WO2004036628A3 - Device and method for transporting wafer-shaped articles - Google Patents

Device and method for transporting wafer-shaped articles Download PDF

Info

Publication number
WO2004036628A3
WO2004036628A3 PCT/EP2003/011178 EP0311178W WO2004036628A3 WO 2004036628 A3 WO2004036628 A3 WO 2004036628A3 EP 0311178 W EP0311178 W EP 0311178W WO 2004036628 A3 WO2004036628 A3 WO 2004036628A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
shaped article
holding
unit
cassette
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2003/011178
Other languages
French (fr)
Other versions
WO2004036628A2 (en
Inventor
Christian Putzi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research AG
Original Assignee
SEZ AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEZ AG filed Critical SEZ AG
Priority to KR1020107029022A priority Critical patent/KR101276785B1/en
Priority to EP03785610A priority patent/EP1554748B1/en
Priority to DE60325626T priority patent/DE60325626D1/en
Priority to JP2004544119A priority patent/JP4986399B2/en
Priority to US10/531,419 priority patent/US7270510B2/en
Priority to AU2003294674A priority patent/AU2003294674A1/en
Publication of WO2004036628A2 publication Critical patent/WO2004036628A2/en
Publication of WO2004036628A3 publication Critical patent/WO2004036628A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/38—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations with angular orientation of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Automatic Disk Changers (AREA)

Abstract

Disclosed is an apparatus for treating wafer-shaped articles comprising at least one linear arranged array of a plurality of at least two process units wherein in each such process unit one single wafer-shaped article can be treated, a cassette-holding unit for holding at least one cassette storing at least one wafer-shaped article therein and a transport system for picking a wafer-shaped article from a cassette and placing it into one of a process unit. The apparatus comprises a transport unit movably mounted on a linear track. Said transport unit comprising at least one holding means for holding a single wafer-shaped article in a substantially vertical plane parallel to the linear track.
PCT/EP2003/011178 2002-10-16 2003-10-09 Device and method for transporting wafer-shaped articles Ceased WO2004036628A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020107029022A KR101276785B1 (en) 2002-10-16 2003-10-09 Device and Method for Transporting Wafer-Shaped Articles
EP03785610A EP1554748B1 (en) 2002-10-16 2003-10-09 Device for transporting wafer-shaped articles
DE60325626T DE60325626D1 (en) 2002-10-16 2003-10-09 DEVICE FOR TRANSPORTING DISKED OBJECTS
JP2004544119A JP4986399B2 (en) 2002-10-16 2003-10-09 Apparatus and method for transporting wafer shaped articles
US10/531,419 US7270510B2 (en) 2002-10-16 2003-10-09 Device and method for transporting wafer-shaped articles
AU2003294674A AU2003294674A1 (en) 2002-10-16 2003-10-09 Device and method for transporting wafer-shaped articles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT15652002 2002-10-16
ATA1565/2002 2002-10-16

Publications (2)

Publication Number Publication Date
WO2004036628A2 WO2004036628A2 (en) 2004-04-29
WO2004036628A3 true WO2004036628A3 (en) 2004-07-01

Family

ID=32097256

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/011178 Ceased WO2004036628A2 (en) 2002-10-16 2003-10-09 Device and method for transporting wafer-shaped articles

Country Status (10)

Country Link
US (1) US7270510B2 (en)
EP (1) EP1554748B1 (en)
JP (2) JP4986399B2 (en)
KR (2) KR101276785B1 (en)
CN (1) CN100369185C (en)
AT (1) ATE419645T1 (en)
AU (1) AU2003294674A1 (en)
DE (1) DE60325626D1 (en)
TW (1) TWI262165B (en)
WO (1) WO2004036628A2 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101024789B1 (en) 2003-12-03 2011-03-24 주식회사 하이닉스반도체 Transistor Formation Method of Semiconductor Device
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
CN101390197B (en) * 2006-02-22 2011-02-23 株式会社荏原制作所 Substrate processing device, substrate transfer device, substrate holding device, and chemical solution processing device
US7901539B2 (en) * 2006-09-19 2011-03-08 Intevac, Inc. Apparatus and methods for transporting and processing substrates
DE102006049488A1 (en) * 2006-10-17 2008-04-30 Höllmüller Maschinenbau GmbH Flat, fragile silicon substrate e.g. silicon wafer, treatment e.g. rinsing and drying treatment, device for semiconductor and solar industry, has side guiding device gripping edge of substrates and provided with side guiding rollers
JP4744426B2 (en) * 2006-12-27 2011-08-10 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP4726776B2 (en) * 2006-12-27 2011-07-20 大日本スクリーン製造株式会社 Inversion apparatus and substrate processing apparatus having the same
JP2008172062A (en) * 2007-01-12 2008-07-24 Murata Mach Ltd Article supply device
JP2008172160A (en) * 2007-01-15 2008-07-24 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate processing method
US20080310939A1 (en) * 2007-06-15 2008-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for use in a lithography tool
US20090162170A1 (en) * 2007-12-19 2009-06-25 Asm Japan K.K. Tandem type semiconductor-processing apparatus
JP4980978B2 (en) * 2008-04-17 2012-07-18 大日本スクリーン製造株式会社 Substrate processing equipment
EP2298959A4 (en) * 2008-06-06 2014-08-13 Ulvac Inc FILM FORMING APPARATUS
JP4757924B2 (en) * 2009-02-26 2011-08-24 東京エレクトロン株式会社 Substrate processing equipment
JP2011009362A (en) * 2009-06-24 2011-01-13 Tokyo Electron Ltd Imprint system, imprinting method, program, and computer storage medium
JP5060517B2 (en) * 2009-06-24 2012-10-31 東京エレクトロン株式会社 Imprint system
JP5657948B2 (en) * 2009-09-02 2015-01-21 キヤノンアネルバ株式会社 Vacuum processing apparatus and substrate transfer method
US8911554B2 (en) * 2010-01-05 2014-12-16 Applied Materials, Inc. System for batch processing of magnetic media
CN102859655A (en) * 2010-04-30 2013-01-02 应用材料公司 Vertical inline CVD system
US9169562B2 (en) * 2010-05-25 2015-10-27 Singulus Mocvd Gmbh I. Gr. Parallel batch chemical vapor deposition system
US9869021B2 (en) 2010-05-25 2018-01-16 Aventa Technologies, Inc. Showerhead apparatus for a linear batch chemical vapor deposition system
US9293356B2 (en) 2011-06-03 2016-03-22 Tel Nexx, Inc. Parallel single substrate processing system
JP5993625B2 (en) * 2012-06-15 2016-09-14 株式会社Ｓｃｒｅｅｎホールディングス Substrate reversing apparatus and substrate processing apparatus
US9099510B2 (en) * 2013-03-15 2015-08-04 Genmark Automation, Inc. Workpiece flipping mechanism for space-constrained environment
US9245783B2 (en) 2013-05-24 2016-01-26 Novellus Systems, Inc. Vacuum robot with linear translation carriage
JP6346509B2 (en) * 2014-07-07 2018-06-20 株式会社荏原製作所 Substrate processing apparatus and substrate transfer method
JP2017183665A (en) * 2016-03-31 2017-10-05 芝浦メカトロニクス株式会社 Substrate transport apparatus, substrate processing apparatus, and substrate processing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981408A (en) * 1989-12-18 1991-01-01 Varian Associates, Inc. Dual track handling and processing system
JP2000049206A (en) * 1998-07-28 2000-02-18 Dainippon Screen Mfg Co Ltd Substrate treating apparatus
JP2001274232A (en) * 2000-03-27 2001-10-05 Tokyo Electron Ltd Substrate processing equipment
US20020078892A1 (en) * 2000-12-27 2002-06-27 Nobuyuki Takahashi Substrate processing device and through-chamber

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970003907B1 (en) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 Substrate Processing Apparatus and Substrate Processing Method
JPH0917835A (en) * 1995-04-27 1997-01-17 Sony Corp How to convey flat work pieces
JPH1022359A (en) 1996-07-01 1998-01-23 Dainippon Screen Mfg Co Ltd Wafer conveyer
US6318951B1 (en) * 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
JP2000138276A (en) * 1998-10-30 2000-05-16 Tokyo Electron Ltd Substrate processing equipment
US6156580A (en) * 1998-11-18 2000-12-05 Advanced Micro Devices, Inc. Semiconductor wafer analysis system and method
JP2000260857A (en) * 1999-03-12 2000-09-22 Sumitomo Heavy Ind Ltd Wafer delivery method using wafer carrier robot, and wafer processing device
JP2001219391A (en) * 1999-12-01 2001-08-14 Ses Co Ltd Substrate reversing device and substrate washing system
US6488462B1 (en) * 2000-01-12 2002-12-03 Quantum Corporation Transport mechanism for a storage system
JP2002110609A (en) * 2000-10-02 2002-04-12 Tokyo Electron Ltd Cleaning equipment
US20020071756A1 (en) * 2000-12-13 2002-06-13 Gonzalez Jose R. Dual wafer edge gripping end effector and method therefor
US6494666B2 (en) * 2001-01-26 2002-12-17 Fortrend Engineering Corporation Simplified and enhanced SCARA arm
WO2003043060A2 (en) * 2001-11-13 2003-05-22 Fsi International, Inc. Reduced footprint tool for automated processing of substrates

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981408A (en) * 1989-12-18 1991-01-01 Varian Associates, Inc. Dual track handling and processing system
JP2000049206A (en) * 1998-07-28 2000-02-18 Dainippon Screen Mfg Co Ltd Substrate treating apparatus
JP2001274232A (en) * 2000-03-27 2001-10-05 Tokyo Electron Ltd Substrate processing equipment
US20020078892A1 (en) * 2000-12-27 2002-06-27 Nobuyuki Takahashi Substrate processing device and through-chamber

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14) *
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 02 2 April 2002 (2002-04-02) *

Also Published As

Publication number Publication date
TW200416188A (en) 2004-09-01
WO2004036628A2 (en) 2004-04-29
JP4986399B2 (en) 2012-07-25
EP1554748A2 (en) 2005-07-20
KR20050052539A (en) 2005-06-02
KR101028782B1 (en) 2011-04-14
EP1554748B1 (en) 2008-12-31
JP2012134533A (en) 2012-07-12
DE60325626D1 (en) 2009-02-12
KR101276785B1 (en) 2013-06-24
TWI262165B (en) 2006-09-21
CN100369185C (en) 2008-02-13
AU2003294674A1 (en) 2004-05-04
JP5367105B2 (en) 2013-12-11
CN1706024A (en) 2005-12-07
US20060008342A1 (en) 2006-01-12
ATE419645T1 (en) 2009-01-15
JP2006503428A (en) 2006-01-26
KR20110014663A (en) 2011-02-11
US7270510B2 (en) 2007-09-18

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