WO2002095795A3 - Vorrichtung zur aufnahme von scheibenförmigen objekten - Google Patents

Vorrichtung zur aufnahme von scheibenförmigen objekten Download PDF

Info

Publication number
WO2002095795A3
WO2002095795A3 PCT/EP2002/004790 EP0204790W WO02095795A3 WO 2002095795 A3 WO2002095795 A3 WO 2002095795A3 EP 0204790 W EP0204790 W EP 0204790W WO 02095795 A3 WO02095795 A3 WO 02095795A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
receiving plate
shaped objects
recesses
support pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2002/004790
Other languages
English (en)
French (fr)
Other versions
WO2002095795A2 (de
Inventor
Arthur Pelzmann
Martin Drechsler
Juergen Niess
Michael Grandy
Hin Yiu Chung
Paul Mantz
Ottmar Graf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mattson Thermal Products GmbH
Original Assignee
Mattson Thermal Products GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10156441A external-priority patent/DE10156441A1/de
Application filed by Mattson Thermal Products GmbH filed Critical Mattson Thermal Products GmbH
Priority to US10/478,285 priority Critical patent/US20040126213A1/en
Priority to JP2002592161A priority patent/JP4116449B2/ja
Priority to EP02771633A priority patent/EP1393355A2/de
Priority to KR1020037014971A priority patent/KR100885343B1/ko
Publication of WO2002095795A2 publication Critical patent/WO2002095795A2/de
Publication of WO2002095795A3 publication Critical patent/WO2002095795A3/de
Anticipated expiration legal-status Critical
Priority to US11/333,727 priority patent/US20060245906A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/741—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Eine Vorrichtung zur Aufnahme von scheibenförmigen Objekten, vorzugsweise Halbleiterwafern, zu deren thermischer Behandlung ermöglicht das Prozessieren insbesondere von Wafern aus Verbindungshalbleitern in besonders einfacher Weise, mit hoher Produktivität und geringem Schadensrisiko, wenn ein Träger wenigstens zwei Ausnehmungen zur Aufnahme jeweils eines Objekts aufweist. Die Ausnehmungen auf dem Träger sind vorzugsweise mit Abdeckungen abdeckbar. Zum Be- und Entladen sind vorzugsweise Stütztifte vorgesehen, wobei der Träger und die Stützstifte relativ zueinander in vertikaler Richtung bewegbar sind. Weiterhin ist Handhabungsvorrichtung für Objekte angegeben.
PCT/EP2002/004790 2001-05-18 2002-05-02 Vorrichtung zur aufnahme von scheibenförmigen objekten Ceased WO2002095795A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/478,285 US20040126213A1 (en) 2001-05-18 2002-05-02 Device for accommodating disk-shaped objects and apparatus for handling objects
JP2002592161A JP4116449B2 (ja) 2001-05-18 2002-05-02 対象物の操作のための操作装置
EP02771633A EP1393355A2 (de) 2001-05-18 2002-05-02 Vorrichtung zur aufnahme von scheibenförmigen objekten
KR1020037014971A KR100885343B1 (ko) 2001-05-18 2002-05-02 판형 대상물을 수용하기 위한 장치 및 상기 대상물을핸들링하기 위한 장치
US11/333,727 US20060245906A1 (en) 2001-05-18 2006-01-17 Device for accommodating disk-shaped objects and apparatus for handling objects

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10124647 2001-05-18
DE10124647.1 2001-05-18
DE10156441A DE10156441A1 (de) 2001-05-18 2001-11-16 Vorrichtung zur Aufnahme von scheibenförmigen Objekten und Vorrichtung zur Handhabung von Objekten
DE10156441.4 2001-11-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/333,727 Continuation US20060245906A1 (en) 2001-05-18 2006-01-17 Device for accommodating disk-shaped objects and apparatus for handling objects

Publications (2)

Publication Number Publication Date
WO2002095795A2 WO2002095795A2 (de) 2002-11-28
WO2002095795A3 true WO2002095795A3 (de) 2003-10-23

Family

ID=26009354

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/004790 Ceased WO2002095795A2 (de) 2001-05-18 2002-05-02 Vorrichtung zur aufnahme von scheibenförmigen objekten

Country Status (6)

Country Link
US (1) US20060245906A1 (de)
EP (1) EP1393355A2 (de)
JP (1) JP4116449B2 (de)
CN (1) CN1271678C (de)
TW (1) TW584919B (de)
WO (1) WO2002095795A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7064749B1 (en) 1992-11-09 2006-06-20 Adc Technology Inc. Portable communicator
JP2008166729A (ja) * 2006-12-08 2008-07-17 Canon Anelva Corp 基板加熱処理装置及び半導体製造方法
JP5109376B2 (ja) * 2007-01-22 2012-12-26 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体
WO2011028597A1 (en) * 2009-08-26 2011-03-10 Veeco Instruments, Inc. System for fabricating a pattern on magnetic recording media
FR2971885A1 (fr) * 2011-02-18 2012-08-24 Commissariat Energie Atomique Procédé de réalisation d'un support de substrat
JP5346982B2 (ja) * 2011-04-28 2013-11-20 大日本スクリーン製造株式会社 熱処理装置
US10316412B2 (en) 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
US10167571B2 (en) * 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
US10014205B2 (en) * 2015-12-14 2018-07-03 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveyance robot and operating method thereof
US11961817B2 (en) * 2021-02-26 2024-04-16 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for forming a package structure

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0488722A1 (de) * 1990-11-29 1992-06-03 Canon Kabushiki Kaisha Vorrichtung des Vakuumtyps zum Halten eines Substrats
JPH04199614A (ja) * 1990-11-29 1992-07-20 Toshiba Ceramics Co Ltd 縦型気相成長用サセプター
US5201653A (en) * 1990-10-02 1993-04-13 Dainippon Screen Mfg. Co., Ltd. Substrate heat-treating apparatus
EP0746009A1 (de) * 1995-05-30 1996-12-04 Moore Epitaxial, Inc. Mehrschichtige Susceptor für schnelle thermische Behandlungsreaktoren
US5850071A (en) * 1996-02-16 1998-12-15 Kokusai Electric Co., Ltd. Substrate heating equipment for use in a semiconductor fabricating apparatus
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
US5872889A (en) * 1996-04-12 1999-02-16 Steag Ast Apparatus and method for rapid thermal processing
JP2000077436A (ja) * 1998-08-31 2000-03-14 Matsushita Electric Ind Co Ltd チップ吸着用のダイコレットおよびチップのボンディング装置
US6072162A (en) * 1998-07-13 2000-06-06 Kabushiki Kaisha Toshiba Device and method for heating substrate, and method for treating substrate
US6113165A (en) * 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
US6123502A (en) * 1997-07-08 2000-09-26 Brooks Automation, Inc. Substrate holder having vacuum holding and gravity holding
WO2000068625A1 (en) * 1999-05-11 2000-11-16 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism
WO2000078654A1 (en) * 1999-06-17 2000-12-28 Speedfam-Ipec Corporation Improved wafer handling apparatus
JP2001332603A (ja) * 2000-05-18 2001-11-30 Nikon Corp 基板搬送装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3539759A (en) * 1968-11-08 1970-11-10 Ibm Susceptor structure in silicon epitaxy
JPS4930319B1 (de) * 1969-08-29 1974-08-12
JPS63144513A (ja) * 1986-12-09 1988-06-16 Nkk Corp バレル型エピタキシヤル成長装置
FR2628984B1 (fr) * 1988-03-22 1990-12-28 Labo Electronique Physique Reacteur d'epitaxie a planetaire
US4978567A (en) * 1988-03-31 1990-12-18 Materials Technology Corporation, Subsidiary Of The Carbon/Graphite Group, Inc. Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same
US4986215A (en) * 1988-09-01 1991-01-22 Kyushu Electronic Metal Co., Ltd. Susceptor for vapor-phase growth system
US5620525A (en) * 1990-07-16 1997-04-15 Novellus Systems, Inc. Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
JPH0639697B2 (ja) * 1990-11-30 1994-05-25 株式会社芝浦製作所 基板のローディング装置
JP2826045B2 (ja) * 1992-10-02 1998-11-18 株式会社キトー 真空リフト装置
US5444217A (en) * 1993-01-21 1995-08-22 Moore Epitaxial Inc. Rapid thermal processing apparatus for processing semiconductor wafers
DE4407377C2 (de) * 1994-03-05 1996-09-26 Ast Elektronik Gmbh Reaktionskammer eines Schnellheizsystems für die Kurzzeittemperung von Halbleiterscheiben und Verfahren zum Spülen der Reaktionskammer
US5855465A (en) * 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US5855681A (en) * 1996-11-18 1999-01-05 Applied Materials, Inc. Ultra high throughput wafer vacuum processing system
US5788777A (en) * 1997-03-06 1998-08-04 Burk, Jr.; Albert A. Susceptor for an epitaxial growth factor
US6051512A (en) * 1997-04-11 2000-04-18 Steag Rtp Systems Apparatus and method for rapid thermal processing (RTP) of a plurality of semiconductor wafers
US5965047A (en) * 1997-10-24 1999-10-12 Steag Ast Rapid thermal processing (RTP) system with rotating substrate
US6005226A (en) * 1997-11-24 1999-12-21 Steag-Rtp Systems Rapid thermal processing (RTP) system with gas driven rotating substrate
US6652662B1 (en) * 1998-04-03 2003-11-25 Tokyo Electron Limited Substrate surface processing apparatus and method
DE19821007A1 (de) * 1998-05-11 1999-11-25 Steag Rtp Systems Gmbh Verfahren und Vorrichtung zum thermischen Behandeln von Substraten
US5970214A (en) * 1998-05-14 1999-10-19 Ag Associates Heating device for semiconductor wafers
US6017820A (en) * 1998-07-17 2000-01-25 Cutek Research, Inc. Integrated vacuum and plating cluster system
US6143082A (en) * 1998-10-08 2000-11-07 Novellus Systems, Inc. Isolation of incompatible processes in a multi-station processing chamber
US6310328B1 (en) * 1998-12-10 2001-10-30 Mattson Technologies, Inc. Rapid thermal processing chamber for processing multiple wafers
US6449428B2 (en) * 1998-12-11 2002-09-10 Mattson Technology Corp. Gas driven rotating susceptor for rapid thermal processing (RTP) system
DE10003639C2 (de) * 2000-01-28 2003-06-18 Steag Rtp Systems Gmbh Vorrichtung zum thermischen Behandeln von Substraten
JP2002134484A (ja) * 2000-10-19 2002-05-10 Asm Japan Kk 半導体基板保持装置
US6634882B2 (en) * 2000-12-22 2003-10-21 Asm America, Inc. Susceptor pocket profile to improve process performance
US6770146B2 (en) * 2001-02-02 2004-08-03 Mattson Technology, Inc. Method and system for rotating a semiconductor wafer in processing chambers
US6591850B2 (en) * 2001-06-29 2003-07-15 Applied Materials, Inc. Method and apparatus for fluid flow control

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5201653A (en) * 1990-10-02 1993-04-13 Dainippon Screen Mfg. Co., Ltd. Substrate heat-treating apparatus
EP0488722A1 (de) * 1990-11-29 1992-06-03 Canon Kabushiki Kaisha Vorrichtung des Vakuumtyps zum Halten eines Substrats
JPH04199614A (ja) * 1990-11-29 1992-07-20 Toshiba Ceramics Co Ltd 縦型気相成長用サセプター
EP0746009A1 (de) * 1995-05-30 1996-12-04 Moore Epitaxial, Inc. Mehrschichtige Susceptor für schnelle thermische Behandlungsreaktoren
US5850071A (en) * 1996-02-16 1998-12-15 Kokusai Electric Co., Ltd. Substrate heating equipment for use in a semiconductor fabricating apparatus
US5872889A (en) * 1996-04-12 1999-02-16 Steag Ast Apparatus and method for rapid thermal processing
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
US6123502A (en) * 1997-07-08 2000-09-26 Brooks Automation, Inc. Substrate holder having vacuum holding and gravity holding
US6072162A (en) * 1998-07-13 2000-06-06 Kabushiki Kaisha Toshiba Device and method for heating substrate, and method for treating substrate
JP2000077436A (ja) * 1998-08-31 2000-03-14 Matsushita Electric Ind Co Ltd チップ吸着用のダイコレットおよびチップのボンディング装置
US6113165A (en) * 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
WO2000068625A1 (en) * 1999-05-11 2000-11-16 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism
WO2000078654A1 (en) * 1999-06-17 2000-12-28 Speedfam-Ipec Corporation Improved wafer handling apparatus
JP2001332603A (ja) * 2000-05-18 2001-11-30 Nikon Corp 基板搬送装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section PQ Week 200219, Derwent World Patents Index; Class Q35, AN 2002-144575, XP002225580 *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 530 (E - 1287) 30 October 1992 (1992-10-30) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) *

Also Published As

Publication number Publication date
EP1393355A2 (de) 2004-03-03
US20060245906A1 (en) 2006-11-02
TW584919B (en) 2004-04-21
CN1526155A (zh) 2004-09-01
JP2004527136A (ja) 2004-09-02
JP4116449B2 (ja) 2008-07-09
WO2002095795A2 (de) 2002-11-28
CN1271678C (zh) 2006-08-23

Similar Documents

Publication Publication Date Title
WO2003058707A1 (en) Semiconductor processing system and semiconductor carrying mechanism
WO2003009346A3 (en) Processing system
EP0398365A3 (de) Mehrkammer-Vakuumvorrichtung mit abgestuften Vakuumniveaus zur Behandlung von Halbleiterwafern
WO2002095795A3 (de) Vorrichtung zur aufnahme von scheibenförmigen objekten
IL145678A0 (en) Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
EP1772901A3 (de) Waferhalter und Verfahren zur Halbleiterverarbeitung
TW338760B (en) Carrier tape and die apparatus for forming the same
AU2002365591A1 (en) Wafer handling apparatus and method
WO2008002780A3 (en) Batch processing platform for ald and cvd
WO2002003431A3 (en) Apparatus and methods for semiconductor wafer processing equipment
WO2006041530A3 (en) Work-piece processing system
WO2004086465A3 (en) Method and apparatus for high speed wafer handling
EP1975996A3 (de) Verfahren und Vorrichtung zum Transportieren von Substratträgern
AU6802200A (en) Atmospheric wafer transfer module with nest for wafer transport robot and methodof implementing same
WO2004030045A3 (en) Semiconductor device processing
TW200519012A (en) Glass substrate transporting facility
WO2005041267A3 (en) Substrate carrier
WO2001064391A3 (en) Planarization system with a wafer transfer corridor and multiple polishing modules
WO2004025711A3 (en) Large area substrate processing system
AU5290098A (en) Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
WO2002005326A3 (en) Robotic end effector provided with wafer supporting pads elastically mounted
AU2003287953A1 (en) Device and method for applying semiconductor chips to carriers
TW200507087A (en) Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces
WO2006031975A3 (en) Improved systems and methods for wafer translation
WO2002022469A3 (en) Loadlock with integrated pre-clean chamber

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CA CN IL JP KR SG US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2002771633

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020037014971

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 02810188X

Country of ref document: CN

Ref document number: 10478285

Country of ref document: US

Ref document number: 2002592161

Country of ref document: JP

WWP Wipo information: published in national office

Ref document number: 2002771633

Country of ref document: EP