WO2003087937A3 - Waterborne printed circuit board coating compositions - Google Patents

Waterborne printed circuit board coating compositions Download PDF

Info

Publication number
WO2003087937A3
WO2003087937A3 PCT/US2003/008838 US0308838W WO03087937A3 WO 2003087937 A3 WO2003087937 A3 WO 2003087937A3 US 0308838 W US0308838 W US 0308838W WO 03087937 A3 WO03087937 A3 WO 03087937A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
coating compositions
board coating
surfactant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/008838
Other languages
French (fr)
Other versions
WO2003087937A2 (en
Inventor
Donald Richard Baughman
Jon Christopher Klein
James Dennis Leonard
Gary Joseph Robideau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SI Group Inc
Original Assignee
Schenectady International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schenectady International Inc filed Critical Schenectady International Inc
Priority to EP03718025A priority Critical patent/EP1493313B1/en
Priority to DE60310055T priority patent/DE60310055T2/en
Priority to AU2003222042A priority patent/AU2003222042A1/en
Priority to DK03718025T priority patent/DK1493313T3/en
Publication of WO2003087937A2 publication Critical patent/WO2003087937A2/en
Publication of WO2003087937A3 publication Critical patent/WO2003087937A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Paints Or Removers (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The present invention provides waterborne printed circuit board coating compositions having surfactants that can bind into the polymeric network that is formed upon curing the printed circuit board coating compositions. In one embodiment, the present invention provides waterborne printed circuit board compositions having one or more of the following components (1)-(3): (1) a thermosetting component comprising one or more thermosetting groups; and a surfactant; (2) a photoreactive polymer comprising at least two ethylenically unsaturated groups; and a surfactant; (3) a surfactant comprising one or more epoxy-reactive groups, e.g. one or more carboxylic acid groups.
PCT/US2003/008838 2002-04-11 2003-03-24 Waterborne printed circuit board coating compositions Ceased WO2003087937A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP03718025A EP1493313B1 (en) 2002-04-11 2003-03-24 Waterborne printed circuit board coating compositions
DE60310055T DE60310055T2 (en) 2002-04-11 2003-03-24 AQUEOUS COATING COMPOSITIONS FOR PCB
AU2003222042A AU2003222042A1 (en) 2002-04-11 2003-03-24 Waterborne printed circuit board coating compositions
DK03718025T DK1493313T3 (en) 2002-04-11 2003-03-24 Waterborne coating compositions for printed circuit boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37149802P 2002-04-11 2002-04-11
US60/371,498 2002-04-11

Publications (2)

Publication Number Publication Date
WO2003087937A2 WO2003087937A2 (en) 2003-10-23
WO2003087937A3 true WO2003087937A3 (en) 2004-03-11

Family

ID=29250689

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/008838 Ceased WO2003087937A2 (en) 2002-04-11 2003-03-24 Waterborne printed circuit board coating compositions

Country Status (9)

Country Link
US (1) US20030219656A1 (en)
EP (1) EP1493313B1 (en)
AT (1) ATE347248T1 (en)
AU (1) AU2003222042A1 (en)
DE (1) DE60310055T2 (en)
DK (1) DK1493313T3 (en)
ES (1) ES2278155T3 (en)
TW (1) TW200304933A (en)
WO (1) WO2003087937A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101020164B1 (en) 2003-07-17 2011-03-08 허니웰 인터내셔날 인코포레이티드 Planarization films for advanced microelectronic applications, and apparatus and methods for making same
JP4929784B2 (en) * 2006-03-27 2012-05-09 富士通株式会社 Multilayer wiring board, semiconductor device and solder resist
CN111454596B (en) * 2019-01-18 2022-04-05 沈阳化工研究院有限公司 Water-based nano anticorrosive paint and preparation method thereof
JP7255285B2 (en) * 2019-03-28 2023-04-11 株式会社レゾナック Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, method for producing multilayer printed wiring board, and method for producing photosensitive resin composition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2261664A (en) * 1991-10-22 1993-05-26 Coates Brothers Plc Coating compositions
US5506089A (en) * 1993-03-09 1996-04-09 The Chromaline Corporation Photosensitive resin composition
WO2001025314A1 (en) * 1999-10-05 2001-04-12 Cognis Corporation Self-dispersible epoxide/surfactant coating compositions

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930072A (en) * 1974-06-28 1975-12-30 Universal Oil Prod Co Stabilization of metal plating baths
US4273851A (en) * 1979-05-29 1981-06-16 Richardson Graphics Company Method of coating using photopolymerizable latex systems
JPS6462375A (en) * 1987-09-02 1989-03-08 Arakawa Chem Ind Liquid photosolder resist ink composition of alkali development type
US5364736A (en) * 1987-12-07 1994-11-15 Morton International, Inc. Photoimageable compositions
US5723261A (en) * 1989-11-30 1998-03-03 Tamura Kaken Co., Ltd. Photopolymerizable composition
JPH04136857A (en) * 1990-09-28 1992-05-11 Hitachi Ltd Photosesetting resist composition and manufacture of printed circuit board by using same and this circuit board
JP2877659B2 (en) * 1993-05-10 1999-03-31 日本化薬株式会社 Resist ink composition and cured product thereof
TW270123B (en) * 1993-07-02 1996-02-11 Ciba Geigy
JP3134037B2 (en) * 1995-01-13 2001-02-13 太陽インキ製造株式会社 Thermosetting or photocuring / thermosetting coating composition using melamine organic acid salt
US5545510A (en) * 1995-03-28 1996-08-13 Mac Dermid, Inc. Photodefinable dielectric composition useful in the manufacture of printed circuits
EP0737701B1 (en) * 1995-04-13 2002-03-06 Mitsui Chemicals, Inc. Epoxy acrylate resins and their uses
US5853957A (en) * 1995-05-08 1998-12-29 Tamura Kaken Co., Ltd Photosensitive resin compositions, cured films thereof, and circuit boards
JP2718007B2 (en) * 1995-06-06 1998-02-25 太陽インキ製造株式会社 Alkali-developable one-pack type photo solder resist composition and method for manufacturing printed wiring board using the same
WO1996041240A1 (en) * 1995-06-07 1996-12-19 W.R. Grace & Co.-Conn. Water photoresist emulsions and methods of preparation thereof
JP3276833B2 (en) * 1995-12-13 2002-04-22 太陽インキ製造株式会社 Photocurable / thermosetting matte resist ink composition
US6207346B1 (en) * 1997-04-09 2001-03-27 Advanced Coatings International Waterborne photoresists made from urethane acrylates
TW538318B (en) * 2000-11-03 2003-06-21 Ind Tech Res Inst Photo-sensitive composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2261664A (en) * 1991-10-22 1993-05-26 Coates Brothers Plc Coating compositions
US5506089A (en) * 1993-03-09 1996-04-09 The Chromaline Corporation Photosensitive resin composition
WO2001025314A1 (en) * 1999-10-05 2001-04-12 Cognis Corporation Self-dispersible epoxide/surfactant coating compositions

Also Published As

Publication number Publication date
EP1493313B1 (en) 2006-11-29
DK1493313T3 (en) 2007-03-26
AU2003222042A8 (en) 2003-10-27
ATE347248T1 (en) 2006-12-15
US20030219656A1 (en) 2003-11-27
DE60310055D1 (en) 2007-01-11
DE60310055T2 (en) 2007-04-12
TW200304933A (en) 2003-10-16
WO2003087937A2 (en) 2003-10-23
AU2003222042A1 (en) 2003-10-27
ES2278155T3 (en) 2007-08-01
EP1493313A2 (en) 2005-01-05

Similar Documents

Publication Publication Date Title
WO2002041079A3 (en) Positive type photosensitive epoxy resin composition and printed circuit board using the same
AU2003266671A1 (en) Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same
WO2004037866A3 (en) Photoresists containing sulfonamide component
DE69800652D1 (en) Flexible, flame retardant photopolymerizable composition for coating printed circuit boards
AU2001284499A1 (en) Photosensitive composition, cured article thereof, and printed circuit board using the same
DE60103529D1 (en) RESIN COMPOSITION THAT CAN BE CURED BY LIGHT AND HEAT, LIGHT-SENSITIVE DRY FILM PRODUCED FROM THIS, AND METHOD FOR MAKING A PATTERN THEREFOR
DE69724169D1 (en) Thermosetting resin mixture, hardened product, metal-covered laminate and printed circuit board
EP1167484A3 (en) Poly(arylene ether) adhesive compositions
CA2127238A1 (en) Photopolymerisable compositions
EP0943963A3 (en) Photoimageable compositions having improved stripping properties in aqueous alkaline solutions
AU2002352080A1 (en) Heat-curable resin composition
AU2001260142A1 (en) High molecular weight epoxy resin and resinous composition for printed circuit board
AU2001244548A1 (en) Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board
CA2530380A1 (en) Intumescent coating compositions
AU2966399A (en) Electric conductor with a surface structure in the form of flanges and etched grooves
WO2006077163A3 (en) Wire-printed circuit board or card comprising conductors with a rectangular or square cross-section
AU7315000A (en) Photosensitive resin compositions, photosensitive element containing the same, process for producing resist pattern, and process for producing printed circuit board
TW290583B (en)
ATE286088T1 (en) IMPROVED POLYUREA COATINGS FROM DIMETHYL-SUBSTITUTED POLYASPARTATE STERIL MIXTURES
AU2003271131A1 (en) Photosensitive resin composition, and, photosensitive element, method for forming resist pattern and printed wiring board using the composition
AU2003222042A1 (en) Waterborne printed circuit board coating compositions
WO2002054122A3 (en) Layered circuit boards and methods of production thereof
EP1108762A3 (en) Polyamic acid varnish composition and a flexible printed board
DE69703419D1 (en) Flexible, flame retardant photopolymerizable composition for coating printed circuit boards
SG118156A1 (en) Photosensitive resin composition and printed wiring board

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003718025

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2003718025

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP

WWG Wipo information: grant in national office

Ref document number: 2003718025

Country of ref document: EP