WO2004038468A3 - Optoelectronic package and fabrication method - Google Patents

Optoelectronic package and fabrication method Download PDF

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Publication number
WO2004038468A3
WO2004038468A3 PCT/US2003/033279 US0333279W WO2004038468A3 WO 2004038468 A3 WO2004038468 A3 WO 2004038468A3 US 0333279 W US0333279 W US 0333279W WO 2004038468 A3 WO2004038468 A3 WO 2004038468A3
Authority
WO
WIPO (PCT)
Prior art keywords
optical
substrate
polymer material
optoelectronic package
fabrication method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/033279
Other languages
French (fr)
Other versions
WO2004038468A2 (en
Inventor
Richard Joseph Saia
Thomas Bert Gorczyca
Christopher James Kapusta
Ernest Wayne Balch
Glenn Scott Claydon
Sahmita Dasgupta
Eladio Clemente Delgado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Priority to EP03776481A priority Critical patent/EP1556723B1/en
Priority to AU2003284300A priority patent/AU2003284300A1/en
Priority to JP2004546943A priority patent/JP2006504138A/en
Priority to DE60321702T priority patent/DE60321702D1/en
Publication of WO2004038468A2 publication Critical patent/WO2004038468A2/en
Publication of WO2004038468A3 publication Critical patent/WO2004038468A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active­side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.
PCT/US2003/033279 2002-10-21 2003-10-20 Optoelectronic package and fabrication method Ceased WO2004038468A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP03776481A EP1556723B1 (en) 2002-10-21 2003-10-20 Optoelectronic package and fabrication method
AU2003284300A AU2003284300A1 (en) 2002-10-21 2003-10-20 Optoelectronic package and fabrication method
JP2004546943A JP2006504138A (en) 2002-10-21 2003-10-20 Optoelectronic package and manufacturing method thereof
DE60321702T DE60321702D1 (en) 2002-10-21 2003-10-20 FEES

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/065,460 US6935792B2 (en) 2002-10-21 2002-10-21 Optoelectronic package and fabrication method
US10/065,460 2002-10-21

Publications (2)

Publication Number Publication Date
WO2004038468A2 WO2004038468A2 (en) 2004-05-06
WO2004038468A3 true WO2004038468A3 (en) 2004-06-17

Family

ID=32092196

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/033279 Ceased WO2004038468A2 (en) 2002-10-21 2003-10-20 Optoelectronic package and fabrication method

Country Status (7)

Country Link
US (1) US6935792B2 (en)
EP (1) EP1556723B1 (en)
JP (1) JP2006504138A (en)
CN (1) CN100403082C (en)
AU (1) AU2003284300A1 (en)
DE (1) DE60321702D1 (en)
WO (1) WO2004038468A2 (en)

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US6985645B2 (en) * 2003-09-24 2006-01-10 International Business Machines Corporation Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines
US7509011B2 (en) * 2004-01-15 2009-03-24 Poa Sana Liquidating Trust Hybrid waveguide
US7317742B2 (en) * 2004-02-19 2008-01-08 Sumitomo Electric Industries, Ltd. Optical sub-assembly having a thermo-electric cooler and an optical transceiver using the optical sub-assembly
US7267930B2 (en) * 2004-06-04 2007-09-11 National Semiconductor Corporation Techniques for manufacturing a waveguide with a three-dimensional lens
US7471865B2 (en) * 2004-06-04 2008-12-30 Poa Sana Liquidating Trust Apparatus and method for a molded waveguide for use with touch screen displays
JP2006189483A (en) * 2004-12-28 2006-07-20 Sumitomo Bakelite Co Ltd Optical waveguide forming substrate and its manufacturing method
US7642628B2 (en) * 2005-01-11 2010-01-05 Rosemount Inc. MEMS packaging with improved reaction to temperature changes
JP4760127B2 (en) * 2005-05-20 2011-08-31 住友ベークライト株式会社 Optical waveguide structure
US7551814B1 (en) 2006-02-21 2009-06-23 National Semiconductor Corporation Optical detection of user interaction based on external light source
US20080031584A1 (en) * 2006-08-02 2008-02-07 National Semiconductor Corporation Apparatus and method for a singulation of polymer waveguides using photolithography
US7369724B2 (en) 2006-10-03 2008-05-06 National Semiconductor Corporation Apparatus and method for an improved lens structure for polymer wave guides which maximizes free space light coupling
JP4825729B2 (en) * 2007-05-24 2011-11-30 日東電工株式会社 Optical waveguide device and manufacturing method thereof
US8138616B2 (en) * 2008-07-07 2012-03-20 Mediatek Inc. Bond pad structure
JP5272999B2 (en) * 2009-09-30 2013-08-28 凸版印刷株式会社 Optical substrate manufacturing method
US8488921B2 (en) * 2010-07-16 2013-07-16 International Business Machines Corporation Packaged multicore fiber optical transceiver module
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US8901576B2 (en) 2012-01-18 2014-12-02 International Business Machines Corporation Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer
KR20140120885A (en) 2012-01-31 2014-10-14 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. Combination underfill-dam and electrical-interconnect structure for an opto-electronic engine
KR20150020278A (en) * 2012-06-08 2015-02-25 호야 코포레이션 유에스에이 Submount for electronic, optoelectronic, optical, or photonic components
JP5989412B2 (en) * 2012-06-11 2016-09-07 新光電気工業株式会社 Optical module and optical module manufacturing method
US10094988B2 (en) 2012-08-31 2018-10-09 Micron Technology, Inc. Method of forming photonics structures
JP6319762B2 (en) * 2013-10-31 2018-05-09 日東電工株式会社 Opto-electric hybrid board and manufacturing method thereof
CN103762205B (en) * 2014-01-28 2017-02-01 华进半导体封装先导技术研发中心有限公司 Multifunctional base plate based on PCB technology and manufacturing method thereof
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US11131929B2 (en) 2018-11-07 2021-09-28 Waymo Llc Systems and methods that utilize angled photolithography for manufacturing light guide elements
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Also Published As

Publication number Publication date
AU2003284300A8 (en) 2004-05-13
AU2003284300A1 (en) 2004-05-13
EP1556723A2 (en) 2005-07-27
JP2006504138A (en) 2006-02-02
CN1723405A (en) 2006-01-18
WO2004038468A2 (en) 2004-05-06
DE60321702D1 (en) 2008-07-31
US20040076382A1 (en) 2004-04-22
CN100403082C (en) 2008-07-16
US6935792B2 (en) 2005-08-30
EP1556723B1 (en) 2008-06-18

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