WO2002069049A3 - Simultaneous imaging of two reticles - Google Patents

Simultaneous imaging of two reticles Download PDF

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Publication number
WO2002069049A3
WO2002069049A3 PCT/US2002/005656 US0205656W WO02069049A3 WO 2002069049 A3 WO2002069049 A3 WO 2002069049A3 US 0205656 W US0205656 W US 0205656W WO 02069049 A3 WO02069049 A3 WO 02069049A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
images
reticles
exposure
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/005656
Other languages
French (fr)
Other versions
WO2002069049A2 (en
Inventor
Harry Sewell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML US Inc
Original Assignee
ASML US Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML US Inc filed Critical ASML US Inc
Priority to KR1020027014433A priority Critical patent/KR100815222B1/en
Priority to JP2002568106A priority patent/JP4714403B2/en
Priority to EP02707881A priority patent/EP1364257A1/en
Publication of WO2002069049A2 publication Critical patent/WO2002069049A2/en
Publication of WO2002069049A3 publication Critical patent/WO2002069049A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The present invention provides a method and system for simultaneously imaging at least two reticles (104a, 104b) onto a substrate. According to the present invention, the wafer is passed through the exposure sequence once with images from the reticles being exposed simultaneously onto the wafer. The throughput of the system is effectively maintained at the standard single pass throughput level or twice that of conventional systems. In one embodiment, the present invention produces two reticle images side-by-side in the exit pupil (134) of the optics (112) of a step and scan wafer exposure system. The scanning action of the exposure tool then effectively superimposes the two images during the exposure of the wafer. Each image exposes the photoresist as the wafer is scanned through the image field synchronously with the scanning is of the reticles. According to one embodiment, the image scanning is synchronized so that two required images are superimposed. According to another embodiment, the two images can be independently focused and aligned.
PCT/US2002/005656 2001-02-27 2002-02-27 Simultaneous imaging of two reticles Ceased WO2002069049A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020027014433A KR100815222B1 (en) 2001-02-27 2002-02-27 A method of exposing a field on a substrate stage with an image from a lithographic apparatus and at least two patterns formed on at least one reticle
JP2002568106A JP4714403B2 (en) 2001-02-27 2002-02-27 Method and apparatus for exposing a dual reticle image
EP02707881A EP1364257A1 (en) 2001-02-27 2002-02-27 Simultaneous imaging of two reticles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27138001P 2001-02-27 2001-02-27
US60/271,380 2001-02-27

Publications (2)

Publication Number Publication Date
WO2002069049A2 WO2002069049A2 (en) 2002-09-06
WO2002069049A3 true WO2002069049A3 (en) 2003-05-30

Family

ID=23035311

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/005656 Ceased WO2002069049A2 (en) 2001-02-27 2002-02-27 Simultaneous imaging of two reticles

Country Status (5)

Country Link
US (1) US6611316B2 (en)
EP (1) EP1364257A1 (en)
JP (1) JP4714403B2 (en)
KR (1) KR100815222B1 (en)
WO (1) WO2002069049A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8721803B2 (en) 2006-12-05 2014-05-13 Nikon Corporation Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method

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* Cited by examiner, † Cited by third party
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