WO2003025475A3 - Modular capillary pumped loop cooling system - Google Patents

Modular capillary pumped loop cooling system Download PDF

Info

Publication number
WO2003025475A3
WO2003025475A3 PCT/US2002/027857 US0227857W WO03025475A3 WO 2003025475 A3 WO2003025475 A3 WO 2003025475A3 US 0227857 W US0227857 W US 0227857W WO 03025475 A3 WO03025475 A3 WO 03025475A3
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
cooling system
vapor
energy
wicking structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/027857
Other languages
French (fr)
Other versions
WO2003025475A2 (en
Inventor
Jason Chesser
Barrett Faneuf
Stephen Montgomery
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Priority to EP02757536A priority Critical patent/EP1427971B1/en
Priority to AU2002323548A priority patent/AU2002323548A1/en
Priority to DE60210640T priority patent/DE60210640T2/en
Publication of WO2003025475A2 publication Critical patent/WO2003025475A2/en
Publication of WO2003025475A3 publication Critical patent/WO2003025475A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Inorganic Insulating Materials (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Compression-Type Refrigeration Machines With Reversible Cycles (AREA)
  • External Artificial Organs (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

The modular CPL cooling system transfers heat from high-power circuit components (22) in a chassis to other locations within or external to the chassis, where the heat can be more easily removed. The CPL cooling system includes one or more evaporators (10) connected to one or more condensers (12) via flexible liquid transport and vapor transport lines (16, 14). A wicking structure (20) is disposed within each evaporator (10). The wicking structure (20) draws working fluid (e.g., water) in a liquid state into the evaporator (10) based on a capillary mechanism and a pressure differential across a meniscus formed at the liquid/vapor interface on an upper surface of the wicking structure (20). At this interface, liquid evaporates and absorbs energy from the heat source (22). The energy is transported by the vapor to the condenser (12) where the working fluid is condensed back into liquid, thereby releasing the energy.
PCT/US2002/027857 2001-09-20 2002-08-29 Modular capillary pumped loop cooling system Ceased WO2003025475A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP02757536A EP1427971B1 (en) 2001-09-20 2002-08-29 Modular capillary pumped loop cooling system
AU2002323548A AU2002323548A1 (en) 2001-09-20 2002-08-29 Modular capillary pumped loop cooling system
DE60210640T DE60210640T2 (en) 2001-09-20 2002-08-29 MODULAR COOLING CIRCUIT WITH CAPILLARY PUMP

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/957,792 US6981543B2 (en) 2001-09-20 2001-09-20 Modular capillary pumped loop cooling system
US09/957,792 2001-09-20

Publications (2)

Publication Number Publication Date
WO2003025475A2 WO2003025475A2 (en) 2003-03-27
WO2003025475A3 true WO2003025475A3 (en) 2003-06-19

Family

ID=25500141

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/027857 Ceased WO2003025475A2 (en) 2001-09-20 2002-08-29 Modular capillary pumped loop cooling system

Country Status (7)

Country Link
US (4) US6981543B2 (en)
EP (3) EP1574800B1 (en)
CN (2) CN100368757C (en)
AT (2) ATE323266T1 (en)
AU (1) AU2002323548A1 (en)
DE (2) DE60210640T2 (en)
WO (1) WO2003025475A2 (en)

Families Citing this family (236)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001072099A2 (en) * 2000-03-21 2001-09-27 Liebert Corporation Method and apparatus for cooling electronic enclosures
US7086452B1 (en) * 2000-06-30 2006-08-08 Intel Corporation Method and an apparatus for cooling a computer
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US6988534B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
AU2003270882A1 (en) 2002-09-23 2004-05-04 Cooligy, Inc. Micro-fabricated electrokinetic pump with on-frit electrode
US6881039B2 (en) 2002-09-23 2005-04-19 Cooligy, Inc. Micro-fabricated electrokinetic pump
US6994151B2 (en) 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7156159B2 (en) 2003-03-17 2007-01-02 Cooligy, Inc. Multi-level microchannel heat exchangers
TWI300466B (en) * 2002-11-01 2008-09-01 Cooligy Inc Channeled flat plate fin heat exchange system, device and method
WO2004042306A2 (en) 2002-11-01 2004-05-21 Cooligy, Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
US7000684B2 (en) 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US6986382B2 (en) 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
KR100450826B1 (en) * 2002-12-11 2004-10-01 삼성전자주식회사 Heat transfer apparatus
KR100505554B1 (en) * 2003-01-24 2005-08-03 아이큐리랩 홀딩스 리미티드 Cooling device of hybrid-type
US7201012B2 (en) 2003-01-31 2007-04-10 Cooligy, Inc. Remedies to prevent cracking in a liquid system
US7293423B2 (en) * 2004-06-04 2007-11-13 Cooligy Inc. Method and apparatus for controlling freezing nucleation and propagation
US7044196B2 (en) 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7090001B2 (en) 2003-01-31 2006-08-15 Cooligy, Inc. Optimized multiple heat pipe blocks for electronics cooling
US20090044928A1 (en) * 2003-01-31 2009-02-19 Girish Upadhya Method and apparatus for preventing cracking in a liquid cooling system
US20040182551A1 (en) * 2003-03-17 2004-09-23 Cooligy, Inc. Boiling temperature design in pumped microchannel cooling loops
US7017654B2 (en) 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
TW591984B (en) * 2003-07-04 2004-06-11 Sentelic Corp Micro-circulating flow channel system and its manufacturing method
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7021369B2 (en) * 2003-07-23 2006-04-04 Cooligy, Inc. Hermetic closed loop fluid system
US20050067146A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Two phase cooling system method for burn-in testing
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
DE20314532U1 (en) * 2003-09-16 2004-02-19 Pries, Wulf H. Device for dissipating heat from electronic and electrical components
US7431071B2 (en) * 2003-10-15 2008-10-07 Thermal Corp. Fluid circuit heat transfer device for plural heat sources
CN100529594C (en) 2003-12-05 2009-08-19 力博特公司 Cooling system for high density heat load
US7273088B2 (en) * 2003-12-17 2007-09-25 Hewlett-Packard Development Company, L.P. One or more heat exchanger components in major part operably locatable outside computer chassis
US7074123B2 (en) * 2004-01-13 2006-07-11 Power Of 4, L.L.C. Cabinet for computer devices with air distribution device
US7068509B2 (en) * 2004-02-03 2006-06-27 Hewlett-Packard Development Company, L.P. Small form factor cooling system
US7177116B2 (en) * 2004-03-03 2007-02-13 Hitachi Global Storage Technologies Netherlands Bv System, method, and apparatus for applying boundary layer manipulation techniques to the air flow inside rotary disk storage devices
US20050207116A1 (en) * 2004-03-22 2005-09-22 Yatskov Alexander I Systems and methods for inter-cooling computer cabinets
CA2561769C (en) * 2004-03-31 2009-12-22 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
US7958935B2 (en) 2004-03-31 2011-06-14 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
JP4592355B2 (en) * 2004-03-31 2010-12-01 株式会社東芝 Liquid feed pump, cooling system, and electrical equipment
US7280358B2 (en) * 2004-04-19 2007-10-09 Hewlett-Packard Development Company, L.P. Liquid loop with multiple heat exchangers for efficient space utilization
US7203063B2 (en) * 2004-05-21 2007-04-10 Hewlett-Packard Development Company, L.P. Small form factor liquid loop cooling system
JP2005344562A (en) * 2004-06-01 2005-12-15 Toshiba Corp Electronic device having pump, cooling device and cooling device
US7616444B2 (en) 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7188662B2 (en) 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
US7353860B2 (en) * 2004-06-16 2008-04-08 Intel Corporation Heat dissipating device with enhanced boiling/condensation structure
CN1713376A (en) * 2004-06-25 2005-12-28 鸿富锦精密工业（深圳）有限公司 Liquid-cooled radiator
JP2006049382A (en) * 2004-07-30 2006-02-16 Toshiba Corp Cooling device and electronic equipment
JP4056504B2 (en) * 2004-08-18 2008-03-05 Ｎｅｃディスプレイソリューションズ株式会社 COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
US20060067052A1 (en) * 2004-09-30 2006-03-30 Llapitan David J Liquid cooling system
TWI284190B (en) * 2004-11-11 2007-07-21 Taiwan Microloops Corp Bendable heat spreader with metallic screens based micro-structure and method for fabricating same
CN101044811A (en) * 2004-11-14 2007-09-26 利伯特公司 Integrated heat exchanger(s) in a rack for vertical board style computer systems
CN100386588C (en) * 2004-12-30 2008-05-07 南京理工大学 Two-phase capillary pump loop compound capillary core and preparation method thereof
US7124811B2 (en) * 2004-12-31 2006-10-24 Intel Corporation Systems for integrated pump and cold plate
US7117931B2 (en) * 2004-12-31 2006-10-10 Intel Corporation Systems for low cost liquid cooling
TWI274839B (en) * 2004-12-31 2007-03-01 Foxconn Tech Co Ltd Pulsating heat conveyance apparatus
EP1846949B1 (en) * 2005-01-05 2018-08-22 Philips Lighting Holding B.V. Thermally and electrically conductive apparatus
US7254025B2 (en) * 2005-02-02 2007-08-07 National Instruments Corporation Cooling mechanisms associated with card adapter
US20060175043A1 (en) * 2005-02-07 2006-08-10 Hung-Tao Peng Temperature conductor and method of making same
JP4321478B2 (en) * 2005-03-31 2009-08-26 日本電気株式会社 Information processing blade and information processing apparatus
US7492595B2 (en) * 2005-03-31 2009-02-17 Tecnisco Limited Semiconductor cooling device and stack of semiconductor cooling devices
TWI280096B (en) * 2005-05-11 2007-04-21 Quanta Comp Inc Electronic device
TWI262285B (en) * 2005-06-03 2006-09-21 Foxconn Tech Co Ltd Loop-type heat exchange apparatus
CN100437004C (en) * 2005-06-04 2008-11-26 富准精密工业(深圳)有限公司 Ring type heat exchanging system
CN100455175C (en) * 2005-07-08 2009-01-21 富准精密工业(深圳)有限公司 Loop Cooling Module
CN100366998C (en) * 2005-07-18 2008-02-06 华中科技大学 A Planar Capillary Wick Condenser for Capillary Suction Two-Phase Fluid Circuit
CN100366997C (en) * 2005-07-18 2008-02-06 华中科技大学 Capillary two-phase fluid circuit with planar evaporator and condenser
WO2007018994A2 (en) 2005-08-04 2007-02-15 Liebert Corporation Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation system
CN100401508C (en) * 2005-09-14 2008-07-09 赵耀华 A High Performance Passive Phase Change Heat Dissipation System and Its Application
US7705342B2 (en) * 2005-09-16 2010-04-27 University Of Cincinnati Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes
US7515418B2 (en) 2005-09-26 2009-04-07 Curtiss-Wright Controls, Inc. Adjustable height liquid cooler in liquid flow through plate
US7324336B2 (en) * 2005-09-27 2008-01-29 Lockheed Martin Corporation Flow through cooling assemblies for conduction-cooled circuit modules
US20070076376A1 (en) * 2005-09-30 2007-04-05 Intel Corporation Method, apparatus and computer system for providing for the transfer of thermal energy
DE602006009687D1 (en) * 2005-11-08 2009-11-19 Byd Co Ltd HEAT LIGHTING DEVICE FOR A BATTERY PACK AND BATTERY PACK THEREWITH
CN100493318C (en) * 2005-11-08 2009-05-27 富准精密工业(深圳)有限公司 An integral liquid cooling heat radiator
US20070109746A1 (en) * 2005-11-15 2007-05-17 Klein David A Liquid cooling of electronic system and method
US20070121295A1 (en) * 2005-11-30 2007-05-31 International Business Machines Corporation Hybrid liquid-air cooled module
US7551442B2 (en) * 2005-12-05 2009-06-23 Nvidia Corporation Embedded heat pipe in a hybrid cooling system
US20070175614A1 (en) * 2006-01-30 2007-08-02 Jaffe Limited Loop heat exchange apparatus
US7347250B2 (en) * 2006-01-30 2008-03-25 Jaffe Limited Loop heat pipe
US7913719B2 (en) * 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
EP1987309B1 (en) * 2006-02-16 2014-04-16 Cooligy, Inc. Liquid cooling loops for server applications
US20070213881A1 (en) * 2006-03-08 2007-09-13 Belady Christian L Liquid cooling of electronic device environments
US20070223193A1 (en) * 2006-03-23 2007-09-27 Hamman Brian A Transport System
US20070223192A1 (en) * 2006-03-24 2007-09-27 Qnx Cooling Systems Inc. Transport system
US8157001B2 (en) * 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US7715194B2 (en) * 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US20070256825A1 (en) * 2006-05-04 2007-11-08 Conway Bruce R Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect
EP2036412B1 (en) * 2006-06-01 2012-11-14 Exaflop LLC Controlled warm air capture
US20080006396A1 (en) * 2006-06-30 2008-01-10 Girish Upadhya Multi-stage staggered radiator for high performance liquid cooling applications
US20080013283A1 (en) * 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components
JP5283836B2 (en) * 2006-07-25 2013-09-04 富士通株式会社 Heat receiver and liquid cooling unit for liquid cooling unit and electronic device
JP4781929B2 (en) * 2006-07-25 2011-09-28 富士通株式会社 Electronics
JP5133531B2 (en) * 2006-07-25 2013-01-30 富士通株式会社 Heat exchanger for liquid cooling unit, liquid cooling unit and electronic equipment
JP4842040B2 (en) * 2006-07-25 2011-12-21 富士通株式会社 Electronics
JP2008027370A (en) * 2006-07-25 2008-02-07 Fujitsu Ltd Electronics
JP5148079B2 (en) * 2006-07-25 2013-02-20 富士通株式会社 Heat exchanger for liquid cooling unit, liquid cooling unit and electronic equipment
JP2008027374A (en) * 2006-07-25 2008-02-07 Fujitsu Ltd Heat receiver and liquid cooling unit for liquid cooling unit and electronic device
GB2441149B (en) 2006-08-25 2011-04-13 Aliaksandr Saroka Differential evaporation heat and hydraulic pumps and external combustion engine
US8561673B2 (en) * 2006-09-26 2013-10-22 Olantra Fund X L.L.C. Sealed self-contained fluidic cooling device
JP2008085144A (en) * 2006-09-28 2008-04-10 Sanyo Electric Co Ltd Cooling system
CN100566530C (en) * 2007-02-16 2009-12-02 财团法人工业技术研究院 Micro droplet cooling device
US7957132B2 (en) * 2007-04-16 2011-06-07 Fried Stephen S Efficiently cool data centers and electronic enclosures using loop heat pipes
US20080283221A1 (en) * 2007-05-15 2008-11-20 Christian Blicher Terp Direct Air Contact Liquid Cooling System Heat Exchanger Assembly
TW200924625A (en) * 2007-08-07 2009-06-01 Cooligy Inc Deformable duct guides that accommodate electronic connection lines
FR2919923B1 (en) * 2007-08-08 2009-10-30 Astrium Sas Soc Par Actions Si PASSIVE DEVICE WITH MICRO BUCKLE FLUID WITH CAPILLARY PUMPING
FR2919922B1 (en) * 2007-08-08 2009-10-30 Astrium Sas Soc Par Actions Si PASSIVE THERMAL CONTROL DEVICE WITH MICRO BUCKLE FLUID WITH CAPILLARY PUMPING
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
CN101796635B (en) * 2007-09-07 2012-07-04 国际商业机器公司 Method and device for cooling a heat generating component
JP4859823B2 (en) * 2007-12-14 2012-01-25 株式会社日立製作所 COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME
US20090225514A1 (en) * 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US8164901B2 (en) * 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
TW200946855A (en) * 2008-05-08 2009-11-16 Golden Sun News Tech Co Ltd Vapor chamber
TWM347809U (en) * 2008-05-26 2008-12-21 Xu xiu cang Fast temperature-averaging heat conductive device
US8188595B2 (en) 2008-08-13 2012-05-29 Progressive Cooling Solutions, Inc. Two-phase cooling for light-emitting devices
JP4812138B2 (en) * 2008-09-24 2011-11-09 株式会社日立製作所 COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
DE102008054224A1 (en) 2008-10-31 2010-05-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method of transporting liquids, thermal capillary pump and their use
US20100132404A1 (en) * 2008-12-03 2010-06-03 Progressive Cooling Solutions, Inc. Bonds and method for forming bonds for a two-phase cooling apparatus
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
FR2942774B1 (en) * 2009-03-06 2011-05-06 Thales Sa THERMAL CONTROL DEVICE FOR A SPACE ENGINE
NL2004281A (en) * 2009-03-19 2010-09-20 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US8208250B2 (en) * 2009-04-08 2012-06-26 Intel Corporation External thermal solution for a mobile computing device
TWM371403U (en) * 2009-06-10 2009-12-21 Chun Teng Entpr Co Ltd Water-cooling thin-type cooling device
JP4783845B2 (en) * 2009-07-23 2011-09-28 東芝テック株式会社 Electronics
CN101988811B (en) * 2009-08-05 2013-07-03 富准精密工业(深圳)有限公司 Flat plate heat pipe and manufacturing method thereof
FR2949642B1 (en) * 2009-08-27 2012-05-04 Alstom Transport Sa ELECTRIC POWER CONVERTER FOR A RAILWAY VEHICLE
US20110073292A1 (en) * 2009-09-30 2011-03-31 Madhav Datta Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems
DE102010046156B4 (en) * 2009-10-08 2022-01-05 Schaeffler Technologies AG & Co. KG Mass balancing gear and method for its assembly
CN102754537B (en) * 2010-02-10 2015-09-09 Nec显示器解决方案株式会社 Liquid cooling system and electronic equipment including liquid cooling system
CN102834688B (en) * 2010-03-29 2015-07-15 日本电气株式会社 Phase change cooler and electronic equipment provided with same
CN102205485A (en) * 2010-03-31 2011-10-05 富准精密工业(深圳)有限公司 Flat plate heat pipe and manufacturing method thereof
JP5651991B2 (en) * 2010-05-10 2015-01-14 富士通株式会社 RADIATOR AND ELECTRONIC DEVICE HAVING THE SAME
ES2769605T3 (en) * 2010-08-26 2020-06-26 Asetek Danmark As Liquid cooling system for a server
WO2012046338A1 (en) * 2010-10-08 2012-04-12 富士通株式会社 Semiconductor package, cooling mechanism, and a method for manufacturing semiconductor package
TWI419641B (en) 2010-10-29 2013-12-11 Ind Tech Res Inst Cooling structure of electronic device
TWM412341U (en) * 2011-04-01 2011-09-21 Academia Sinica Cooling system for electronic instrument cabinet
US9609786B2 (en) * 2011-04-01 2017-03-28 Academia Sinica Cooling system for an electronic rack
US20120279683A1 (en) * 2011-05-05 2012-11-08 Alcatel-Lucent Usa Inc. Cooling apparatus for communications platforms
EP2716147A4 (en) * 2011-05-27 2015-08-26 Aavid Thermalloy Llc THERMAL TRANSFER DEVICE WITH REDUCED VERTICAL PROFILE
CN102856275A (en) * 2011-06-29 2013-01-02 鸿富锦精密工业（深圳）有限公司 Cooling system
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
DE102011082352A1 (en) * 2011-09-08 2013-03-14 Siemens Aktiengesellschaft Apparatus and method for cooling a device
US9049803B2 (en) * 2011-09-22 2015-06-02 Panduit Corp. Thermal management infrastructure for IT equipment in a cabinet
US8817473B2 (en) * 2011-09-26 2014-08-26 Mellanox Technologies Ltd. Liquid cooling system for modular electronic systems
US20130092353A1 (en) * 2011-10-17 2013-04-18 Asia Vital Components Co., Ltd. Vapor chamber structure and method of manufacturing same
US9155230B2 (en) 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server
JP6107665B2 (en) * 2012-01-04 2017-04-05 日本電気株式会社 COOLING DEVICE AND ELECTRONIC DEVICE USING THE SAME
JP6191137B2 (en) * 2012-05-14 2017-09-06 富士通株式会社 Cooling system
EP2704190A1 (en) * 2012-09-03 2014-03-05 ABB Technology AG Modular cooling system
CN103813695B (en) * 2012-11-13 2016-08-17 台达电子工业股份有限公司 Siphon cooling device
US9046288B2 (en) * 2012-11-21 2015-06-02 Hamilton Sundstrand Space Systems International, Inc. Pumped two phase fluid routing system and method of routing a working fluid for transferring heat
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
JP5950857B2 (en) * 2013-03-26 2016-07-13 豊田鉄工株式会社 Automotive electronic circuit cooling system
JP2014214985A (en) * 2013-04-26 2014-11-17 富士通株式会社 Evaporator, cooler, and electronic apparatus
CN104144591A (en) * 2013-05-09 2014-11-12 鸿富锦精密工业（深圳）有限公司 Cooling device and server cabinet with the same
FR3006431B1 (en) * 2013-05-29 2015-06-05 Euro Heat Pipes DEVICE FOR TRANSPORTING HEAT WITH A DIPHASIC FLUID
JP2015012282A (en) * 2013-07-02 2015-01-19 富士通株式会社 Electronic apparatus
CN103369934A (en) * 2013-07-17 2013-10-23 曙光信息产业(北京)有限公司 Cooling device and server with cooling device
FR3009376A1 (en) * 2013-08-01 2015-02-06 Calyos Sa SIMPLIFIED ASSEMBLY EVAPORATOR FOR DIPHASIC LOOP
US9874414B1 (en) 2013-12-06 2018-01-23 Google Llc Thermal control system
CN104780738A (en) * 2014-01-15 2015-07-15 奇鋐科技股份有限公司 Heat pipe structure and heat radiation module
CA2954439A1 (en) * 2014-07-08 2016-01-14 Adc Technologies Inc. Robust redundant-capable leak-resistant cooled enclosure wall
WO2016027299A1 (en) * 2014-08-18 2016-02-25 株式会社Ｍｕｒａｋｕｍｏ System, information processing device and rack
US12523431B2 (en) 2014-09-15 2026-01-13 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US12385697B2 (en) 2014-09-17 2025-08-12 Kelvin Thermal Technologies, Inc. Micropillar-enabled thermal ground plane
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
US9987712B2 (en) * 2015-04-02 2018-06-05 Asia Vital Components Co., Ltd. Manufacturing method of flat-plate heat pipe
CN106163215A (en) * 2015-04-08 2016-11-23 宏碁股份有限公司 Heat radiation module
US9693484B2 (en) * 2015-05-07 2017-06-27 Dell Products, L.P. Apparatus and method for cooling an information handling system
CN106358420B (en) * 2015-07-15 2020-05-19 宏碁股份有限公司 cooling module
US9835384B2 (en) * 2015-10-13 2017-12-05 International Business Machines Corporation Demand-based charging of a heat pipe
US9863712B2 (en) 2015-10-13 2018-01-09 International Business Machines Corporation Demand-based charging of a heat pipe
EP3193571B1 (en) * 2015-10-23 2020-08-26 Huawei Technologies Co., Ltd. Heat pipe based cooling system and power equipment
FR3042886B1 (en) 2015-10-26 2018-05-11 Calyos Sa COMPUTER EQUIPMENT WITH ELECTRICAL POWER SUPPLY UNIT
US10136557B2 (en) * 2015-12-04 2018-11-20 General Electric Company Thermal management systems and methods for heat generating electronics
US11236948B2 (en) * 2016-08-24 2022-02-01 Delta Electronics, Inc. Heat dissipation assembly
CN113784599B (en) 2016-08-24 2024-08-27 台达电子工业股份有限公司 Heat dissipation components
US10058007B2 (en) * 2016-09-26 2018-08-21 Asia Vital Components Co., Ltd. Water-cooling radiator unit and water-cooling module using same
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
US20180209745A1 (en) * 2017-01-26 2018-07-26 Asia Vital Components Co., Ltd. Loop heat pipe structure
US10119767B2 (en) 2017-02-10 2018-11-06 Hamilton Sundstrand Corporation Two-phase thermal loop with membrane separation
US10436521B2 (en) 2017-02-10 2019-10-08 Hamilton Sundstrand Corporation Dual-mode thermal management loop
US10295271B2 (en) 2017-02-10 2019-05-21 Hamilton Sundstrand Corporation Two-phase thermal loop with rotary separation
WO2018208801A1 (en) 2017-05-08 2018-11-15 Kelvin Thermal Technologies, Inc. Thermal management planes
US10483727B2 (en) * 2017-09-01 2019-11-19 Eaton Intelligent Power Limited Cooling system for tanks
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
JP7036416B2 (en) * 2017-10-18 2022-03-15 Ｎｅｃプラットフォームズ株式会社 Device
US10813246B2 (en) * 2017-10-23 2020-10-20 Asia Vital Components (China) Co., Ltd. Chassis heat dissipation structure
US10976111B2 (en) * 2017-10-27 2021-04-13 Shinko Electric Industries Co., Ltd. Loop type heat pipe
US11754344B2 (en) 2018-01-19 2023-09-12 Sumitomo Precision Products Co., Ltd. Boiling cooler
US10907910B2 (en) * 2018-01-19 2021-02-02 Asia Vital Components Co., Ltd Vapor-liquid phase fluid heat transfer module
US10548245B2 (en) * 2018-02-12 2020-01-28 Robert J Lipp Liquid cooled open compute project rack insert
JP7181443B2 (en) * 2018-02-14 2022-12-01 日本電産サンキョー株式会社 Cooling system
TW201945680A (en) * 2018-04-26 2019-12-01 泰碩電子股份有限公司 Loop heat pipe having different pipe diameters characterized in allowing a working liquid to be rapidly returned to the evaporating chamber so as to increase the heat dissipation efficiency
US10962301B2 (en) * 2018-07-23 2021-03-30 Shinko Electric Industries Co., Ltd. Loop heat pipe
US11209215B2 (en) * 2018-07-27 2021-12-28 Qualcomm Incorporated Enhanced cooling of an electronic device using micropumps in thermosiphons
US11152283B2 (en) 2018-11-15 2021-10-19 Hewlett Packard Enterprise Development Lp Rack and row-scale cooling
US20200163257A1 (en) * 2018-11-16 2020-05-21 Hewlett Packard Enterprise Development Lp Micro-axial pump for servers
US11015608B2 (en) 2018-12-10 2021-05-25 Hewlett Packard Enterprise Development Lp Axial flow pump with reduced height dimension
DE212019000445U1 (en) 2018-12-11 2021-08-17 Kelvin Thermal Technologies Steam chamber
US10746084B2 (en) * 2018-12-13 2020-08-18 General Electric Company Liquid driven thermal module and thermal management system
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
JP6888751B2 (en) * 2019-03-11 2021-06-16 大日本印刷株式会社 Vapor chambers, electronics, and seats for vapor chambers
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
US11044141B2 (en) 2019-07-09 2021-06-22 Phillip N Hughes High density, high availability compute system
CN111141832A (en) * 2019-12-31 2020-05-12 北京机电工程研究所 High-temperature-resistant acoustic emission sensor based on active air cooling
CN111007934B (en) * 2020-03-11 2020-05-22 北京中航科电测控技术股份有限公司 Rack-mounted server mainboard based on Loongson 3A4000
CN111642103B (en) * 2020-04-29 2023-06-23 西南电子技术研究所（中国电子科技集团公司第十研究所） High heat flux porous heat sink flow cooling device
EP4150216A4 (en) 2020-05-11 2023-11-01 Coolit Systems, Inc. LIQUID PUMP UNITS AND ASSOCIATED SYSTEMS AND METHODS
EP3919850A1 (en) * 2020-06-03 2021-12-08 ABB Schweiz AG Loop heat pipe for low voltage drives
CN111613592B (en) * 2020-06-05 2022-05-17 中国科学院工程热物理研究所 An electronic device cooling device
US12464679B2 (en) 2020-06-19 2025-11-04 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
NL2025918B1 (en) * 2020-06-25 2022-02-22 Microsoft Technology Licensing Llc Systems and methods of improving thermal management of heat-generation components
JP7812998B2 (en) * 2020-10-16 2026-02-12 ソルスティス アドバンスト マテリアルズ ユーエス インコーポレイテッド Novel heat pipe configuration
US12241688B2 (en) * 2020-10-22 2025-03-04 Asia Vital Components Co., Ltd. Vapor-phase/liquid-phase fluid heat exchange unit
US11744044B2 (en) 2020-11-05 2023-08-29 Deeia, Inc. Loop thermosyphon devices and systems, and related methods
US12581622B2 (en) 2020-11-05 2026-03-17 Deeia Inc. Metallic thermal interface materials and associated devices, systems, and methods
EP4050775A3 (en) 2021-02-25 2023-01-25 Regal Beloit America, Inc. Electric machine assembly having a terminal box
US12225692B2 (en) * 2021-03-04 2025-02-11 Te Connectivity Solutions Gmbh Heat exchange assembly for an electrical device
CN115087296B (en) * 2021-03-10 2026-02-06 亚浩电子五金塑胶（惠州）有限公司 Heat dissipation device
CN113133283B (en) * 2021-04-13 2023-10-20 上海天马微电子有限公司 Heat dissipation device and manufacturing method thereof
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
CN115443025B (en) * 2021-06-02 2025-06-06 英业达科技有限公司 Electronic devices and heat dissipation components
US12341082B2 (en) * 2021-08-06 2025-06-24 Baidu Usa Llc Chip cooling package with multiple fluid paths
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
US11877424B2 (en) * 2022-04-21 2024-01-16 Quanta Computer Inc. Cold plate for cooling electronic component
US12512389B1 (en) * 2022-05-02 2025-12-30 Advanced Thermal Solutions, Inc. Thermal management multi-loop transport apparatus, and related methods
US12342454B2 (en) * 2022-06-03 2025-06-24 Microsoft Technology Licensing, Llc Computing system with cooling for controlling temperature of electronic components
US12453042B2 (en) 2022-06-21 2025-10-21 Deeia Inc. Metallic thermal interface materials and associated devices, systems, and methods
US12557245B1 (en) * 2022-09-27 2026-02-17 International Business Machines Corporation Dual-phase evaporative cooling in sealed electronics devices
CN116469852B (en) * 2023-04-12 2024-05-17 广东工业大学 Integrated chip substrate with loop heat pipe heat dissipation system
TWI890096B (en) * 2023-07-24 2025-07-11 華碩電腦股份有限公司 Heat dissipation module

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2190737A (en) * 1986-05-19 1987-11-25 Grumman Aerospace Corp Heat transfer panel
US4890668A (en) * 1987-06-03 1990-01-02 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
JPH0961074A (en) * 1995-08-25 1997-03-07 Akutoronikusu Kk Closed temperature control system
US5725049A (en) * 1995-10-31 1998-03-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary pumped loop body heat exchanger
US5761037A (en) * 1996-02-12 1998-06-02 International Business Machines Corporation Orientation independent evaporator
US5940270A (en) * 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
US6227286B1 (en) * 1997-02-24 2001-05-08 Fujitsu Limited Heat sink and information processor using heat sink
US6257323B1 (en) * 2000-06-12 2001-07-10 Ching-Sung Kuo Heat dissipating device
JP2001196778A (en) * 1999-11-08 2001-07-19 Samsung Electronics Co Ltd Cooling device by CPL
FR2813662A1 (en) * 2000-09-05 2002-03-08 Astrium Sas Capillary evaporator, for thermal transfer loop, comprises a housing made of material with low thermal conductivity

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH247529A (en) * 1945-06-27 1947-03-15 Schweizerische Lokomotiv Heat exchanger with heat transfer fluid in closed circuit.
US3528494A (en) * 1966-11-07 1970-09-15 Teledyne Inc Heat pipe for low thermal conductivity working fluids
DE2120475A1 (en) * 1971-04-27 1972-11-02 Brown, Boveri & Cie Ag, 6800 Mannheim Heat pipe
US4002200A (en) * 1972-12-07 1977-01-11 Dean Products, Inc. Extended fin heat exchanger panel
US4470450A (en) * 1981-10-22 1984-09-11 Lockheed Missiles & Space Co. Pump-assisted heat pipe
US4476922A (en) * 1981-10-26 1984-10-16 Heilig Jr Glenn M Forced bilateral thermosiphon loop
DE3329325A1 (en) * 1982-09-03 1984-03-08 Peter 2563 Ipsach Herren Heat sink for liquid cooling of at least one electrical power element
US4867235A (en) 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US4994937A (en) 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
JPH04196395A (en) 1990-11-28 1992-07-16 Hitachi Ltd Electronic computer and cooling device thereof
EP0488679A3 (en) 1990-11-30 1993-08-04 Fujitsu Limited Storage disk module and storage disk device having a plurality of storage disk modules
GB9215442D0 (en) 1992-07-21 1992-09-02 British Aerospace Cooling of electronic components
US5269372A (en) * 1992-12-21 1993-12-14 International Business Machines Corporation Intersecting flow network for a cold plate cooling system
US5289694A (en) 1993-02-26 1994-03-01 At&T Bell Laboratories Circuit card mounting assembly
JP3166423B2 (en) * 1993-07-22 2001-05-14 株式会社デンソー Cooling structure
US5816313A (en) * 1994-02-25 1998-10-06 Lockheed Martin Corporation Pump, and earth-testable spacecraft capillary heat transport loop using augmentation pump and check valves
US5528454A (en) 1994-12-29 1996-06-18 Compuserve Incorporated Cooling device for electronic components arranged in a vertical series and vertical series of electronic devices containing same
BE1009410A3 (en) * 1995-06-14 1997-03-04 B C A Sa Device heat transport.
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
US5916259A (en) * 1995-09-20 1999-06-29 Sun Microsystems, Inc. Coaxial waveguide applicator for an electromagnetic wave-activated sorption system
US5673029A (en) 1996-02-15 1997-09-30 Orbitron Computer System, Inc. Apparatus for cooling a memory storage device
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6118654A (en) * 1997-04-22 2000-09-12 Intel Corporation Heat exchanger for a portable computing device and docking station
EP0898220B1 (en) * 1997-08-19 2003-01-15 Hewlett-Packard Company, A Delaware Corporation Electronic apparatus with improved heatsink arrangement
TW331586B (en) * 1997-08-22 1998-05-11 Biing-Jiun Hwang Network-type heat pipe device
US5924482A (en) * 1997-10-29 1999-07-20 Motorola, Inc. Multi-mode, two-phase cooling module
US6021049A (en) 1998-03-05 2000-02-01 International Business Machines Corporation PCI and ISA adapter card guide pincher
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
US6141211A (en) * 1998-06-29 2000-10-31 Hewlett-Packard Company Heat sink conduction between disk drive carrier and information storage enclosure
JP2000124374A (en) * 1998-10-21 2000-04-28 Furukawa Electric Co Ltd:The Plate type heat pipe and cooling structure using it
US6115251A (en) 1999-04-15 2000-09-05 Hewlett Packard Company Cooling apparatus for computer subsystem
US6473297B1 (en) 1999-04-23 2002-10-29 Inclose Design, Inc. Memory storage device docking adapted having a laterally mounted fan
US6237223B1 (en) * 1999-05-06 2001-05-29 Chip Coolers, Inc. Method of forming a phase change heat sink
US6209625B1 (en) * 1999-06-14 2001-04-03 Zhen Guo Heat pipe with hydrogen getter
US6366461B1 (en) * 1999-09-29 2002-04-02 Silicon Graphics, Inc. System and method for cooling electronic components
US6149007A (en) * 1999-10-27 2000-11-21 Inteplast Group, Ltd. Central handled co-extruded stiff polyethylene bag stack and method of making same
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6337794B1 (en) 2000-02-11 2002-01-08 International Business Machines Corporation Isothermal heat sink with tiered cooling channels
ATE319972T1 (en) * 2000-06-30 2006-03-15 Swales Aerospace PHASE CONTROL IN A CAPILLARY EVAPORATOR
US6317322B1 (en) * 2000-08-15 2001-11-13 The Furukawa Electric Co., Ltd. Plate type heat pipe and a cooling system using same
US6496364B1 (en) * 2001-01-12 2002-12-17 Crystal Group Inc. Upgradeable system and method for connecting a 1U personal computer
US6504719B2 (en) * 2001-03-30 2003-01-07 Intel Corporation Computer system that can be operated without a cooling fan
JP3686005B2 (en) * 2001-03-30 2005-08-24 山洋電気株式会社 Cooling device with heat sink
US6351381B1 (en) 2001-06-20 2002-02-26 Thermal Corp. Heat management system
US6536510B2 (en) * 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6388882B1 (en) * 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
FR2829746B1 (en) * 2001-09-18 2003-12-19 Cit Alcatel HEAT TRANSFER DEVICE
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6693797B2 (en) * 2002-01-04 2004-02-17 Intel Corporation Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another
US6643132B2 (en) * 2002-01-04 2003-11-04 Intel Corporation Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
US6836407B2 (en) * 2002-01-04 2004-12-28 Intel Corporation Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
US6690575B1 (en) * 2002-02-14 2004-02-10 Mercury Computer Systems, Inc. Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies
US6804117B2 (en) * 2002-08-14 2004-10-12 Thermal Corp. Thermal bus for electronics systems

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2190737A (en) * 1986-05-19 1987-11-25 Grumman Aerospace Corp Heat transfer panel
US4890668A (en) * 1987-06-03 1990-01-02 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
JPH0961074A (en) * 1995-08-25 1997-03-07 Akutoronikusu Kk Closed temperature control system
US5725049A (en) * 1995-10-31 1998-03-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary pumped loop body heat exchanger
US5761037A (en) * 1996-02-12 1998-06-02 International Business Machines Corporation Orientation independent evaporator
US6227286B1 (en) * 1997-02-24 2001-05-08 Fujitsu Limited Heat sink and information processor using heat sink
US5940270A (en) * 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
JP2001196778A (en) * 1999-11-08 2001-07-19 Samsung Electronics Co Ltd Cooling device by CPL
US6257323B1 (en) * 2000-06-12 2001-07-10 Ching-Sung Kuo Heat dissipating device
FR2813662A1 (en) * 2000-09-05 2002-03-08 Astrium Sas Capillary evaporator, for thermal transfer loop, comprises a housing made of material with low thermal conductivity

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 24 11 May 2001 (2001-05-11) *

Also Published As

Publication number Publication date
US20030051859A1 (en) 2003-03-20
EP1574800A3 (en) 2006-05-10
US20040050533A1 (en) 2004-03-18
EP1559982A2 (en) 2005-08-03
CN100568496C (en) 2009-12-09
WO2003025475A2 (en) 2003-03-27
EP1427971B1 (en) 2006-04-12
CN101093818A (en) 2007-12-26
EP1559982A3 (en) 2006-04-26
ATE433089T1 (en) 2009-06-15
US7770630B2 (en) 2010-08-10
US6776221B2 (en) 2004-08-17
EP1427971A2 (en) 2004-06-16
DE60232555D1 (en) 2009-07-16
AU2002323548A1 (en) 2003-04-01
CN1556911A (en) 2004-12-22
ATE323266T1 (en) 2006-04-15
DE60210640T2 (en) 2007-04-05
US6981543B2 (en) 2006-01-03
DE60210640D1 (en) 2006-05-24
US20040040695A1 (en) 2004-03-04
EP1574800B1 (en) 2009-06-03
EP1574800A2 (en) 2005-09-14
US20030051860A1 (en) 2003-03-20
CN100368757C (en) 2008-02-13

Similar Documents

Publication Publication Date Title
WO2003025475A3 (en) Modular capillary pumped loop cooling system
US6615912B2 (en) Porous vapor valve for improved loop thermosiphon performance
FR2829746B1 (en) HEAT TRANSFER DEVICE
KR100442888B1 (en) Apparatus for dense chip packaging using heat pipes and thermoelectric coolers
US4602679A (en) Capillary-pumped heat transfer panel and system
US4685512A (en) Capillary-pumped heat transfer panel and system
US6990816B1 (en) Hybrid capillary cooling apparatus
US5412535A (en) Apparatus and method for cooling electronic devices
SE9500944D0 (en) Cooling system for electronics
US6490160B2 (en) Vapor chamber with integrated pin array
US4951740A (en) Bellows heat pipe for thermal control of electronic components
EP0529837B1 (en) Method and apparatus for cooling multi-chip modules using integral heatpipe technology
AU2002245046A1 (en) Thermally enhanced microcircuit package and method of forming same
JPH0727999B2 (en) Integrated heat pipe module
EP1383369A3 (en) Thermosiphon for electronics cooling with high performance boiling and condensing surfaces
JP2000513504A (en) Heat removal device in chip module on multi-layer ceramic support, especially in multi-chip module
US7882889B2 (en) Loop type heat dissipating apparatus with sprayer
US7843693B2 (en) Method and system for removing heat
EP0806620A3 (en) Capillary evaporator
US5259447A (en) Heat transport system
JP4178855B2 (en) COOLING DEVICE, ELECTRIC DEVICE, AND COOLING DEVICE MANUFACTURING METHOD
WO2002050488A1 (en) Horizontal two-phase loop thermosyphon with capillary structures
WO1997008483A3 (en) Heat pipe
GB2190737A (en) Heat transfer panel
RU2052884C1 (en) Radio electronic device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ OM PH PL PT RU SD SE SG SI SK SL TJ TM TN TR TZ UA UG UZ VN YU ZA ZM

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE BG CH CY CZ DK EE ES FI FR GB GR IE IT LU MC PT SE SK TR BF BJ CF CG CI GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2002757536

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 20028185617

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2002757536

Country of ref document: EP

WWG Wipo information: grant in national office

Ref document number: 2002757536

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP