WO2001020619A3 - Electrical devices and process for making such devices - Google Patents

Electrical devices and process for making such devices Download PDF

Info

Publication number
WO2001020619A3
WO2001020619A3 PCT/US2000/025118 US0025118W WO0120619A3 WO 2001020619 A3 WO2001020619 A3 WO 2001020619A3 US 0025118 W US0025118 W US 0025118W WO 0120619 A3 WO0120619 A3 WO 0120619A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive surface
laminate
devices
laminates
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2000/025118
Other languages
French (fr)
Other versions
WO2001020619A2 (en
Inventor
Scott Hetherton
Wayne Montoya
Thomas Bruguier
Randy Daering
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corp filed Critical Tyco Electronics Corp
Priority to DE60038030T priority Critical patent/DE60038030T2/en
Priority to EP00961888A priority patent/EP1212759B1/en
Priority to JP2001524112A priority patent/JP5210480B2/en
Publication of WO2001020619A2 publication Critical patent/WO2001020619A2/en
Publication of WO2001020619A3 publication Critical patent/WO2001020619A3/en
Priority to US10/017,670 priority patent/US6854176B2/en
Anticipated expiration legal-status Critical
Priority to TW091135771A priority patent/TWI275107B/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed with two or more layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49089—Filling with powdered insulation
    • Y10T29/49091—Filling with powdered insulation with direct compression of powdered insulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Laminated Bodies (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7, 8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1), in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31, 51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.
PCT/US2000/025118 1999-09-14 2000-09-13 Electrical devices and process for making such devices Ceased WO2001020619A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE60038030T DE60038030T2 (en) 1999-09-14 2000-09-13 ELECTRICAL DEVICES AND MANUFACTURING METHOD
EP00961888A EP1212759B1 (en) 1999-09-14 2000-09-13 Electrical devices and process for making such devices
JP2001524112A JP5210480B2 (en) 1999-09-14 2000-09-13 Electrical device and method of manufacturing such a device
US10/017,670 US6854176B2 (en) 1999-09-14 2001-12-12 Process for manufacturing a composite polymeric circuit protection device
TW091135771A TWI275107B (en) 1999-09-14 2002-12-11 Electrical devices and process for making such devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/395,869 US6640420B1 (en) 1999-09-14 1999-09-14 Process for manufacturing a composite polymeric circuit protection device
US09/395,869 1999-09-14

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US09/395,869 Continuation-In-Part US6640420B1 (en) 1999-09-14 1999-09-14 Process for manufacturing a composite polymeric circuit protection device
US10/017,670 Continuation-In-Part US6854176B2 (en) 1999-09-14 2001-12-12 Process for manufacturing a composite polymeric circuit protection device

Publications (2)

Publication Number Publication Date
WO2001020619A2 WO2001020619A2 (en) 2001-03-22
WO2001020619A3 true WO2001020619A3 (en) 2001-12-06

Family

ID=23564886

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/025118 Ceased WO2001020619A2 (en) 1999-09-14 2000-09-13 Electrical devices and process for making such devices

Country Status (8)

Country Link
US (2) US6640420B1 (en)
EP (1) EP1212759B1 (en)
JP (2) JP5210480B2 (en)
CN (2) CN101521066B (en)
AT (1) ATE386330T1 (en)
DE (1) DE60038030T2 (en)
TW (1) TW523899B (en)
WO (1) WO2001020619A2 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6854176B2 (en) * 1999-09-14 2005-02-15 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
TW583080B (en) * 2001-03-07 2004-04-11 Protectronics Technology Corp Composite material for thermistor having positive temperature coefficient and manufacturing method thereof
TW528210U (en) * 2001-11-12 2003-04-11 Polytronics Technology Corp Battery protection device of multi-layer structure
TW547866U (en) * 2002-07-31 2003-08-11 Polytronics Technology Corp Over-current protection device
US7367114B2 (en) * 2002-08-26 2008-05-06 Littelfuse, Inc. Method for plasma etching to manufacture electrical devices having circuit protection
CN1695210A (en) * 2002-09-17 2005-11-09 泰科电子有限公司 A kind of manufacture method of polymer PTC device
KR100485890B1 (en) * 2002-10-22 2005-04-29 엘에스전선 주식회사 positive temperature coefficient electrical device for surface mounting and method thereof
KR100495133B1 (en) * 2002-11-28 2005-06-14 엘에스전선 주식회사 PTC Thermister
WO2004084270A2 (en) * 2003-03-14 2004-09-30 Bourns, Inc. Multi-layer polymeric electronic device and method of manufacturing same
JP4135651B2 (en) * 2003-03-26 2008-08-20 株式会社村田製作所 Multilayer positive temperature coefficient thermistor
TWI265534B (en) * 2003-12-31 2006-11-01 Polytronics Technology Corp Over-current protection apparatus
TWM254809U (en) * 2004-03-09 2005-01-01 Protectronics Technology Corp Multi-layer over-current protector
US20050225423A1 (en) * 2004-04-12 2005-10-13 Wei Hsu Fast-test printed resistor device with test auxiliary lines
US20060132277A1 (en) * 2004-12-22 2006-06-22 Tyco Electronics Corporation Electrical devices and process for making such devices
US20060202794A1 (en) * 2005-03-10 2006-09-14 Chang-Wei Ho Resettable over-current protection device and method for producing the same
JP2006279045A (en) 2005-03-28 2006-10-12 Tyco Electronics Corp Surface mount multilayer electrical circuit protection device with active elements between PPTC layers
FR2885131B1 (en) * 2005-04-27 2008-03-07 Arkema Sa POLYMER-BASED CELL STRUCTURE COMPRISING CARBON NANOTUBES, PREPARATION METHOD AND APPLICATIONS THEREOF
EP1790916B1 (en) * 2005-11-23 2014-05-21 Eberspächer catem GmbH & Co. KG Electric heating device with tolerance PTC heating element
US8044763B2 (en) * 2005-12-27 2011-10-25 Polytronics Technology Corp. Surface-mounted over-current protection device
USRE44224E1 (en) * 2005-12-27 2013-05-21 Polytronics Technology Corp. Surface-mounted over-current protection device
TWI490891B (en) * 2011-05-03 2015-07-01 Polytronics Technology Corp Over-current and over-temperature protection device
JP6152342B2 (en) * 2011-06-17 2017-06-21 Ｌｉｔｔｅｌｆｕｓｅジャパン合同会社 PTC device
WO2013018719A1 (en) * 2011-07-29 2013-02-07 タイコエレクトロニクスジャパン合同会社 Ptc device
CN103918040B (en) * 2011-09-15 2018-06-29 力特电子(日本)有限责任公司 Ptc device
US8957531B2 (en) * 2011-10-20 2015-02-17 International Business Machines Corporation Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
TWI562718B (en) * 2012-06-05 2016-12-11 Ind Tech Res Inst Emi shielding device and manufacturing method thereof
TWI453923B (en) * 2012-06-22 2014-09-21 台灣晶技股份有限公司 Light sensing chip package structure
JP2016515305A (en) * 2013-03-11 2016-05-26 ボーンズ、インコーポレイテッド Apparatus and method for planar magnetic technology using laminated polymer
TWI464756B (en) * 2013-05-31 2014-12-11 Polytronics Technology Corp Anti-surge over-current protection device
US20140353230A1 (en) * 2013-06-03 2014-12-04 Mann+Hummel Gmbh Filter with heating medium and filter element of a filter
US20150235744A1 (en) * 2014-02-20 2015-08-20 Fuzetec Technology Co., Ltd. Pptc over-current protection device
CN104658926B (en) * 2015-03-11 2017-07-28 禾邦电子（中国）有限公司 Element anoxybiotic encapsulating method and its element being made
US9959958B1 (en) * 2017-08-01 2018-05-01 Fuzetec Technology Co., Ltd. PTC circuit protection device and method of making the same
CN109427452B (en) * 2017-08-21 2021-01-29 富致科技股份有限公司 Positive temperature coefficient circuit protection device and manufacturing method thereof
TWI814547B (en) * 2022-08-24 2023-09-01 聚鼎科技股份有限公司 Circuit protection device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998029879A1 (en) * 1996-12-26 1998-07-09 Matsushita Electric Industrial Co., Ltd. Ptc thermistor and method for manufacturing the same
WO1999045551A2 (en) * 1998-03-05 1999-09-10 Bourns, Multifuse (Hong Kong), Ltd. Multilayer conductive polymer device and method of manufacturing same

Family Cites Families (130)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482316A (en) 1945-05-26 1949-09-20 Amalgamated Wireless Australas Lamella resistance unit
US3221145A (en) 1963-09-06 1965-11-30 Armstrong Cork Co Laminated heating sheet
US3351882A (en) 1964-10-09 1967-11-07 Polyelectric Corp Plastic resistance elements and methods for making same
US3435399A (en) 1966-04-19 1969-03-25 Gen Electric Thermistor device and method of producing said device
US3497859A (en) 1968-05-28 1970-02-24 Stackpole Carbon Co Electrical resistors for printed circuits
US3775725A (en) 1970-04-30 1973-11-27 Hokuriku Elect Ind Printed resistor
US3648364A (en) 1970-04-30 1972-03-14 Hokuriku Elect Ind Method of making a printed resistor
GB1415454A (en) 1973-05-04 1975-11-26 Welwyn Electric Ltd Mounting means of electrical components
US3835434A (en) 1973-06-04 1974-09-10 Sprague Electric Co Ptc resistor package
US4330703A (en) 1975-08-04 1982-05-18 Raychem Corporation Layered self-regulating heating article
JPS5441102B2 (en) 1975-03-04 1979-12-06
US4560498A (en) 1975-08-04 1985-12-24 Raychem Corporation Positive temperature coefficient of resistance compositions
US4534889A (en) 1976-10-15 1985-08-13 Raychem Corporation PTC Compositions and devices comprising them
US4388607A (en) 1976-12-16 1983-06-14 Raychem Corporation Conductive polymer compositions, and to devices comprising such compositions
US4200970A (en) 1977-04-14 1980-05-06 Milton Schonberger Method of adjusting resistance of a thermistor
DE2816593A1 (en) 1978-04-17 1979-10-18 Siemens Ag Doped barium titanate PTC resistor tube - which occupies less space than an equiv. disc PTC resistor
US4304987A (en) 1978-09-18 1981-12-08 Raychem Corporation Electrical devices comprising conductive polymer compositions
US4315237A (en) 1978-12-01 1982-02-09 Raychem Corporation PTC Devices comprising oxygen barrier layers
US4238812A (en) 1978-12-01 1980-12-09 Raychem Corporation Circuit protection devices comprising PTC elements
US4237441A (en) 1978-12-01 1980-12-02 Raychem Corporation Low resistivity PTC compositions
US4255698A (en) 1979-01-26 1981-03-10 Raychem Corporation Protection of batteries
US4445026A (en) 1979-05-21 1984-04-24 Raychem Corporation Electrical devices comprising PTC conductive polymer elements
US4327351A (en) 1979-05-21 1982-04-27 Raychem Corporation Laminates comprising an electrode and a conductive polymer layer
US4272471A (en) 1979-05-21 1981-06-09 Raychem Corporation Method for forming laminates comprising an electrode and a conductive polymer layer
US4371860A (en) 1979-06-18 1983-02-01 General Electric Company Solderable varistor
US4475138A (en) 1980-04-21 1984-10-02 Raychem Corporation Circuit protection devices comprising PTC element
US4317027A (en) 1980-04-21 1982-02-23 Raychem Corporation Circuit protection devices
US4545926A (en) 1980-04-21 1985-10-08 Raychem Corporation Conductive polymer compositions and devices
US4352083A (en) 1980-04-21 1982-09-28 Raychem Corporation Circuit protection devices
US5049850A (en) 1980-04-21 1991-09-17 Raychem Corporation Electrically conductive device having improved properties under electrical stress
US4591700A (en) 1980-05-19 1986-05-27 Raychem Corporation PTC compositions
US4426633A (en) 1981-04-15 1984-01-17 Raychem Corporation Devices containing PTC conductive polymer compositions
US4845838A (en) 1981-04-02 1989-07-11 Raychem Corporation Method of making a PTC conductive polymer electrical device
DE3122612A1 (en) 1981-06-06 1982-12-23 Draloric Electronic GmbH, 8672 Selb Method for producing chip resistors
US4935156A (en) 1981-09-09 1990-06-19 Raychem Corporation Conductive polymer compositions
DE3204207C2 (en) 1982-02-08 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Electrical resistance with a ceramic PTC body and method for its manufacture
US4486738A (en) 1982-02-16 1984-12-04 General Electric Ceramics, Inc. High reliability electrical components
EP0092428B1 (en) 1982-04-20 1990-04-04 Fujitsu Limited A method for producing a piezoelectric resonator
US4463407A (en) 1982-09-27 1984-07-31 Northern Telecom Limited Surface mounted electronic components having pre-applied solder
JPS59185801U (en) 1983-05-26 1984-12-10 アルプス電気株式会社 chip resistance
US4434416A (en) 1983-06-22 1984-02-28 Milton Schonberger Thermistors, and a method of their fabrication
US4514620A (en) 1983-09-22 1985-04-30 Raychem Corporation Conductive polymers exhibiting PTC characteristics
US4593181A (en) 1984-02-06 1986-06-03 Raychem Corporation Heating element having deformed buss bars
US4780598A (en) 1984-07-10 1988-10-25 Raychem Corporation Composite circuit protection devices
JPH0316251Y2 (en) 1985-03-04 1991-04-08
US4774024A (en) 1985-03-14 1988-09-27 Raychem Corporation Conductive polymer compositions
US4724417A (en) 1985-03-14 1988-02-09 Raychem Corporation Electrical devices comprising cross-linked conductive polymers
US4605471A (en) 1985-06-27 1986-08-12 Ncr Corporation Method of manufacturing printed circuit boards
US4689475A (en) 1985-10-15 1987-08-25 Raychem Corporation Electrical devices containing conductive polymers
US4861966A (en) 1985-10-15 1989-08-29 Raychem Corporation Method and apparatus for electrically heating diesel fuel utilizing a PTC polymer heating element
US4757298A (en) 1986-01-29 1988-07-12 Alps Electric Co., Ltd. Ceramic substrates for tip electronic parts
GB8604519D0 (en) 1986-02-24 1986-04-03 Raychem Sa Nv Electrical devices
JPH0690962B2 (en) 1986-03-31 1994-11-14 日本メクトロン株式会社 Method for manufacturing PTC element
DE3761236D1 (en) 1986-04-23 1990-01-25 Siemens Ag ELECTRICAL COMPONENT WITH HIGH STRENGTH WHEN STRESSED BY TEMPERATURE CHANGES AND BY CURRENT CURRENTS, IN PARTICULAR A VARISTOR.
US4777718A (en) 1986-06-30 1988-10-18 Motorola, Inc. Method of forming and connecting a resistive layer on a pc board
US4786888A (en) 1986-09-20 1988-11-22 Murata Manufacturing Co., Ltd. Thermistor and method of producing the same
US4706060A (en) 1986-09-26 1987-11-10 General Electric Company Surface mount varistor
JPS6420601A (en) 1987-07-16 1989-01-24 Jgc Corp Composit chip varister
FR2620561B1 (en) 1987-09-15 1992-04-24 Europ Composants Electron CTP THERMISTOR FOR SURFACE MOUNTING
US4907340A (en) 1987-09-30 1990-03-13 Raychem Corporation Electrical device comprising conductive polymers
US5166658A (en) 1987-09-30 1992-11-24 Raychem Corporation Electrical device comprising conductive polymers
US4924074A (en) 1987-09-30 1990-05-08 Raychem Corporation Electrical device comprising conductive polymers
US5097492A (en) 1987-10-30 1992-03-17 Four Pi Systems Corporation Automated laminography system for inspection of electronics
JPH01143203A (en) 1987-11-27 1989-06-05 Murata Mfg Co Ltd Organic positive characteristic thermister
DE8716103U1 (en) 1987-12-05 1988-01-21 Degussa Ag, 6000 Frankfurt Measuring resistor for temperature measurements
US4788523A (en) 1987-12-10 1988-11-29 United States Of America Viad chip resistor
NL8800156A (en) 1988-01-25 1989-08-16 Philips Nv CHIP RESISTOR AND METHOD FOR MANUFACTURING A CHIP RESISTOR.
DE68918303T2 (en) 1988-02-05 1995-05-18 Raychem Ltd., London Layered polymer film.
EP0327860A1 (en) 1988-02-10 1989-08-16 Siemens Aktiengesellschaft Electrical component of the chip type, and method of making the same
US4811164A (en) 1988-03-28 1989-03-07 American Telephone And Telegraph Company, At&T Bell Laboratories Monolithic capacitor-varistor
NL8800853A (en) 1988-04-05 1989-11-01 Philips Nv CHIP RESISTOR AND METHOD FOR MANUFACTURING A CHIP RESISTOR.
JPH0616442B2 (en) 1988-04-06 1994-03-02 株式会社村田製作所 Organic positive temperature coefficient thermistor
US4882466A (en) 1988-05-03 1989-11-21 Raychem Corporation Electrical devices comprising conductive polymers
US4873508A (en) 1988-06-06 1989-10-10 Therm-O-Disc, Incorporated Variable resistance thermal protector and method of making same
US4967176A (en) * 1988-07-15 1990-10-30 Raychem Corporation Assemblies of PTC circuit protection devices
US5057811A (en) 1988-12-22 1991-10-15 Texas Instruments Incorporated Electrothermal sensor
JPH02181475A (en) 1989-01-06 1990-07-16 Mitsubishi Electric Corp Solar battery cell and manufacture thereof
US4937551A (en) 1989-02-02 1990-06-26 Therm-O-Disc, Incorporated PTC thermal protector device
US5015824A (en) 1989-02-06 1991-05-14 Thermacon, Inc. Apparatus for heating a mirror or the like
US4904850A (en) 1989-03-17 1990-02-27 Raychem Corporation Laminar electrical heaters
AU637370B2 (en) 1989-05-18 1993-05-27 Fujikura Ltd. Ptc thermistor and manufacturing method for the same
US4993142A (en) 1989-06-19 1991-02-19 Dale Electronics, Inc. Method of making a thermistor
JPH0774328B2 (en) 1989-09-05 1995-08-09 千住金属工業株式会社 Adhesive for temporary fixing of electronic parts
US5247277A (en) 1990-02-14 1993-09-21 Raychem Corporation Electrical devices
EP0443618B1 (en) 1990-02-22 1995-11-08 Murata Manufacturing Co., Ltd. Method for producing a PTC thermistor
AU627663B2 (en) 1990-07-25 1992-08-27 Matsushita Electric Industrial Co., Ltd. Sic thin-film thermistor
US5089801A (en) 1990-09-28 1992-02-18 Raychem Corporation Self-regulating ptc devices having shaped laminar conductive terminals
US5382938A (en) 1990-10-30 1995-01-17 Asea Brown Boveri Ab PTC element
JPH04167501A (en) 1990-10-31 1992-06-15 Daito Tsushinki Kk Ptc element
US5142263A (en) 1991-02-13 1992-08-25 Electromer Corporation Surface mount device with overvoltage protection feature
US5258738A (en) 1991-04-16 1993-11-02 U.S. Philips Corporation SMD-resistor
US5196136A (en) 1991-06-20 1993-03-23 E. I. Du Pont De Nemours And Company Cleaning composition of hydrocarbon component, surfactant and multibasic ester additive
JPH0521207A (en) 1991-07-12 1993-01-29 Daito Tsushinki Kk PTC element
DE4126913A1 (en) 1991-08-14 1993-02-18 Siemens Ag METHOD FOR SOLDERING AND ASSEMBLING PCBS WITH COMPONENTS
US5303115A (en) 1992-01-27 1994-04-12 Raychem Corporation PTC circuit protection device comprising mechanical stress riser
US5166656A (en) 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
US5378407A (en) 1992-06-05 1995-01-03 Raychem Corporation Conductive polymer composition
CA2139330C (en) 1992-07-09 2004-10-12 Gregory A. Graves Electrical devices
US5852397A (en) * 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
US5488348A (en) 1993-03-09 1996-01-30 Murata Manufacturing Co., Ltd. PTC thermistor
US5347258A (en) 1993-04-07 1994-09-13 Zycon Corporation Annular resistor coupled with printed circuit board through-hole
JPH06302404A (en) 1993-04-16 1994-10-28 Murata Mfg Co Ltd Stacked positive temperature coefficient thermistor
US5451919A (en) 1993-06-29 1995-09-19 Raychem Corporation Electrical device comprising a conductive polymer composition
US5451921A (en) 1993-10-04 1995-09-19 Raychem Corporation Electrical devices
US5907273A (en) 1993-11-24 1999-05-25 Rochester Gauges, Inc. Linear positioning indicator
CN1030873C (en) * 1993-12-04 1996-01-31 清华大学 A method for preparing a multilayer laminated thermistor
US5847436A (en) 1994-03-18 1998-12-08 Kabushiki Kaisha Tokai Rika Denki Seisakusho Bipolar transistor having integrated thermistor shunt
DE69504333T2 (en) * 1994-05-16 1999-05-12 Raychem Corp., Menlo Park, Calif. ELECTRICAL COMPONENT WITH A PTC RESISTANCE ELEMENT
US5582770A (en) 1994-06-08 1996-12-10 Raychem Corporation Conductive polymer composition
CA2192363C (en) 1994-06-08 2005-10-25 Daniel A. Chandler Electrical devices containing conductive polymers
CA2192369A1 (en) 1994-06-09 1995-12-14 Michael Zhang Electrical devices
EP0815568B1 (en) 1995-03-22 2005-05-25 Tyco Electronics Corporation Electrical device
JP3930905B2 (en) 1995-03-22 2007-06-13 レイケム・コーポレイション Conductive polymer composition and device
WO1997006537A2 (en) 1995-08-07 1997-02-20 Philips Electronics N.V. Multiplet ptc resistor
US5801612A (en) 1995-08-24 1998-09-01 Raychem Corporation Electrical device
JPH09162004A (en) * 1995-12-13 1997-06-20 Murata Mfg Co Ltd Positive thermistor element
US5907272A (en) * 1996-01-22 1999-05-25 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element and a fusible link
JPH09219302A (en) 1996-02-13 1997-08-19 Daito Tsushinki Kk PTC element
JP3284873B2 (en) * 1996-03-27 2002-05-20 三菱マテリアル株式会社 Manufacturing method of chip type thermistor
JPH09266103A (en) * 1996-03-28 1997-10-07 Mitsubishi Materials Corp Chip type thermistor and manufacturing method thereof
US5818676A (en) 1997-05-16 1998-10-06 Yazaki Corporation Multiple element PTC overcurrent protection device
US6104587A (en) 1997-07-25 2000-08-15 Banich; Ann Electrical device comprising a conductive polymer
US6020808A (en) * 1997-09-03 2000-02-01 Bourns Multifuse (Hong Kong) Ltd. Multilayer conductive polymer positive temperature coefficent device
US6242997B1 (en) 1998-03-05 2001-06-05 Bourns, Inc. Conductive polymer device and method of manufacturing same
US6606023B2 (en) 1998-04-14 2003-08-12 Tyco Electronics Corporation Electrical devices
US6331763B1 (en) 1998-04-15 2001-12-18 Tyco Electronics Corporation Devices and methods for protection of rechargeable elements
US6429533B1 (en) 1999-11-23 2002-08-06 Bourns Inc. Conductive polymer device and method of manufacturing same
US6297722B1 (en) 2000-09-15 2001-10-02 Fuzetec Technology Co., Ltd. Surface mountable electrical device
TW507220B (en) 2001-03-13 2002-10-21 Protectronics Technology Corp Surface mountable polymeric circuit protection device and its manufacturing process
US6686827B2 (en) 2001-03-28 2004-02-03 Protectronics Technology Corporation Surface mountable laminated circuit protection device and method of making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998029879A1 (en) * 1996-12-26 1998-07-09 Matsushita Electric Industrial Co., Ltd. Ptc thermistor and method for manufacturing the same
EP0955643A1 (en) * 1996-12-26 1999-11-10 Matsushita Electric Industrial Co., Ltd Ptc thermistor and method for manufacturing the same
WO1999045551A2 (en) * 1998-03-05 1999-09-10 Bourns, Multifuse (Hong Kong), Ltd. Multilayer conductive polymer device and method of manufacturing same

Also Published As

Publication number Publication date
DE60038030D1 (en) 2008-03-27
JP2003515245A (en) 2003-04-22
ATE386330T1 (en) 2008-03-15
CN100492554C (en) 2009-05-27
US7343671B2 (en) 2008-03-18
JP2012099845A (en) 2012-05-24
EP1212759A2 (en) 2002-06-12
CN101521066B (en) 2012-06-27
JP5210480B2 (en) 2013-06-12
EP1212759B1 (en) 2008-02-13
TW523899B (en) 2003-03-11
WO2001020619A2 (en) 2001-03-22
CN1379905A (en) 2002-11-13
DE60038030T2 (en) 2009-02-05
US6640420B1 (en) 2003-11-04
US20040090304A1 (en) 2004-05-13
CN101521066A (en) 2009-09-02

Similar Documents

Publication Publication Date Title
DE60038030D1 (en) ELECTRICAL DEVICES AND MANUFACTURING METHOD
HK1004032A1 (en) Metal base board and electronic equipment using the same
WO2005011060A3 (en) Electrical interconnect assembly with interlocking contact system
EP1265466A3 (en) Method for fabrication wiring board provided with passive element and wiring board provided with passive element
AU6121598A (en) Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board
WO2003030602A1 (en) Multi-layered circuit wiring plate, ic package, and production method of multi-layered circuit wiring plate
EP0961533A3 (en) Circuit board and method of manufacturing the same
WO2002049405A3 (en) Multi-layer circuits and methods of manufacture thereof
EP2079292A3 (en) Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
WO2004008832A3 (en) Attachable modular electronic systems
EP1041633A4 (en) Semiconductor device, method of manufacture thereof, circuit board, and electronic device
WO2005125298A3 (en) Method for manufacturing an electronics module comprising a component electrically connected to a conductor- pattern layer
TW359862B (en) PTC conductive polymer protection device for surface mounting on a printed circuit board
EP1180818A3 (en) Electronic control unit mounting structure
WO2006056643A3 (en) Method for manufacturing an electronics module
WO2005065238A3 (en) Micro pin grid array with pin motion isolation
WO2002019430A3 (en) Hybrid substrate with embedded capacitors and methods of manufacture
WO2002055431A3 (en) Wafer level interconnection
AU2854099A (en) Semiconductor device and method for manufacturing the same, circuit substrate, and electronic device
EP1478023A4 (en) MODULE PIECE
EP1337136A3 (en) Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
EP0905763A3 (en) Multilayer wiring substrate and method for producing the same
WO2002017367A3 (en) Semiconductor device having passive elements and method of making same
CA2030826A1 (en) Composite circuit board with thick embedded conductor and method of manufacturing the same
CA2158785A1 (en) Electronic Thick Film Component Multiple Terminal and Method of Making the Same

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CN JP US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): CN JP US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

WWE Wipo information: entry into national phase

Ref document number: 2000961888

Country of ref document: EP

ENP Entry into the national phase

Ref country code: JP

Ref document number: 2001 524112

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 008129134

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2000961888

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 10088253

Country of ref document: US

WWG Wipo information: grant in national office

Ref document number: 2000961888

Country of ref document: EP