WO2003015160A3 - Dual layer cmos devices - Google Patents

Dual layer cmos devices Download PDF

Info

Publication number
WO2003015160A3
WO2003015160A3 PCT/US2002/025286 US0225286W WO03015160A3 WO 2003015160 A3 WO2003015160 A3 WO 2003015160A3 US 0225286 W US0225286 W US 0225286W WO 03015160 A3 WO03015160 A3 WO 03015160A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
distal
proximal
channel
dual layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/025286
Other languages
French (fr)
Other versions
WO2003015160A2 (en
Inventor
Eugene A Fitzgerald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amber Wave Systems Inc
Original Assignee
Amber Wave Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amber Wave Systems Inc filed Critical Amber Wave Systems Inc
Priority to JP2003519990A priority Critical patent/JP2004538639A/en
Priority to DE60234450T priority patent/DE60234450D1/en
Priority to EP02761307A priority patent/EP1415337B1/en
Priority to AT02761307T priority patent/ATE449420T1/en
Publication of WO2003015160A2 publication Critical patent/WO2003015160A2/en
Publication of WO2003015160A3 publication Critical patent/WO2003015160A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0167—Manufacturing their channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/751—Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/791—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions
    • H10D30/798—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions being provided in or under the channel regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/017—Manufacturing their source or drain regions, e.g. silicided source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85—Complementary IGFETs, e.g. CMOS
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/8311—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET] the IGFETs characterised by having different channel structures

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Fats And Perfumes (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

A semiconductor-based device includes a channel layer, which includes a distal layer and a proximal layer in contact with the distal layer. The distal layer supports at least a portion of hole conduction for at least one p-channel component, and the proximal layer supports at least a portion of electron conduction for at least one n-channel component. The proximal layer has a thickness that permits a hole wave function to effectively extend from the proximal layer into the distal layer to facilitate hole conduction by the distal layer. A method for fabricating a semiconductor-based device includes providing a distal portion of a channel layer and providing a proximal portion of the channel layer.
PCT/US2002/025286 2001-08-09 2002-08-09 Dual layer cmos devices Ceased WO2003015160A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003519990A JP2004538639A (en) 2001-08-09 2002-08-09 Double layer COMS device and method of manufacturing the same
DE60234450T DE60234450D1 (en) 2001-08-09 2002-08-09 CMOS COMPONENTS WITH DOUBLE LAYER
EP02761307A EP1415337B1 (en) 2001-08-09 2002-08-09 Dual layer cmos devices
AT02761307T ATE449420T1 (en) 2001-08-09 2002-08-09 DOUBLE LAYER CMOS COMPONENTS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3118801P 2001-08-09 2001-08-09
US60/311,88 2001-08-09

Publications (2)

Publication Number Publication Date
WO2003015160A2 WO2003015160A2 (en) 2003-02-20
WO2003015160A3 true WO2003015160A3 (en) 2003-12-04

Family

ID=32092164

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/025286 Ceased WO2003015160A2 (en) 2001-08-09 2002-08-09 Dual layer cmos devices

Country Status (5)

Country Link
EP (1) EP1415337B1 (en)
JP (1) JP2004538639A (en)
AT (1) ATE449420T1 (en)
DE (1) DE60234450D1 (en)
WO (1) WO2003015160A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040072738A (en) * 2002-01-23 2004-08-18 스피나커 세미컨덕터, 인크. Field effect transistor having source and/or drain forming schottky or schottky-like contact with strained semiconductor substrate
US6909186B2 (en) * 2003-05-01 2005-06-21 International Business Machines Corporation High performance FET devices and methods therefor
FR2868209B1 (en) * 2004-03-25 2006-06-16 Commissariat Energie Atomique FIELD-FIELD FIELD EFFECT TRANSISTOR DIAMOND CARBON
US7244958B2 (en) * 2004-06-24 2007-07-17 International Business Machines Corporation Integration of strained Ge into advanced CMOS technology
KR102069275B1 (en) 2013-06-07 2020-01-22 삼성전자주식회사 Semiconductor device having strained channel layer and method of manufacturing the same

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155571A (en) * 1990-08-06 1992-10-13 The Regents Of The University Of California Complementary field effect transistors having strained superlattice structure
EP0683522A2 (en) * 1994-05-20 1995-11-22 International Business Machines Corporation CMOS with strained Si/SiGe layers
JPH09219524A (en) * 1996-02-09 1997-08-19 Toshiba Corp Semiconductor device and manufacturing method thereof
JP2000021783A (en) * 1998-06-30 2000-01-21 Toshiba Corp Semiconductor device and manufacturing method thereof
US6111267A (en) * 1997-05-13 2000-08-29 Siemens Aktiengesellschaft CMOS integrated circuit including forming doped wells, a layer of intrinsic silicon, a stressed silicon germanium layer where germanium is between 25 and 50%, and another intrinsic silicon layer
JP2001160594A (en) * 1999-09-20 2001-06-12 Toshiba Corp Semiconductor device
JP2001168342A (en) * 1999-12-10 2001-06-22 Fujitsu Ltd Semiconductor device and method of manufacturing the same
US6339232B1 (en) * 1999-09-20 2002-01-15 Kabushika Kaisha Toshiba Semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4521542B2 (en) * 1999-03-30 2010-08-11 ルネサスエレクトロニクス株式会社 Semiconductor device and semiconductor substrate

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155571A (en) * 1990-08-06 1992-10-13 The Regents Of The University Of California Complementary field effect transistors having strained superlattice structure
EP0683522A2 (en) * 1994-05-20 1995-11-22 International Business Machines Corporation CMOS with strained Si/SiGe layers
JPH09219524A (en) * 1996-02-09 1997-08-19 Toshiba Corp Semiconductor device and manufacturing method thereof
US6111267A (en) * 1997-05-13 2000-08-29 Siemens Aktiengesellschaft CMOS integrated circuit including forming doped wells, a layer of intrinsic silicon, a stressed silicon germanium layer where germanium is between 25 and 50%, and another intrinsic silicon layer
JP2000021783A (en) * 1998-06-30 2000-01-21 Toshiba Corp Semiconductor device and manufacturing method thereof
US6407406B1 (en) * 1998-06-30 2002-06-18 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
JP2001160594A (en) * 1999-09-20 2001-06-12 Toshiba Corp Semiconductor device
US6339232B1 (en) * 1999-09-20 2002-01-15 Kabushika Kaisha Toshiba Semiconductor device
JP2001168342A (en) * 1999-12-10 2001-06-22 Fujitsu Ltd Semiconductor device and method of manufacturing the same

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
MIZUNO T ET AL: "ADVANCED SOI-MOSFETS WITH STRAINED-SI CHANNEL FOR HIGH SPEED CMOS -ELECTRON/HOLE MOBILITY ENHANCEMENT-", 2000 SYMPOSIUM ON VLSI TECHNOLOGY. DIGEST OF TECHNICAL PAPERS. HONOLULU, JUNE 13-15, 2000, SYMPOSIUM ON VLSI TECHNOLOGY, NEW YORK, NY: IEEE, US, 13 June 2000 (2000-06-13), pages 210 - 211, XP000970820, ISBN: 0-7803-6306-X *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 12 25 December 1997 (1997-12-25) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 23 10 February 2001 (2001-02-10) *
YEE-CHIA YEO ET AL: "Enhanced performance in sub-100 nm CMOSFETs using strained epitaxial silicon-germanium", 2000, PISCATAWAY, NJ, USA, IEEE, USA, 10 December 2000 (2000-12-10), pages 753 - 756, XP010531871 *

Also Published As

Publication number Publication date
WO2003015160A2 (en) 2003-02-20
JP2004538639A (en) 2004-12-24
EP1415337A2 (en) 2004-05-06
ATE449420T1 (en) 2009-12-15
DE60234450D1 (en) 2009-12-31
EP1415337B1 (en) 2009-11-18

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