WO2004010114A3 - Vorrichtung zur wafer-inspektion - Google Patents

Vorrichtung zur wafer-inspektion Download PDF

Info

Publication number
WO2004010114A3
WO2004010114A3 PCT/EP2003/007677 EP0307677W WO2004010114A3 WO 2004010114 A3 WO2004010114 A3 WO 2004010114A3 EP 0307677 W EP0307677 W EP 0307677W WO 2004010114 A3 WO2004010114 A3 WO 2004010114A3
Authority
WO
WIPO (PCT)
Prior art keywords
illumination
axis
imaging
wafer inspection
inspected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2003/007677
Other languages
English (en)
French (fr)
Other versions
WO2004010114A2 (de
Inventor
Henning Backhauss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leica Microsystems CMS GmbH
KLA Tencor MIE GmbH
Original Assignee
Leica Microsystems CMS GmbH
Vistec Semiconductor Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsystems CMS GmbH, Vistec Semiconductor Systems GmbH filed Critical Leica Microsystems CMS GmbH
Priority to AU2003250961A priority Critical patent/AU2003250961A1/en
Priority to EP03764995A priority patent/EP1523670A2/de
Priority to JP2004522463A priority patent/JP2005533260A/ja
Publication of WO2004010114A2 publication Critical patent/WO2004010114A2/de
Publication of WO2004010114A3 publication Critical patent/WO2004010114A3/de
Priority to US11/037,668 priority patent/US20050122509A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Es wird eine Vorrichtung zur Wafer-Inspektion beschrieben, die eine Auflicht-Beleuchtungseinrichtung mit einer Beleuchtungsachse und eine Abbildungseinrichtung mit einer Abbildungsachse umfasst, welche beide gegeneinander geneigt und auf einen zu inspizierenden Bereich der Oberfläche eines Wafers gerichtet sind. Eine Abbildungsebene ist dadurch definiert, dass sie in Hellfeldbeleuchtungs-Einstellung der Vorrichtung von der Beleuchtungsachse und der Abbildungsachse aufgespannt wird. Erfindungsgemäß zeichnet sich die Vorrichtung dadurch aus, dass die Beleuchtungsachse aus der Abbildungsebene um einen Dunkelfeldwinkel Ϝ > 0 herausgedreht so angeordnet ist, dass in dem zu inspizierenden Bereich eine Dunkelfeldbeleuchtung besteht.
PCT/EP2003/007677 2002-07-18 2003-07-16 Vorrichtung zur wafer-inspektion Ceased WO2004010114A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2003250961A AU2003250961A1 (en) 2002-07-18 2003-07-16 Device for wafer inspection
EP03764995A EP1523670A2 (de) 2002-07-18 2003-07-16 Vorrichtung zur wafer-inspektion
JP2004522463A JP2005533260A (ja) 2002-07-18 2003-07-16 ウェハ検査装置
US11/037,668 US20050122509A1 (en) 2002-07-18 2005-01-18 Apparatus for wafer inspection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10232781A DE10232781B4 (de) 2002-07-18 2002-07-18 Vorrichtung zur Wafer-Inspektion
DE10232781.5 2002-07-18

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/037,668 Continuation US20050122509A1 (en) 2002-07-18 2005-01-18 Apparatus for wafer inspection

Publications (2)

Publication Number Publication Date
WO2004010114A2 WO2004010114A2 (de) 2004-01-29
WO2004010114A3 true WO2004010114A3 (de) 2004-10-21

Family

ID=30010202

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/007677 Ceased WO2004010114A2 (de) 2002-07-18 2003-07-16 Vorrichtung zur wafer-inspektion

Country Status (5)

Country Link
EP (1) EP1523670A2 (de)
JP (1) JP2005533260A (de)
AU (1) AU2003250961A1 (de)
DE (1) DE10232781B4 (de)
WO (1) WO2004010114A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004029012B4 (de) * 2004-06-16 2006-11-09 Leica Microsystems Semiconductor Gmbh Verfahren zur Inspektion eines Wafers
DE502005008676D1 (de) * 2005-07-13 2010-01-21 Audi Ag Verfahren und Vorrichtung zur optischen Prüfung von Carbon-Keramik-Brems- und Kupplungskomponenten
DE102005061834B4 (de) 2005-12-23 2007-11-08 Ioss Intelligente Optische Sensoren & Systeme Gmbh Vorrichtung und Verfahren zum optischen Prüfen einer Oberfläche
DE102007042271B3 (de) * 2007-09-06 2009-02-05 Vistec Semiconductor Systems Gmbh Verfahren zur Bestimmung der Lage der Entlackungskante eines scheibenförmigen Objekts
TWI601952B (zh) * 2016-01-25 2017-10-11 Wafer edge measurement module (a)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264912A (en) * 1992-02-07 1993-11-23 Tencor Instruments Speckle reduction track filter apparatus for optical inspection of patterned substrates
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
WO1999006823A1 (en) * 1997-08-01 1999-02-11 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
EP1102058A1 (de) * 1999-11-17 2001-05-23 Applied Materials, Inc. Verfahren und Vorrichtung zur Überprüfung von Gegenständen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264912A (en) * 1992-02-07 1993-11-23 Tencor Instruments Speckle reduction track filter apparatus for optical inspection of patterned substrates
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
WO1999006823A1 (en) * 1997-08-01 1999-02-11 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
EP1102058A1 (de) * 1999-11-17 2001-05-23 Applied Materials, Inc. Verfahren und Vorrichtung zur Überprüfung von Gegenständen

Also Published As

Publication number Publication date
AU2003250961A8 (en) 2004-02-09
DE10232781A1 (de) 2004-02-05
WO2004010114A2 (de) 2004-01-29
DE10232781B4 (de) 2013-03-28
AU2003250961A1 (en) 2004-02-09
EP1523670A2 (de) 2005-04-20
JP2005533260A (ja) 2005-11-04

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