described in connection with the accompanying drawing, which illustrates a product made in accordance with this invention and shows the elements with which this invention is practiced. DESCRIPTION OF THE PREFERRED EMBODIMENTS
The electrical semiconductive chip 1 may be an entirely standard thermal inkjet heater chip. As such it is a body which is primarily silicon which has a number of cavities in which a heater resistor is incorporated on the chip and which has external aluminum electrical contacts for receiving electrical signals from off the chip. As is standard, the electrical contacts are connected through the chip to select and provide heating current to selected resistors. An illustrative chip of this kind is described in technical detail in U.S. Patent Application Serial No. 08/545,126, filed November 19, 1995, now allowed with issue fee paid. The disclosure of this application is incorporated herein by reference.
The electrical leads 3 shown in the drawing are similarly standard in that they are thin metal elements mounted on a tape 5 and extending away from tape 5. The tape 5 is commonly known as a TAB circuit for tape automated bonding. The tape 5 has a hole in the center to receive chip 1, and the leads 3 are then connected to aluminum contacts on the surface of chip 1. This is now entirely standard electrical circuit fabrication and is done virtually entirely by robotics. The connection of leads 3 to contacts on chip 1 is typically by ultrasonic Tape Automated Bonding (TAB) welding. Particularly when chip 1 has a large number of heaters supporting a large number of ink drops ejected by the heaters, dissipation of heat has become an important design objective. To dissipate such heat, the support body 7, on which chip 1 is mounted, is made of heat conductive material to carry heat away from chip 1. Chip 1 is connected to support 7 by an adhesive 9, which also must be heat conductive.
However, the heat conductive adhesive 9 is also inherently and significantly electrically conductive or semiconductive. This invention prevents contact between adhesive 9 and leads 3 as such contact would be a bypass or short circuit which would disable operation of chip 1. Accordingly, the product shown in the drawing is manufactured as follows: chip 1 is located within tape 5 and leads 3 are welded to chip 1 ; this assembly is then located so the side of TAB beam leads 3 which reach the contacts faces up and a curable material liquid, such as heat curable or ultraviolet curable liquid, which cures to form an electrically insulative solid 11 , is applied to the entire exposed under surfaces of leads 3; this coated assembly is then cured using heat, ultraviolet radiation, or other treatment suitable for the liquid used; a heat conductive adhesive 9 is then applied between chip 1 and support 7, preferably by positioning support 7 so that its surface which supports chip 1 faces upward and applying a mobile (liquid or paste) adhesive 9 to that surface of support 7 and then moving the assembly of chip 1 and tape 5 downward so that chip 1 contacts the adhesive 9. After any necessary curing to harden adhesive 9, the assembly in accordance with this invention is completed. Some adhesive 9 occasionally does reach leads 3, but the undercoating 11 on leads 3 prevents any electrical malfunction from such occurrence.
The coating to form solid 11 is applied to the leads 3 by applying a bead of the coating material from a needle tip or by brush coating by brushing along the length of each side of chip 1 where exposed leads 3 are present. The brush advantageously may be a small, pointed watercolor paintbrush. The curable liquid which cures to form solid 11 must have good adhesion to the TAB beam leads 3; it must cure without deforming TAB beam leads; it must have good resistance to the water, dyes, organic cosolvents and other components of ink in the printhead; and it must bond to chip 1. One material as the liquid which cures to form solid 11 is FLUORAD FC-725, a heat curable product of 3M Corp. This is brushed onto the TAB beam leads 3 and the assembly of tape 5, TAB leads 3 and chip 1 are baked at 70° C for 15 minutes. Other possible ultraviolet curable systems are UV9000, a product of Emmerson and Cummings, Specialty Polymers, a Division of National Starch and Chemicals Company, and EMCAST 7000 series, a product of EMI, Inc. Various modifications, including the use of a wide range of suitable adhesives, will be apparent and can be anticipated. Patent protection is sought as provided by law with particular reference to the following claims. We claim:

Claims

1. The method of making a thermal inkjet printhead assembly comprising attaching leads from an electrical circuit tape to contacts on the surface of a thermal inkjet heater chip, applying a liquid, which cures to an electrically insulative solid, to the entire exposed sides of said leads which reach said contacts, curing said liquid to an electrically insulative solid which covers the entire previously exposed sides of said leads, attaching said chip to a heat conductive support body with a curable mobile adhesive which cures to a heat conductive solid, and curing said mobile adhesive to a solid, heat conductive state.
2. The method as in claim 1 in which said liquid is FLUORAD FC-725.
3. The method as in claim 1 wherein said liquid curing step is accomplished using heat.
4. The method as in claim 1 wherein said liquid curing step is accomplished using ultraviolet light.
5. The method as in claim 2 wherein said liquid curing step is accomplished using heat.
PCT/US1999/010080 1998-05-14 1999-05-07 Thermal printhead manufacture Ceased WO1999058338A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU39763/99A AU3976399A (en) 1998-05-14 1999-05-07 Thermal printhead manufacture
EP99922862A EP1098767B1 (en) 1998-05-14 1999-05-07 Thermal printhead manufacture
JP2000548164A JP2002514534A (en) 1998-05-14 1999-05-07 Method of fabricating a thermal inkjet printhead assembly
KR1020007012269A KR20010043305A (en) 1998-05-14 1999-05-07 Thermal printhead manufacture
DE69923455T DE69923455T2 (en) 1998-05-14 1999-05-07 PREPARATION OF A THERMAL INK JET PRINT HEAD

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/078,912 1998-05-14
US09/078,912 US5980682A (en) 1998-05-14 1998-05-14 Thermal printhead manufacture

Publications (1)

Publication Number Publication Date
WO1999058338A1 true WO1999058338A1 (en) 1999-11-18

Family

ID=22146974

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/010080 Ceased WO1999058338A1 (en) 1998-05-14 1999-05-07 Thermal printhead manufacture

Country Status (8)

Country Link
US (1) US5980682A (en)
EP (1) EP1098767B1 (en)
JP (1) JP2002514534A (en)
KR (1) KR20010043305A (en)
CN (1) CN1101754C (en)
AU (1) AU3976399A (en)
DE (1) DE69923455T2 (en)
WO (1) WO1999058338A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6834937B2 (en) * 2002-08-13 2004-12-28 Lexmark International, Inc. Printhead corrosion protection
US7404613B2 (en) * 2004-06-30 2008-07-29 Lexmark International, Inc. Inkjet print cartridge having an adhesive with improved dimensional control
KR100612325B1 (en) * 2004-07-16 2006-08-16 삼성전자주식회사 An ink cartridge having an adhesive insulating layer, a method of manufacturing the same, and an image forming apparatus equipped therewith
JP5404121B2 (en) * 2009-03-25 2014-01-29 キヤノン株式会社 Recording substrate, method for manufacturing the recording substrate, and liquid discharge head
WO2011053288A1 (en) * 2009-10-28 2011-05-05 Hewlett-Packard Development Company, L.P. Protective coating for print head feed slots
WO2012054035A1 (en) 2010-10-21 2012-04-26 Hewlett-Packard Development Company L.P. Adhesion-promoting surface
US11046073B2 (en) 2017-04-05 2021-06-29 Hewlett-Packard Development Company, L.P. Fluid ejection die heat exchangers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653959A (en) * 1970-04-14 1972-04-04 Grace W R & Co Encapsulating and potting composition and process
US4881318A (en) * 1984-06-11 1989-11-21 Canon Kabushiki Kaisha Method of manufacturing a liquid jet recording head
US5530282A (en) * 1993-04-15 1996-06-25 Rohm Co., Ltd. Semiconductor device having a multilayer interconnection structure

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US4811081A (en) * 1987-03-23 1989-03-07 Motorola, Inc. Semiconductor die bonding with conductive adhesive
US5208188A (en) * 1989-10-02 1993-05-04 Advanced Micro Devices, Inc. Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process
JPH04175728A (en) * 1990-11-08 1992-06-23 Minolta Camera Co Ltd Solid scanning type optical print head
JP2682936B2 (en) * 1992-02-07 1997-11-26 ローム株式会社 Semiconductor device
US5442386A (en) * 1992-10-13 1995-08-15 Hewlett-Packard Company Structure and method for preventing ink shorting of conductors connected to printhead
US5336564A (en) * 1993-12-06 1994-08-09 Grumman Aerospace Corporation Miniature keeper bar
JPH0858078A (en) * 1994-08-24 1996-03-05 Canon Inc Inkjet head, inkjet head cartridge, and inkjet device
US5538586A (en) * 1994-10-04 1996-07-23 Hewlett-Packard Company Adhesiveless encapsulation of tab circuit traces for ink-jet pen
US5637166A (en) * 1994-10-04 1997-06-10 Hewlett-Packard Company Similar material thermal tab attachment process for ink-jet pen
US5774148A (en) * 1995-10-19 1998-06-30 Lexmark International, Inc. Printhead with field oxide as thermal barrier in chip
JP3459726B2 (en) * 1996-06-14 2003-10-27 キヤノン株式会社 Ink jet recording head and method of manufacturing the same
JP3472042B2 (en) * 1996-07-31 2003-12-02 キヤノン株式会社 Inkjet recording head
JPH1044419A (en) * 1996-07-31 1998-02-17 Canon Inc Liquid discharge head, method of manufacturing liquid discharge head, liquid discharge device, and recording device
US5939206A (en) * 1996-08-29 1999-08-17 Xerox Corporation Stabilized porous, electrically conductive substrates
JPH10119275A (en) * 1996-10-17 1998-05-12 Canon Inc Inkjet recording head

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653959A (en) * 1970-04-14 1972-04-04 Grace W R & Co Encapsulating and potting composition and process
US4881318A (en) * 1984-06-11 1989-11-21 Canon Kabushiki Kaisha Method of manufacturing a liquid jet recording head
US5530282A (en) * 1993-04-15 1996-06-25 Rohm Co., Ltd. Semiconductor device having a multilayer interconnection structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1098767A4 *

Also Published As

Publication number Publication date
EP1098767B1 (en) 2005-01-26
US5980682A (en) 1999-11-09
CN1101754C (en) 2003-02-19
CN1301216A (en) 2001-06-27
EP1098767A4 (en) 2001-10-10
JP2002514534A (en) 2002-05-21
AU3976399A (en) 1999-11-29
KR20010043305A (en) 2001-05-25
DE69923455T2 (en) 2006-06-14
EP1098767A1 (en) 2001-05-16
DE69923455D1 (en) 2005-03-03

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