WO2002083764A1 - Photoreactive composition - Google Patents

Photoreactive composition Download PDF

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Publication number
WO2002083764A1
WO2002083764A1 PCT/JP2002/003520 JP0203520W WO02083764A1 WO 2002083764 A1 WO2002083764 A1 WO 2002083764A1 JP 0203520 W JP0203520 W JP 0203520W WO 02083764 A1 WO02083764 A1 WO 02083764A1
Authority
WO
WIPO (PCT)
Prior art keywords
photoreactive composition
compound
hydrolyzable
reaction
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/003520
Other languages
English (en)
French (fr)
Inventor
Katsunori Takahashi
Hiroji Fukui
Kazuhiro Kawabata
Takeo Kuroda
Motokuni Ichitani
Yasuhiro Nakatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2002582112A priority Critical patent/JP3904518B2/ja
Priority to US10/474,376 priority patent/US7312013B2/en
Priority to CA002443406A priority patent/CA2443406A1/en
Priority to KR1020037013244A priority patent/KR100881301B1/ko
Priority to EP02714550.7A priority patent/EP1391476B1/en
Publication of WO2002083764A1 publication Critical patent/WO2002083764A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/117—Free radical
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/124—Carbonyl compound containing

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Paints Or Removers (AREA)
  • Silicon Polymers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
PCT/JP2002/003520 2001-04-09 2002-04-09 Photoreactive composition Ceased WO2002083764A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2002582112A JP3904518B2 (ja) 2001-04-09 2002-04-09 光反応性組成物
US10/474,376 US7312013B2 (en) 2001-04-09 2002-04-09 Photoreactive composition
CA002443406A CA2443406A1 (en) 2001-04-09 2002-04-09 Photoreactive composition
KR1020037013244A KR100881301B1 (ko) 2001-04-09 2002-04-09 광반응성 조성물
EP02714550.7A EP1391476B1 (en) 2001-04-09 2002-04-09 Photoreactive composition

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2001-110138 2001-04-09
JP2001110138 2001-04-09
JP2001347708 2001-11-13
JP2001-347708 2001-11-13
JP2001-357853 2001-11-22
JP2001357853 2001-11-22
JP2002062421 2002-03-07
JP2002-62421 2002-03-07

Publications (1)

Publication Number Publication Date
WO2002083764A1 true WO2002083764A1 (en) 2002-10-24

Family

ID=27482189

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/003520 Ceased WO2002083764A1 (en) 2001-04-09 2002-04-09 Photoreactive composition

Country Status (8)

Country Link
US (1) US7312013B2 (ja)
EP (1) EP1391476B1 (ja)
JP (1) JP3904518B2 (ja)
KR (1) KR100881301B1 (ja)
CN (1) CN1524104A (ja)
CA (1) CA2443406A1 (ja)
TW (1) TW591058B (ja)
WO (1) WO2002083764A1 (ja)

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JP2006010829A (ja) * 2004-06-23 2006-01-12 Fuji Photo Film Co Ltd 反射防止膜、反射防止フィルム、偏光板、及びそれを用いた画像表示装置
JP2006036889A (ja) * 2004-07-26 2006-02-09 Sekisui Chem Co Ltd 加水分解性金属化合物の硬化物の製造方法及び加水分解性金属化合物の硬化物
WO2006035646A1 (ja) * 2004-09-27 2006-04-06 Nippon Steel Chemical Co., Ltd. シリカ含有シリコーン樹脂組成物及びその成形体
JP2006154770A (ja) * 2004-10-28 2006-06-15 Fuji Photo Film Co Ltd 防眩性反射防止フィルム、偏光板、および画像表示装置
WO2007029733A1 (ja) 2005-09-08 2007-03-15 Kaneka Corporation 硬化性組成物
JP2009035676A (ja) * 2007-08-03 2009-02-19 Sekisui Chem Co Ltd 光硬化性組成物
JP2009126984A (ja) * 2007-11-27 2009-06-11 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
WO2009075233A1 (ja) 2007-12-10 2009-06-18 Kaneka Corporation アルカリ現像性を有する硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ
WO2011024545A1 (ja) * 2009-08-24 2011-03-03 日産化学工業株式会社 マイクロレンズ用感光性樹脂組成物
WO2011142468A1 (ja) * 2010-05-10 2011-11-17 学校法人関西大学 硬化性組成物、これを用いたエポキシ樹脂－無機ポリマー複合材料の製造方法及びエポキシ樹脂－無機ポリマー複合材料
JP2011237728A (ja) * 2010-05-13 2011-11-24 Jsr Corp カラーフィルタ用着色組成物、カラーフィルタ、カラー液晶表示素子及びカラーフィルタの製造方法
JP2011251890A (ja) * 2010-05-07 2011-12-15 Canon Inc 酸化アルミニウム前駆体ゾル、光学用部材および光学用部材の製造方法
WO2012073742A1 (ja) * 2010-11-30 2012-06-07 日産化学工業株式会社 マイクロレンズ用感光性樹脂組成物
WO2016043198A1 (ja) * 2014-09-17 2016-03-24 Jsr株式会社 パターン形成方法
WO2017033945A1 (ja) * 2015-08-24 2017-03-02 株式会社ニコン 誘電エラストマー、誘電エラストマーの製造方法、誘電エラストマーアクチュエータ、及び、補助用具
JP2021038394A (ja) * 2013-08-30 2021-03-11 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ Ｇｅｓｅｌｌｓｃｈａｆｔ ｍｉｔ ｂｅｓｃｈｒａｅｎｋｔｅｒ Ｈａｆｔｕｎｇ ハードマスクおよび充填材料として安定な金属化合物、その組成物、およびその使用方法
WO2021230371A1 (ja) * 2020-05-15 2021-11-18 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、硬化体、及び電子部品
JP2025130023A (ja) * 2024-02-26 2025-09-05 三星エスディアイ株式会社 半導体フォトレジスト用組成物およびこれを用いたパターン形成方法

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JP5140290B2 (ja) * 2007-03-02 2013-02-06 富士フイルム株式会社 絶縁膜
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JP5708518B2 (ja) * 2011-02-09 2015-04-30 信越化学工業株式会社 レジスト材料及びこれを用いたパターン形成方法
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Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0243215A (ja) * 1988-06-09 1990-02-13 General Electric Co <Ge> 二元硬化性シリコーン組成物
JPH06273936A (ja) 1993-03-19 1994-09-30 Toray Ind Inc 感光性樹脂組成物およびこれを使用したパターン形成方法
EP0965618A1 (en) 1998-06-18 1999-12-22 JSR Corporation Photo-curable composition and photo-cured product
JP2000001648A (ja) * 1998-06-18 2000-01-07 Jsr Corp 光硬化性組成物および硬化膜
JP2000066051A (ja) * 1998-08-25 2000-03-03 Jsr Corp 光導波路の製造方法および光導波路
JP2000144012A (ja) * 1998-11-06 2000-05-26 Jsr Corp 回路基板およびその製造方法
JP2000169755A (ja) * 1998-12-07 2000-06-20 Jsr Corp 親水性硬化物、親水性硬化物を含む積層体、親水性硬化物用組成物および親水性硬化物の製造方法
JP2000167993A (ja) * 1998-12-04 2000-06-20 Jsr Corp 防汚性積層体およびその製造方法
JP2000171604A (ja) * 1998-12-07 2000-06-23 Jsr Corp 反射防止膜、反射防止膜を含む積層体および反射防止膜の製造方法
JP2000298352A (ja) * 1999-04-14 2000-10-24 Jsr Corp 電子部品用材料およびその使用方法
JP2000327980A (ja) * 1999-05-18 2000-11-28 Jsr Corp 硬化性インク、およびその使用方法、並びにその硬化方法
JP2001083710A (ja) * 1999-09-09 2001-03-30 Jsr Corp 電子部品用材料およびそれを硬化してなる電子部品
JP2001083342A (ja) * 1999-09-09 2001-03-30 Jsr Corp 光導波路形成用組成物、光導波路の形成方法、および光導波路
JP2001288364A (ja) * 2000-04-05 2001-10-16 Jsr Corp 放射線硬化性組成物およびそれを用いた光導波路ならびに光導波路の製造方法
JP2001300951A (ja) * 2000-04-19 2001-10-30 Jsr Corp フィルムの製造方法およびこの方法により製造されたフィルム
JP2002069387A (ja) * 2000-08-28 2002-03-08 Sekisui Chem Co Ltd 接着剤組成物及び該接着剤組成物を用いた接合方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615943A (en) * 1969-11-25 1971-10-26 Milton Genser Deposition of doped and undoped silica films on semiconductor surfaces
DE2616382C2 (de) * 1976-04-14 1986-09-11 Basf Ag, 6700 Ludwigshafen Verfahren zur Herstellung von nicht-cyclischen, unsymmetrischen 1,1-Acetalen aromatischer 1,2-Diketone, einige nicht-cyclische, unsymmetrische 1,2-Diketone als solche und deren Verwendung als Photoinitiatoren
US4101513A (en) 1977-02-02 1978-07-18 Minnesota Mining And Manufacturing Company Catalyst for condensation of hydrolyzable silanes and storage stable compositions thereof
EP0035049B1 (en) * 1980-03-05 1984-02-22 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Curable composition
EP0297437B1 (en) * 1987-06-27 1993-09-01 Shimadzu Corporation Flexible replica grating and optical multiplexer/demultiplexer using it
US5175027A (en) * 1990-02-23 1992-12-29 Lord Corporation Ultra-thin, uniform sol-gel coatings
JP3343377B2 (ja) 1992-11-30 2002-11-11 ダイセル化学工業株式会社 酸化物薄膜の作製方法
JP3191541B2 (ja) 1993-12-27 2001-07-23 三菱マテリアル株式会社 金属酸化物薄膜パターン形成用組成物およびその形成方法
DE4401219A1 (de) * 1994-01-18 1995-07-20 Bosch Gmbh Robert Integriert optisches Bauelement und Verfahren zur Herstellung eines integriert optischen Bauelements
EP0839872B1 (en) * 1996-11-01 2003-03-12 Kaneka Corporation Curable polymer having reactive silicon-containing functional groups
JP3976350B2 (ja) 1997-03-14 2007-09-19 スリーエム カンパニー 反応性シラン官能性を有する要求に応じて硬化する、湿分硬化性組成物
ATE333114T1 (de) * 1998-01-30 2006-08-15 Albemarle Corp Maleimide enthaltende fotopolymerisierbare zusammensetzungen und verfahren zu deren verwendung
GB9907801D0 (en) * 1999-04-06 1999-06-02 Rolic Ag Photoactive polymers
EP1889862A1 (en) * 1999-12-17 2008-02-20 DAICEL CHEMICAL INDUSTRIES, Ltd. Curable resin composition, process for producing the same, and coated object made with the same

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0243215A (ja) * 1988-06-09 1990-02-13 General Electric Co <Ge> 二元硬化性シリコーン組成物
JPH06273936A (ja) 1993-03-19 1994-09-30 Toray Ind Inc 感光性樹脂組成物およびこれを使用したパターン形成方法
EP0965618A1 (en) 1998-06-18 1999-12-22 JSR Corporation Photo-curable composition and photo-cured product
JP2000001648A (ja) * 1998-06-18 2000-01-07 Jsr Corp 光硬化性組成物および硬化膜
JP2000066051A (ja) * 1998-08-25 2000-03-03 Jsr Corp 光導波路の製造方法および光導波路
JP2000144012A (ja) * 1998-11-06 2000-05-26 Jsr Corp 回路基板およびその製造方法
JP2000167993A (ja) * 1998-12-04 2000-06-20 Jsr Corp 防汚性積層体およびその製造方法
JP2000171604A (ja) * 1998-12-07 2000-06-23 Jsr Corp 反射防止膜、反射防止膜を含む積層体および反射防止膜の製造方法
JP2000169755A (ja) * 1998-12-07 2000-06-20 Jsr Corp 親水性硬化物、親水性硬化物を含む積層体、親水性硬化物用組成物および親水性硬化物の製造方法
JP2000298352A (ja) * 1999-04-14 2000-10-24 Jsr Corp 電子部品用材料およびその使用方法
JP2000327980A (ja) * 1999-05-18 2000-11-28 Jsr Corp 硬化性インク、およびその使用方法、並びにその硬化方法
JP2001083710A (ja) * 1999-09-09 2001-03-30 Jsr Corp 電子部品用材料およびそれを硬化してなる電子部品
JP2001083342A (ja) * 1999-09-09 2001-03-30 Jsr Corp 光導波路形成用組成物、光導波路の形成方法、および光導波路
JP2001288364A (ja) * 2000-04-05 2001-10-16 Jsr Corp 放射線硬化性組成物およびそれを用いた光導波路ならびに光導波路の製造方法
JP2001300951A (ja) * 2000-04-19 2001-10-30 Jsr Corp フィルムの製造方法およびこの方法により製造されたフィルム
JP2002069387A (ja) * 2000-08-28 2002-03-08 Sekisui Chem Co Ltd 接着剤組成物及び該接着剤組成物を用いた接合方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
H. INOUE ET AL., J. PHOTOPOLYM. SCI., vol. 12, 1999, pages 129 - 132
See also references of EP1391476A4

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006010829A (ja) * 2004-06-23 2006-01-12 Fuji Photo Film Co Ltd 反射防止膜、反射防止フィルム、偏光板、及びそれを用いた画像表示装置
JP2006036889A (ja) * 2004-07-26 2006-02-09 Sekisui Chem Co Ltd 加水分解性金属化合物の硬化物の製造方法及び加水分解性金属化合物の硬化物
WO2006035646A1 (ja) * 2004-09-27 2006-04-06 Nippon Steel Chemical Co., Ltd. シリカ含有シリコーン樹脂組成物及びその成形体
JPWO2006035646A1 (ja) * 2004-09-27 2008-07-31 新日鐵化学株式会社 シリカ含有シリコーン樹脂組成物及びその成形体
JP2006154770A (ja) * 2004-10-28 2006-06-15 Fuji Photo Film Co Ltd 防眩性反射防止フィルム、偏光板、および画像表示装置
JPWO2007029733A1 (ja) * 2005-09-08 2009-03-19 株式会社カネカ 硬化性組成物
WO2007029733A1 (ja) 2005-09-08 2007-03-15 Kaneka Corporation 硬化性組成物
JP2009035676A (ja) * 2007-08-03 2009-02-19 Sekisui Chem Co Ltd 光硬化性組成物
JP2009126984A (ja) * 2007-11-27 2009-06-11 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
WO2009075233A1 (ja) 2007-12-10 2009-06-18 Kaneka Corporation アルカリ現像性を有する硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ
WO2011024545A1 (ja) * 2009-08-24 2011-03-03 日産化学工業株式会社 マイクロレンズ用感光性樹脂組成物
US8993699B2 (en) 2009-08-24 2015-03-31 Nissan Chemical Industries, Ltd. Photosensitive resin composition for microlens
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WO2011142468A1 (ja) * 2010-05-10 2011-11-17 学校法人関西大学 硬化性組成物、これを用いたエポキシ樹脂－無機ポリマー複合材料の製造方法及びエポキシ樹脂－無機ポリマー複合材料
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US8796349B2 (en) 2010-11-30 2014-08-05 Nissan Chemical Industries, Ltd. Photosensitive resin composition for microlenses
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US7312013B2 (en) 2007-12-25
EP1391476A1 (en) 2004-02-25
US20040202956A1 (en) 2004-10-14
JPWO2002083764A1 (ja) 2004-09-16
JP3904518B2 (ja) 2007-04-11
EP1391476A4 (en) 2009-08-26
KR100881301B1 (ko) 2009-02-03
EP1391476B1 (en) 2015-12-09
KR20040030574A (ko) 2004-04-09
CN1524104A (zh) 2004-08-25
TW591058B (en) 2004-06-11

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