WO2002039099A3 - Measurement of surface defects - Google Patents

Measurement of surface defects Download PDF

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Publication number
WO2002039099A3
WO2002039099A3 PCT/EP2001/013042 EP0113042W WO0239099A3 WO 2002039099 A3 WO2002039099 A3 WO 2002039099A3 EP 0113042 W EP0113042 W EP 0113042W WO 0239099 A3 WO0239099 A3 WO 0239099A3
Authority
WO
WIPO (PCT)
Prior art keywords
lines
inspection
light source
measurement
interference pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2001/013042
Other languages
French (fr)
Other versions
WO2002039099A2 (en
Inventor
Teunis W Tukker
Hooft Gert W T
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Priority to EP01993826A priority Critical patent/EP1336094A2/en
Priority to JP2002541373A priority patent/JP2004513364A/en
Publication of WO2002039099A2 publication Critical patent/WO2002039099A2/en
Publication of WO2002039099A3 publication Critical patent/WO2002039099A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

A device (1) for the inspection of one or a plurality of moving surfaces (8), more particularly for the inspection of a rotating surface (8) of a silicon wafer (13). The device comprises at least a laser light source (1) and a beam splitter (4) for splitting a light beam (2) that is emitted by said light source (1) into at least two sub-beams (5, 6) that interfere with one another so as to produce an interference pattern (10) on the surface (8) to be inspected. The device is arranged so that the interference pattern (10) contains a plurality of lines (11) of maximum intensity and lines (12) of minimum intensity, said lines extending essentially transversely of the direction of movement of the surface (8).
PCT/EP2001/013042 2000-11-13 2001-11-08 Measurement of surface defects Ceased WO2002039099A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP01993826A EP1336094A2 (en) 2000-11-13 2001-11-08 Measurement of surface defects
JP2002541373A JP2004513364A (en) 2000-11-13 2001-11-08 Measurement of surface defects

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00203979 2000-11-13
EP00203979.0 2000-11-13

Publications (2)

Publication Number Publication Date
WO2002039099A2 WO2002039099A2 (en) 2002-05-16
WO2002039099A3 true WO2002039099A3 (en) 2003-02-13

Family

ID=8172263

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/013042 Ceased WO2002039099A2 (en) 2000-11-13 2001-11-08 Measurement of surface defects

Country Status (4)

Country Link
US (1) US20020191179A1 (en)
EP (1) EP1336094A2 (en)
JP (1) JP2004513364A (en)
WO (1) WO2002039099A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6597446B2 (en) * 2001-03-22 2003-07-22 Sentec Corporation Holographic scatterometer for detection and analysis of wafer surface deposits
MY142390A (en) 2002-05-22 2010-11-30 Glaxosmithkline Llc 3' - [(2z)-[1-(3,4-dimethylphenyl)-1,5- dihydro-3- methyl-5-0xo-4h-pyrazol-4- ylidene]hydrazino]-2' -hydroxy -[1,1' -biphenyl]-3-carboxylic acid bis-(monoethanolamine)
US7420669B2 (en) * 2004-07-01 2008-09-02 Midwest Research Institute Optic probe for semiconductor characterization
FR2927175B1 (en) * 2008-02-05 2011-02-18 Altatech Semiconductor DEVICE FOR INSPECTING SEMICONDUCTOR WAFERS
CN103018258B (en) * 2011-09-23 2015-11-25 深圳中科飞测科技有限公司 Wafer detection method and wafer detecting apparatus
FR3026484B1 (en) * 2014-09-29 2018-06-15 Altatech Semiconductor METHOD AND SYSTEM FOR INSPECTING TRANSPARENT PLATES FOR ELECTRONICS, OPTICS OR OPTOELECTRONICS
FR3026485B1 (en) 2014-09-29 2016-09-23 Altatech Semiconductor METHOD AND SYSTEM FOR INSPECTING PLATELETS FOR ELECTRONICS, OPTICS OR OPTOELECTRONICS
FR3049710B1 (en) 2016-03-31 2020-06-19 Unity Semiconductor LASER DOPPLER EFFECT INSPECTION METHOD AND SYSTEM FOR MICROELECTRONICS OR OPTICS
FR3076618B1 (en) * 2018-01-05 2023-11-24 Unity Semiconductor METHOD AND SYSTEM FOR OPTICAL INSPECTION OF A SUBSTRATE
EP4202423B1 (en) 2021-12-23 2025-09-24 Unity Semiconductor A method and system for discriminating defects present on a frontside from defects present on a backside of a transparent substrate
CN116087107B (en) * 2022-12-31 2025-09-26 苏州声学产业技术研究院有限公司 Laser nondestructive detection method and device for surface defects based on dynamic speckle illumination
EP4647746A1 (en) 2024-05-07 2025-11-12 Unity Semiconductor Support for a dark field optical inspection system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343290A (en) * 1992-06-11 1994-08-30 International Business Machines Corporation Surface particle detection using heterodyne interferometer
US5502001A (en) * 1990-12-19 1996-03-26 Hitachi, Ltd. Method of forming light beam and method of fabricating semiconductor integrated circuits
WO1997034124A1 (en) * 1996-03-14 1997-09-18 Phase Metrics, Inc. Optical surface detection for magnetic disks
US5698069A (en) * 1995-09-10 1997-12-16 Nikon Precision Inc. Technique for detecting particles on a wafer support surface

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030830A (en) * 1976-01-05 1977-06-21 Atlantic Research Corporation Process and apparatus for sensing defects on a smooth surface
US4334779A (en) * 1980-08-04 1982-06-15 Canadian Patents & Dev. Limited Non-contact optical apparatus for measuring the length or speed of a relatively moving surface
US4794265A (en) * 1987-05-08 1988-12-27 Qc Optics, Inc. Surface pit detection system and method
JP2711140B2 (en) * 1989-06-08 1998-02-10 三菱電機株式会社 Fine particle measuring device
JPH0427848A (en) * 1990-05-23 1992-01-30 Hitachi Electron Eng Co Ltd Sample scanning system of foreign matter inspection apparatus
US5486919A (en) * 1992-04-27 1996-01-23 Canon Kabushiki Kaisha Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5502001A (en) * 1990-12-19 1996-03-26 Hitachi, Ltd. Method of forming light beam and method of fabricating semiconductor integrated circuits
US5343290A (en) * 1992-06-11 1994-08-30 International Business Machines Corporation Surface particle detection using heterodyne interferometer
US5698069A (en) * 1995-09-10 1997-12-16 Nikon Precision Inc. Technique for detecting particles on a wafer support surface
WO1997034124A1 (en) * 1996-03-14 1997-09-18 Phase Metrics, Inc. Optical surface detection for magnetic disks

Also Published As

Publication number Publication date
US20020191179A1 (en) 2002-12-19
EP1336094A2 (en) 2003-08-20
WO2002039099A2 (en) 2002-05-16
JP2004513364A (en) 2004-04-30

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