WO2003029355A1 - Curable compositions, sealing material, and adhesive - Google Patents

Curable compositions, sealing material, and adhesive Download PDF

Info

Publication number
WO2003029355A1
WO2003029355A1 PCT/JP2002/009892 JP0209892W WO03029355A1 WO 2003029355 A1 WO2003029355 A1 WO 2003029355A1 JP 0209892 W JP0209892 W JP 0209892W WO 03029355 A1 WO03029355 A1 WO 03029355A1
Authority
WO
WIPO (PCT)
Prior art keywords
phyllosilicate
curable compositions
weatherability
adhesive
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/009892
Other languages
English (en)
French (fr)
Inventor
Akihiko Bandou
Masaya Kobayashi
Yukihiko Murayama
Takuto Ikeuchi
Tetsuya Kusano
Hideyuki Takahashi
Kouji Yamauchi
Takahiro Futamura
Satoshi Kusuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to US10/490,618 priority Critical patent/US7135518B2/en
Priority to EP02768074A priority patent/EP1457527B1/en
Publication of WO2003029355A1 publication Critical patent/WO2003029355A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1021—Polyurethanes or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09D201/10—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1012—Sulfur-containing polymers, e.g. polysulfides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0243—Silica-rich compounds, e.g. silicates, cement, glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0243—Silica-rich compounds, e.g. silicates, cement, glass
    • C09K2200/0252—Clays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09K2200/0625—Polyacrylic esters or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647—Polyepoxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0657—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/068—Containing also other elements than carbon, oxygen or nitrogen in the polymer main chain
    • C09K2200/0682—Containing sulfur

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2002/009892 2001-09-27 2002-09-25 Curable compositions, sealing material, and adhesive Ceased WO2003029355A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/490,618 US7135518B2 (en) 2001-09-27 2002-09-25 Curable compositions, sealing material, and adhesive
EP02768074A EP1457527B1 (en) 2001-09-27 2002-09-25 Curable composition, sealing material, and adhesive

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2001298034 2001-09-27
JP2001-298034 2001-09-27
JP2002-60811 2002-03-06
JP2002060811 2002-03-06
JP2002-165999 2002-06-06
JP2002165999 2002-06-06

Publications (1)

Publication Number Publication Date
WO2003029355A1 true WO2003029355A1 (en) 2003-04-10

Family

ID=27347594

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009892 Ceased WO2003029355A1 (en) 2001-09-27 2002-09-25 Curable compositions, sealing material, and adhesive

Country Status (3)

Country Link
US (1) US7135518B2 (ja)
EP (1) EP1457527B1 (ja)
WO (1) WO2003029355A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005007751A1 (ja) * 2003-07-18 2005-01-27 Konishi Co., Ltd. 硬化性樹脂組成物及び常温硬化接着剤
EP1550704A1 (en) * 2003-12-24 2005-07-06 Rohm and Haas Electronic Materials, L.L.C. Improved adhesive
EP1650261A4 (en) * 2003-07-18 2008-02-27 Kaneka Corp HARDENING COMPOSITION
CN102533194A (zh) * 2012-02-21 2012-07-04 广州秀珀化工股份有限公司 一种风力发电叶片的层状硅酸盐插层复合胶粘剂及其制备方法
CN110819298A (zh) * 2019-07-24 2020-02-21 天永诚高分子材料（常州）有限公司 一种有机硅灌封胶及其制备方法
JPWO2019216358A1 (ja) * 2018-05-08 2021-05-27 積水フーラー株式会社 合成樹脂組成物、耐火材料、シーリング材、接着剤及び目地構造

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001311056A (ja) * 2000-04-28 2001-11-09 Kanegafuchi Chem Ind Co Ltd 被着体の接着方法
US7364782B2 (en) 2000-07-24 2008-04-29 High Voltage Graphics, Inc. Flocked transfer and article of manufacture including the application of the transfer by thermoplastic polymer film
US8354050B2 (en) 2000-07-24 2013-01-15 High Voltage Graphics, Inc. Co-molded direct flock and flock transfer and methods of making same
CN100404613C (zh) * 2003-07-08 2008-07-23 株式会社钟化 固化性组合物
US7465485B2 (en) 2003-12-23 2008-12-16 High Voltage Graphics, Inc. Process for dimensionalizing flocked articles or wear, wash and abrasion resistant flocked articles
WO2005095492A1 (ja) * 2004-03-30 2005-10-13 Kaneka Corporation 硬化性組成物
JP2006265502A (ja) * 2005-03-25 2006-10-05 Fuji Xerox Co Ltd 光重合性組成物及び難燃性樹脂成形品
WO2006116706A2 (en) 2005-04-28 2006-11-02 High Voltage Graphics, Inc. Flocked multi-colored adhesive article with bright lustered flock and methods for making the same
WO2007016341A2 (en) 2005-07-28 2007-02-08 High Voltage Graphics, Inc. Flocked articles incorporating a porous film
WO2007016655A2 (en) * 2005-08-01 2007-02-08 High Voltage Graphics, Inc. Process for heat setting polyester fibers for sublimation printing
WO2007035809A2 (en) 2005-09-20 2007-03-29 High Voltage Graphics, Inc. Flocked elastomeric articles
US20070069882A1 (en) * 2005-09-27 2007-03-29 Kamal Mahajan Intelligent exit sign
US20070173597A1 (en) * 2006-01-20 2007-07-26 Williams David A Sealant composition containing inorganic-organic nanocomposite filler
US7687121B2 (en) 2006-01-20 2010-03-30 Momentive Performance Materials Inc. Insulated glass unit with sealant composition having reduced permeability to gas
US8206800B2 (en) 2006-11-02 2012-06-26 Louis Brown Abrams Flocked adhesive article having multi-component adhesive film
JP5139713B2 (ja) * 2006-11-10 2013-02-06 日東電工株式会社 色素増感型太陽電池
WO2008076934A2 (en) * 2006-12-15 2008-06-26 High Voltage Graphics, Inc. Flocked slurried thermosetting adhesive article
WO2008101115A1 (en) 2007-02-14 2008-08-21 High Voltage Graphics, Inc. Sublimation dye printed textile
JP5049620B2 (ja) * 2007-03-20 2012-10-17 リンテック株式会社 粘着シート
KR101454183B1 (ko) * 2007-11-12 2014-10-27 린텍 코포레이션 점착 시트
US8193293B2 (en) * 2008-03-17 2012-06-05 Ppg Industries Ohio, Inc. Low temperature curable coating compositions and related methods
JP5160951B2 (ja) * 2008-04-30 2013-03-13 日東電工株式会社 色素増感型太陽電池
WO2010019802A1 (en) 2008-08-15 2010-02-18 Gesturetek, Inc. Enhanced multi-touch detection
EP2199351A1 (de) 2008-12-19 2010-06-23 Sika Technology AG Flüssigfolie auf Basis von silanterminierten Polymeren
WO2011112936A1 (en) 2010-03-12 2011-09-15 High Voltage Graphics, Inc. Flocked articles having a resistance to splitting and methods for making the same
DE102010002808B4 (de) * 2010-03-12 2019-02-21 Henkel Ag & Co. Kgaa Härtbare Zusammensetzungen auf Basis Silan-modifizierter Polymere und ihre Verwendung als Fliesenkleber
US9180728B2 (en) 2010-06-18 2015-11-10 High Voltage Graphics, Inc. Dimensional, patterned heat applied applique or transfer made from knit textile
JP2012028113A (ja) * 2010-07-22 2012-02-09 Nitto Denko Corp 色素増感型太陽電池
US10370322B2 (en) 2011-02-15 2019-08-06 3M Innovative Properties Company Addition-fragmentation agents
US20120208965A1 (en) * 2011-02-15 2012-08-16 3M Innovative Properties Company Addition-fragmentation agents
DE102011077200A1 (de) 2011-06-08 2012-12-13 Bayer Materialscience Aktiengesellschaft Klebstoffe
JP5158240B2 (ja) * 2011-07-27 2013-03-06 横浜ゴム株式会社 複層ガラス用二次シーリング材組成物及びそれを用いた複層ガラス
EP2890751A2 (en) * 2012-08-31 2015-07-08 Bostik Sa Dual action adhesive composition
JP2016502470A (ja) 2012-10-12 2016-01-28 ハイ ボルテイジ グラフィックス インコーポレイテッドＨｉｇｈ Ｖｏｌｔａｇｅ Ｇｒａｐｈｉｃｓ，Ｉｎｃ． 熱融着可能な可撓性の装飾品およびそれを製造する方法
DE102013213655A1 (de) * 2013-07-12 2015-01-15 Evonik Industries Ag Härtbare Silylgruppen enthaltende Zusammensetzungen mit verbesserter Lagerstabilität
DE102013216787A1 (de) 2013-08-23 2015-02-26 Evonik Degussa Gmbh Guanidingruppen aufweisende semi-organische Siliciumgruppen enthaltende Verbindungen
CN103436218B (zh) * 2013-09-05 2014-10-08 湖州吉昌丝绸有限公司 一种改进的纺织机械修补胶
EP3034548A1 (en) * 2014-12-18 2016-06-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate
WO2021030259A1 (en) * 2019-08-09 2021-02-18 Delstar Technologies, Inc. Low trauma wound dressings and adhesives for same
WO2022013332A1 (en) * 2020-07-16 2022-01-20 Omya International Ag Reinforced fluoropolymer
CN112795348A (zh) * 2021-01-20 2021-05-14 山东万达有机硅新材料有限公司 一种ms密封胶及其制备方法

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JPH06234887A (ja) * 1993-02-09 1994-08-23 Mitsubishi Petrochem Co Ltd 熱可塑性樹脂組成物
JP2001342201A (ja) * 2000-05-31 2001-12-11 Dainippon Ink & Chem Inc 樹脂エマルジョンの製造法、塗料組成物および塗装方法

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JP2789705B2 (ja) 1989-09-06 1998-08-20 東洋紡績株式会社 被覆プラスチックフィルム
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US5760106A (en) * 1995-07-05 1998-06-02 Board Of Trustees Operating Michigan State University Sealant method of epoxy resin-clay composites
CN1297470A (zh) * 1998-02-20 2001-05-30 范蒂科股份公司 亲有机物的页硅酸盐

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JPH06234887A (ja) * 1993-02-09 1994-08-23 Mitsubishi Petrochem Co Ltd 熱可塑性樹脂組成物
JP2001342201A (ja) * 2000-05-31 2001-12-11 Dainippon Ink & Chem Inc 樹脂エマルジョンの製造法、塗料組成物および塗装方法

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See also references of EP1457527A4 *

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005007751A1 (ja) * 2003-07-18 2005-01-27 Konishi Co., Ltd. 硬化性樹脂組成物及び常温硬化接着剤
KR100720816B1 (ko) * 2003-07-18 2007-05-21 고니시 가부시키가이샤 경화성 수지 조성물 및 상온 경화 접착제
EP1650261A4 (en) * 2003-07-18 2008-02-27 Kaneka Corp HARDENING COMPOSITION
US7576167B2 (en) 2003-07-18 2009-08-18 Konishi Co., Ltd. Curable resin composition
CN100590149C (zh) * 2003-07-18 2010-02-17 小西株式会社 固化性树脂组合物及常温固化性粘结剂
US8110645B2 (en) 2003-07-18 2012-02-07 Konishi Co., Ltd. Curable resin composition
EP1550704A1 (en) * 2003-12-24 2005-07-06 Rohm and Haas Electronic Materials, L.L.C. Improved adhesive
CN102533194A (zh) * 2012-02-21 2012-07-04 广州秀珀化工股份有限公司 一种风力发电叶片的层状硅酸盐插层复合胶粘剂及其制备方法
JPWO2019216358A1 (ja) * 2018-05-08 2021-05-27 積水フーラー株式会社 合成樹脂組成物、耐火材料、シーリング材、接着剤及び目地構造
JP7429972B2 (ja) 2018-05-08 2024-02-09 積水フーラー株式会社 合成樹脂組成物、耐火材料、シーリング材、接着剤及び目地構造
CN110819298A (zh) * 2019-07-24 2020-02-21 天永诚高分子材料（常州）有限公司 一种有机硅灌封胶及其制备方法
CN110819298B (zh) * 2019-07-24 2021-11-30 天永诚高分子材料（常州）有限公司 一种有机硅灌封胶及其制备方法

Also Published As

Publication number Publication date
EP1457527A4 (en) 2004-11-10
US7135518B2 (en) 2006-11-14
EP1457527B1 (en) 2013-03-27
EP1457527A1 (en) 2004-09-15
US20050261412A1 (en) 2005-11-24

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