WO2004012244A1 - 導光装置 - Google Patents
導光装置 Download PDFInfo
- Publication number
- WO2004012244A1 WO2004012244A1 PCT/JP2003/008560 JP0308560W WO2004012244A1 WO 2004012244 A1 WO2004012244 A1 WO 2004012244A1 JP 0308560 W JP0308560 W JP 0308560W WO 2004012244 A1 WO2004012244 A1 WO 2004012244A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- face
- optical fiber
- glass rod
- fiber bundle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/04—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4298—Coupling light guides with opto-electronic elements coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
Definitions
- the present invention relates to a light guide device used for exposure for removing unnecessary resist around a semiconductor wafer.
- the peripheral portion of the pattern forming portion may not be exposed, and the resist may remain on the peripheral portion.
- the resist remaining in the peripheral area may peel off and become dust adhering to the semiconductor wafer, and thus needs to be removed before moving to the next step.
- a method of irradiating the light guided by the light guide device to the removed portion and moving the irradiation spot on the removed portion to expose the entire removed portion is known. Used.
- the cross section of the light emitted from the light guide device is shaped so as to be rectangular, and the illuminance is uniformed over the entire cross section of the emitted light. Is required.
- JP-A-10-74676 As a prior art of such a light guide device, for example, there is a light guide device disclosed in JP-A-10-74676.
- an aperture member having a rectangular transmission portion provided on an irradiation head adjusts a cross section of light emitted from the light guide device into a rectangular shape.
- An optical device is disclosed.
- the conventional light guide device has a problem in that the light shielding portion of the aperture member shields the outer ring of light emitted from the light guide fiber, so that the amount of emitted light is reduced.
- the light shielding portion of the aperture member shields the outer ring of light emitted from the light guide fiber, so that the amount of emitted light is reduced.
- the present invention has been made to solve the above-mentioned problem. Therefore, it is an object of the present invention to provide a light guide device in which the cross section of the emitted light is shaped into a rectangular shape and the illuminance is made uniform over the entire cross section of the emitted light without reducing the amount of light emitted from the light guide fiber. I do.
- a light guide device of the present invention is a light guide device used for exposing a peripheral portion of a semiconductor wafer, and is configured by bundling a plurality of optical fibers.
- An optical fiber bundle having a first light incidence end face and a first light emission end face; and a second light incidence end face and a second light emission end face, wherein light emitted from the first light emission end face of the optical fiber bundle is emitted.
- the glass rod which takes in the light from the second light incident end face and guides it to the second light emitting end face, makes the illuminance uniform in the cross section of the light emitted from the second light emitting end face, and the second light incident end face of the glass rod forms the light.
- the glass rod takes in the light emitted from the optical fiber bundle and makes the illuminance uniform over the entire cross section of the emitted light. Further, since the second light emitting end face of the glass rod is rectangular, the light emitted from the glass rod is also shaped so that the cross section becomes rectangular. Therefore, it is not necessary to apply an aperture member to shield and shape the outer ring of the cross section of the emitted light. As a result, it is possible to irradiate the light guided by the optical fiber bundle to the peripheral portion of the semiconductor wafer without reducing the amount of light.
- the glass opening satisfies the relational expressions represented by the following expressions (1) and (2).
- ⁇ ' Refraction angle when light emitted from the optical fiber at the maximum emission angle is incident on the second light incident end face
- the maximum emission angle component of the light emitted from the optical fiber that enters the glass rod from the central axis is at least once at the boundary surface of the glass rod. Total reflection at the interface between the glass rod and the clad or outside air). Therefore, the outgoing light from each optical fiber is totally reflected and mixed at the boundary surface of the glass rod, so that the unevenness of the illuminance on the first light emitting end face of the optical fiber bundle is satisfactorily uniform.
- the light guide device of the present invention includes a slip member that covers the front end portion of the optical fiber bundle on the light emitting end surface side, and the glass opening holding member is formed as a slip member. Preferably, it is detachably attached.
- a plurality of optical fibers are bonded to each other with an adhesive at a light emitting end face side end of the optical fiber bundle.
- the optical fibers are adhered to each other with an adhesive at the light emitting end face side tip of the optical fiber bundle, so that the shape of the light emitting end face side tip is maintained regardless of the shape of the optical fiber bundle.
- the density of the core end face at the first light emitting end face of the optical fiber pandle is increased, and the dark portion (the portion other than the core end face) is reduced. Therefore, the light quantity density at the first light emitting end face increases.
- the first light emitting end face of the optical fiber bundle and the second light incident end face of the glass rod face each other with a gap therebetween. is there. Since there is a gap between the second light incidence end face of the glass rod and the first light emission end face of the optical fiber bundle, the second light incidence end face and the first light emission end face have a V, It can be prevented from being damaged by contact with the surface.
- the light guide device of the present invention includes a sleeve member covering the light emitting end face side end of the optical fiber bundle, and a part near the light emitting end face side end of the optical fiber bundle. It is preferable that the optical fiber bundle further includes a bending portion holding member that holds the optical fiber bundle in a curved state near the distal end portion by being fixed to the one-piece member.
- the optical fiber bundle Since the optical fiber bundle is held in a curved state near the light emitting end face side tip by the bending portion holding member having a strong structure, the optical fiber bundle occupies near the light emitting end face side tip. Space can be reduced.
- FIG. 1 is a diagram illustrating an appearance of the light guide device 1.
- FIG. 2 is an enlarged partial cross-sectional view of region X of light guide device 1 shown in FIG.
- FIG. 3 is a diagram showing a light emitting end face of the light guide cable 10.
- FIG. 4 is a diagram showing a light emitting end face of the irradiation head 4. As shown in FIG.
- FIG. 5 is a diagram showing an end face of the first light incidence section.
- FIG. 6 is a diagram showing a state in which the light emitting end face side end of the optical fiber bundle 16 is fitted to the slip member 13.
- FIG. 7 is a diagram showing a state in which light is totally reflected and propagated in a cross section along the length direction of the glass rod 40 (a cross section including a diagonal line of the light emitting end face 40o). You.
- FIG. 8 is a schematic diagram of a semiconductor wafer peripheral exposure device 5 to which the light guide device 1 is applied.
- FIG. 1 is a diagram illustrating an appearance of the light guide device 1.
- FIG. 2 is an enlarged partial cross-sectional view of a region X of the light guide device 1 shown in FIG.
- the light guide device 1 is a light guide cable configured by covering an optical fiber bundle 16 that bundles a plurality of optical fiber cores (quartz fiber cores for UV transmission) on a light emitting end face side with a PVC coating 17. 10 is provided.
- the light guide cable 10 branches into a light guide cable 20 and a light guide cable 30 on the light incident end face side.
- the number of cores in the light guide cable 20 and the light guide cable 30 is almost the same, and the optical fiber bundles 16 of the light guide cable 10 are constructed by staggering the optical fiber core wires constituting each at the branch. You.
- the branch portion of the light guide cable is covered with a branch portion outer periphery 11.
- FIG. 3 is a diagram showing a light emitting end face of the light guide cable 10.
- FIG. 6 is a view showing a state in which the tip end of the optical fiber bundle 16 on the light emitting end face side is fitted to the sleeve member 13. The shape of the optical fiber bundle 16 is fixed by bonding the optical fiber core wires together with an adhesive at the light emitting end face side tip (a portion corresponding to the region Y shown in FIG. 6).
- the cross-sectional shape of the light emitting end face side tip is shaped into a rectangle having a width of 8.0 mm and a length of 4.0 mm. Further, it is desirable that the arrangement of the optical fibers at the light emitting end face side end is as random as possible with respect to the arrangement of the optical fibers at other portions. The random arrangement of the optical fiber cores at the light emitting end face side tip in this way contributes to uniformity in the variation in the amount of light emitted from each optical fiber core.
- the sleeve member 13 has an overall shape. Is a cylindrical member having an elliptical column shape.
- the hollow portion of the sleeve member 13 has a rectangular shape with a cross section of 8.0 mm in width and 4.0 mm in length, and a step 13 a is formed by slightly projecting the side wall at one opening. Have been.
- the thickness of the step 13a is adjusted to a predetermined length g.
- the optical fiber bundle 16 whose light emitting end face side tip is fixed with an adhesive is fitted into the sleeve member 13 by being inserted into the hollow portion.
- the step 13 a locks the light emitting end face 16 o of the optical fiber bundle 16, and a gap of a distance g is formed between the bottom face of the sleeve member 13 and the light emitting end face 16 o. it can.
- the shape of the light emitting end face side end portion is maintained regardless of the change in the shape of the optical fiber bundle 16.
- the shape of the core end face at the light emitting end face 16 o is increased by shaping the tip end of the light emitting end face side with an adhesive, and the density of the core end face at the light emitting end face 16 o is increased, so that dark portions (parts other than the core end face) are reduced. Less. Therefore, the light intensity density at the light emitting end face 16 o increases.
- the slip member 13 is a cylindrical member having an overall shape of an elliptic cylinder, and the emission portion outer periphery 14 having an elliptical hollow is formed of a sleeve member 1. 3 is mounted such that the bottom surface of 3 and the bottom surface of the outer periphery 14 of the emission section are located on the same plane. The front end of the optical fiber bundle 16 on the light emitting end face side is covered with the emitting portion outer periphery 14 and the P CV coating 17.
- an irradiation head 4 is detachably attached to the light emitting end face side end of the optical fiber bundle 16.
- the irradiation head 4 includes a glass rod holding member 42, a glass rod 40 housed in the glass rod holding member 42, and a positioning pin 44 for fixing the glass rod 40.
- the fiber bundle 16 is installed so as to face the light emitting end face 16 o.
- FIG. 4 is a diagram showing a light emitting end face of the irradiating head 4.
- the glass rod 40 has a rectangular shape with a bottom surface of 8.0 mm in width and 4.0 mm in height, and a length (height) of 40.0 mm. Make a shape.
- One bottom surface of the glass rod 40 is a light incident end surface 40 i, and the other bottom surface is a light output end surface 40 o.
- the glass opening holding member 42 has a cylindrical shape, and both the inner and outer circumferences of the cross section at the tip end (glass rod receiving portion) are elliptical. Has become.
- the inner and outer peripheries of the cross section at the end portion (the mounting part around the emission part) are also oval, but the inner diameter at the mounting part around the emission part is larger than the inner diameter at the glass rod housing part.
- the major axis of the inner circumference of the cross section is longer than 8.0 mm (the length of the side of the light emitting end face 40 o of the glass rod 40), and the minor axis is: It is set to be longer than 4.0 mm (the length of the vertical side of the light emitting end face 40o of the glass rod 40).
- the length of the hollow portion is set to 40. O mm (the length of the glass rod 40).
- Two 4a are formed on the distal end side and the distal end side, respectively.
- the glass rod 40 When inserted into the glass rod housing, the glass rod 40 is housed with a degree of freedom, but the positioning pin 44 inserted into the positioning pin insertion hole 42a fixes the position of the glass rod 40.
- a screw groove may be formed on the side surface of the positioning pin ⁇ insertion hole 42 a, and a positioning screw may be screwed into the positioning pin ⁇ insertion hole 42 a instead of the positioning pin 44.
- the shape and size of the inner circumference of the cross section of the emission unit outer circumference mounting portion are the same as the outer circumference of the emission unit outer circumference 14, and the emission unit outer circumference 14 is It is set to fit in the hollow part.
- the irradiation head 4 is removably attached to the emission part surrounding 14 by fitting the emission part surrounding 14 into the hollow part of the emission part surrounding mounting part. That is, the irradiation head 4 is detachably attached to the sleeve member 13 via the irradiation part outer periphery 14. Since the irradiation head 4 is detachable, the replacement and cleaning of the glass rod 40 is facilitated.
- the inner peripheral diameter of the emission unit outer periphery mounting part is Because the diameter is larger than the inner diameter, there is a step 42 b at the boundary between the two.
- the step 42 b locks the bottom surface of the emission part outer circumference 14.
- the glass rod 40 when the glass rod 40 is inserted into the glass rod accommodating portion, the glass rod 40 has a light incident end face 40 i with a step 42 b (the outer periphery of the emission part 14 and the bottom surface of the sleeve member 13). It is fixed so that it is located on the same plane.
- the glass rod 40 has its light incident end face 40i through the gap of the distance g.
- the optical fiber bundle 16 is fixed so as to face the light emitting end face 16 o of the optical fiber bundle 16. Further, by shifting the position of the positioning pins 44, the posture of the glass rod 40 is adjusted so that the light incident end face 40i can pick up the light emitted from the light emitting end face 16o without leakage.
- the light guide cable 10 is bent in a right angle direction near the distal end, and the shape is held by the bent portion holding member 12.
- the bending portion holding member 12 is provided with a ring 122, a ring 124, a fixing plate 126 and a screw 128.
- the ring 122 is fixed to a portion near the distal end of the light guide cable 10.
- the ring 124 is fixed to the outer peripheral surface of the outer periphery 14 of the emission part. That is, the ring 124 is fixed to the sleeve member 13 via the emission part outer periphery 14.
- Both ends of the fixing plate 1 26 are attached to the ring 122 and the ring 124, respectively, and after being screwed with the screw 128, they are fixed with an epoxy adhesive.
- the bending portion holding member 12 configured as described above, the light guide cable 1 Since a force acts to attract the portion near the leading end of the light guide cable 13 to the sleep member 13, the curved state near the leading end of the light guide cable 1 ° is maintained.
- the optical fiber bundles 16 are twisted with each other so that the optical fiber bundle 16 has a bending-resistant structure in the bending portion. For example, a sub-bundle is formed by twisting about 20 ° optical fibers, and an optical fiber bundle is formed by twisting seven sub-bundles.
- the light guide cable 10 is bent in the right-angle direction near the distal end portion and the shape is held by the bent portion holding member 12, it is possible to maintain the vertical falling state of the emitted light satisfactorily. It is possible to prevent damage due to the repeated bending of the fiber bundle 16 and to prevent damage due to contact with the peripheral portion inside the device due to the fact that the distal end of the light guide cable 10 is in a floating state when attached to the exposure apparatus. You.
- FIG. 5 is a diagram showing an end face of the first light incidence section. As shown in FIG. 5, the distal end surface (light incident end surface 26 i) of the optical fiber bundle constituting the light guide cable 20 is exposed from the incident portion outer periphery 24. The light incident end face 26 i has a circular shape.
- the light guide cable 20 is bent near the distal end, and the bent state is held by the bent portion holding member 22.
- the light guide cable 30 has a second light incident portion at the distal end, and the bent state is held by the bent portion holding member 32.
- a light source is connected to the first incident portion, and light for exposing the periphery of the semiconductor wafer is taken into the optical fiber bundle from the light incident end face 26i of the first light incident portion. If a larger amount of light is required, another light source is also connected to the second light input section.
- the light from the light source is guided by the optical fiber bundle and is emitted from the light emitting end face 16o.
- the light emitted from the light emitting end face 16o enters the light incident end face 40i of the glass rod 40.
- Light incident on the light incident end face 40 i propagates through the glass rod 40 and exits from the light exit end face 40 o.
- Outgoing force In the process, the illuminance in the cross section of the outgoing light is made uniform and the cross-sectional shape of the outgoing light is shaped.
- FIG. 7 is a view showing a state in which light is totally reflected and propagated in a cross section along the length direction of the glass rod 40 (a cross section including a diagonal line of the light emitting end face 40o).
- the length d of this diagonal is 8.94 mm as shown in equation (3).
- d W h Wi «8.9 small .- (3)
- the light constituting the optical fiber bundle 16 in the present embodiment The maximum emission angle 0 (the maximum angle between the optical axis of the optical fiber core and the emitted light) of the optical fiber bundle in the air is: 11.5 °.
- the angle 0 between the light of the maximum angle component and the optical axis (the central axis of the glass rod 40) is expressed by the following equation: As shown in equation (4) derived from 2), it becomes 7.768 °.
- the length of the glass rod 40 of the present embodiment is 40 mm, which satisfies the above condition. Therefore, the light emitted from each optical fiber core is totally reflected and mixed at the interface between the glass rod 40 and the air, so that the uneven illuminance on the light emitting end face 16 o of the optical fiber bundle 16 is made uniform. Is done. That is, the bending loss of the guided light is different for each optical fiber core, and there is a cladding region on the light emitting end surface 16o where light does not propagate. Irradiation unevenness occurs on 16 o. However, by applying the glass rod 40 of the present embodiment and mixing the light emitted from each optical fiber core, it is possible to make the illuminance uneven.
- the cross section of the light emitted from the light emitting end face 40o is shaped into a rectangular shape. Therefore, there is no need to apply an aperture member to shield the outer ring of the outgoing light in a shaded manner. As a result, the light guided by the optical fiber bundle can be applied to the periphery of the semiconductor wafer without a decrease in the amount of light.
- the shape of the light emitting end face of the optical fiber bundle and the shape of the light incident end face of the glass rod need not be rectangular. Even in this case, as long as the light emitting end face of the glass rod has a rectangular shape, the cross section of light emitted from the light emitting end face of the glass rod is shaped into a rectangular shape.
- FIG. 8 is a schematic view of a semiconductor wafer peripheral exposure device 5 to which the light guide device 1 is applied.
- the semiconductor wafer peripheral exposure device 5 includes a housing 52, and a peripheral portion (resist removed portion) of the semiconductor wafer 6 is exposed inside the housing 52.
- the semiconductor radiator 6 is set on a rotation support plate 54.
- An irradiation head moving device 56 supports the irradiation head 4 and controls the position of the irradiation head 4.
- the irradiation head 4 irradiates a point on the periphery (resist removal portion) of the semiconductor wafer 6, and the semiconductor support 6
- the peripheral portion (resist removed portion) of the semiconductor wafer 6 is uniformly exposed.
- the optical axis of the light guide cable 10 is oriented vertically at the tip end on the light emitting end face side, but the light guide cable 10 is oriented such that the optical axis is oriented horizontally near the tip end. Since it is curved, the size of the housing 52 in the vertical direction can be reduced. Also, the storage space when the irradiation head 4 is moved to the storage position can be reduced.
- the cross section of the outgoing light is shaped into a rectangular shape without reducing the amount of light emitted from the light guide fiber, and the cross section of the outgoing light is It is possible to provide a light guide device that makes the illuminance uniform over the whole.
- the present invention can be applied to, for example, the manufacture of a semiconductor integrated circuit.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
Claims
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020047019510A KR100936591B1 (ko) | 2002-07-25 | 2003-07-04 | 도광 장치 |
| CN038178184A CN1672242B (zh) | 2002-07-25 | 2003-07-04 | 导光装置 |
| EP03741212A EP1548802B1 (en) | 2002-07-25 | 2003-07-04 | Light conducting device |
| DE60322557T DE60322557D1 (de) | 2002-07-25 | 2003-07-04 | Lichtleiteinrichtung |
| US10/522,180 US7360953B2 (en) | 2002-07-25 | 2003-07-04 | Light guiding device |
| AU2003281709A AU2003281709A1 (en) | 2002-07-25 | 2003-07-04 | Light conducting device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002217184A JP4302373B2 (ja) | 2002-07-25 | 2002-07-25 | 導光装置 |
| JP2002-217184 | 2002-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2004012244A1 true WO2004012244A1 (ja) | 2004-02-05 |
Family
ID=31184599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2003/008560 Ceased WO2004012244A1 (ja) | 2002-07-25 | 2003-07-04 | 導光装置 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7360953B2 (ja) |
| EP (1) | EP1548802B1 (ja) |
| JP (1) | JP4302373B2 (ja) |
| KR (1) | KR100936591B1 (ja) |
| CN (1) | CN1672242B (ja) |
| AU (1) | AU2003281709A1 (ja) |
| DE (1) | DE60322557D1 (ja) |
| TW (1) | TWI278719B (ja) |
| WO (1) | WO2004012244A1 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010014815A (ja) * | 2008-07-01 | 2010-01-21 | Mitsubishi Electric Corp | 投写型表示装置 |
| JP2010170835A (ja) * | 2009-01-22 | 2010-08-05 | Sanyo Electric Co Ltd | 照明装置および投写型映像表示装置 |
| JP6061571B2 (ja) * | 2012-09-04 | 2017-01-18 | キヤノン株式会社 | 被検体情報取得装置 |
| JP6082721B2 (ja) * | 2014-10-01 | 2017-02-15 | Hoya Candeo Optronics株式会社 | 周辺露光装置用の光照射装置 |
| JP6002261B2 (ja) * | 2015-03-11 | 2016-10-05 | Hoya Candeo Optronics株式会社 | 光照射装置 |
| CN106842828B (zh) * | 2017-04-05 | 2019-09-03 | 无锡影速半导体科技有限公司 | 一种匀光棒固定装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07192993A (ja) * | 1993-12-27 | 1995-07-28 | Tokyo Electron Ltd | 周辺露光装置及び周辺露光方法 |
| JPH10233354A (ja) * | 1997-02-20 | 1998-09-02 | Ushio Inc | 紫外線照射装置 |
| EP0920053A2 (en) * | 1997-11-26 | 1999-06-02 | Ushiodenki Kabushiki Kaisha | Device for exposing the peripheral area of a semiconductor wafer |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4964692A (en) * | 1982-07-21 | 1990-10-23 | Smith & Nephew Dyonics, Inc. | Fiber bundle illumination system |
| US4662714A (en) | 1983-10-28 | 1987-05-05 | Kei Mori | Integrated construction of a large number of optical conductor cables |
| US5229811A (en) * | 1990-06-15 | 1993-07-20 | Nikon Corporation | Apparatus for exposing peripheral portion of substrate |
| JP3237522B2 (ja) | 1996-02-05 | 2001-12-10 | ウシオ電機株式会社 | ウエハ周辺露光方法および装置 |
| JP3223826B2 (ja) | 1996-06-26 | 2001-10-29 | ウシオ電機株式会社 | 基板上の不要レジスト露光装置 |
| JP2001195901A (ja) * | 2000-01-14 | 2001-07-19 | Nippon Sheet Glass Co Ltd | 照明装置 |
| JP4090273B2 (ja) * | 2002-05-23 | 2008-05-28 | 株式会社Sokudo | エッジ露光装置 |
-
2002
- 2002-07-25 JP JP2002217184A patent/JP4302373B2/ja not_active Expired - Fee Related
-
2003
- 2003-07-04 WO PCT/JP2003/008560 patent/WO2004012244A1/ja not_active Ceased
- 2003-07-04 DE DE60322557T patent/DE60322557D1/de not_active Expired - Lifetime
- 2003-07-04 KR KR1020047019510A patent/KR100936591B1/ko not_active Expired - Fee Related
- 2003-07-04 EP EP03741212A patent/EP1548802B1/en not_active Expired - Lifetime
- 2003-07-04 CN CN038178184A patent/CN1672242B/zh not_active Expired - Fee Related
- 2003-07-04 AU AU2003281709A patent/AU2003281709A1/en not_active Abandoned
- 2003-07-04 US US10/522,180 patent/US7360953B2/en not_active Expired - Fee Related
- 2003-07-24 TW TW092120212A patent/TWI278719B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07192993A (ja) * | 1993-12-27 | 1995-07-28 | Tokyo Electron Ltd | 周辺露光装置及び周辺露光方法 |
| JPH10233354A (ja) * | 1997-02-20 | 1998-09-02 | Ushio Inc | 紫外線照射装置 |
| EP0920053A2 (en) * | 1997-11-26 | 1999-06-02 | Ushiodenki Kabushiki Kaisha | Device for exposing the peripheral area of a semiconductor wafer |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP1548802A4 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1548802B1 (en) | 2008-07-30 |
| US7360953B2 (en) | 2008-04-22 |
| US20060099754A1 (en) | 2006-05-11 |
| AU2003281709A1 (en) | 2004-02-16 |
| TW200405123A (en) | 2004-04-01 |
| KR100936591B1 (ko) | 2010-01-13 |
| JP2004063597A (ja) | 2004-02-26 |
| CN1672242A (zh) | 2005-09-21 |
| DE60322557D1 (de) | 2008-09-11 |
| EP1548802A4 (en) | 2007-12-19 |
| KR20050020818A (ko) | 2005-03-04 |
| TWI278719B (en) | 2007-04-11 |
| CN1672242B (zh) | 2010-04-21 |
| EP1548802A1 (en) | 2005-06-29 |
| JP4302373B2 (ja) | 2009-07-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6614971B2 (en) | Fanout system or apparatus for a fiber optic cable and including a method of fabricating same | |
| JP2008507328A (ja) | 医療機器に使用する光ファイバープローブチップの製造方法 | |
| PT676218E (pt) | Difusor de luz e processo para a manufactura de um difusor de luz | |
| EP1780564B1 (en) | Optical fibre with fluorescent tip cap and methods of manufacturing | |
| CN101900918B (zh) | 具有可变电致变色外部吸收能力的光学部件 | |
| WO2004012244A1 (ja) | 導光装置 | |
| EP0277504B1 (en) | Optical fiber bundle having improved terminal structure | |
| US4774104A (en) | Irradiation device, arrangement for and method of cladding a filamentary body | |
| JP2007086779A (ja) | ファイバに対するコーティング処理および閉じ込められていない漏れ光のためのスリッティング | |
| JPH10233354A (ja) | 紫外線照射装置 | |
| CN112617719A (zh) | 一种照明装置及内窥镜设备 | |
| JP2000173330A (ja) | 光源装置 | |
| JP4883196B2 (ja) | 照明装置及びそれを用いた密着型イメージセンサ | |
| JP2005283713A (ja) | 光ファイバアレイ | |
| EP3929637B1 (en) | Optical fiber fixing structure, laser transmission cable using optical fiber fixing structure, and laser device | |
| JPS58221818A (ja) | 光フアイバ余長処理構造 | |
| JP7489464B2 (ja) | 固定構造、光デバイス、及びレーザ装置 | |
| JP2014157182A (ja) | 光コネクタ及びその製造方法 | |
| US20240295700A1 (en) | Optical Fiber Cladding Optical Filter | |
| WO2025254233A1 (ko) | Led 광원 조립체 및 이를 적용하는 측면 조명 장치 | |
| JPS63136004A (ja) | マルチ光フアイバの端末部 | |
| JP3262627B2 (ja) | 光ファイバ端末ユニット | |
| JP2563252Y2 (ja) | 光コネクタ | |
| JP2002328247A (ja) | 光導波路の形成方法 | |
| JP2001174641A (ja) | 光空間減衰器 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| WWE | Wipo information: entry into national phase |
Ref document number: 1020047019510 Country of ref document: KR |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 20038178184 Country of ref document: CN |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2003741212 Country of ref document: EP |
|
| WWP | Wipo information: published in national office |
Ref document number: 1020047019510 Country of ref document: KR |
|
| WWP | Wipo information: published in national office |
Ref document number: 2003741212 Country of ref document: EP |
|
| ENP | Entry into the national phase |
Ref document number: 2006099754 Country of ref document: US Kind code of ref document: A1 |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 10522180 Country of ref document: US |
|
| WWP | Wipo information: published in national office |
Ref document number: 10522180 Country of ref document: US |
|
| WWG | Wipo information: grant in national office |
Ref document number: 2003741212 Country of ref document: EP |