WO2001035708A2 - Method and apparatus for holding a printed circuit board in a precise position during processing - Google Patents
Method and apparatus for holding a printed circuit board in a precise position during processing Download PDFInfo
- Publication number
- WO2001035708A2 WO2001035708A2 PCT/US2000/042009 US0042009W WO0135708A2 WO 2001035708 A2 WO2001035708 A2 WO 2001035708A2 US 0042009 W US0042009 W US 0042009W WO 0135708 A2 WO0135708 A2 WO 0135708A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- conveyor
- supporting
- printed circuit
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Definitions
- This invention relates to a method and apparatus for holding a printed circuit board and; more particularly, to a method and apparatus for holding a printed circuit board while the board is subjected to a solder paste printing process.
- the present invention relates to printed circuit board manufacture and; more particularly, to solder paste printers.
- solder paste printers are typically employed to form solder paste patterns on printed circuit boards for subsequently mounted electrical components.
- solder paste printers include a conventional conveyor system for transporting a printed circuit board through a number of processing stations, including a print station.
- the conveyor system typically includes a pair of elongated longitudinal rails oriented parallel with respect to each other.
- the rails each have a number of pulleys mounted thereon, and at least one of the pulleys is motorized.
- Each of the rails further includes a drive belt mounted on the pulleys, whereby movement of the pulleys causes a printed circuit board positioned on the conveyor to move along the conveyor.
- One processing station includes the operation of positioning a stencil, which stencil has a planar surface with a number of apertures defined thereon, onto the printed circuit board. Solder paste is thereafter uniformly distributed, in a manner well known in the art, over the planar surface with a squeegee, so that solder is deposited at designated sites on the board. Specifically, a controlled downwardly directed force is exerted on the solder paste by the squeegee so that the solder paste is forced through the number of apertures defined on the stencil and onto the printed circuit board for forming the solder paste patterns thereon.
- Another processing station can include a mechanical arm assembly that picks and places electrical components onto the printed circuit board.
- circuit board substrate is comprised of a relatively thin and flexible material.
- the downwardly directed forces exerted on the printed circuit board by the squeegee can cause the board to bend or flex while the solder paste patterns are deposited thereon.
- the resulting solder paste patterns formed on the printed circuit may not register with the designated sites on the circuit board. The problem is further compounded when electrical components subsequently positioned do not electrically connect with the designated sites, resulting in printed circuit board failure.
- the printed circuit board It is important that the printed circuit board not move from the predetermined orientation while depositing the solder paste patterns on the board with the squeegee. This can occur as a result of the printed circuit board being supported on drive belts constructed of an elastic material such as rubber. If the printed circuit board moves from the predetermined orientation during the solder paste printing process, the solder paste patterns formed on the printed circuit board may be misaligned.
- Beale A prior mechanism for holding a printed circuit board in position is shown and described in U.S. Patent No. 5, 157, 438 to Beale (hereinafter "Beale").
- the mechanism for holding the printed circuit board in position for solder paste printing includes supporting the circuit board with a plurality of elongated members ( or support rods) that cooperate with a platform and a number of pneumatic cylinders to actuate the support rods.
- Beale further includes a mechanism that clamps the edges of the circuit board to the elastic drive belts of the conveyor for minimizing vertical movement of said board.
- One drawback in Beale is that the clamping mechanism clamps the edges of the printed circuit board to the elastic drive belts, which belts themselves can move as previously mentioned.
- edge clamping mechanism in Beale incorporates clamping foils positioned on each side of the printed circuit board that require actuating devices and controls for such actuating devices.
- the actuating devices and controls add to the expense and complexity of the clamping functions.
- One object of the present invention is to provide an improved printed circuit board holding mechanism for securely holding a printed circuit board in a predetermined position during solder paste printing.
- a solder paste printing apparatus is set forth having the improved printed circuit board holding mechanism which securely holds a printed circuit board in a predetermined position while the printed circuit board is subjected to a solder paste printing process.
- the printed circuit board holding mechanism includes a vertically movable pin support table having at least one tooling pin or other support member mounted thereon.
- the circuit board holding mechanism further includes a pair of elongated conveyor rails that are separated and oriented parallel with respect to each other.
- the conveyor rails each support a number of pulleys, which pulleys have a drive belt mounted thereon.
- At least one segment of each conveyor rail further includes a clamping rail that is spring biased downwardly. The clamping rail is dimensioned to engage opposite top edges of the printed circuit board when the movable pin support table is actuated upwardly.
- the movable pin support table is actuated upwardly so that the tooling pin or other support member mounted thereon contacts the bottom surface of the printed circuit board to move the printed circuit board up and off of the drive belts and into engagement with the clamping rails. In this orientation, the printed circuit board is no longer supported by the resilient drive belts, rather, the printed circuit board is securely held between the clamping rails and the tooling pin or other support member.
- Fig. 1 is a partial top plan view of a solder paste printer conveyor system having principles of the present invention
- Fig. 2 is a partial side view of the slotted board support strip mounted on the conveyor system shown in Fig. 1 ;
- Fig. 3 is a partial cross-sectional view of the printed circuit board holding mechanism;
- Fig. 4 is partial cross-sectional view of the printed circuit board holding mechanism of Fig. 1 shown in an engaged relationship with a printed circuit board.
- the present invention provides an improved printed circuit board holding mechanism for use in conjunction with a solder paste printing apparatus.
- solder paste printing apparatus 5 generally includes conveyor system 10 for transporting printed circuit board 15 through a number of processing stations.
- Conveyor system 10 typically includes a pair of elongated longitudinal conveyor rails 20 oriented parallel with respect to each other.
- Conveyor rails 20 each have a number of pulleys 25 mounted thereon, whereby at least one of the pulleys 25 is motorized by, for example, one or more electric motors 26.
- Drive belt 30 is mounted on the pulleys 25 associated with each rail 20 so that when rotational motion is transposed to the pulleys 25 by the motor, drive belts 30 move linearly.
- Solder paste printing apparatus 5 further includes a movable printed circuit board pin support table 35 having one or more tooling pins 40 and 41 mounted thereon.
- Pin support table 35 can be actuated, for example, by a hydraulic or pneumatic cylinder (not shown) to vertically move towards and/or away from printed circuit board 15.
- Pin support table 35 can be constructed from a rigid and sturdy material such as steel or a metal alloy.
- Tooling pins 40 and 41, which are mounted on pin support table 35 may be in the form of a cylinder having one end 40a and 41a respectively mounted on the pin support table 35 and another end 40b and 41b respectively adapted to intermittently contact bottom surface 15a of printed circuit board 15.
- a number of slotted board support strips 55 are slidably attached to each of the conveyor rails 20. Each slotted board support strip 55 can slide vertically upward and/or downward with respect to a mounting screw 56 associated with slotted board support strip 55. Each board support strip 55 includes a first end 55a adapted to intermittently contact pin support table 35 and a second end 55b adapted to intermittently contact bottom surface 15a of printed circuit board 15. While in Fig. 1 the slotted board support strip 55 is shown as being narrow in its dimension perpendicular to the slot, and four such strips are shown, it is to be understood that narrow dimension may be lengthened to, for example, up to the dimension of table 35 to provide support along the entire bottom of board 15.
- slotted board support strip 55 and screw 56 mount are illustrated herein, it is understood that other mechanisms may be utilized to move upward and/or downward with table 35 and provide support to bottom surface 15a of printed circuit board 15.
- slotted board support strips 55 may not be mounted on conveyor rails 20 at all, but rather mounted directly on pin support table 35.
- each conveyor rail 20 includes a clamp rail support 23 having hollow interior cavity 60 dimensioned to accept a piston 65 having a first end 65a and a second end 65b.
- First end 65a of piston 65 is dimensioned to conformingly contact first end 70a of helical compression spring 70 which is also positioned in cavity 60.
- Second end 70b of compression spring 70 conformingly contacts an annular collet 73 formed on an interior portion of cavity 60.
- Clamp rail 80 includes clamping foil 85 which may be integrally formed on clamp rail 80.
- Each clamping foil 85 is oriented to extend inwardly so each clamp foils 85 mounted on opposing rails 20 face each other and are dimensioned to overlap opposite top edges 15b of printed circuit board 15.
- clamping foil 85 may be separate from clamp rail 80 and joined to clamp rail 80 by adhesives, screws or other conventional attachment devices.
- clamp rail 80 with its clamping foil 85 may extend along the entire length of clamp rail 80 or only in segment 50 or even less than the length of segment 50, as desired to hold down printed circuit board 15.
- pin support table 35 moves upwardly until one end 41b of tooling pin 41 contacts bottom surface 15a of printed circuit board 15.
- pin support table 35 continues moving upwardly and lifts printed circuit board 15 off conveyor system 10.
- Printed circuit board 15 continues to move upwardly until top edge 15b of printed circuit board 15 contacts each of foils 85 defined on clamping rails 80.
- Compression of compression spring 70 generates a downwardly directed pre-load force on clamping foil 85 which is transposed to top edge 15b of printed circuit board 15 to securely hold printed circuit board 15 in a sandwiched position between foils 85, second ends 55b of board support strips 55 and one end 41b of tooling pin 41. Also, during the same movement in which the pin support table 35 moves upwardly, the pin support table contacts first ends 55a of slotted board support strips 55. After initial contact, and as pin support table 35 continues its upward movement, slotted board support strips 55 slide upwardly along mounting screw 56 until second ends 55b of slotted board support strips 55 contact bottom surface 15a of printed circuit board 15 and lifts the printed circuit board 15 off drive belt 30.
- printed circuit board 35 is securely held in a suspended position off conveyor, system 10 (Fig.4).
- Printed circuit board 15 is supported on bottom surface 15a by slotted, board support strips 55 and tooling pin 41 and top edges 15b of printed circuit board 15 ar&held by clamping rails 80 and associated foils 85. In this orientation, printed circuit board 15 is securely held so that motion of printed circuit board 15 during processing is significantly reduced or eliminated.
- the height of slotted board support strip 55 and tooling pin 41 are preferably equal so that substantially the same support is provided to bottom surface 15a of printed circuit board 15.
- tooling pin 41 is '.shown as having a substantially conical portion 41b, it is to be understood that tooling 41 may be of any desired shape or dimension and used in a suitable number across upper surface 35a of pin support table 35 to provide support for an interior region of bottom surface 15a of printed circuit board 15.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE60011664T DE60011664T2 (en) | 1999-11-08 | 2000-11-08 | METHOD AND DEVICE FOR MAINTAINING A PCB IN AN EXACT POSITION DURING PROCESSING |
| AU27524/01A AU2752401A (en) | 1999-11-08 | 2000-11-08 | Method and apparatus for holding a printed circuit board in a precise position during processing |
| EP00990505A EP1228676B1 (en) | 1999-11-08 | 2000-11-08 | Method and apparatus for holding a printed circuit board in a precise position during processing |
| HK03100673.1A HK1048721A1 (en) | 1999-11-08 | 2000-11-08 | Method and apparatus for holding a printed circuit board in a precise position during processing |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16393499P | 1999-11-08 | 1999-11-08 | |
| US60/163,934 | 1999-11-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2001035708A2 true WO2001035708A2 (en) | 2001-05-17 |
| WO2001035708A3 WO2001035708A3 (en) | 2001-12-27 |
Family
ID=22592256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2000/042009 Ceased WO2001035708A2 (en) | 1999-11-08 | 2000-11-08 | Method and apparatus for holding a printed circuit board in a precise position during processing |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1228676B1 (en) |
| AU (1) | AU2752401A (en) |
| DE (1) | DE60011664T2 (en) |
| HK (1) | HK1048721A1 (en) |
| WO (1) | WO2001035708A2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003063569A1 (en) * | 2002-01-22 | 2003-07-31 | Teradyne, Inc. | Automated optical inspection system with staging conveyor |
| WO2005086558A1 (en) * | 2004-03-05 | 2005-09-15 | Siemens Aktiengesellschaft | Device for handling substrates in a fitting device |
| TWI418271B (en) * | 2010-12-17 | 2013-12-01 | Zhen Ding Technology Co Ltd | Holding apparatus |
| JP2014154627A (en) * | 2013-02-06 | 2014-08-25 | Yamaha Motor Co Ltd | Substrate fixing device, substrate working device and substrate fixing method |
| CN109436664A (en) * | 2019-01-10 | 2019-03-08 | 北亚美亚电子科技(深圳)有限公司 | A kind of multi-functional general-using type conveying track |
| WO2019135959A1 (en) * | 2018-01-02 | 2019-07-11 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| CN110035616A (en) * | 2019-04-25 | 2019-07-19 | 王薪皓 | A kind of pcb board processing clamping device being equipped with flexible clamping body structure |
| US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1940567B (en) * | 2005-09-30 | 2011-01-19 | 良瑞科技股份有限公司 | Conveying and gripping device for circuit board inspection |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62130596A (en) * | 1985-12-02 | 1987-06-12 | 三菱電機株式会社 | Electronic parts automatic assembly equipment |
| GB9102850D0 (en) * | 1991-02-11 | 1991-03-27 | Dek Printing Machines Ltd | Workpiece support means |
| JPH10501926A (en) * | 1995-03-28 | 1998-02-17 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | Method of positioning a printed wiring board in a component placement machine and component placement machine for this method |
-
2000
- 2000-11-08 WO PCT/US2000/042009 patent/WO2001035708A2/en not_active Ceased
- 2000-11-08 EP EP00990505A patent/EP1228676B1/en not_active Expired - Lifetime
- 2000-11-08 AU AU27524/01A patent/AU2752401A/en not_active Abandoned
- 2000-11-08 DE DE60011664T patent/DE60011664T2/en not_active Expired - Lifetime
- 2000-11-08 HK HK03100673.1A patent/HK1048721A1/en unknown
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003063569A1 (en) * | 2002-01-22 | 2003-07-31 | Teradyne, Inc. | Automated optical inspection system with staging conveyor |
| WO2005086558A1 (en) * | 2004-03-05 | 2005-09-15 | Siemens Aktiengesellschaft | Device for handling substrates in a fitting device |
| TWI418271B (en) * | 2010-12-17 | 2013-12-01 | Zhen Ding Technology Co Ltd | Holding apparatus |
| US9668393B2 (en) | 2013-02-06 | 2017-05-30 | Yamaha Hatsudoki Kabushiki Kaisha | Substrate fixing apparatus and substrate working apparatus |
| EP2765843A3 (en) * | 2013-02-06 | 2015-08-19 | Yamaha Hatsudoki Kabushiki Kaisha | Substrate fixing apparatus, substrate working apparatus and substrate fixing method |
| TWI583606B (en) * | 2013-02-06 | 2017-05-21 | 山葉發動機股份有限公司 | Substrate fixing apparatus, substrate working apparatus, and substrate fixing method |
| JP2014154627A (en) * | 2013-02-06 | 2014-08-25 | Yamaha Motor Co Ltd | Substrate fixing device, substrate working device and substrate fixing method |
| US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| WO2019135959A1 (en) * | 2018-01-02 | 2019-07-11 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| CN109436664A (en) * | 2019-01-10 | 2019-03-08 | 北亚美亚电子科技(深圳)有限公司 | A kind of multi-functional general-using type conveying track |
| CN110035616A (en) * | 2019-04-25 | 2019-07-19 | 王薪皓 | A kind of pcb board processing clamping device being equipped with flexible clamping body structure |
| CN110035616B (en) * | 2019-04-25 | 2021-11-23 | 嵊州市鉴亭新材料科技有限公司 | Clamping device provided with flexible clamping body structure and used for processing PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2752401A (en) | 2001-06-06 |
| EP1228676A2 (en) | 2002-08-07 |
| WO2001035708A3 (en) | 2001-12-27 |
| DE60011664T2 (en) | 2005-09-08 |
| HK1048721A1 (en) | 2003-04-11 |
| DE60011664D1 (en) | 2004-07-22 |
| EP1228676B1 (en) | 2004-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1228676B1 (en) | Method and apparatus for holding a printed circuit board in a precise position during processing | |
| JP4942624B2 (en) | Substrate positioning device and substrate positioning method for screen printing apparatus | |
| US6870745B2 (en) | Printed-board supporting device, electric-component mounting system, and process of manufacturing printed-circuit board | |
| US5322565A (en) | Method and apparatus for through hole substrate printing | |
| EP1757176B1 (en) | Screen printing apparatus and screen printing method | |
| KR100263823B1 (en) | Printed board positioning method | |
| US4782589A (en) | Process of connecting lead frame to a semi-conductor device and a device to effect same | |
| JP3708253B2 (en) | Substrate underlay method | |
| US20250214333A1 (en) | Conveyance device and conveyance method | |
| JP2808840B2 (en) | Substrate positioning device | |
| JP3395644B2 (en) | Lead frame transfer device | |
| JPS6284871A (en) | Screen printing machine for print board | |
| CN215709929U (en) | Go up unloading and open production line system that presss from both sides device and have this last unloading and open clamp device | |
| US4846700A (en) | Lead frame for semi-conductor device | |
| JP2000307299A (en) | Component mounting device | |
| JP2707752B2 (en) | Substrate support device for screen printing equipment | |
| CN214059146U (en) | Clamping jaw assembly for PCB board retracting and releasing sucker device | |
| JP3906904B2 (en) | Screen printing apparatus and screen printing method | |
| JP2022070231A (en) | Gripping system for variable thickness workpieces | |
| CN223252560U (en) | A steel mesh quick positioning device and solder paste printer | |
| KR100373230B1 (en) | Pcb feeding apparatus of pcb manufacturing machine | |
| US20040172812A1 (en) | Device for displacing printed circuit boards | |
| JP2637994B2 (en) | Screen printing machine | |
| CN221553552U (en) | Circuit board assembling equipment | |
| CN219617811U (en) | Template grabbing device and template loading and unloading manipulator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
| AK | Designated states |
Kind code of ref document: A3 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2000990505 Country of ref document: EP |
|
| WWP | Wipo information: published in national office |
Ref document number: 2000990505 Country of ref document: EP |
|
| REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
| WWG | Wipo information: grant in national office |
Ref document number: 2000990505 Country of ref document: EP |