WO2003020003A3 - Horizontal component retention socket - Google Patents

Horizontal component retention socket Download PDF

Info

Publication number
WO2003020003A3
WO2003020003A3 PCT/US2002/025011 US0225011W WO03020003A3 WO 2003020003 A3 WO2003020003 A3 WO 2003020003A3 US 0225011 W US0225011 W US 0225011W WO 03020003 A3 WO03020003 A3 WO 03020003A3
Authority
WO
WIPO (PCT)
Prior art keywords
component retention
retention socket
horizontal component
bending
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/025011
Other languages
French (fr)
Other versions
WO2003020003A2 (en
Inventor
Patrick Boyd
Alan Lavalle
Jarett Rinaldi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Priority to DE60204896T priority Critical patent/DE60204896T2/en
Priority to AT02750444T priority patent/ATE298971T1/en
Priority to EP02750444A priority patent/EP1419681B1/en
Publication of WO2003020003A2 publication Critical patent/WO2003020003A2/en
Anticipated expiration legal-status Critical
Publication of WO2003020003A3 publication Critical patent/WO2003020003A3/en
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092Treatment of the terminal leads as a separate operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Casings For Electric Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Abstract

A component retention socket, which allows through-hole mount electronic components to be attached to a substrate in a stabilized, horizontal orientation, without requiring prior lead preparation (e.g., bending), wherein the component retention socket itself facilitates safe and easy lead bending.
PCT/US2002/025011 2001-08-24 2002-08-07 Horizontal component retention socket Ceased WO2003020003A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE60204896T DE60204896T2 (en) 2001-08-24 2002-08-07 SOCKET FOR HORIZONTAL MOUNTING OF A COMPONENT
AT02750444T ATE298971T1 (en) 2001-08-24 2002-08-07 SOCKET FOR HORIZONTAL FIXING OF A COMPONENT
EP02750444A EP1419681B1 (en) 2001-08-24 2002-08-07 Horizontal component retention socket

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/939,115 US6555746B2 (en) 2001-08-24 2001-08-24 Horizontal component retention socket
US09/939,115 2001-08-24

Publications (2)

Publication Number Publication Date
WO2003020003A2 WO2003020003A2 (en) 2003-03-06
WO2003020003A3 true WO2003020003A3 (en) 2004-02-26

Family

ID=25472569

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/025011 Ceased WO2003020003A2 (en) 2001-08-24 2002-08-07 Horizontal component retention socket

Country Status (6)

Country Link
US (1) US6555746B2 (en)
EP (1) EP1419681B1 (en)
CN (1) CN100521889C (en)
AT (1) ATE298971T1 (en)
DE (1) DE60204896T2 (en)
WO (1) WO2003020003A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039900A (en) * 2003-07-17 2005-02-10 Yazaki Corp Electrical module structure
DE102005035809A1 (en) * 2005-07-27 2007-02-01 Conti Temic Microelectronic Gmbh Electronic module is formed by mounting of wired sensor onto a ceramic circuit plate carrying a control module
DE112007000056T5 (en) * 2006-09-29 2008-08-07 Matsushita Electric Industrial Co., Ltd., Kadoma Electronic component and electronic control device using this
US8451617B2 (en) * 2010-07-30 2013-05-28 Lien Chang Electronic Enterprise Co., Ltd. Integrated circuit board
CN102625577A (en) * 2011-01-30 2012-08-01 比亚迪股份有限公司 Electronic component positioning device, positioning method and electronic equipment
CN103140127A (en) * 2011-11-22 2013-06-05 亚旭电子科技(江苏)有限公司 Electronic component pin regulating device
CN104588537B (en) * 2014-12-30 2016-04-20 河南工程学院 Electronic component pin foot bending and fixing device
TWI612543B (en) * 2016-06-21 2018-01-21 鈺邦科技股份有限公司 Capacitor detection system and passive-type pin-diverging module thereof
JP6499213B2 (en) * 2017-02-17 2019-04-10 太陽誘電株式会社 Cover and module using the same
CN116379397A (en) * 2023-02-24 2023-07-04 浙江阳光照明电器集团股份有限公司 Wire fixer and wire fixing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4065198A (en) * 1976-12-13 1977-12-27 Wescom, Inc. LED Mounting retainer and display
US4436362A (en) * 1981-02-02 1984-03-13 Siemens Aktiengesellschaft Connector for printed circuit boards
US5121311A (en) * 1991-01-09 1992-06-09 R & D Molded Products, Inc. Hinged LED holder
US5707249A (en) * 1996-02-12 1998-01-13 Schneider Automation Inc. Device holder attaching to a printed circuit board

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4195330A (en) * 1975-12-08 1980-03-25 Savage John Jun Lens clip and cap for led or light unit assembly
US4447105A (en) * 1982-05-10 1984-05-08 Illinois Tool Works Inc. Terminal bridging adapter
JPS6181170U (en) * 1984-10-31 1986-05-29
US4682829A (en) * 1985-06-13 1987-07-28 Amp Incorporated Surface mount socket for dual in-line package
US5116229A (en) * 1990-12-17 1992-05-26 Savage John Jun Light unit terminals maintained in bent condition
US5204498A (en) * 1991-12-30 1993-04-20 Therm-O-Disc, Incorporated Packaging assembly
US5469893A (en) * 1993-12-21 1995-11-28 Panduit Corp. Tab and slot fiber optic fitting
US5704797A (en) * 1994-05-19 1998-01-06 Tii Industries, Inc. Switchable electrical socket
US6037543A (en) * 1994-11-17 2000-03-14 Panduit Corp. Wiring duct fittings
US5709554A (en) * 1996-02-12 1998-01-20 Savage, Jr.; John M. Angled circuit connector structure
US5798910A (en) * 1996-08-29 1998-08-25 Caloritech Inc. Sealable housing for electrical components
US6002089A (en) * 1997-09-26 1999-12-14 The Wiremold Company Non-linear raceway section having radial insert
US6231370B1 (en) * 1998-03-19 2001-05-15 The Whitaker Corporation Electrical connector for leaded electronic component
US6363198B1 (en) * 2000-03-07 2002-03-26 Sumitomo Electric Lightwave Corp. Optical fiber cable distribution shelf with cable management system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4065198A (en) * 1976-12-13 1977-12-27 Wescom, Inc. LED Mounting retainer and display
US4436362A (en) * 1981-02-02 1984-03-13 Siemens Aktiengesellschaft Connector for printed circuit boards
US5121311A (en) * 1991-01-09 1992-06-09 R & D Molded Products, Inc. Hinged LED holder
US5707249A (en) * 1996-02-12 1998-01-13 Schneider Automation Inc. Device holder attaching to a printed circuit board

Also Published As

Publication number Publication date
CN100521889C (en) 2009-07-29
ATE298971T1 (en) 2005-07-15
EP1419681A2 (en) 2004-05-19
EP1419681B1 (en) 2005-06-29
US6555746B2 (en) 2003-04-29
CN1547877A (en) 2004-11-17
DE60204896D1 (en) 2005-08-04
US20030037946A1 (en) 2003-02-27
DE60204896T2 (en) 2006-05-24
WO2003020003A2 (en) 2003-03-06

Similar Documents

Publication Publication Date Title
AU2001251627A1 (en) Connector assembly with stabilized modules
WO2007032816A3 (en) A connector for harsh environments
TW572393U (en) Electrical connector assembly and module incorporating the same
TW507950U (en) Electronic card connector
TW539283U (en) Electronic card connector
TW532533U (en) Electronic card connector
AU2002348028A1 (en) Seat connector for portable electronic devices
TW532601U (en) Electronic card connector
WO2003020003A3 (en) Horizontal component retention socket
TW476465U (en) Electronic card connector
TW534397U (en) Electronic card connector
AU2003257662A1 (en) Electronic device terminal connector
TW523197U (en) Electronic card connector
TW509395U (en) Electronic card connector
WO2008052045A3 (en) Ceramic header method and system
AU2002357592A1 (en) Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
AU2002362101A1 (en) Flip-chip mounted opto-electronic circuit
SG124335A1 (en) Semiconductor package system with cavity substrat e
WO2004008901A3 (en) Connector and webbing arrangement
AU2002352511A1 (en) Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components
AU2003244213A1 (en) Connector, method for manufacturing the same, and wiring board structure employing it
TW529791U (en) Electronic card connector
AU2002249330A1 (en) Low cost electronic camera made with integrated circuit technology
AU2002332398A1 (en) Interconnect structure for interconnecting electronic modules
AU2002249337A1 (en) Secure electronic component

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ OM PH PL PT RU SD SE SG SI SK SL TJ TM TN TR TZ UA UG UZ VN YU ZA ZM

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE BG CH CY CZ DK EE ES FI FR GB GR IE IT LU MC PT SE SK TR BF BJ CF CG CI GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2002750444

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 20028165799

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2002750444

Country of ref document: EP

WWG Wipo information: grant in national office

Ref document number: 2002750444

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP