WO2002003439A3 - Process for selectively etching doped silicon dioxide over undoped silicon dioxide and silicon nitride - Google Patents

Process for selectively etching doped silicon dioxide over undoped silicon dioxide and silicon nitride Download PDF

Info

Publication number
WO2002003439A3
WO2002003439A3 PCT/US2001/041275 US0141275W WO0203439A3 WO 2002003439 A3 WO2002003439 A3 WO 2002003439A3 US 0141275 W US0141275 W US 0141275W WO 0203439 A3 WO0203439 A3 WO 0203439A3
Authority
WO
WIPO (PCT)
Prior art keywords
etchant
silicon dioxide
silicon nitride
c2hxfy
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/041275
Other languages
French (fr)
Other versions
WO2002003439A8 (en
WO2002003439A2 (en
Inventor
Kei-Yu Ko
Li Li
Guy T Blalock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to DE60135844T priority Critical patent/DE60135844D1/en
Priority to KR1020037000043A priority patent/KR100750081B1/en
Priority to AU2001278191A priority patent/AU2001278191A1/en
Priority to EP01956164A priority patent/EP1297564B1/en
Priority to JP2002507425A priority patent/JP2004503082A/en
Publication of WO2002003439A2 publication Critical patent/WO2002003439A2/en
Publication of WO2002003439A3 publication Critical patent/WO2002003439A3/en
Publication of WO2002003439A8 publication Critical patent/WO2002003439A8/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/069—Manufacture or treatment of conductive parts of the interconnections by forming self-aligned vias or self-aligned contact plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Weting (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

An etchant including C2HxFy, where x is an integer from two to five, inclusive, where y is an integer from one to four, inclusive, and where x plus y equals six. The etchant etches doped silicon dioxide with selectivity over both undoped silicon dioxide and silicon nitride. Thus, undoped silicon dioxide and silicon nitride may be employed as etch stops in dry etch processes which utilize the C2HxFy-containing etchant. C2HxFy may be employed as either a primary etchant or as an additive to another etchant or etchant mixture. Semiconductor devices (10) that include structures that have been patterned with an etchant of the present invention or in accordance with the method of the present invention are also disclosed. Specifically, the present invention includes semiconductor devices (10) including doped silicon oxide structures (24) with substantially vertical sidewalls (34) and adjacent undoped silicon oxide or silicon nitride structures (36) exposed adjacent the sidewall (34).
PCT/US2001/041275 2000-07-05 2001-07-05 Process for selectively etching doped silicon dioxide over undoped silicon dioxide and silicon nitride Ceased WO2002003439A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE60135844T DE60135844D1 (en) 2000-07-05 2001-07-05 METHOD FOR SELECTIVATING DOTED SILICON OXIDE ON UNDOTIZED SILICON OXIDE
KR1020037000043A KR100750081B1 (en) 2000-07-05 2001-07-05 How to selectively etch undoped silicon dioxide and doped silicon dioxide on silicon nitride
AU2001278191A AU2001278191A1 (en) 2000-07-05 2001-07-05 Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby
EP01956164A EP1297564B1 (en) 2000-07-05 2001-07-05 Process for selectively etching doped silicon dioxide over undoped silicon dioxide
JP2002507425A JP2004503082A (en) 2000-07-05 2001-07-05 An etchant with selectivity for doped silicon oxide on top of undoped silicon oxide and silicon nitride, methods of using the etchant, and structures formed thereby.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61004900A 2000-07-05 2000-07-05
US09/610,049 2000-07-05

Publications (3)

Publication Number Publication Date
WO2002003439A2 WO2002003439A2 (en) 2002-01-10
WO2002003439A3 true WO2002003439A3 (en) 2002-06-06
WO2002003439A8 WO2002003439A8 (en) 2002-07-04

Family

ID=24443420

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/041275 Ceased WO2002003439A2 (en) 2000-07-05 2001-07-05 Process for selectively etching doped silicon dioxide over undoped silicon dioxide and silicon nitride

Country Status (8)

Country Link
EP (1) EP1297564B1 (en)
JP (1) JP2004503082A (en)
KR (1) KR100750081B1 (en)
CN (1) CN1211841C (en)
AT (1) ATE408896T1 (en)
AU (1) AU2001278191A1 (en)
DE (1) DE60135844D1 (en)
WO (1) WO2002003439A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10311691A1 (en) * 2003-03-17 2004-10-07 Infineon Technologies Ag Method for preparation of a semiconductor structure by provision of Si nitride layer and Si dioxide layers useful for etching of Si dioxide layers with higher selectivity than Si nitride layers
US8778804B2 (en) * 2009-01-30 2014-07-15 Fei Company High selectivity, low damage electron-beam delineation etch
CN102945892B (en) * 2012-11-07 2015-08-05 南通大学 A kind of method for manufacturing solar battery
US10217681B1 (en) 2014-08-06 2019-02-26 American Air Liquide, Inc. Gases for low damage selective silicon nitride etching

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4529476A (en) * 1983-06-01 1985-07-16 Showa Denko K.K. Gas for selectively etching silicon nitride and process for selectively etching silicon nitride with the gas
JPS61251138A (en) * 1985-04-30 1986-11-08 Matsushita Electric Ind Co Ltd Dry etching
EP0721205A2 (en) * 1994-12-07 1996-07-10 Cypress Semiconductor Corporation Method of etching an oxide layer with simultaneous deposition of a polymer layer
WO1998049719A1 (en) * 1997-04-30 1998-11-05 Micron Technology, Inc. Undoped silicon dioxide as etch stop for selective etch of doped silicon dioxide
US6018184A (en) * 1998-01-22 2000-01-25 Micron Technology, Inc. Semiconductor structure useful in a self-aligned contact having multiple insulation layers of non-uniform thickness
US6066555A (en) * 1995-12-22 2000-05-23 Cypress Semiconductor Corporation Method for eliminating lateral spacer erosion on enclosed contact topographies during RF sputter cleaning
US6117791A (en) * 1998-06-22 2000-09-12 Micron Technology, Inc. Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814563A (en) * 1996-04-29 1998-09-29 Applied Materials, Inc. Method for etching dielectric using fluorohydrocarbon gas, NH3 -generating gas, and carbon-oxygen gas

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4529476A (en) * 1983-06-01 1985-07-16 Showa Denko K.K. Gas for selectively etching silicon nitride and process for selectively etching silicon nitride with the gas
JPS61251138A (en) * 1985-04-30 1986-11-08 Matsushita Electric Ind Co Ltd Dry etching
EP0721205A2 (en) * 1994-12-07 1996-07-10 Cypress Semiconductor Corporation Method of etching an oxide layer with simultaneous deposition of a polymer layer
US6066555A (en) * 1995-12-22 2000-05-23 Cypress Semiconductor Corporation Method for eliminating lateral spacer erosion on enclosed contact topographies during RF sputter cleaning
WO1998049719A1 (en) * 1997-04-30 1998-11-05 Micron Technology, Inc. Undoped silicon dioxide as etch stop for selective etch of doped silicon dioxide
US6018184A (en) * 1998-01-22 2000-01-25 Micron Technology, Inc. Semiconductor structure useful in a self-aligned contact having multiple insulation layers of non-uniform thickness
US6117791A (en) * 1998-06-22 2000-09-12 Micron Technology, Inc. Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 011, no. 099 (E - 493) 27 March 1987 (1987-03-27) *

Also Published As

Publication number Publication date
AU2001278191A1 (en) 2002-01-14
CN1451176A (en) 2003-10-22
KR20030038651A (en) 2003-05-16
WO2002003439A8 (en) 2002-07-04
ATE408896T1 (en) 2008-10-15
EP1297564B1 (en) 2008-09-17
WO2002003439A2 (en) 2002-01-10
EP1297564A2 (en) 2003-04-02
DE60135844D1 (en) 2008-10-30
JP2004503082A (en) 2004-01-29
KR100750081B1 (en) 2007-08-21
CN1211841C (en) 2005-07-20

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