WO2002053801A3 - Electroless copper plating of ferrous metal substrates - Google Patents

Electroless copper plating of ferrous metal substrates Download PDF

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Publication number
WO2002053801A3
WO2002053801A3 PCT/EP2001/015291 EP0115291W WO02053801A3 WO 2002053801 A3 WO2002053801 A3 WO 2002053801A3 EP 0115291 W EP0115291 W EP 0115291W WO 02053801 A3 WO02053801 A3 WO 02053801A3
Authority
WO
WIPO (PCT)
Prior art keywords
ferrous metal
bath
copper plating
electroless copper
metal substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2001/015291
Other languages
French (fr)
Other versions
WO2002053801A2 (en
Inventor
Kevin Brown
Trevor Herbert Pover
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chemetall GmbH
Original Assignee
Chemetall GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chemetall GmbH filed Critical Chemetall GmbH
Priority to EP01994832A priority Critical patent/EP1381712A2/en
Priority to US10/451,941 priority patent/US20040052961A1/en
Publication of WO2002053801A2 publication Critical patent/WO2002053801A2/en
Anticipated expiration legal-status Critical
Publication of WO2002053801A3 publication Critical patent/WO2002053801A3/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Lubricants (AREA)
  • Chemically Coating (AREA)
  • Metal Extraction Processes (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The present invention provides a continuous wire drawing process, wherein ferrous metal is drawn through multiple dies, in which the wire is coated in-line in an electroless coppering step between two wire drawing stages by being passed through a bath using transport means comprising ferrous metal components which contact solution in the bath, the bath containing an aqueous solution containing copper ions, bromide ions, a water soluble lubricant and an inhibitor compound such that a coating of copper is deposited on to the ferrous metal surface. A treatment composition as well as dry and liquid concentrate compositions are also described.
PCT/EP2001/015291 2000-12-29 2001-12-22 Electroless copper plating of ferrous metal substrates Ceased WO2002053801A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP01994832A EP1381712A2 (en) 2000-12-29 2001-12-22 Electroless copper plating of ferrous metal substrates
US10/451,941 US20040052961A1 (en) 2000-12-29 2001-12-22 Electroless copper plating of ferrous metal substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0031806.3 2000-12-29
GBGB0031806.3A GB0031806D0 (en) 2000-12-29 2000-12-29 Electroless copper plating of ferrous metal substrates

Publications (2)

Publication Number Publication Date
WO2002053801A2 WO2002053801A2 (en) 2002-07-11
WO2002053801A3 true WO2002053801A3 (en) 2003-11-20

Family

ID=9906006

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/015291 Ceased WO2002053801A2 (en) 2000-12-29 2001-12-22 Electroless copper plating of ferrous metal substrates

Country Status (5)

Country Link
US (1) US20040052961A1 (en)
EP (1) EP1381712A2 (en)
CN (1) CN1227386C (en)
GB (1) GB0031806D0 (en)
WO (1) WO2002053801A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4555540B2 (en) * 2002-07-08 2010-10-06 ルネサスエレクトロニクス株式会社 Semiconductor device
CN101831645B (en) * 2010-05-28 2012-10-17 河海大学常州校区 Method for electroless copper plating on the surface of hard alloy steel parts
US20130143071A1 (en) * 2010-08-17 2013-06-06 Chemetall Gmbh Process for the electroless copper plating of metallic substrates
US20130264214A1 (en) * 2012-04-04 2013-10-10 Rohm And Haas Electronic Materials Llc Metal plating for ph sensitive applications

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3141780A (en) * 1962-03-30 1964-07-21 Minnesota Mining & Mfg Copper coating compositions
US3630057A (en) * 1968-04-19 1971-12-28 Boehler & Co Ag Geb Process and apparatus for manufacturing copper-plated steel wire
US3793037A (en) * 1972-03-13 1974-02-19 Oxy Metal Finishing Corp Electroless copper plating solution and process
US4325990A (en) * 1980-05-12 1982-04-20 Macdermid Incorporated Electroless copper deposition solutions with hypophosphite reducing agent
US5352350A (en) * 1992-02-14 1994-10-04 International Business Machines Corporation Method for controlling chemical species concentration
EP0711848A1 (en) * 1994-11-11 1996-05-15 Metallgesellschaft Ag Process for copper electroless plating on iron or iron alloys surfaces

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353933A (en) * 1979-11-14 1982-10-12 C. Uyemura & Co., Ltd. Method for controlling electroless plating bath
EP0043480B1 (en) * 1980-06-25 1985-04-03 Hitachi, Ltd. Process for forming metallic images

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3141780A (en) * 1962-03-30 1964-07-21 Minnesota Mining & Mfg Copper coating compositions
US3630057A (en) * 1968-04-19 1971-12-28 Boehler & Co Ag Geb Process and apparatus for manufacturing copper-plated steel wire
US3793037A (en) * 1972-03-13 1974-02-19 Oxy Metal Finishing Corp Electroless copper plating solution and process
US4325990A (en) * 1980-05-12 1982-04-20 Macdermid Incorporated Electroless copper deposition solutions with hypophosphite reducing agent
US5352350A (en) * 1992-02-14 1994-10-04 International Business Machines Corporation Method for controlling chemical species concentration
EP0711848A1 (en) * 1994-11-11 1996-05-15 Metallgesellschaft Ag Process for copper electroless plating on iron or iron alloys surfaces

Also Published As

Publication number Publication date
CN1492943A (en) 2004-04-28
GB0031806D0 (en) 2001-02-07
EP1381712A2 (en) 2004-01-21
CN1227386C (en) 2005-11-16
US20040052961A1 (en) 2004-03-18
WO2002053801A2 (en) 2002-07-11

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