WO2002015651A3 - Low inductance transistor module with distributed bus - Google Patents

Low inductance transistor module with distributed bus Download PDF

Info

Publication number
WO2002015651A3
WO2002015651A3 PCT/US2001/041520 US0141520W WO0215651A3 WO 2002015651 A3 WO2002015651 A3 WO 2002015651A3 US 0141520 W US0141520 W US 0141520W WO 0215651 A3 WO0215651 A3 WO 0215651A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
bus
distributed bus
conducting sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/041520
Other languages
French (fr)
Other versions
WO2002015651A2 (en
Inventor
Jeffrey A Reichard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Superconductor Corp
Original Assignee
American Superconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Superconductor Corp filed Critical American Superconductor Corp
Priority to EP01959863A priority Critical patent/EP1308071A2/en
Priority to AU2001281379A priority patent/AU2001281379A1/en
Publication of WO2002015651A2 publication Critical patent/WO2002015651A2/en
Publication of WO2002015651A3 publication Critical patent/WO2002015651A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A switching module (23) includes a first printed circuit board (42) for mounting a switching element. To reduce inductance, the switching module (23) includes a distributed bus. By electrically connecting a power bus (28, 32) disposed on the printed circuit board (42) with a conducting sheet (60, 66), the switching module (23) provides a distributed bus having an inductance that is smaller than the inductance of the power bus (28, 32). When the first conducting sheet (60) is on a second printed circuit board (56), a plurality of conducting posts (54) extends from the first printed circuit board (42) to support the second printed circuit board (56). Alternatively, the conducting sheet and the power bus can be on the same printed circuit board, in which case a via in contact with the power bus and the conducting sheet provides electrical communication to create a distributed bus.
PCT/US2001/041520 2000-08-11 2001-07-31 Low inductance transistor module with distributed bus Ceased WO2002015651A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP01959863A EP1308071A2 (en) 2000-08-11 2001-07-31 Low inductance transistor module with distributed bus
AU2001281379A AU2001281379A1 (en) 2000-08-11 2001-07-31 Low inductance transistor module with distributed bus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/637,619 US6459605B1 (en) 2000-08-11 2000-08-11 Low inductance transistor module with distributed bus
US09/637,619 2000-08-11

Publications (2)

Publication Number Publication Date
WO2002015651A2 WO2002015651A2 (en) 2002-02-21
WO2002015651A3 true WO2002015651A3 (en) 2002-08-29

Family

ID=24556702

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/041520 Ceased WO2002015651A2 (en) 2000-08-11 2001-07-31 Low inductance transistor module with distributed bus

Country Status (4)

Country Link
US (1) US6459605B1 (en)
EP (1) EP1308071A2 (en)
AU (1) AU2001281379A1 (en)
WO (1) WO2002015651A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6954368B1 (en) 1996-07-22 2005-10-11 HYDRO-QUéBEC Low stray interconnection inductance power converting molecule for converting a DC voltage into an AC voltage, and a method therefor
US7248483B2 (en) * 2004-08-19 2007-07-24 Xantrex Technology, Inc. High power density insulated metal substrate based power converter assembly with very low BUS impedance
US20060214654A1 (en) * 2005-03-28 2006-09-28 Trisco Technology Corp. [conducting structure of a meter]
US20070041160A1 (en) * 2005-08-19 2007-02-22 Kehret William E Thermal management for a ruggedized electronics enclosure
GB2487185B (en) * 2011-01-05 2015-06-03 Penny & Giles Controls Ltd Power Switching Circuitry
WO2012117694A1 (en) * 2011-02-28 2012-09-07 株式会社日立製作所 Electric power converter
CN104955273B (en) * 2014-03-31 2018-10-02 奇点新源国际技术开发(北京)有限公司 Printed circuit board and network cabling system
CN120499927A (en) 2020-02-27 2025-08-15 台达电子工业股份有限公司 Power module assembling structure and assembling method thereof
DE102020209238A1 (en) * 2020-07-22 2022-01-27 Robert Bosch Gesellschaft mit beschränkter Haftung EMC filter with a shield

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63157677A (en) * 1986-12-19 1988-06-30 R F Enajii Kk Bridge type inverter
EP0287681A1 (en) * 1986-10-20 1988-10-26 Fanuc Ltd. Multi-layer printed circuit board and a method of fabricating the same
US4899251A (en) * 1987-10-29 1990-02-06 Hitachi, Ltd. Power supply network of printed circuit board
DE9403108U1 (en) * 1994-02-24 1994-04-14 Siemens AG, 80333 München Low-inductance high-current busbar for converter modules
JPH08274428A (en) * 1995-03-31 1996-10-18 Sony Tektronix Corp Power control circuit
JPH09135565A (en) * 1995-09-08 1997-05-20 Hitachi Ltd Wiring board and power converter using the same
JP2000200948A (en) * 1999-01-07 2000-07-18 Toshiba Corp Wiring structure of parallel circuit

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5027253A (en) * 1990-04-09 1991-06-25 Ibm Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5172310A (en) * 1991-07-10 1992-12-15 U.S. Windpower, Inc. Low impedance bus for power electronics
US5901038A (en) * 1997-03-17 1999-05-04 Cheng; Wing Ling Power supply system for high density printed circuit boards

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0287681A1 (en) * 1986-10-20 1988-10-26 Fanuc Ltd. Multi-layer printed circuit board and a method of fabricating the same
JPS63157677A (en) * 1986-12-19 1988-06-30 R F Enajii Kk Bridge type inverter
US4899251A (en) * 1987-10-29 1990-02-06 Hitachi, Ltd. Power supply network of printed circuit board
DE9403108U1 (en) * 1994-02-24 1994-04-14 Siemens AG, 80333 München Low-inductance high-current busbar for converter modules
JPH08274428A (en) * 1995-03-31 1996-10-18 Sony Tektronix Corp Power control circuit
JPH09135565A (en) * 1995-09-08 1997-05-20 Hitachi Ltd Wiring board and power converter using the same
JP2000200948A (en) * 1999-01-07 2000-07-18 Toshiba Corp Wiring structure of parallel circuit

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 199701, Derwent World Patents Index; AN 1997-005114, XP002189459 *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 420 (E - 679) 8 November 1988 (1988-11-08) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 09 30 September 1997 (1997-09-30) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 10 17 November 2000 (2000-11-17) *

Also Published As

Publication number Publication date
AU2001281379A1 (en) 2002-02-25
US6459605B1 (en) 2002-10-01
WO2002015651A2 (en) 2002-02-21
EP1308071A2 (en) 2003-05-07

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