WO2003058698A1 - Polishing pad, process for producing the same, and method of polishing - Google Patents

Polishing pad, process for producing the same, and method of polishing Download PDF

Info

Publication number
WO2003058698A1
WO2003058698A1 PCT/JP2002/013709 JP0213709W WO03058698A1 WO 2003058698 A1 WO2003058698 A1 WO 2003058698A1 JP 0213709 W JP0213709 W JP 0213709W WO 03058698 A1 WO03058698 A1 WO 03058698A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
polishing pad
producing
same
nonwoven fabric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/013709
Other languages
English (en)
French (fr)
Inventor
Shoichi Furukawa
Atsushi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Kasei Microdevices Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Corp, Asahi Chemical Industry Co Ltd, Asahi Kasei EMD Corp filed Critical Asahi Kasei Corp
Priority to US10/498,903 priority Critical patent/US20050107007A1/en
Priority to AU2002361109A priority patent/AU2002361109A1/en
Priority to KR10-2004-7010014A priority patent/KR20040066193A/ko
Priority to EP02792026A priority patent/EP1467403A1/en
Priority to JP2003558914A priority patent/JPWO2003058698A1/ja
Publication of WO2003058698A1 publication Critical patent/WO2003058698A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
PCT/JP2002/013709 2001-12-28 2002-12-26 Polishing pad, process for producing the same, and method of polishing Ceased WO2003058698A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/498,903 US20050107007A1 (en) 2001-12-28 2002-12-26 Polishing pad process for producing the same and method of polishing
AU2002361109A AU2002361109A1 (en) 2001-12-28 2002-12-26 Polishing pad, process for producing the same, and method of polishing
KR10-2004-7010014A KR20040066193A (ko) 2001-12-28 2002-12-26 연마패드, 그의 제조방법 및 연마방법
EP02792026A EP1467403A1 (en) 2001-12-28 2002-12-26 Polishing pad, process for producing the same, and method of polishing
JP2003558914A JPWO2003058698A1 (ja) 2001-12-28 2002-12-26 研磨パッド、その製法及び研磨方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-400250 2001-12-28
JP2001400250 2001-12-28

Publications (1)

Publication Number Publication Date
WO2003058698A1 true WO2003058698A1 (en) 2003-07-17

Family

ID=19189589

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/013709 Ceased WO2003058698A1 (en) 2001-12-28 2002-12-26 Polishing pad, process for producing the same, and method of polishing

Country Status (8)

Country Link
US (1) US20050107007A1 (ja)
EP (1) EP1467403A1 (ja)
JP (1) JPWO2003058698A1 (ja)
KR (1) KR20040066193A (ja)
CN (1) CN1610962A (ja)
AU (1) AU2002361109A1 (ja)
TW (1) TWI225813B (ja)
WO (1) WO2003058698A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005177934A (ja) * 2003-12-19 2005-07-07 Toyo Tire & Rubber Co Ltd Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法
CN104039506A (zh) * 2011-09-30 2014-09-10 Hoya株式会社 抛光垫以及使用该抛光垫的玻璃基板的制造方法
CN111805413A (zh) * 2020-07-23 2020-10-23 中国科学院微电子研究所 化学机械研磨方法
CN112658948A (zh) * 2020-12-17 2021-04-16 庆安集团有限公司 一种对金属内凹型面进行抛光的抛光装置和方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6863774B2 (en) * 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US20050153634A1 (en) * 2004-01-09 2005-07-14 Cabot Microelectronics Corporation Negative poisson's ratio material-containing CMP polishing pad
US20070111644A1 (en) * 2005-09-27 2007-05-17 Spencer Preston Thick perforated polishing pad and method for making same
FR2896179B1 (fr) * 2006-01-17 2009-08-07 Gekatex Soc Par Actions Simpli Utilisation d'un systeme tridimensionnel a structure souple.
TWI409136B (zh) * 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊
WO2008093850A1 (ja) * 2007-02-01 2008-08-07 Kuraray Co., Ltd. 研磨パッド及び研磨パッドの製造方法
TWI465315B (zh) * 2008-11-12 2014-12-21 Bestac Advanced Material Co Ltd 可導電之拋光墊及其製造方法
KR20120112476A (ko) * 2009-12-22 2012-10-11 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 이를 이용한 화학 기계 연마 방법
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
KR102100654B1 (ko) * 2012-04-02 2020-04-14 토마스 웨스트 인코포레이티드 폴리머 연마패드의 원심주조를 위한 방법 및 시스템 및 상기 방법으로 만들어진 연마패드
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
CN103753382B (zh) * 2014-01-06 2016-04-27 成都时代立夫科技有限公司 一种抛光垫及其制备方法
KR101600393B1 (ko) * 2015-05-20 2016-03-07 에프엔에스테크 주식회사 연마 패드 및 이의 제조 방법
CN106826540A (zh) * 2017-02-15 2017-06-13 蓝思科技（长沙）有限公司 一种光固型树脂研磨垫及其制备方法
TWI748192B (zh) * 2019-06-04 2021-12-01 中國砂輪企業股份有限公司 具有纖維研磨層的化學機械研磨拋光墊修整器及製作方法
US12220784B2 (en) 2021-10-13 2025-02-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof
US11679531B2 (en) 2021-10-13 2023-06-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and preparation thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0451944A2 (en) * 1990-03-29 1991-10-16 Minnesota Mining And Manufacturing Company Nonwoven surface finishing articles reinforced with a polymer backing layer and method of making same
JPH1190836A (ja) * 1997-09-16 1999-04-06 Kanebo Ltd 研磨布
JP2000301449A (ja) * 1999-04-16 2000-10-31 Okamoto Machine Tool Works Ltd ウエハ研磨用パッド

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US6036579A (en) * 1997-01-13 2000-03-14 Rodel Inc. Polymeric polishing pad having photolithographically induced surface patterns(s) and methods relating thereto
US5965460A (en) * 1997-01-29 1999-10-12 Mac Dermid, Incorporated Polyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing pads

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0451944A2 (en) * 1990-03-29 1991-10-16 Minnesota Mining And Manufacturing Company Nonwoven surface finishing articles reinforced with a polymer backing layer and method of making same
JPH1190836A (ja) * 1997-09-16 1999-04-06 Kanebo Ltd 研磨布
JP2000301449A (ja) * 1999-04-16 2000-10-31 Okamoto Machine Tool Works Ltd ウエハ研磨用パッド

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005177934A (ja) * 2003-12-19 2005-07-07 Toyo Tire & Rubber Co Ltd Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法
CN104039506A (zh) * 2011-09-30 2014-09-10 Hoya株式会社 抛光垫以及使用该抛光垫的玻璃基板的制造方法
CN104039506B (zh) * 2011-09-30 2016-09-21 Hoya株式会社 抛光垫以及使用该抛光垫的玻璃基板的制造方法
CN111805413A (zh) * 2020-07-23 2020-10-23 中国科学院微电子研究所 化学机械研磨方法
CN112658948A (zh) * 2020-12-17 2021-04-16 庆安集团有限公司 一种对金属内凹型面进行抛光的抛光装置和方法

Also Published As

Publication number Publication date
AU2002361109A1 (en) 2003-07-24
JPWO2003058698A1 (ja) 2005-05-19
US20050107007A1 (en) 2005-05-19
CN1610962A (zh) 2005-04-27
TW200302151A (en) 2003-08-01
KR20040066193A (ko) 2004-07-23
EP1467403A1 (en) 2004-10-13
TWI225813B (en) 2005-01-01

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