WO2002045137A3 - Reduced edge contact wafer handling system and method of retrofitting and using same - Google Patents

Reduced edge contact wafer handling system and method of retrofitting and using same Download PDF

Info

Publication number
WO2002045137A3
WO2002045137A3 PCT/US2002/001545 US0201545W WO0245137A3 WO 2002045137 A3 WO2002045137 A3 WO 2002045137A3 US 0201545 W US0201545 W US 0201545W WO 0245137 A3 WO0245137 A3 WO 0245137A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
area
chucks
chuck
retrofitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/001545
Other languages
French (fr)
Other versions
WO2002045137A2 (en
Inventor
Stephen D Coomer
Stanislaw Kopacz
Glyn Reynolds
Michael James Lombardi
Todd Michael Visconti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Tokyo Electron Arizona Inc
Original Assignee
Tokyo Electron Ltd
Tokyo Electron Arizona Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Tokyo Electron Arizona Inc filed Critical Tokyo Electron Ltd
Priority to JP2002547208A priority Critical patent/JP4060185B2/en
Priority to AU2002236801A priority patent/AU2002236801A1/en
Priority to EP02703165A priority patent/EP1340246A2/en
Publication of WO2002045137A2 publication Critical patent/WO2002045137A2/en
Publication of WO2002045137A3 publication Critical patent/WO2002045137A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A wafer handling system (200) and a method of retrofitting the system to an existing wafer handling apparatus (100) are provided that make possible a method of handling wafers (35) by contacting only a narrow area (202) of not more than two millimeters wide adjacent the edge of the wafer, which is particularly useful for backside deposition where device side contact defines an area of exclusion (202) that renders the wafer unusable in that area. The system (200) provides a chuck (201) on a wafer transfer arm (212) that holds a wafer by gravity on a segmented, upwardly facing annular surface (207, 208). A compatible annular surface (223) is provided on an aligning station chuck (216) so that wafers can be transferred by contact only with the exclusion area (202) of the wafer surface. A load arm (260) has two similarly compatible chucks (259) further provided with pneumatically actuated grippers (270) to allow the wafer to be loaded into a vertical processing apparatus (10). The wafer chucks (201, 216, 259) are retrofitted into a processing apparatus (100) in place of vacuum chucks and the vacuum lines that were provided to activate them are used for wafer detection. The electrical signals that were provided for vacuum chuck commands are utilized to actuate the grippers (270) on the transfer arm (260) so that no control software and little hardware need be altered for the retrofit.
PCT/US2002/001545 2000-11-29 2001-11-20 Reduced edge contact wafer handling system and method of retrofitting and using same Ceased WO2002045137A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002547208A JP4060185B2 (en) 2000-11-29 2001-11-20 Wafer handling system with reduced edge contact, modification method and use thereof
AU2002236801A AU2002236801A1 (en) 2000-11-29 2001-11-20 Reduced edge contact wafer handling system and method of retrofitting and using same
EP02703165A EP1340246A2 (en) 2000-11-29 2001-11-20 Reduced edge contact wafer handling system and method of retrofitting and using same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/725,823 US6692219B2 (en) 2000-11-29 2000-11-29 Reduced edge contact wafer handling system and method of retrofitting and using same
US09/725,823 2000-11-29

Publications (2)

Publication Number Publication Date
WO2002045137A2 WO2002045137A2 (en) 2002-06-06
WO2002045137A3 true WO2002045137A3 (en) 2003-03-20

Family

ID=24916099

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/001545 Ceased WO2002045137A2 (en) 2000-11-29 2001-11-20 Reduced edge contact wafer handling system and method of retrofitting and using same

Country Status (7)

Country Link
US (1) US6692219B2 (en)
EP (1) EP1340246A2 (en)
JP (1) JP4060185B2 (en)
CN (1) CN1481577A (en)
AU (1) AU2002236801A1 (en)
TW (1) TW511136B (en)
WO (1) WO2002045137A2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7319335B2 (en) 2004-02-12 2008-01-15 Applied Materials, Inc. Configurable prober for TFT LCD array testing
US7330021B2 (en) 2004-02-12 2008-02-12 Applied Materials, Inc. Integrated substrate transfer module
US7355418B2 (en) 2004-02-12 2008-04-08 Applied Materials, Inc. Configurable prober for TFT LCD array test
US7535238B2 (en) 2005-04-29 2009-05-19 Applied Materials, Inc. In-line electron beam test system
US7569818B2 (en) 2006-03-14 2009-08-04 Applied Materials, Inc. Method to reduce cross talk in a multi column e-beam test system
US7602199B2 (en) 2006-05-31 2009-10-13 Applied Materials, Inc. Mini-prober for TFT-LCD testing

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6986636B2 (en) * 2000-06-09 2006-01-17 Brooks Automation, Inc. Device for positioning disk-shaped objects
US6824343B2 (en) * 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
DE10217028C1 (en) * 2002-04-11 2003-11-20 Nanophotonics Ag Measuring module for wafer production plants
AU2003245484A1 (en) * 2002-06-14 2003-12-31 Fortrend Engineering Corporation Universal reticle transfer system
US6769861B2 (en) * 2002-10-08 2004-08-03 Brooks Automation Inc. Apparatus for alignment and orientation of a wafer for processing
SG115602A1 (en) * 2003-01-09 2005-10-28 Disco Corp Conveying device for a plate-like workpiece
JP3981885B2 (en) * 2003-05-20 2007-09-26 株式会社ダイフク Transport device
US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
TW200532043A (en) * 2004-02-10 2005-10-01 Ulvac Inc Thin film forming apparatus
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US8167522B2 (en) 2005-03-30 2012-05-01 Brooks Automation, Inc. Substrate transport apparatus with active edge gripper
US7374391B2 (en) * 2005-12-22 2008-05-20 Applied Materials, Inc. Substrate gripper for a substrate handling robot
JP4636288B2 (en) * 2005-05-18 2011-02-23 株式会社村田製作所 Positioning stage, bump forming apparatus and bump forming method using the same
US20070029227A1 (en) * 2005-07-08 2007-02-08 Bonora Anthony C Workpiece support structures and apparatus for accessing same
KR100631928B1 (en) * 2005-12-02 2006-10-04 삼성전자주식회사 Wafer Guide in Wafer Cleaner
US20070231108A1 (en) * 2006-04-04 2007-10-04 Applied Materials, Inc. Method and apparatus for transferring wafers
KR100809594B1 (en) * 2006-09-12 2008-03-04 세메스 주식회사 Chucking member and spin head including same
KR101361382B1 (en) * 2006-12-14 2014-02-10 아이에스 테크놀로지 재팬 가부시키가이샤 Disc holding apparatus and defect/foreign material detecting apparatus
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
KR101246310B1 (en) * 2007-04-23 2013-03-21 가부시키가이샤 아루박 Supporting member, carrier and supporting method
JP5206528B2 (en) * 2009-03-19 2013-06-12 トヨタ自動車株式会社 Work conveying device and work conveying method
US8698099B2 (en) * 2009-09-30 2014-04-15 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
JP5574177B2 (en) * 2010-09-16 2014-08-20 株式会社ダイフク Transport device
TWI579939B (en) * 2011-08-04 2017-04-21 政美應用股份有限公司 Device and method for testing and classifying led wafer
JP5877016B2 (en) * 2011-08-26 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス Substrate reversing apparatus and substrate processing apparatus
US8556566B1 (en) * 2011-09-30 2013-10-15 WD Media, LLC Disk stacking method and apparatus
US9136155B2 (en) * 2011-11-17 2015-09-15 Lam Research Ag Method and device for processing wafer shaped articles
DE202012013639U1 (en) * 2011-12-01 2018-12-06 solar-semi GmbH Device for processing a substrate
US9431282B2 (en) * 2011-12-27 2016-08-30 Rudolph Technologies, Inc. Wafer inversion mechanism
US20140064888A1 (en) * 2012-09-06 2014-03-06 Texas Instruments Incorporated Appartaus for handling an electronic device and related methodology
CN102903661A (en) * 2012-10-25 2013-01-30 上海宏力半导体制造有限公司 Wafer tail end executor
JP6186124B2 (en) * 2012-12-14 2017-08-23 東京応化工業株式会社 Transfer arm, transfer device, and transfer method
KR102245762B1 (en) * 2014-04-17 2021-04-27 어플라이드 머티어리얼스, 인코포레이티드 Holder, carrier having the same, and method for fixing a substrate
US9410249B2 (en) * 2014-05-15 2016-08-09 Infineon Technologies Ag Wafer releasing
US10293365B2 (en) * 2014-09-18 2019-05-21 Halliburton Energy Services, Inc. Electrically conductive pattern printer for downhole tools
CN105619406B (en) * 2015-12-31 2017-10-17 北京七星华创电子股份有限公司 The calibration method of multifinger mechanical handsheet fork
USD803283S1 (en) 2016-05-16 2017-11-21 Veeco Instruments Inc. Wafer handling assembly
TWI766105B (en) * 2017-09-28 2022-06-01 美商魯道夫科技股份有限公司 Wafer-level package assembly handling
KR102242812B1 (en) 2018-05-17 2021-04-22 세메스 주식회사 Transfer unit, apparatus for treating substrate including the same
US11121019B2 (en) * 2018-06-19 2021-09-14 Kla Corporation Slotted electrostatic chuck
TWI890340B (en) * 2019-03-13 2025-07-11 以色列商核心流有限公司 Circular wafer lateral positioning device
US20230126459A1 (en) * 2020-03-06 2023-04-27 Lam Research Corporation Ring structure with compliant centering fingers
CN111392395A (en) * 2020-03-30 2020-07-10 武汉华星光电半导体显示技术有限公司 Feeding device
JP7005690B2 (en) * 2020-06-17 2022-02-10 株式会社Kokusai Electric Substrate processing equipment, semiconductor device manufacturing methods, and programs
CN112858343B (en) * 2021-02-02 2021-11-16 西安中科微星光电科技有限公司 Multifunctional silicon-based liquid crystal chip online detection system and method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4915564A (en) * 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
WO1999023691A2 (en) * 1997-11-03 1999-05-14 Asm America, Inc. Improved low mass wafer support system
WO2000002808A1 (en) * 1998-07-11 2000-01-20 Semitool, Inc. Robots for microelectronic workpiece handling
WO2000014772A1 (en) * 1998-09-02 2000-03-16 Tec-Sem Ag Device and method for handling individual wafers
US6116848A (en) * 1997-11-26 2000-09-12 Brooks Automation, Inc. Apparatus and method for high-speed transfer and centering of wafer substrates
JP2000260859A (en) * 1999-03-09 2000-09-22 Nikon Corp Substrate housing device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5749469A (en) * 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
US5516732A (en) 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
JP3143770B2 (en) * 1994-10-07 2001-03-07 東京エレクトロン株式会社 Substrate transfer device
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
US5647626A (en) * 1995-12-04 1997-07-15 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer pickup system
US5746460A (en) * 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
TW321192U (en) * 1995-12-23 1997-11-21 Samsung Electronics Co Ltd A arm of robot for transporting semiconductor wafer
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
US5820329A (en) 1997-04-10 1998-10-13 Tokyo Electron Limited Vacuum processing apparatus with low particle generating wafer clamp
EP1057214A1 (en) * 1998-02-18 2000-12-06 Applied Materials, Inc. End effector for wafer handler in processing system
US6298280B1 (en) * 1998-09-28 2001-10-02 Asyst Technologies, Inc. Method for in-cassette wafer center determination
US6143147A (en) 1998-10-30 2000-11-07 Tokyo Electron Limited Wafer holding assembly and wafer processing apparatus having said assembly
US6357996B2 (en) * 1999-05-14 2002-03-19 Newport Corporation Edge gripping specimen prealigner

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4915564A (en) * 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
WO1999023691A2 (en) * 1997-11-03 1999-05-14 Asm America, Inc. Improved low mass wafer support system
US6116848A (en) * 1997-11-26 2000-09-12 Brooks Automation, Inc. Apparatus and method for high-speed transfer and centering of wafer substrates
WO2000002808A1 (en) * 1998-07-11 2000-01-20 Semitool, Inc. Robots for microelectronic workpiece handling
WO2000014772A1 (en) * 1998-09-02 2000-03-16 Tec-Sem Ag Device and method for handling individual wafers
JP2000260859A (en) * 1999-03-09 2000-09-22 Nikon Corp Substrate housing device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 12 3 January 2001 (2001-01-03) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7319335B2 (en) 2004-02-12 2008-01-15 Applied Materials, Inc. Configurable prober for TFT LCD array testing
US7330021B2 (en) 2004-02-12 2008-02-12 Applied Materials, Inc. Integrated substrate transfer module
US7355418B2 (en) 2004-02-12 2008-04-08 Applied Materials, Inc. Configurable prober for TFT LCD array test
US7535238B2 (en) 2005-04-29 2009-05-19 Applied Materials, Inc. In-line electron beam test system
US7569818B2 (en) 2006-03-14 2009-08-04 Applied Materials, Inc. Method to reduce cross talk in a multi column e-beam test system
US7602199B2 (en) 2006-05-31 2009-10-13 Applied Materials, Inc. Mini-prober for TFT-LCD testing

Also Published As

Publication number Publication date
TW511136B (en) 2002-11-21
JP4060185B2 (en) 2008-03-12
US6692219B2 (en) 2004-02-17
WO2002045137A2 (en) 2002-06-06
US20020064450A1 (en) 2002-05-30
CN1481577A (en) 2004-03-10
AU2002236801A1 (en) 2002-06-11
EP1340246A2 (en) 2003-09-03
JP2004515073A (en) 2004-05-20

Similar Documents

Publication Publication Date Title
US6612590B2 (en) Apparatus and methods for manipulating semiconductor wafers
TW511136B (en) Reduced edge contact wafer handling system and method of retrofitting and using same
US6113165A (en) Self-sensing wafer holder and method of using
US8939696B2 (en) Automatic carrier transfer for transferring a substrate carrier in a semiconductor manufacturing post-process and method of transferring the substrate carrier using the same
JP2004515073A5 (en)
TW556405B (en) Acoustic detection of dechucking and apparatus therefor
EP1060836A3 (en) Wafer tranfer station for a chemical mechanical polisher
US7292427B1 (en) Pin lift chuck assembly for warped substrates
US6572321B1 (en) Loader conveyor for substrate processing system
EP1061558A3 (en) Edge contact loadcup
WO2000028581A3 (en) Processing chamber with rapid wafer exchange
WO2004086465A3 (en) Method and apparatus for high speed wafer handling
WO2004033158A3 (en) Substrate handling system for aligning and orienting substrates during a transfer operation
WO2002080231A3 (en) Semiconductor wafer lifting device and methods for implementing the same
KR20100023821A (en) Inertial wafer centering end effector and transport apparatus
US20070018469A1 (en) Contamination-free edge gripping mechanism with withdrawable pads and method for loading/unloading and transferring flat objects
CN117542786A (en) Negative pressure suction cup for realizing wafer separation by using negative pressure and separation mechanism
CN116682781A (en) Intelligent end effector structure for semiconductor wafer transport system
CN109244027B (en) Wafer grabbing device and control method
US5868803A (en) Method for mounting a wafer loading device to a process machine
KR100519646B1 (en) The Wafer Cassette Transporting System
CN219696438U (en) Rotating assembly and wafer notch detection device
KR200173017Y1 (en) Wafer transporting unit
CN215265913U (en) Silicon steel plate talc pill bonding processing equipment for transformer
CN220155512U (en) Wafer feeding mechanism

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2002547208

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 018199429

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2002703165

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2002703165

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWW Wipo information: withdrawn in national office

Ref document number: 2002703165

Country of ref document: EP