WO2003081637A3 - Leitungsüberführung für einen halbleiter-detektor - Google Patents

Leitungsüberführung für einen halbleiter-detektor Download PDF

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Publication number
WO2003081637A3
WO2003081637A3 PCT/EP2003/003209 EP0303209W WO03081637A3 WO 2003081637 A3 WO2003081637 A3 WO 2003081637A3 EP 0303209 W EP0303209 W EP 0303209W WO 03081637 A3 WO03081637 A3 WO 03081637A3
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WO
WIPO (PCT)
Prior art keywords
conductor
semiconductor
crossover
detector
conductor crossover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2003/003209
Other languages
English (en)
French (fr)
Other versions
WO2003081637A2 (de
Inventor
Lothar Strueder
Gerhard Lutz
Rainer Richter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Max-Planck-Gesellschaft zur Förderung der Wissenschaften eV
Original Assignee
Max-Planck-Gesellschaft zur Förderung der Wissenschaften eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Max-Planck-Gesellschaft zur Förderung der Wissenschaften eV filed Critical Max-Planck-Gesellschaft zur Förderung der Wissenschaften eV
Priority to EP03714890A priority Critical patent/EP1490911B1/de
Priority to DE50310157T priority patent/DE50310157D1/de
Priority to US10/509,320 priority patent/US7238949B2/en
Priority to AU2003219104A priority patent/AU2003219104A1/en
Publication of WO2003081637A2 publication Critical patent/WO2003081637A2/de
Priority to NO20035244A priority patent/NO20035244L/no
Publication of WO2003081637A3 publication Critical patent/WO2003081637A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/29—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to radiation having very short wavelengths, e.g. X-rays, gamma-rays or corpuscular radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/29—Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
    • G01T1/2914—Measurement of spatial distribution of radiation
    • G01T1/2921—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras
    • G01T1/2928—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras using solid state detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
    • H10F77/148—Shapes of potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)
  • Light Receiving Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

Es wird eine Leitungsüberführung für einen Halbleiter-Detektor, insbesondere für einen Driftdetektor zur Röntgenspektroskopie beschrieben, die mindestens zwei in einem Halbleitersubstrat (1) angeordnete dotierte Halbleiterelektroden (2), mindestens eine über die Halbleiterelektroden (2) geführte Anschlussleitung (M) und eine erste Isolationsschicht (Ox) umfasst, wobei zwischen der Anschlussleitung (M) und der ersten Isolationsschicht (Ox) eine Zwischenelektrode (L) angeordnet ist, die den Bereich des Halbleitersubstrats (1) zwischen den Halbleiterelektroden (2) überdeckt und durch mindestens eine weitere Isolationsschicht (I) gegenüber der Anschlussleitung (M) elektrisch isoliert ist. Es werden auch ein mit einer derartigen Leitungsüberführung ausgestatteter Driftdetektor und eine Detektoranordnung zur Röntgenspektroskopie beschrieben.
PCT/EP2003/003209 2002-03-27 2003-03-27 Leitungsüberführung für einen halbleiter-detektor Ceased WO2003081637A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP03714890A EP1490911B1 (de) 2002-03-27 2003-03-27 Leitungsüberführung für einen halbleiter-detektor
DE50310157T DE50310157D1 (de) 2002-03-27 2003-03-27 Leitungsüberführung für einen halbleiter-detektor
US10/509,320 US7238949B2 (en) 2002-03-27 2003-03-27 Conductor crossover for a semiconductor detector
AU2003219104A AU2003219104A1 (en) 2002-03-27 2003-03-27 Conductor crossover for a semiconductor detector
NO20035244A NO20035244L (no) 2002-03-27 2003-11-26 Ledningsovergang for en halvlederdetektor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10213812A DE10213812B4 (de) 2002-03-27 2002-03-27 Leitungsüberführung für einen Halbleiter-Detektor
DE10213812.5 2002-03-27

Publications (2)

Publication Number Publication Date
WO2003081637A2 WO2003081637A2 (de) 2003-10-02
WO2003081637A3 true WO2003081637A3 (de) 2003-12-18

Family

ID=28050925

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/003209 Ceased WO2003081637A2 (de) 2002-03-27 2003-03-27 Leitungsüberführung für einen halbleiter-detektor

Country Status (7)

Country Link
US (1) US7238949B2 (de)
EP (1) EP1490911B1 (de)
AT (1) ATE401668T1 (de)
AU (1) AU2003219104A1 (de)
DE (2) DE10213812B4 (de)
NO (1) NO20035244L (de)
WO (1) WO2003081637A2 (de)

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DE10260229B3 (de) * 2002-12-20 2005-08-18 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Halbleiter-Detektor mit optimiertem Strahlungseintrittsfenster
FI20041479L (fi) * 2004-11-17 2006-05-05 Artto Aurola Muunnettu puolijohdeajautumisilmaisin
US20070072332A1 (en) * 2005-09-26 2007-03-29 Josef Kemmer Semiconductor radiation detectors and method for fabrication thereof
EP1873834B1 (de) 2006-06-29 2008-12-10 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Löschbarriere, insbesondere für einem Halbleiterdetektor, und zugehöriges Betriebsverfahren
GB2446429A (en) * 2006-12-08 2008-08-13 E2V Tech Photosensor with variable sensing area
CN101281148B (zh) * 2007-07-27 2011-01-05 江苏天瑞仪器股份有限公司 一种高分辨率的半导体核辐射探测器
US8932894B2 (en) * 2007-10-09 2015-01-13 The United States of America, as represented by the Secratary of the Navy Methods and systems of curved radiation detector fabrication
US20100264319A1 (en) * 2009-04-17 2010-10-21 Massimo Morichi Intelligent Sensor Platform
US8698091B2 (en) 2009-06-10 2014-04-15 Moxtek, Inc. Semiconductor MOS entrance window for radiation detectors
US8314468B2 (en) * 2009-06-10 2012-11-20 Moxtek, Inc. Variable ring width SDD
US8421172B2 (en) 2009-07-16 2013-04-16 Canberra Industries, Inc. Simplified silicon drift detector and wraparound neutron detector
DE102010027128A1 (de) 2010-07-14 2012-01-19 Pnsensor Gmbh Halbleiterbauelement, insbesondere Strahlungsdetektor, mit einem integrierten Überspannungsschutz
GB2486208A (en) * 2010-12-06 2012-06-13 Melexis Tessenderlo Nv Demodulation sensor and method for detection and demodulation of temporarily modulated electromagnetic fields for use in Time of Flight applications.
DE102010055633A1 (de) * 2010-12-22 2012-06-28 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Halbleiterdetektor mit versetztem Bondkontakt
DE102011104489A1 (de) 2011-06-17 2012-12-20 Pndetector Gmbh Halbleiterdriftdetektor und entsprechendes Betriebsverfahren
US8921797B2 (en) * 2012-06-20 2014-12-30 Oxford Instruments Analytical Oy Leakage current collection structure and a radiation detector with the same
US9530902B2 (en) * 2012-06-20 2016-12-27 Oxford Instruments Analytical Oy Two-dimensional guard structure and a radiation detector with the same
WO2016162865A1 (en) * 2015-04-07 2016-10-13 Verifood, Ltd. Detector for spectrometry system
ITUB20159390A1 (it) * 2015-12-24 2017-06-24 Fond Bruno Kessler Rivelatore a semiconduttore, rivelatore di radiazione e apparecchiatura di rivelazione di radiazione.
ITUB20159644A1 (it) * 2015-12-24 2017-06-24 Horiba Ltd Rivelatore a semiconduttore, rivelatore di radiazione e apparecchiatura di rivelazione di radiazione.
IT201700122669A1 (it) * 2017-10-27 2019-04-27 Lfoundry Srl Sensore integrato di radiazione ionizzante e di particelle ionizzanti
DE102018008959B4 (de) 2018-11-14 2021-03-25 Karlsruher Institut für Technologie Vorrichtung zum Erfassen von Röntgenstrahlung und Verfahren zum Herstellen einer solchen Vorrichtung zum Erfassen von Röntgenstrahlung
CN109671799B (zh) * 2018-12-21 2020-08-18 中国科学院微电子研究所 漂移探测器及其制作方法
WO2020162246A1 (ja) * 2019-02-04 2020-08-13 株式会社堀場製作所 放射線検出素子、放射線検出器及び放射線検出装置
CN110854223B (zh) * 2019-11-22 2021-04-06 中国科学院微电子研究所 一种漂移探测器的制备方法及漂移探测器
CN110854222B (zh) * 2019-11-22 2021-04-06 中国科学院微电子研究所 一种漂移探测器的双面制备方法及漂移探测器
JP7792275B2 (ja) * 2022-03-11 2025-12-25 株式会社日立ハイテクアナリシス 半導体検出器及びその製造方法

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DE3427476A1 (de) * 1984-04-25 1985-10-31 Josef Dr. 8048 Haimhausen Kemmer Halbleiterelement
US4729005A (en) * 1985-04-29 1988-03-01 General Electric Company Method and apparatus for improved metal-insulator-semiconductor device operation
US20020139970A1 (en) * 2001-02-21 2002-10-03 Jan Iwanczyk Semiconductor radiation detector with internal gain

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US4729005A (en) * 1985-04-29 1988-03-01 General Electric Company Method and apparatus for improved metal-insulator-semiconductor device operation
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Non-Patent Citations (1)

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STRUDER L: "High-resolution imaging X-ray spectrometers", NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH, SECTION - A: ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT, NORTH-HOLLAND PUBLISHING COMPANY. AMSTERDAM, NL, vol. 454, no. 1, 1 November 2000 (2000-11-01), pages 73 - 113, XP004238224, ISSN: 0168-9002 *

Also Published As

Publication number Publication date
AU2003219104A8 (en) 2003-10-08
DE10213812B4 (de) 2007-03-29
NO20035244D0 (no) 2003-11-26
EP1490911B1 (de) 2008-07-16
US7238949B2 (en) 2007-07-03
ATE401668T1 (de) 2008-08-15
AU2003219104A1 (en) 2003-10-08
US20050173733A1 (en) 2005-08-11
DE50310157D1 (de) 2008-08-28
WO2003081637A2 (de) 2003-10-02
NO20035244L (no) 2003-11-26
DE10213812A1 (de) 2003-10-23
EP1490911A2 (de) 2004-12-29

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