WO1999063557A1 - Printed annular coil and method of manufacture thereof - Google Patents
Printed annular coil and method of manufacture thereof Download PDFInfo
- Publication number
- WO1999063557A1 WO1999063557A1 PCT/JP1999/002815 JP9902815W WO9963557A1 WO 1999063557 A1 WO1999063557 A1 WO 1999063557A1 JP 9902815 W JP9902815 W JP 9902815W WO 9963557 A1 WO9963557 A1 WO 9963557A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- annular
- conductor film
- annular portion
- film
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/04—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
- H02K3/26—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors consisting of printed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Definitions
- the present invention relates to a method for manufacturing an annular print coil and an annular print coil manufactured by the method.
- the method for manufacturing an annular print coil according to the present invention is suitable for simultaneously manufacturing a plurality of annular print coils, and a print coil sheet used in the process of the manufacturing method has a plurality of annular print coils. It can be used also as a printed wiring board.
- the annular print coil obtained by the present invention is used as an inductance element, an antenna, a solenoid coil, a motor coil, and the like. Background art
- At least two elongated linear through slits 11 are formed in the insulating substrate 10 so as to face each other at a predetermined interval, and the front, rear, and through holes of the insulating substrate 10 are formed.
- a metal layer is formed on the inner surface of the slit 11, and the metal layers on the front surface and the back surface of the insulating substrate 10 are removed except for portions 16 constituting a plurality of coil strands.
- the coil is manufactured by connecting the metal layers on the front and back surfaces of the insulating substrate 10 spirally. This is known (Japanese Patent Laid-Open No. 59-103321).
- the insulating substrate is cut along the through slit, and thereafter, Further, the front and back surfaces of the insulating substrate Since the metal layers are formed so as to be connected in a spiral shape, the number of manufacturing steps is increased, which is complicated.
- an object of the present invention is to solve the above-mentioned problems, and to provide a method of manufacturing a ring-shaped print coil and a method of manufacturing the ring-shaped print coil which can extremely easily manufacture a ring-shaped print coil without any trouble.
- the present invention is configured as follows to achieve the above object.
- an annular island formed by a plurality of annular holes provided in an insulating plate and a plurality of annular portions surrounded by a plurality of central holes surrounded by the annular holes.
- the present invention provides a method of manufacturing an annular print coil, in which a plurality of annular print coils are simultaneously manufactured by simultaneously and spirally forming a conductor film on both the front and back surfaces and the inner and outer surfaces of each of the annular portions.
- the insulating plate is provided with the plurality of annular holes and the plurality of center holes surrounded by the annular holes. And a method for manufacturing the annular printed coil described in (1).
- the conductor film when the conductor film is formed, a plating resist layer is formed on a portion other than a portion to be left as the conductor film to form a pattern, and then the plating is performed.
- a first aspect there is provided the method for manufacturing a circular printed coil, wherein the conductor film is formed on a portion to be left as a film.
- the conductive film when the conductive film is formed, the conductive film is formed substantially entirely on both front and rear surfaces and the inner and outer surfaces of the annular island, and then the conductive film is formed substantially entirely.
- An annular printed coil manufacturing method according to the first or second aspect wherein an unnecessary portion of the film is removed by irradiation with a laser beam or the like, and the conductive film is formed only on the necessary portion. .
- the conductive film when the conductive film is formed, the conductive film is formed substantially entirely on both the front and back surfaces and the inner and outer surfaces of the annular island, and then the conductive film is formed. After forming and patterning an etching resist layer in a portion to be left after the etching, an unnecessary portion of the conductive film formed substantially entirely is removed by etching, so that the conductive film is formed only in a necessary portion.
- the present invention provides a method for producing an annular printed coil according to the first or second aspect, wherein the annular printed coil is formed.
- a copper-clad laminated board in which copper foil is provided on the front and back surfaces of the insulating plate,
- a copper plating is formed almost entirely on both front and back surfaces and inside and outside surfaces of the annular part of each annular dejima,
- the terminals of the start portion and the end portion of the spiral conductive film are formed on the same portion by etching on the same surface
- the connecting portion is cut to obtain the plurality of annular printed coils.
- the present invention also provides a method for manufacturing an annular printed coil according to any one of the above aspects.
- the annular shape described in any one of the first to seventh aspects wherein the center hole is circular, and an outer periphery of the annular portion of the annular dejima is concentric with the center hole.
- a method for manufacturing a printed coil is provided.
- the center hole is polygonal
- the present invention provides the method for manufacturing an annular printed coil according to any one of the first to eighth aspects, wherein an outer periphery of the annular portion is a polygon similar to the center hole.
- the method of manufacturing an annular printed coil according to any one of the first to tenth aspects, wherein the width of the conductive film is unequal.
- the annular printed island according to any one of the first to eleventh aspects, wherein the plurality of annular printed coils are obtained by cutting each of the annular islands from the insulating plate.
- a method for manufacturing a coil is provided.
- an annular printed coil manufactured by the method for manufacturing an annular printed coil according to any one of the first to the eleventh aspects.
- the photosensitive resist film constituting the plating resist layer is of a photo-curing type
- a ninth mask in which a surface pattern forming portion for forming a conductive film and side pattern forming portions for forming a conductive film on the outer surface and the inner surface with the annular portion as an axis do not transmit light and other portions transmit light;
- a light control sheet that scatters or refracts the incident light and emits it from the side opposite to the incident side is exposed on one surface of the annular portion, and a conductor film on the back surface is formed around the annular portion as an axis.
- the 10th mask in which a back pattern forming portion to be formed and a side pattern forming portion for forming a conductor film on the outer surface and the inner surface with the annular portion as an axis does not transmit light and transmits the other portion, and has entered Scattering light or A light control sheet that is folded and emitted from the side opposite to the incident side is superposed on the other surface of the annular portion and exposed, and only the exposed portion of the photosensitive resist film is cured, By developing the photosensitive resist film and removing the uncured portion other than the cured portion, a conductor film on the front surface with the annular portion as an axis, a conductor film on the back surface with the annular portion as an axis, and A method for manufacturing an annular print coil according to a third aspect, wherein the mask resist layer is formed in a portion other than a portion where the conductor film is formed on the outer surface and the inner surface around the annular portion.
- the photosensitive resist film constituting the plating resist layer is of a photodecomposable type
- a surface pattern forming portion for forming a conductive film and a side pattern forming portion for forming a conductive film on the outer surface and the inner surface with the annular portion as an axis transmit light and block other portions.
- a mask and a light control sheet that scatters or refracts the incident light and emits the light from the side opposite to the incident side are overlapped and exposed on one surface of the annular portion, and the conductor film on the back surface is centered on the annular portion.
- First and second masks and incident light in which a back pattern forming portion to be formed and a side pattern forming portion forming a conductor film on the outer and inner surfaces of the annular portion as an axis transmit light and block other portions. Scattering or bending Then, a light control sheet is superposed on the other surface of the annular portion and exposed to light, so that only the exposed portion of the photosensitive resist film is photolyzed, and By developing the conductive resist film and removing only the photodecomposed portion, the conductor film on the front surface with the annular portion as the axis, the conductor film on the back surface with the annular portion as the axis, and the annular portion as the axis According to a third aspect of the present invention, there is provided a method for manufacturing an annular print coil according to a third aspect, wherein the above-mentioned mask resist layer is formed on a portion other than a portion where the conductor film is formed on the outer surface and the inner surface.
- the photosensitive resist film constituting the plating resist layer is of a photo-curable type
- a surface pattern forming portion forming one of the conductor film and the conductor film on the back surface with the annular portion as an axis
- a side pattern forming portion forming the conductor film on the outer surface and the inner surface with the annular portion as an axis.
- the 13th mask that transmits light while the other part does not transmit light and the light control sheet that scatters or refracts the incident light and emits it from the side opposite to the incident side are superimposed on one surface of the above-mentioned annular part.
- the back surface pattern forming portion which forms the other of the conductor film on the front surface around the annular portion and the conductor film on the back surface around the annular portion, overlaps the annular hole or the center hole.
- Part A 14th mask which does not transmit light but transmits other parts, is superimposed on the other surface of the annular portion, and is exposed to light. After curing only the exposed portions of the conductive film, the photosensitive resist film is developed to remove uncured portions other than the cured portions.
- the photosensitive resist film constituting the plating resist layer is of a photo-decomposable type, and the surface of the surface is formed around the annular portion as an axis.
- the pattern forming portion which forms one of the conductor film on the front surface and the conductor film on the back surface with the annular portion as the axis, and blocks the other portions
- 16th mask Exposure is performed by overlapping the other surface of the annular portion, and only the exposed portion of the photosensitive resist film is photolyzed. Then, the photosensitive resist film is developed to remove only the photolyzed portion.
- the conductor film on the front surface with the annular portion as the axis, the conductor film on the back surface with the annular portion as the axis, and the portion where the conductor film on the outer surface or the inner surface with the annular portion as the axis are formed.
- the method for manufacturing a circular printed coil wherein the plating resist layer is formed on an outer portion.
- the photosensitive resist film constituting the etching resist layer is of a photo-curing type, and the surface of the photosensitive resist film is formed around the annular portion.
- a first mask in which a surface pattern forming portion for forming a conductive film and a side pattern forming portion for forming a conductive film on the outer surface or the inner surface around the above-mentioned annular portion transmit light and do not transmit other portions.
- a light control sheet that scatters or refracts the incident light and emits it from the side opposite to the incident side.
- a pattern is formed on the backside of the 7-shaped portion, and the conductor film is formed on the outer surface or the inner surface around the annular portion.
- the second pattern and the second mask which transmits light while the other pattern does not transmit, and the light control sheet that scatters or refracts the incident light and emits it from the side opposite to the incident side, is provided on the other side of the annular portion.
- the photosensitive resist film constituting the etching resist layer is of a photodecomposable type, and the surface of the photosensitive resist film is formed around the annular portion as an axis.
- the surface pattern forming portion forming the conductor film and the side pattern forming portion forming the conductor film on the outer surface or the inner surface around the above-mentioned annular portion shield the light and transmit the other portions.
- a mask and a light control sheet that scatters or refracts the incident light and emits the light from the side opposite to the incident side are superposed on one surface of the annular portion and exposed, and the conductor on the back surface of the annular portion is used as an axis.
- the fourth mask and the incident surface where the back pattern forming portion for forming the film and the side pattern forming portion for forming the conductor film on the outer surface or the inner surface around the annular portion shield light and transmit the other portions.
- Scattered light After refracting and exposing a light control sheet that emits light from the side opposite to the incident side on the other surface of the annular portion, only the exposed portion of the photosensitive resist film is photolyzed.
- the photosensitive resist film constituting the etching resist layer is of a photo-curing type, and the surface of the photosensitive resist film is formed around the annular portion as an axis.
- the fifth mask which transmits light but does not transmit the other parts, and a light control sheet that scatters or refracts the incident light and emits it from the side opposite to the incident side is exposed on one side of the above annular portion.
- the photosensitive resist film is developed and cured.
- the conductor film on the front surface with the annular portion as the axis, the conductor film on the back surface with the annular portion as the axis, and the outer or inner surface with the annular portion as the axis The etching resist layer is formed in a portion where the conductive film is formed.
- a method for manufacturing the annular printed coil according to the fifth aspect is provided.
- the photosensitive resist film constituting the etching resist layer is of a photodecomposable type, and the surface of the photosensitive resist film is formed around the annular portion as an axis.
- a surface pattern forming portion that forms one of the conductor film and the conductor film on the back surface with the annular portion as an axis, and a side pattern forming portion that forms a conductor film on the outer surface or the inner surface with the annular portion as an axis.
- a light control sheet that scatters or refracts the incident light and emits it from the side opposite to the incident side, and exposes it on one surface of the above-mentioned annular portion.
- FIG. 1 is a partial perspective view showing a printed coil sheet used in a method of manufacturing a ring-shaped printed coil according to a first embodiment of the present invention
- FIG. 2 is a partial perspective view showing the annular printed coil of the first embodiment of the present invention and a printed coil sheet used in the method of manufacturing the same.
- FIG. 3 is a perspective view of an annular print coil cut from the print coil sheet shown in FIG.
- FIG. 4 is a perspective view of an annular print coil cut from the print coil sheet shown in FIG. 2,
- FIG. 5 is a perspective view of an annular print coil according to another embodiment of the present invention and an annular print coil manufactured by the method of manufacturing the same.
- FIG. 6 is a perspective view of an annular print coil according to still another embodiment of the present invention and an annular print coil manufactured by the method of manufacturing the same.
- FIG. 7 is an explanatory diagram for explaining a state in which the conductive film is formed in a spiral shape
- FIG. 8 is an explanatory diagram showing a conventional method for manufacturing a print coil.
- FIG. 9 shows a method of exposing a part of the photosensitive resist film of the conductor film on the outer side surface or the inner side surface of the side wall surface of the annular hole or the center hole according to the annular print coil according to another embodiment of the present invention.
- FIG. 10 is a part of the photosensitive resist film of the conductor film on the outer side surface or the inner side surface of the side wall surface of the annular hole or the center hole according to the annular print coil according to the modification of the other embodiment of the present invention. It is an explanatory view showing a method of exposing, FIG. 11 shows an example of a photosensitive resist film of the conductor film on the outer side surface or the inner side surface of the side wall surface of the annular hole or the center hole according to another modified example of the other embodiment of the present invention. It is an explanatory view showing a method of exposing a portion,
- FIG. 12 shows one example of a photosensitive resist film of the conductor film on the outer surface or the inner surface of the side wall surface of the annular hole or the center hole according to another modified example of the other embodiment of the present invention. It is an explanatory view showing a method of exposing a portion,
- FIG. 13 is a cross-sectional view illustrating a method of exposing a part of the photosensitive resist film.
- FIG. 14 is a cross-sectional view illustrating a method of exposing a part of the photosensitive resist film.
- 5 is a cross-sectional view showing a method of exposing a part of the photosensitive resist film
- FIG. 16 is a cross-sectional view showing a method of exposing a part of the photosensitive resist film
- FIG. FIG. 18 is a cross-sectional view illustrating a method of exposing a part of the photosensitive resist film.
- FIG. 18 is a cross-sectional view illustrating a method of exposing a part of the photosensitive resist film.
- annular print coil according to an embodiment of the present invention, a method for manufacturing the same, and an annular print coil manufactured by the method for manufacturing the same will be described in detail with reference to the drawings.
- FIGS. 1 and 2 are partial perspective views showing a printed coil sheet 70 used in a method of manufacturing an annular printed coil according to the first embodiment and the second embodiment of the present invention, respectively.
- FIGS. 3 and 4 show the annular print coil P cut from the print coil sheet 70 used in the method of manufacturing the annular print coil of the first embodiment and the second embodiment shown in FIGS. 1 and 2, respectively. It is a perspective view.
- 1 is an insulating plate
- 2 is a substantially C-shaped annular hole formed through the insulating plate
- 3 is a circular (FIG. 1) or hexagonal formed through the insulating plate 1 (FIG. 2).
- 4 is an annular island formed by the annular hole 2 and the central hole 3
- 5 is an annular island of 4
- 6 is a conductor film spirally formed on both the front and back surfaces and the inner and outer surfaces of the annular portion 5
- 7 is a connecting portion for connecting the annular portion 5 of the annular island 4 to a portion other than the annular island 4
- 8 is a connecting portion
- the two terminals P of the conductor film 6 formed in the annular portion 5 near 7 indicate an annular print coil.
- the first embodiment and the second embodiment are different from the first and second embodiments only in the shape of the annular hole 2, the center hole 3, and the annular portion 5, and have the same basic structure.
- the method of manufacturing the annular printed coil according to the first and second embodiments shown in FIGS. 1 and 2 includes the steps of: providing an insulating plate 1 with a plurality of annular holes 2 and a plurality of centers surrounded by the annular holes 2; Since the holes 3 are provided so as to penetrate, the respective annular departure islands 4 are formed from portions surrounded by the respective annular holes 2 and the respective center holes 3 arranged at predetermined intervals inside the annular holes 2.
- the print coil sheet 70 is configured.
- the conductor film 6 is continuously formed in a spiral shape on the front and back surfaces and the inner and outer surfaces of the printed coil sheet 70 around the annular portion 5 of each annular island 4 as shown in FIG. Thus, a plurality of annular print coils P are simultaneously formed.
- the conductor film 6a on the surface of the annular portion 5 is a conductor film 6b on the outer surface of the annular portion 5, a conductor film 6c on the back surface of the annular portion 5, and a conductor film on the inner surface of the annular portion 5.
- the conductive film 6 d on the inner surface of the annular portion 5 is connected to the conductive film 6 a adjacent to the leading conductive film 6 a on the surface of the annular portion 5. It is like that. As a result, the conductor film 6 is formed in a spiral shape in the annular portion 5.
- the insulating plate 1 examples include a paper base phenolic resin, a paper base epoxy resin, a synthetic fiber cloth base epoxy resin, a glass cloth, a paper composite base epoxy resin, a glass cloth, and a glass nonwoven composite base material.
- Laminated board such as epoxy resin, glass cloth base epoxy resin, glass cloth base Teflon resin, or resin such as polyetherimide resin, polysulfone resin, polyethersulfone resin, benzocyclobutene resin, Teflon resin, etc.
- a material having insulating properties on both front and back surfaces and all side surfaces, such as ceramics such as aluminum nitride, silicon carbide, and alumina, can be used.
- the form of the insulating plate 1 can be any of plate, sheet, and film. It may be.
- Each of the annular dejimas 4 includes one annular hole 2, an annular portion 5 which is an annular portion sandwiched between one central hole 3 surrounded by the annular hole 2, and an annular portion 5. And a connecting portion 7 for connecting the other portion 71 of the print coil sheet 70.
- the center hole 3 is circular, and the contour of the outer periphery is concentric with the circle of the center hole 3 (see FIG. 1). 1).
- the center hole 3 of the print coil sheet 70 of the second embodiment shown in FIG. 2 is polygonal, for example, hexagonal. It is a polygon similar to polygon 3 (for example, hexagon) (see Fig. 2).
- the center hole 43 is circular, and the outline of the outer periphery of the annular portion 45 of the annular dejima 4 is polygonal.
- the center hole 53 is a polygon, for example, a hexagon, and the outer periphery of the annular portion 55 of the annular dejima 4 is circular. Can be.
- the center hole 3 may be elliptical and the outer periphery of the annular dejima 4 may be elliptical similar to the center hole.
- the size and shape of the annular hole 2 and the center hole 3 and the annular island 4 formed thereby are not particularly limited, and may be appropriately selected depending on the application.
- Examples of the shape of the annular dejima 4 include a substantially C shape and a D shape.
- Examples of a method for forming the annular hole 2 and the center hole 3 include a press working method, a router working method, a laser working method, and an NC do-notre processing method.
- the conductor film 6 can be formed by various methods. As an example, on the front and back surfaces and the inner and outer surfaces of the annular dejima 4, a plating resist layer is formed on a portion other than a portion to be left as the conductor film 6, and then a plating is applied to a portion to be left as the conductor film 6. There is a method of forming the conductor film 6. Further, as another example, a conductor film is formed substantially entirely on both the front and back surfaces and the inner and outer surfaces of the circular dejima 4, and then, approximately.
- Unnecessary portions of the conductor film formed over the entire surface are removed by irradiating a laser beam or the like, and the conductor film 6 is formed only at the necessary portions, or the conductor film is formed over substantially the entire surface.
- an etching resist layer on a portion of the film to be left as the conductor film 6, an unnecessary portion of the substantially entire conductor film is etched and removed, and the conductor film is formed only on a necessary portion.
- the location where the conductive film 6 is formed may be the entire circumference of the annular dejima 4 or a part thereof.
- FIG. 9 a method for patterning the conductive film 6 will be described in detail with reference to FIGS. 9 to 18.
- FIG. In the following description, reference numerals used in the first and second embodiments are used as representative examples. In addition, in order to simplify the drawings, depending on the drawings, only one of the first embodiment and the second embodiment is shown. The force is not shown, and the present invention can be similarly applied to the other embodiment. Needless to say.
- an insulating substrate 38 covered with a photosensitive resist film (after completion, becomes the above-mentioned insulating substrate 1).
- the light control sheet 34 is used only on one surface of the insulating substrate 38.
- FIG. 14 shows a modified example in which the positional relationship between the mask 33 and the light control sheet 34 may be opposite to the positional relationship in FIG. 13 with respect to the insulating substrate 38.
- an insulating substrate 38 covered with a photosensitive resist film is applied in the order of FIGS. 13 and 16 or vice versa. This is a method of exposing one surface at a time, and the light control sheet 34 is used on both surfaces of the insulating substrate 38.
- both sides of the insulating substrate 38 covered with the photosensitive resist film are exposed simultaneously, and the light control sheet 34 is exposed on one side.
- the exposure of the photosensitive resist film 32 for forming the etching resist layer and the plating resist layer is performed as follows.
- the mask 33 and the light control sheet 34 are overlaid on one surface of the insulating substrate 38, for example, the upper surface of FIG. 11, as shown in FIG. 13, the light control sheet 34 and the mask
- the photosensitive resist film 32 is exposed downward from the top through the light transmitting portion 35 of 33.
- the mask 33 and each of the masks 33 described below can be made of glass or an acryl-based film sheet.
- the photosensitive resist film 32 is developed to form an etching resist layer or a plating resist layer having a pattern corresponding to the pattern of the mask 33.
- the insulating substrate of the two masks 33 is used.
- the conductor film 6 (corresponding to 6 a in FIG. 7) on the surface is formed around the annular portion 5.
- a correspondingly patterned surface pattern forming portion 33a and a conductive film 6 on the outer surface of the annular portion 5 connected to the conductive film 6a on the surface around the annular portion 5 (see 6b in FIG. 7) Corresponding to the conductive film 6 (corresponding to 6d in FIG.
- the back surface pattern forming portion 33c which is patterned corresponding to (corresponding portion), is formed transparent as the light transmitting portion 35, and the other portion is formed opaque as a light shielding portion. Therefore, since a portion corresponding to the back pattern forming portion 33 c is the light transmitting portion 35, light is transmitted, and the side pattern forming portion 33 c and the back pattern forming portion of the photosensitive resist film 32 are formed. The part corresponding to the part 33d is exposed and cured, while the other part is not cured because it does not transmit light and is not exposed.
- Etching resist layers are formed on both surfaces and on the portions corresponding to the conductor films 6a, 6c, 6b, and 6d on the inner and outer surfaces.
- a dotted line 33 e on each mask 33 in FIG. 11 indicates a position where the mask 33 overlaps the annular hole 2 or the center hole 3.
- the light control sheet 34 scatters or refracts the incident light, and then emits the light from the side opposite to the incident side to form the annular portion 5 in the annular hole 2 or the central hole 3. Irradiation is performed on the photosensitive resist film 32 on the side wall surface on which the conductor film 6b or 6d on the outer side or the inner side is desired to be formed.
- the insulating substrate 1 of the two masks 33 is used.
- the upper mask 3 3 (the upper mask 3 3 in FIG. 12) disposed on the upper surface side of the surface pattern shield portion formed with a pattern corresponding to the conductor film 6 a on the surface around the annular portion 5.
- the side pattern shielding part 33g connected to the surface pattern shielding part 33f is opaquely formed as the light shielding part 135, and the other part is the light transmitting part 35. As transparently shaped Is done. Therefore, since the portion corresponding to the surface pattern shielding portion 3 3 f and the side pattern shielding portion 33 g is the light shielding portion 135, no light is transmitted and the surface pattern shielding of the photosensitive resist film 32 is not performed.
- the part corresponding to the part 33 f and the side pattern shielding part 33 g is not exposed and is not decomposed, while the other part is transmitted and exposed to light to be decomposed.
- the backside mask 3 3 arranged on the rear surface side of the insulating substrate 1 (Fig. 1 2 mask 3 3 lower in) pattern formed corresponding to the conductive film 6 of the rear surface of the annular portion 5 as an axis
- the rear surface pattern shielding portion 33 h and the portion 33 e overlapped with the annular hole 2 or the center hole 3 are opaquely formed as the light shielding portion 135, and the other portions are formed.
- the transparent portion 35 is formed transparent.
- the portion corresponding to the portion 3 3 e overlapping the backside pattern shielding portion 3 3 h and the annular hole 2 or the center hole 3 is the light shielding portion 135, light does not pass through and the photosensitive resist film is not formed.
- the portion corresponding to the backside pattern shielding portion 3 3 h of 3 2 is not exposed and is not decomposed, and the outer or inner portion of the annular hole 2 of the photosensitive resist film 32 or the annular portion 5 in the center hole.
- the wall corresponding to the conductive film 6b or 6d is not exposed, and the portion corresponding to the side pattern shielding portion 33g is not decomposed, while the other portion is exposed and exposed to light to be decomposed. .
- the decomposed portion is removed by the developing solution, while the undecomposed portion is not removed by the developing solution but remains, and the annular portion 5 is used as an axis, on both the front and rear surfaces and on An etching resist layer is formed on portions of the inner and outer surfaces corresponding to the conductor films 6a, 6c, 6b, and 6d.
- a dotted line 33 e on each mask 33 in FIG. 12 indicates a position where the mask 33 is superimposed on the annular hole 2 or the center hole 3.
- the light control sheet 34 is also overlapped as shown in FIG. Except that the photosensitive resist film 32 is exposed upward from the bottom through the light control sheet 34 and the light transmitting portion 35 of the mask 33, and that the lower mask pattern is different. (See FIGS. 9 and 10.)
- the annular portion 5 is pivoted on the back side mask 33 (the lower mask 33 in FIG. 9) disposed on the back side of the insulating substrate 1. And a pattern corresponding to the connecting portion 7 connected to the conductive film 6 on the back surface around the annular portion 5 as an axis.
- the side pattern forming portions 33 d formed and connected to the back surface pattern forming portion 33 c are each formed transparently as the light transmitting portion 35, and the other portions are light shielding portions. As opaque. Therefore, since the portions corresponding to the back pattern forming portion 33 c and the side pattern forming portion 33 d are the light transmitting portions 35, light is transmitted and the back pattern of the photosensitive resist film 32 is formed.
- the portions corresponding to the portion 33c and the side pattern forming portion 33d are exposed and cured, while the other portions are not cured because they do not transmit light and are not exposed.
- the annular portion 5 is pivoted on the back side mask 33 (the lower mask 33 in FIG. 10) disposed on the back side of the insulating substrate 1.
- the side pattern forming portions 33 d formed and connected to the back pattern forming portions 33 c are opaquely formed as the light shielding portions 135, and the other portions are light transmitting. It is formed transparent as a part.
- a portion corresponding to the back pattern forming portion 33c and the side pattern forming portion 33d is a light shielding portion, no light is transmitted, and the annular portion 5 is used as an axis on both front and back surfaces and inside and outside surfaces.
- a portion of the formed photosensitive resist film 32 other than the portion corresponding to the back pattern forming portion 33 c and the side pattern forming portion 33 d is exposed and separated, while the back pattern forming portion 3 is exposed.
- the portion corresponding to 3c and the side pattern forming portion 33d is not decomposed because light is not exposed.
- the step of FIG. 13 and the step of FIG. 15 in the first method are simultaneously performed as shown in FIG.
- the steps in FIG. 13 and the steps in FIG. 16 in the second method are performed simultaneously as shown in FIG.
- the insulating substrate 38 covered with the photosensitive resist film 32 is shown in FIGS. 9 to 12 of the above first to fourth methods.
- PC JP
- a metal layer exists between the photosensitive resist film 32 and the insulating substrate 38.
- the mask resist layer is formed by the above-described first to fourth methods, the portions other than the conductor films 6a, 6C, 6b, and 6d on the front and back surfaces and the inner and outer surfaces of the annular portion 5 are used as an axis. Then, a mask is set so that the resist layer is formed by the development process.
- the light control sheet 34 converts the parallel light 36 from the light source into scattered light or refracted light 37, and partially converts the parallel light 36 into the annular hole 2 or the annular hole in the center hole 3. It is controlled so as to face the side wall surface of the conductor film 6b or 6d on the outer or inner part of the part 5 (see FIG. 13).
- the light control sheet 34 for example, a sheet provided with fine convexities on the surface, such as a diffusion sheet, or fine particles or air bubbles contained therein, or prism-like protrusions on the surface, such as a prism sheet.
- the provided sheet can be used.
- the light transmitted through the light transmitting portion 35 of the mask 33 hardly irradiates the side wall surface of the annular hole 2 and the center hole 3, and the side inside the annular hole 2 or the center hole 3 It is not possible to form a patterned etching resist layer or plating resist layer of the conductive film 6b or 6d on the outside or inside of the annular portion 5 on the wall surface.
- the conductor film 6a, 6c, 6b, and 6d on both the front and back surfaces and the inner and outer surfaces of the annular portion 5 are used as axes.
- An etching resist layer or a mask resist layer can be formed, and the process can be omitted.
- a prism sheet (bidirectional refraction sheet) has a greater amount of light traveling in two directions from its shape than a diffusion sheet.
- a diffusion sheet light travels in directions other than the two directions, so that the amount of light traveling in the two directions is smaller than that of the prism sheet, and the exposure is weaker. Therefore, the use of the prism sheet rather than the diffusion sheet makes it possible to use the outer conductor film or the inner conductor film on the end face in the direction in which light travels, in other words, on the side wall surface of the annular hole 2 or the center hole 3 of the substrate sheet.
- the order in which the mask 33 and the light control sheet 34 are overlapped may be such that the light control sheet 34 is at the bottom (see FIG. 14).
- the light used for exposure may be sunlight, a mercury lamp, a xenon lamp, an arc lamp, or a light source using an argon laser or the like.
- the exposure on one surface of the substrate 38 and the exposure on the other surface may be performed simultaneously or sequentially on one surface. Fig. 13 and Fig.
- the photosensitive resist film 32 when the photosensitive resist film 32 is a photocurable type, the uncured portion of the photosensitive resist film 32 is selectively removed by using soda carbonate or the like as a developing solution. It is done by doing.
- the photosensitive resist film 32 is of a photo-decomposable type, the photo-decomposition is performed by selectively removing the photo-decomposed portion of the photosensitive resist film 32 by using sodium metasilicate as a developing solution. It is.
- the above-described method using the etching resist layer or the plating resist layer is used. Is most preferable, but the conductive film 6 can be scraped off by a laser or other physical means.
- the conductor film 6a on the front surface of the annular portion 5 or a part of the conductor film 6a on the back surface of the annular portion 5 may be insulated with a solder resist.
- Materials for the solder resist include epoxy resin, varnish, or enamel.
- As a method of forming the solder resist there are methods such as screen printing, a roll coater, a curtain coater, a spray, or an electrostatic coating.
- a surface treatment may be performed on a part or all of the conductor film 6a on the front surface around the annular portion 5 or the conductor film 6 on the back surface around the annular portion 5.
- Examples of surface treatment include solder leveler, gold plating, solder plating, nickel plating, silver plating, and palladium plating.
- the surface treatment layer formed by these surface treatments may be appropriately combined into a plurality of layers, or may be a single layer. Good. As an exception, a single layer of gold plating is not possible, and the gold plating layer is usually laminated on the nickel plating layer.
- an electroless plating can be applied to the plating layer for the surface treatment.
- the surface pattern forming portion 33a is formed with the annular portion 5 as an axis corresponding to the conductive film 6a on the surface thereof, and the side pattern forming portion 33b is formed in the annular portion 5a. Is formed in a pattern corresponding to the conductor film 6 on the outer surface or the conductor film 6 on the inner surface of the annular portion 5 connected to the conductor film 6a on the surface with the axis as an axis, and is connected to the surface pattern forming portion 33a.
- the backside pattern forming portion 33c is formed in a pattern corresponding to the conductor film 6 on the backside thereof with the annular portion 5 as an axis
- the side pattern forming portion 33d is formed of the conductor on the backside with the annular portion 5 as an axis.
- a pattern is formed corresponding to the conductor film 6 on the outer surface or the conductor film 6 on the inner surface of the annular portion 5 connected to the film 6, and is connected to the back pattern forming portion 33c.
- the surface pattern forming portion 33a is patterned around the annular portion 5 in correspondence with the conductor film 6 on the back surface thereof.
- the side pattern forming portion 33b is formed corresponding to the conductor film 6 on the outer surface or the conductor film 6 on the inner surface of the annular portion 5 connected to the conductor film 6 on the back surface with the annular portion 5 as an axis.
- the pattern is formed and connected to the front surface pattern forming portion 33a, and the rear surface pattern forming portion 33c is patterned with the annular portion 5 as an axis corresponding to the conductor film 6a on its surface, and the side pattern forming portion is formed.
- 33 d is formed in a pattern corresponding to the conductor film 6 on the outer surface or the conductor film 6 on the inner surface of the annular portion 5 connected to the conductor film 6 a on the surface with the annular portion 5 as an axis, and You may make it connect with back surface pattern formation part 33c.
- a pattern is formed corresponding to the conductive film 6a on the surface with the surface pattern shielding portion 33 and the annular portion 5 as an axis
- the side pattern shielding portion 33g is formed on the surface with the annular portion 5 as an axis.
- the pattern shielding portion 33h is formed in a pattern around the annular portion 5 corresponding to the conductor film 6 on the back surface thereof, but is not limited to this. No.
- the front surface pattern shielding portion 3 3f is formed with the annular portion 5 as an axis corresponding to the conductor film 6 on the back surface.
- the side pattern shielding portion 33g is formed with a pattern corresponding to the connection portion 7 connected to the conductor film 6 on the back surface thereof with the annular portion 5 as an axis, and is connected to the front surface pattern shielding portion 33f.
- the back surface pattern shielding portion 33h may be formed so as to correspond to the conductor film 6a on the front surface with the annular portion 5 as an axis.
- Conductor film 6a on the front surface with the annular portion 5 as the axis, conductor film 6 on the outer surface of the annular portion 5 or the conductor film 6 on the inner surface, and the conductor film on the back surface with the annular portion 5 as the axis on both sides and the inner and outer surfaces 6 can be formed efficiently and inexpensively simultaneously by etching or plating
- any material may be used for the conductive film 6 as long as it has conductivity, and examples thereof include metals such as copper, nickel, and gold.
- the width of the conductive film 6 is not particularly limited, but usually, about 0.05 mm to 1 mm is sufficient.
- the width of the conductor film 6 may be unequal, as well as being equal throughout. For example, when the width of the conductive film 6 is gradually increased in the winding direction, the frequency bandwidth can be widened.
- the thickness of the conductive film 6 also, is not particularly limited, is usually sufficient at 3 ⁇ ⁇ 5 0 // m.
- the number of turns of the conductor film 6, that is, the number of turns of the coil is selected according to the use of the printed coil.
- a surface treatment may be performed on part or all of the conductor film 6.
- the surface treatment method may be solder labeler, gold plating, solder plating, or nickel There are rumetsuki.
- the conductor film 6 other than the portions that become the both terminals 8 of the annular print coil P may be subjected to insulation treatment with a solder resist.
- a solder resist examples include an epoxy resin, a varnish, and an enamel.
- the method for forming the solder resist include a screen printing method, a roll coating method, a curtain coating method, a spray method, and an electrostatic coating method.
- each annular island 4 of the print coil sheet 70 is simply cut from the insulating plate 1 at the connecting portion 7 to form each annular print coil.
- Print Koinore P can be obtained.
- the cutting position for obtaining the annular print coil P is not particularly limited, and the connecting portion 7 is cut at the boundary between the connecting portion 7 and the other portion 71 of the print coil 70.
- the joint 7 remains at the other part 71 side of the printed coil sheet 70 by cutting at the boundary between the joint 7 and the annular part 5. (See Figure 4).
- the cutting method of the annular print coil P for obtaining the individual annular print coil P from the print coil sheet 70 includes a punching press method, a router processing method, a laser cutting method, and a V-cut method. Or cutting method.
- the print coil sheet on which the annular print coil P is formed is provided.
- the method of manufacturing the annular printed coil according to the present invention has the following effects.
- the method for manufacturing an annular printed coil according to the present invention comprises a plurality of annular portions surrounded by a plurality of annular holes provided in the insulating plate and a plurality of center holes surrounded by the annular holes.
- a conductor film is simultaneously and spirally formed on both the front and back surfaces and the inner and outer surfaces around the above-mentioned annular portion of each of the annular dejimas.
- Print coils are manufactured at the same time. Therefore, in a printed coil sheet in which a plurality of annular printed coils are formed on the insulating plate, by cutting each annular island from the insulating plate, it is possible to easily obtain a plurality of individual annular printed coils, and to save labor. An annular printed coil can be obtained very easily without any need.
- the through slit 11 is linear
- the insulating substrate 10 is cut along the through slit 11 and the cutting lines A, B, C, and D.
- a connection metal layer can be easily formed on the side surface of each chip. This is because the cut side surface of each chip is flat, so that the connection metal layer can be easily formed.
- an annular printed coil is to be manufactured by such a method, if an annular chip is cut from the insulating substrate 10 and a connection metal layer is formed on the side surface of each chip, the annular printed coil is formed.
- the inner and outer surfaces of the chip are formed by a combination of concave curved surface ⁇ convex curved surface or a plurality of planes having different inclination angles, for example, when forming a conductive film by printing, the chip-shaped insulating substrates are printed one by one.
- the conductor film must be formed while rotating at various angles so as to face the plate surface of the machine, which requires considerable time and effort.
- the chips are small and difficult to handle. Further, the conductive film cannot be cleanly connected to the conductor film that has already been formed, and the conductor film may be formed with a positional shift, so that a desired resistance value may not be obtained.
- the surface of the annular portion before cutting the annular portion formed by the combination of the concave curved surface ⁇ convex curved surface or the plurality of planes having different inclination angles into a chip shape, the surface of the annular portion, Since the conductor film required as a coil is formed on all of the back surface and the inner and outer surfaces, all the above difficulties can be solved.
- Thickness 0. 2 mm of the insulating plate 1 (Matsushita Electric Works Co., glass cloth base epoxy resin) front and back surface in the thickness 1 8 mu ChoTsutatate 3 copper foil m 4 0 mm of the horizontal 2 5 5 mm Copper clad product Prepare a layer plate, drill a center hole 3 with an inner diameter of 5 mm through the plate by router machining, and concentric with the center hole 3 so that the width of the annular portion 5 of the annular dejima 4 is 6 mm. An annular hole 2 having a width of 1 mm was formed. The width of the connecting portion 7 was 2 mm.
- the etching resist was removed, and the conductive film 6 was obtained.
- terminals at the beginning and end of the coil were formed on the same surface of the connecting portion 7 by etching with a diameter of 0.5 mm. Furthermore, after covering a portion other than the copper foil portion of the terminal portion of the coil with a solder resist, the connecting portion was cut by pressing to obtain 294 annular printed coils.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
- Windings For Motors And Generators (AREA)
- Manufacture Of Motors, Generators (AREA)
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP99922533A EP1001439A4 (en) | 1998-05-29 | 1999-05-28 | PRINTED RING-SHAPED COIL, AND PRODUCTION METHOD |
| US09/463,630 US6686824B1 (en) | 1998-05-29 | 1999-05-28 | Toroidal printed coil |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10/148575 | 1998-05-29 | ||
| JP10148575A JP3090906B2 (ja) | 1998-05-29 | 1998-05-29 | 環状プリントコイルの製造方法 |
| JP10/148574 | 1998-05-29 | ||
| JP14857498A JP2923290B1 (ja) | 1998-05-29 | 1998-05-29 | 環状プリントコイルを有するプリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1999063557A1 true WO1999063557A1 (en) | 1999-12-09 |
Family
ID=26478725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1999/002815 Ceased WO1999063557A1 (en) | 1998-05-29 | 1999-05-28 | Printed annular coil and method of manufacture thereof |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6686824B1 (ja) |
| EP (1) | EP1001439A4 (ja) |
| WO (1) | WO1999063557A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170261942A1 (en) * | 2016-03-08 | 2017-09-14 | Seiko Instruments Inc. | Portable device and portable timepiece |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001244123A (ja) * | 2000-02-28 | 2001-09-07 | Kawatetsu Mining Co Ltd | 表面実装型平面磁気素子及びその製造方法 |
| JP4354187B2 (ja) * | 2003-01-21 | 2009-10-28 | Tdk株式会社 | 高qヘリカルコイルチップおよびその製造方法 |
| US10049803B2 (en) | 2005-09-22 | 2018-08-14 | Radial Electronics, Inc. | Arrayed embedded magnetic components and methods |
| US10431367B2 (en) | 2005-09-22 | 2019-10-01 | Radial Electronics, Inc. | Method for gapping an embedded magnetic device |
| US9754712B2 (en) | 2005-09-22 | 2017-09-05 | Radial Electronics, Inc. | Embedded magnetic components and methods |
| US10522279B2 (en) | 2005-09-22 | 2019-12-31 | Radial Electronics, Inc. | Embedded high voltage transformer components and methods |
| US7477128B2 (en) | 2005-09-22 | 2009-01-13 | Radial Electronics, Inc. | Magnetic components |
| US7777644B2 (en) * | 2005-12-12 | 2010-08-17 | InatelliServ, LLC | Method and conduit for transmitting signals |
| US8203418B2 (en) * | 2007-01-11 | 2012-06-19 | Planarmag, Inc. | Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors |
| JP5270576B2 (ja) | 2007-01-11 | 2013-08-21 | プラナーマグ インコーポレイテッド | 平面型広帯域トランス |
| WO2008152641A2 (en) * | 2007-06-12 | 2008-12-18 | Advanced Magnetic Solutions Ltd. | Magnetic induction devices and methods for producing them |
| US9754714B2 (en) | 2009-07-31 | 2017-09-05 | Radial Electronics, Inc. | Embedded magnetic components and methods |
| CN102159037A (zh) * | 2011-03-04 | 2011-08-17 | 聚信科技有限公司 | 一种大电流磁器件的埋磁方法和印制电路板的制造方法 |
| JP5811353B2 (ja) * | 2012-04-06 | 2015-11-11 | 日立金属株式会社 | 非接触給電システム |
| CN103384456A (zh) * | 2013-07-11 | 2013-11-06 | 优利德科技(中国)有限公司 | 一种pcb线圈的制备方法及pcb线圈 |
| KR101940981B1 (ko) | 2014-05-05 | 2019-01-23 | 3디 글래스 솔루션즈 인코포레이티드 | 2d 및 3d 인덕터 안테나 및 변압기 제작 광 활성 기판 |
| GB2535763B (en) * | 2015-02-26 | 2018-08-01 | Murata Manufacturing Co | An embedded magnetic component device |
| US10720823B1 (en) * | 2016-01-15 | 2020-07-21 | University Of Southern California | Ferrofluid liquid spring with magnets between coils inside an enclosed chamber for vibration energy harvesting |
| KR20200010598A (ko) | 2016-02-25 | 2020-01-30 | 3디 글래스 솔루션즈 인코포레이티드 | 3d 커패시터 및 커패시터 어레이 제작용 광활성 기재 |
| US12165809B2 (en) | 2016-02-25 | 2024-12-10 | 3D Glass Solutions, Inc. | 3D capacitor and capacitor array fabricating photoactive substrates |
| WO2017177171A1 (en) | 2016-04-08 | 2017-10-12 | 3D Glass Solutions, Inc. | Methods of fabricating photosensitive substrates suitable for optical coupler |
| US20180286556A1 (en) * | 2017-04-01 | 2018-10-04 | Intel Corporation | Integrated circuit implemented inductors and methods of manufacture |
| WO2018200804A1 (en) | 2017-04-28 | 2018-11-01 | 3D Glass Solutions, Inc. | Rf circulator |
| AU2018297035B2 (en) | 2017-07-07 | 2021-02-25 | 3D Glass Solutions, Inc. | 2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates |
| WO2019118761A1 (en) | 2017-12-15 | 2019-06-20 | 3D Glass Solutions, Inc. | Coupled transmission line resonate rf filter |
| KR102600200B1 (ko) | 2018-01-04 | 2023-11-10 | 3디 글래스 솔루션즈 인코포레이티드 | 고효율 rf 회로들을 위한 임피던스 정합 도전성 구조 |
| KR102145746B1 (ko) | 2018-04-10 | 2020-08-19 | 3디 글래스 솔루션즈 인코포레이티드 | Rf 집적형 전력 조절 커패시터 |
| KR102475010B1 (ko) | 2018-05-29 | 2022-12-07 | 3디 글래스 솔루션즈 인코포레이티드 | 저 삽입 손실 rf 전송 라인 |
| KR102518025B1 (ko) | 2018-09-17 | 2023-04-06 | 3디 글래스 솔루션즈 인코포레이티드 | 접지면을 갖는 고효율 컴팩트형 슬롯 안테나 |
| JP7241433B2 (ja) | 2018-12-28 | 2023-03-17 | スリーディー グラス ソリューションズ,インク | 光活性ガラス基板におけるrf、マイクロ波及びmm波システムのためのヘテロジニアスインテグレーション |
| WO2020139955A1 (en) | 2018-12-28 | 2020-07-02 | 3D Glass Solutions, Inc. | Annular capacitor rf, microwave and mm wave systems |
| WO2020206323A1 (en) | 2019-04-05 | 2020-10-08 | 3D Glass Solutions, Inc. | Glass based empty substrate integrated waveguide devices |
| WO2020214788A1 (en) | 2019-04-18 | 2020-10-22 | 3D Glass Solutions, Inc. | High efficiency die dicing and release |
| WO2021000074A1 (zh) * | 2019-06-29 | 2021-01-07 | 瑞声声学科技(深圳)有限公司 | 一种振动马达 |
| EP4100973A4 (en) | 2020-02-07 | 2024-05-22 | Systems, Machines, Automation Components Corporation | MULTILAYER PRINTED COIL ARRANGEMENT WITH VARIABLE INCLINATION PRINTED COILS |
| US11581828B2 (en) * | 2021-05-05 | 2023-02-14 | Enervibe Ltd | Electromagnetic vibration and energy harvester having vibrating body, magnets and stationary magnet and hinge |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388950A (en) * | 1977-01-13 | 1978-08-04 | Cit Alcatel | Method of making induction cicuit |
| JPS57128008A (en) * | 1981-01-30 | 1982-08-09 | Matsushita Electric Ind Co Ltd | Inductance element |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3372358A (en) | 1966-04-12 | 1968-03-05 | Itt | Film transformers |
| GB1440304A (en) * | 1974-11-29 | 1976-06-23 | Mullard Ltd | Transmission line pulse transformers |
| JPS5723208A (en) | 1980-07-17 | 1982-02-06 | Matsushita Electric Ind Co Ltd | Manufacture of closed magnetic circuit inductor |
| JPS5873183A (ja) | 1981-10-28 | 1983-05-02 | 株式会社東芝 | 印刷コイルを備えたプリント回路板 |
| JPS59103321A (ja) | 1982-12-03 | 1984-06-14 | Murata Mfg Co Ltd | コイルの製造方法 |
| US4873757A (en) * | 1987-07-08 | 1989-10-17 | The Foxboro Company | Method of making a multilayer electrical coil |
| US5173678A (en) * | 1990-09-10 | 1992-12-22 | Gte Laboratories Incorporated | Formed-to-shape superconducting coil |
| US5929733A (en) * | 1993-07-21 | 1999-07-27 | Nagano Japan Radio Co., Ltd. | Multi-layer printed substrate |
| US6000128A (en) * | 1994-06-21 | 1999-12-14 | Sumitomo Special Metals Co., Ltd. | Process of producing a multi-layered printed-coil substrate |
| TW265450B (en) | 1994-06-30 | 1995-12-11 | At & T Corp | Devices using metallized magnetic substrates |
-
1999
- 1999-05-28 WO PCT/JP1999/002815 patent/WO1999063557A1/ja not_active Ceased
- 1999-05-28 EP EP99922533A patent/EP1001439A4/en not_active Withdrawn
- 1999-05-28 US US09/463,630 patent/US6686824B1/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388950A (en) * | 1977-01-13 | 1978-08-04 | Cit Alcatel | Method of making induction cicuit |
| JPS57128008A (en) * | 1981-01-30 | 1982-08-09 | Matsushita Electric Ind Co Ltd | Inductance element |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP1001439A4 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170261942A1 (en) * | 2016-03-08 | 2017-09-14 | Seiko Instruments Inc. | Portable device and portable timepiece |
| CN107171445A (zh) * | 2016-03-08 | 2017-09-15 | 精工电子有限公司 | 便携设备和便携钟表 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6686824B1 (en) | 2004-02-03 |
| EP1001439A1 (en) | 2000-05-17 |
| EP1001439A4 (en) | 2001-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO1999063557A1 (en) | Printed annular coil and method of manufacture thereof | |
| TW561803B (en) | Circuit substrate and manufacturing method thereof | |
| JP4523051B2 (ja) | 配線回路基板の製造方法 | |
| JP2006073984A (ja) | 抵抗内蔵型プリント基板およびその製造方法 | |
| JPH0773914A (ja) | 電気結線基板用コアおよびコアを備えた電気結線用基板、ならびにそれらの製造方法 | |
| US5679498A (en) | Method for producing high density multi-layer integrated circuit carriers | |
| KR101726950B1 (ko) | 인쇄회로기판 제조방법 | |
| CN110267448A (zh) | 复合铜厚基板制作方法 | |
| JP3699334B2 (ja) | 配線回路基板の製造方法およびフォトマスク | |
| WO2000030420A1 (en) | Method of manufacturing multilayer wiring boards | |
| JP2009239215A (ja) | 銅張積層板およびこれを用いた配線基板の製造方法ならびに銅張積層板の端面処理方法およびこれに用いる端面処理装置 | |
| JP2004214410A (ja) | 多層配線基板の製造方法及び多層配線基板 | |
| US5139924A (en) | Method for producing a circuit board and a circuit-board preform for use in carrying out the method | |
| JP3062142B2 (ja) | 多層印刷配線板の製造方法 | |
| CN120021001A (zh) | 一种封装基板及其制备方法 | |
| JP2003273516A (ja) | 逐次多層配線基板及びその製造方法 | |
| JPH0745923A (ja) | フレキシブルプリント配線板及び複合基板 | |
| JP3090906B2 (ja) | 環状プリントコイルの製造方法 | |
| KR100509391B1 (ko) | 인쇄 배선판 제조 방법 | |
| JPH04116887A (ja) | 回路パターンの形成方法 | |
| JPH09331153A (ja) | 多層フレキシブル配線板の製造方法 | |
| JP2001154052A (ja) | 光導波路の製造方法 | |
| EP1259102B1 (en) | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same | |
| JPH10256707A (ja) | 樹脂製配線基板とその製造方法 | |
| JP2020017614A (ja) | 基板のスルーホール製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): US |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 1999922533 Country of ref document: EP Ref document number: 09463630 Country of ref document: US |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| WWP | Wipo information: published in national office |
Ref document number: 1999922533 Country of ref document: EP |
|
| WWW | Wipo information: withdrawn in national office |
Ref document number: 1999922533 Country of ref document: EP |