WO2003058613A1 - Procede de fabrication d'une matrice de pressage pour support d'informations, matrice de pressage et disque original photosensible - Google Patents
Procede de fabrication d'une matrice de pressage pour support d'informations, matrice de pressage et disque original photosensible Download PDFInfo
- Publication number
- WO2003058613A1 WO2003058613A1 PCT/JP2002/013876 JP0213876W WO03058613A1 WO 2003058613 A1 WO2003058613 A1 WO 2003058613A1 JP 0213876 W JP0213876 W JP 0213876W WO 03058613 A1 WO03058613 A1 WO 03058613A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- stamper
- pattern
- convex pattern
- forming
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
- G11B7/261—Preparing a master, e.g. exposing photoresist, electroforming
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
- G11B7/263—Preparing and using a stamper, e.g. pressing or injection molding substrates
Definitions
- stamper for manufacturing information medium, stamper and photoresist master
- the present invention relates to a stamper used for manufacturing an information medium having a concavo-convex pattern such as a group or a prepit, a photoresist master for manufacturing the stamper, a method for manufacturing a stamper using the photoresist master, and information manufactured by the stamper.
- a stamper used for manufacturing an information medium having a concavo-convex pattern such as a group or a prepit
- a photoresist master for manufacturing the stamper
- a method for manufacturing a stamper using the photoresist master and information manufactured by the stamper.
- optical discs as information media, an optical recording disc that can be written on or rewritten, and a read-only disc on which information is recorded in advance.
- a groove (guide groove) used for tracking or the like is formed on a disk substrate of the optical recording disk, and a recording layer containing a phase change material or an organic dye material is further laminated on the disk substrate.
- the recording layer is irradiated with the laser beam, the recording layer undergoes a chemical or physical change to form a recording mark.
- recording marks are formed in advance on a disk substrate of a read-only disk as a part of a concavo-convex pattern.
- these recording marks are irradiated with a reading laser beam, the amount of light reflection fluctuates. By detecting this fluctuation, information can be read (reproduced).
- a stamper in which a negative concavo-convex pattern (also a type of concavo-convex pattern) is formed in advance is used.
- a method is generally used in which injection molding is performed using a mold in which the stamper is fixed in a cavity, and the negative pattern is transferred to the filled resin to produce a disk substrate.
- a stamper having a concavo-convex pattern is usually constituted by a metal plate containing Ni or the like.
- a photoresist master having a negative pattern of the concave and convex pattern of the stamper is prepared in advance, and a metal film is formed on the photoresist master by plating. Thereafter, the metal film is peeled from the photolithographic master, and a predetermined process such as surface cleaning is performed to obtain a stamper.
- the manufacturing process of the photoresist master 1 will be described with reference to the conventional photoresist master 1 shown in FIG.
- a photoresist layer 4 is formed on a glass substrate 2.
- the photoresist layer 4 is exposed to light using a patterning beam such as a laser, and the latent image pattern is developed.
- the photoresist master 1 having the uneven pattern 6 formed on the photoresist layer 4 is obtained.
- a metal thin film 8 containing a Ni material or the like is formed on the surface of the uneven pattern 6 by electroless plating or the like. It is formed to impart conductivity to the photoresist master 1.
- the metal thin film 8 is used as a base to conduct electricity to perform plating, thereby forming a metal film 10 containing Ni or the like.
- the stamper 20 By peeling off the metal thin film 8 and the metal film 10 from the photoresist master 1, it is possible to obtain the stamper 20 on which the concavo-convex pattern 6 is transferred.
- the minimum width of the latent image pattern formed on the photoresist layer 4 is limited by the spot diameter of the laser beam reaching the photoresist layer 4.
- k is a constant determined by the aperture shape of the objective lens and the intensity distribution of the incident light beam.
- the concavo-convex pattern transferred to the stamper is shallow or the shape of the concavo-convex pattern is rounded.
- the sharpness is insufficient due to squatting (this is called “sagging” of the pattern).
- This is generally considered to be due to a change in the thickness of the photoresist layer 4 during the exposure and development work (this is referred to as “film reduction”). It has been considered that this thickness variation is caused by the fact that the laser beam is reflected between the photoresist layer 4 and the glass substrate 2, and the reflected light exposes the photoresist layer 4 more than necessary. Disclosure of the invention
- the present invention has been made in view of the above problems, and is directed to a method of manufacturing a photoresist master, capable of sharply forming a pattern having a width smaller than the spot diameter of a laser beam, a photoresist master, and a stamper manufactured using the same. It is intended to provide
- the inventors of the present invention have conducted intensive studies on a method of manufacturing an information medium such as an optical recording medium and a magnetic disk (discrete medium), and have devised a method of forming a concavo-convex pattern on a stamper in a sharp manner. That is, the following objects can be achieved by the following inventions.
- At least a light absorption layer and a photoresist layer are formed in this order on a substrate, and the photoresist layer is irradiated with light from a surface opposite to a surface in contact with the light absorption layer to form a latent image.
- Forming a photoresist master by forming a concavo-convex pattern by developing the latent image; forming a metal thin film on the concavo-convex pattern in the photoresist master; and forming a metal thin film on the metal thin film. A film is formed, and the metal thin film and the metal film are peeled from the photoresist master.
- Manufacturing a stamper for manufacturing an information medium comprising a step of applying Pd to the surface of the concave / convex pattern as a pretreatment before the step of forming the stamper and the step of forming the metal thin film on the photoresist layer.
- a photoresist master wherein Pd is provided on the surface of the uneven pattern formed on the photoresist layer.
- the amount Y of Pd applied to the mirror surface which is the area where the concavo-convex pattern is not formed, is 0.9X ⁇ Y ⁇ 1.IX.
- At least a light absorbing layer and a photoresist layer are formed in this order on a substrate, and the photoresist layer is irradiated with light from a surface opposite to a surface in contact with the light absorbing layer to form a latent image.
- Forming a concave / convex pattern by developing the latent image to produce a photoresist master; forming a metal thin film on the concave / convex pattern in the photoresist master; Forming a stamper by forming a metal film on the metal film and peeling the metal thin film and the metal film from the photoresist master; and forming the metal thin film on the photoresist layer as the pretreatment.
- the final concavo-convex pattern is formed by transferring a concavo-convex pattern of a child board, and the concavo-convex pattern of the child board is transferred by using the stamper as a master board.
- the stamper has a final concavo-convex pattern formed by transferring a concavo-convex pattern from a mother board formed by transferring a concavo-convex pattern using the stamper as a master board.
- the final concavo-convex pattern is formed by transferring a concavo-convex pattern of a child board, and the concavo-convex pattern of the child board is transferred by using the stamper as a master board.
- the present inventor has confirmed that a sharp uneven pattern can be formed on a stamper by using a light absorption layer and further adding Pd to a photoresist master. This is presumably because the compatibility of Pd in the light absorbing layer is very close to the compatibility of Pd in the photoresist layer, and such Pd itself is uniformly applied to the surface of the photoresist master. As a result, it is possible to accurately reproduce a concave / convex pattern that is sharply exposed due to the characteristics of the light absorbing layer on a metal thin film formed by electroless plating.
- the information medium for example, the group of the optical recording medium and the information pits are also formed in a sharp manner, so that the recording and reproducing characteristics can be improved.
- the information storage (recording) capacity of the information medium can be increased.
- FIG. 1 is a sectional view showing a photoresist master according to an embodiment of the present invention.
- FIG. 2 (A) is a cross-sectional view showing a state where a stamper is being manufactured using the same photoresist master.
- FIG. 2 (B) is a cross-sectional view showing the manufactured stamper.
- FIG. 3 (A) shows an uneven pattern formed on a stamper according to an embodiment of the present invention.
- FIG. 3 is a diagram showing a state analyzed by AFM.
- FIG. 3 (B) is a diagram showing a cross-sectional shape of the concavo-convex pattern based on the AFM analysis.
- FIG. 4 (A) is a diagram showing a state in which a concavo-convex pattern formed on a stamper according to a comparative example of the present invention has been analyzed by AFM.
- FIG. 4 (B) is a diagram showing a cross-sectional shape of the concavo-convex pattern based on the AFM analysis.
- FIG. 5 is a sectional view showing a conventional photoresist master.
- FIG. 6 is a cross-sectional view showing a state where a stamper is manufactured using a conventional photoresist master.
- FIG. 1 shows a photoresist master 100 according to an embodiment of the present invention.
- the photoresist master 100 includes a glass substrate 102, a light absorbing layer 103 laminated on the glass substrate 102, and a photoresist layer 104 laminated on the light absorbing layer 103.
- the photoresist layer 104 is exposed to a laser beam for patterning from the opposite side (the upper side in FIG. 1) of the light absorbing layer 103 to form a latent image of a concavo-convex pattern, and a part of the latent image is developed by developing the latent image.
- the concave / convex pattern 106 is formed by the removal.
- Reference numeral 107 in FIG. 1 denotes a non-concavo-convex area where no concavo-convex pattern is formed.
- the concave / convex pattern 106 becomes the pattern surface 206 of the stamper 120.
- a region where the concave / convex pattern is not formed becomes the mirror surface 207 of the stamper 120.
- the patterning beam is absorbed by the light absorbing layer 103, whereby light reflection is suppressed, and fine irregularities can be sharply formed.
- Pd (106 A) is provided on the surface of the concavo-convex pattern 106 in the photoresist master 100. Specifically, the catalyst (Pd—Sn compound) is adsorbed on the surface of the concavo-convex pattern 106, and Pd is deposited on the concavo-convex pattern 106 surface by removing only Sn from the catalyst using an accelerator. Let it. In FIG. 1, the applied state of Pd (106A) is schematically shown in the form of a film, but does not represent the actual applied state.
- the amount of Pd provided in the uneven pattern region 106 and the non-irregular region 107 is different from the amount X of Pd deposited on the pattern surface 206 of the stamper 120 with respect to the mirror surface 207. It is preferable to set the precipitation amount Y of Pd so as to be in the range of 0.9X ⁇ Y ⁇ 1.1 1.
- FIG. 2A shows a state in which a stamper 120 is formed on the photoresist master 100 described above.
- a Ni thin film 108 is formed on the surface of the concavo-convex pattern 106 on which Pd is deposited by an electroless plating.
- the reducing agent in the plating solution emits electrons when oxidized on the Pd surface having catalytic activity, the electrons reduce the Ni ions in the solution, and the thin film 108 becomes uneven. It is adapted to the pattern 106 effectively.
- the Ni thin film 1 08 is formed.
- the surface is energized using the Ni thin film 108 as a base, and the Ni film 110 is formed by electric plating.
- the Ni thin film 108 and Nil! 110 are peeled from the photoresist master 100, a stamper 120 on which the concavo-convex pattern 106 is accurately transferred can be obtained as shown in FIG. 2 (B). .
- the Pd (106A) is attached to the Ni thin film 108 side.
- a pattern surface 206 is formed corresponding to the region of the uneven pattern 106, and a mirror surface 207 is formed corresponding to the non-irregular region 107.
- the stamper 120 is placed in a mold, and an optical disc substrate having a final concave / convex pattern transferred with the concave / convex pattern as a negative pattern by injection molding or the like is manufactured.
- a mother board may be created by an electrical process using the stamper 120 as a master board, and an optical disc may be manufactured using the mother board. .
- a child board may be prepared by using the mother disc as an original disc, and an optical disc may be manufactured using the child disc. That is, the stamper 120 in the present invention is not limited to the case where the stamper 120 is actually used directly for the production of an optical disc, but is used indirectly for the production of an optical disc by creating a mother disc as a master disc. It may be something.
- a clear latent image can be drawn by laminating the light absorbing layer 103, and a sharp uneven pattern 106 can be obtained.
- Pd is preliminarily applied to the concavo-convex pattern 106 as a pretreatment for the electroless plating, it is possible to form an accurate Ni thin film 108 conforming to the shape of the concavo-convex pattern 106. I have.
- the reason why the Ni thin film 108 can be accurately formed is that the compatibility between the light absorbing layer 103 exposed in the concave portions of the concave-convex pattern 106 and Pd is favorable. Is done.
- the sharp concavo-convex pattern 106 can be transferred to the stamper 120 in a sharp state, and as a result, the concavo-convex pattern formed on the stamper 120 can be transferred. "Drip" is suppressed.
- this stamper 120 an optical recording medium with high recording and reading (reproducing) accuracy can be obtained.
- the synergistic effect of Pd addition and the light absorbing layer can be obtained.
- the uneven pattern can be transferred to the stamper in a sharp state.
- the present invention is not limited to this, and other metal plating may be used, or a metal thin film may be formed by a process other than plating. It is also applied when forming.
- the Ni film 110 may be a metal film formed by means other than the electric plating.
- stamper is generally applied to the manufacture of not only optical disks but also information media including, for example, magnetic disks (discrete media and the like).
- a light absorbing layer was formed by spin coating.
- SWK-T5D60 Tokyo Ohka Kogyo Co., Ltd.
- 4.4'-bis (getylamino) benzophenone as a light absorber was used as a coating solution.
- This coating film was baked at 200 ° C. for 15 minutes to be cured, and the residual solvent was removed.
- a light absorbing layer having a thickness of 140 nm was obtained.
- a photoresist DVR100, manufactured by Zeon Corporation
- Stamper No. 2 was produced in the same manner as in the production of stamper No. 1 except that it did not have a light absorbing layer.
- the shape of the concavo-convex pattern formed on each stamper was confirmed using AFM (atomic force microscope).
- the probe of AFM used the silicon nitride (SiN) needle.
- the measurement was performed in the non-contact mode, and the change in the atomic force between the sample and the probe was imaged.
- Fig. 3 (A) shows an AFM image of stamper No. 1
- Fig. 3 (B) shows the same cross-sectional shape diagrammatically
- Fig. 4 (A) shows an AFM image of stamper No2
- Fig. 4 (B) shows the same cross-sectional view as a diagram.
- areas where the density of the dots are high are the depressions in the concavo-convex pattern, and areas where the density of the dots is low or white are the concavities, which correspond to the projections and depressions of the concavo-convex pattern on the photoresist master. are doing.
- the irregularities are formed at 0.32 (1 m pitch).
- the pattern surface and the mirror surface of the stamper No. 1 and the stamper No. 2 were subjected to Pd amount analysis using ESCA (Electron Spectoroscopy for Chemikal Analysis). Table 1 shows the results.
- the Pd amount on the pattern surface is a measured value over a plurality of irregularities because the spot diameter of the ESCA is a size in millimeters.
- stamper No. 1 using the light absorbing layer, the same amount of Pd exists on both the pattern surface and the mirror surface.
- stamper No. 2 the amount of Pd on the pattern surface is much smaller than that on the mirror surface. This is considered to be due to the fact that the glass surface, which is the bottom surface of the concave portion in the concave / convex pattern on the photoresist master side, is exposed in stamper No. 2.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02790950A EP1460626A1 (en) | 2001-12-28 | 2002-12-27 | Method for manufacturing stamper for information medium manufacture, stamper, and photoresist original disk |
| US10/500,008 US20050066825A1 (en) | 2001-12-28 | 2002-12-27 | Method for manufacturing stamper for information medium manufacture, stamper, and photoresist original disk |
| AU2002367345A AU2002367345A1 (en) | 2001-12-28 | 2002-12-27 | Method for manufacturing stamper for information medium manufacture, stamper, and photoresist original disk |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-398994 | 2001-12-28 | ||
| JP2001398994 | 2001-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2003058613A1 true WO2003058613A1 (fr) | 2003-07-17 |
Family
ID=19189414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2002/013876 Ceased WO2003058613A1 (fr) | 2001-12-28 | 2002-12-27 | Procede de fabrication d'une matrice de pressage pour support d'informations, matrice de pressage et disque original photosensible |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20050066825A1 (ja) |
| EP (1) | EP1460626A1 (ja) |
| AU (1) | AU2002367345A1 (ja) |
| TW (1) | TW200301478A (ja) |
| WO (1) | WO2003058613A1 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030078085A (ko) * | 2001-02-27 | 2003-10-04 | 티디케이가부시기가이샤 | 광정보매체용 포토레지스트원반의 제조방법 및광정보매체용 스탬퍼의 제조방법 |
| JP2003085829A (ja) * | 2001-09-06 | 2003-03-20 | Tdk Corp | 光情報媒体用スタンパの製造方法およびこれに用いるフォトレジスト原盤、ならびに、光情報媒体用スタンパおよび光情報媒体 |
| TWI228718B (en) * | 2001-11-05 | 2005-03-01 | Tdk Corp | Manufacturing method and device of mold plate for information medium |
| WO2003046904A1 (fr) * | 2001-11-30 | 2003-06-05 | Tdk Corporation | Procede et dispositif de matriçage et de pressage de supports d'information |
| TWI258142B (en) * | 2002-01-08 | 2006-07-11 | Tdk Corp | Manufacturing method of stamper for manufacturing data medium, the stamper, and the stamper spacer with template |
| JPWO2003077239A1 (ja) * | 2002-03-11 | 2005-07-07 | Tdk株式会社 | フォトレジスト原盤の加工方法、記録媒体用原盤の製造方法、記録媒体の製造方法、フォトレジスト原盤、記録媒体用原盤及び記録媒体 |
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| JPH03180476A (ja) * | 1989-12-08 | 1991-08-06 | Sony Corp | 光ディスクの原盤作成方法 |
| JPH04263140A (ja) * | 1991-02-07 | 1992-09-18 | Ricoh Co Ltd | 無反射コート付きガラス原盤 |
| JPH05214547A (ja) * | 1992-01-31 | 1993-08-24 | Sony Corp | 無電解めっき方法 |
| JPH06215422A (ja) * | 1993-01-14 | 1994-08-05 | Sony Corp | スタンパーの製造方法及びスタンパー |
| JPH08185643A (ja) * | 1994-12-30 | 1996-07-16 | Sony Corp | デイスク原盤作成装置 |
| WO1996032521A1 (fr) * | 1995-04-10 | 1996-10-17 | Kao Corporation | Procede de metallisation au bain chaud, et procede et equipement de production de matrices |
| JPH08273219A (ja) * | 1995-03-30 | 1996-10-18 | Sony Corp | 光ディスクの製造装置 |
| JPH08283950A (ja) * | 1995-04-10 | 1996-10-29 | Kao Corp | 無電解めっき方法及びスタンパーの製造方法 |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3436843B2 (ja) * | 1996-04-25 | 2003-08-18 | 東京応化工業株式会社 | リソグラフィー用下地材及びそれを用いたリソグラフィー用レジスト材料 |
| JP2001357567A (ja) * | 2000-04-14 | 2001-12-26 | Tdk Corp | 光ディスク原盤の製造方法 |
| TWI254306B (en) * | 2002-01-08 | 2006-05-01 | Tdk Corp | Manufacturing method of stamper for manufacturing data medium, the stamper, and the photoresist template |
| TWI264717B (en) * | 2002-01-08 | 2006-10-21 | Tdk Corp | Manufacturing method of stamper for manufacturing data medium, the stamper, and the photoresist template |
| US7074341B1 (en) * | 2002-07-01 | 2006-07-11 | Seagate Technology Llc | Method for protecting surface of stamper/imprinter during manufacture thereof |
-
2002
- 2002-12-27 US US10/500,008 patent/US20050066825A1/en not_active Abandoned
- 2002-12-27 AU AU2002367345A patent/AU2002367345A1/en not_active Abandoned
- 2002-12-27 WO PCT/JP2002/013876 patent/WO2003058613A1/ja not_active Ceased
- 2002-12-27 TW TW091137734A patent/TW200301478A/zh unknown
- 2002-12-27 EP EP02790950A patent/EP1460626A1/en not_active Withdrawn
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03180476A (ja) * | 1989-12-08 | 1991-08-06 | Sony Corp | 光ディスクの原盤作成方法 |
| JPH04263140A (ja) * | 1991-02-07 | 1992-09-18 | Ricoh Co Ltd | 無反射コート付きガラス原盤 |
| JPH05214547A (ja) * | 1992-01-31 | 1993-08-24 | Sony Corp | 無電解めっき方法 |
| JPH06215422A (ja) * | 1993-01-14 | 1994-08-05 | Sony Corp | スタンパーの製造方法及びスタンパー |
| JPH08185643A (ja) * | 1994-12-30 | 1996-07-16 | Sony Corp | デイスク原盤作成装置 |
| JPH08273219A (ja) * | 1995-03-30 | 1996-10-18 | Sony Corp | 光ディスクの製造装置 |
| WO1996032521A1 (fr) * | 1995-04-10 | 1996-10-17 | Kao Corporation | Procede de metallisation au bain chaud, et procede et equipement de production de matrices |
| JPH08283950A (ja) * | 1995-04-10 | 1996-10-29 | Kao Corp | 無電解めっき方法及びスタンパーの製造方法 |
| JPH09109276A (ja) * | 1995-10-17 | 1997-04-28 | Kao Corp | 光ディスク用のスタンパーの製造方法 |
| JP2000280255A (ja) * | 1999-03-31 | 2000-10-10 | Seiko Epson Corp | 原盤の製造方法 |
| JP2001184734A (ja) * | 1999-12-24 | 2001-07-06 | Hitachi Maxell Ltd | 情報記録媒体用基板を製造するための原盤及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200301478A (en) | 2003-07-01 |
| AU2002367345A1 (en) | 2003-07-24 |
| US20050066825A1 (en) | 2005-03-31 |
| EP1460626A1 (en) | 2004-09-22 |
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