WO2004051701A2 - A method for attaching chips to a transponder - Google Patents

A method for attaching chips to a transponder Download PDF

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Publication number
WO2004051701A2
WO2004051701A2 PCT/FI2003/000877 FI0300877W WO2004051701A2 WO 2004051701 A2 WO2004051701 A2 WO 2004051701A2 FI 0300877 W FI0300877 W FI 0300877W WO 2004051701 A2 WO2004051701 A2 WO 2004051701A2
Authority
WO
WIPO (PCT)
Prior art keywords
web
chips
transponder
cavities
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FI2003/000877
Other languages
French (fr)
Other versions
WO2004051701A3 (en
Inventor
Juhani STRÖMBERG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UPM Raflatac Oy
Original Assignee
Rafsec Oy
UPM Rafsec Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rafsec Oy, UPM Rafsec Oy filed Critical Rafsec Oy
Priority to AU2003282145A priority Critical patent/AU2003282145A1/en
Publication of WO2004051701A2 publication Critical patent/WO2004051701A2/en
Publication of WO2004051701A3 publication Critical patent/WO2004051701A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7432—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics

Definitions

  • the present invention relates to a method for supplying chips to cavities of a chip carrier web by allowing the chips to flow over the chip carrier web in a medium.
  • the present invention also relates to a method for attaching chips to transponders on a transponder web comprising successive and/or adjacent circuitry patterns, or to a structural part web, from which structural parts are separated and attached to the transponder web.
  • transponders refer to cards, tags, labels, and the like comprising an RF-ID circuit (identification).
  • a reader device and the transponder are coupled inductively.
  • the transponder is used for the retail logistics and the supply chain management.
  • Such a transponder can also be used for example as an electrical purse, as a ticket in public service vehicles, or for personal identification.
  • a base material of the transponder may be plastic or paper.
  • a circuitry pattern and an integrated circuit on a chip are located on the base material.
  • transponders having an antenna based on the dipole antenna technique and an electric coupling belong to the scope of the invention.
  • a general technique to attach a chip on a substrate is to use a so-called flip-chip technology.
  • the flip-chip technology includes several sub-techniques but their common feature is that the chip is taken from a wafer by a tool, the tool is turned and the chip is attached to the substrate in such a manner that an active surface of the chip is against the substrate.
  • the active surface means the surface having electrical contacts for connecting the chip to the circuitry pattern.
  • chips which are delivered as separate single chips are called shaped blocks.
  • the shaped blocks may have smaller dimensions than the chips to be separated from a wafer.
  • the chips shall be arranged so that they all have the active surface on the same side.
  • the flip-chip technology is too slow, and restricts the manufacturing capacity. Even if high investments are made to enhance the technology a satisfying level is not achieved. Further, when using the flip-chip technology, the surface on which the tool is arranged to grip must not be the active surface.
  • the chips when the chips have a shape of a truncated pyramid, their active surface are on the lower surface of the pyramid, in other words, on the surface having a larger area. Otherwise the chip has to be turned once again before attaching to the substrate.
  • the easiest way to arrange the chips is to arrange them the active surface upwards.
  • a known technique for supplying chips to cavities of a chip carrier substrate is a fluidic self assembly.
  • the technique is described for example in the publications US 6,274,508 and US 6,281 ,038.
  • the method consists of suspending chips in a liquid, and allowing the chips flow across a substrate surface. As the chips pass over the substrate surface they drop into correspondingly shaped holes.
  • a drawback of this method is the use of the liquid, which is not the most convenient way to handle chips during a continuous manufacturing process.
  • the method for supplying chips is characterized in that the medium is a gas.
  • the method for attaching chips is characterized in that the chips, which are located in cavities of a chip carrier web, are attached to precise locations on the transponder web, or the structural part web by bringing the transponder web, or the structural part web and the chips in contact with each other in a nip.
  • the chips By using the method for supplying chips, the chips can be placed in the cavities of the chip carrier substrate, and thus the chips are surely in a right location. No extra orientation check is required.
  • the method for attaching chips is an easy and time-saving way to attach the chips to the transponders because no additional turning operations or tools are needed. The both methods are suitable for rapid production rates.
  • transponders refer to transponders comprising an RF-ID circuit (identification).
  • the transponder web comprising successive and/or adjacent transponders can be formed in a continuous process.
  • the transponder web is a web that is flexible but still has a suitable rigidity.
  • the circuitry pattern can be manufactured for example by printing the circuitry pattern with an electroconductive printing ink on a film, by electroplating (a conductive ink is first printed on a substrate, and then a layer is formed on the ink layer by electrolysis), by etching the circuitry pattern on a metal film, by punching the circuitry pattern from a metal film, or by winding the circuitry pattern of for example copper wire.
  • the circuitry pattern is formed by electroplating.
  • the electrically operating RFID (radio frequency identification) circuit of the transponder is an electric oscillating circuit (RCL circuit) operating at a determined frequency.
  • the circuit consists of an antenna, a capacitor, and an integrated circuit on a chip.
  • the antenna may be a coil, or an antenna based on the dipole antenna technique.
  • the shape of the chip can vary.
  • the chip may have a shape of a truncated pyramid, which active side is on the lower surface of the pyramid, in other words, it is on that surface which has a larger surface area.
  • the integrated circuit comprises an escort memory and an RF part, which is arranged to communicate with a reader device.
  • the capacitor of the RCL circuit can be integrated in the chip or it can be located outside the chip.
  • transponders comprising the shaped blocks
  • two sequential process steps are required, namely supplying the chips to the chip carrier substrate, and attaching the chips to the transponders on the transponder web.
  • the chip instead of attaching the chip to the circuitry pattern on the transponder web, it is possible to attach the chip first to a structural part on a structural part web, and after that attach the structural part to the circuitry pattern in such a way that the circuitry pattern and the chip are connected electrically.
  • the ready transponder is formed from two parts, namely the basic label and the structural part, which are attached to each other.
  • a third process step which is separating the structural parts from the structural part web, and attaching them to the transponder web.
  • the chip carrier substrate is preferably an endless web, which rotates around guiding rolls.
  • the web is preferably of metal.
  • the metallic web which thickness is preferably 50 - 150 ⁇ m, has been engraved successive cavities, which are compatible with the shaped blocks.
  • the cavities do not necessarily have the same shape and size as the shaped blocks;
  • the main purpose is to control the location of the active surface.
  • the shaped blocks may have two active surfaces. For example, there may be an active surface in contact with the bottom of the cavity and an active surface on the top, or two active surfaces in contact with the side walls of the cavity.
  • the cavities may have the same shape and enlarge upwards.
  • the cavities and the surface of the web are coated by a non-sticking material, for example polytetrafluoroethylene (PTFE), to enhance a separation of the chip from the web in a suitable process step.
  • a non-sticking material for example polytetrafluoroethylene (PTFE)
  • the depth of the cavity is chosen so, that the cavity is 10 - 20 ⁇ m lower than the height of the chip.
  • the web comprises successive and/or adjacent cavities.
  • the width of the metallic web is preferably 50 - 2000 mm.
  • the length of the metallic web is preferably 500 - 2000 mm.
  • the metallic web is arranged to be an endless belt, which is guided by differences in pressure, such as suction and/or blowing.
  • the chips are supplied on the metallic web in a continuous manner, and the surface of the web is flushed by a gas stream, for example an air stream, to distribute the chips in the cavities.
  • a gas stream for example an air stream
  • the plane of the metallic web is preferably inclined, thus causing the chips to drop into the cavities more easily.
  • the surface of the metallic web may have different properties in different locations.
  • the surface region, which is located near the cavity may have a lower coefficient of friction than the other parts of the surface. On one hand, this arrangement assists the chip to drop into the cavity, and on the other hand prevents the chip to slip further from the cavity.
  • the cavities are provided with tiny holes through which a pressure differing from the pressure prevailing at the chip carrier web is arranged to exert.
  • the pressure may be a positive or a negative pressure, preferably it is the negative pressure.
  • the negative pressure is produced underneath the metallic web for example by using suction rolls as the guiding rolls of the metallic web or another suitable vacuum device. The difference in pressure and the gravity hold the chips in the cavities.
  • the shaped blocks which are located in the cavities of the metallic web, are attached to the circuitry patterns of the transponders on the transponder web in a continuous process.
  • the position where the chip is to be located has been pre- treated with a suitable adhesive material, such as a conductive hot melt adhesive, a non-conductive polymer paste or an anisotropically conductive paste, to adhere the chip.
  • a suitable adhesive material such as a conductive hot melt adhesive, a non-conductive polymer paste or an anisotropically conductive paste
  • the transponder web is entirely or partly covered with an adhesive film, such as an anisotropic or non-conductive adhesive film.
  • the adhesive films can be thermosetting, thermoplastic, or a hybrid of those two.
  • the chips are released from the cavities by a difference in pressure, for example with a help of a positive pressure blown through the tiny holes in the cavities.
  • a gas flow is arranged to prevent loose chips to adhere to the transponder web.
  • the alignment of the chip In the cross-direction of the metallic web, the alignment of the chip must be precise but in the machine direction some variation is allowed.
  • a movement of the transponder web and a movement of the metallic web are made compatible with each other, i.e. speeds of the both webs can be synchronized so that the chip can be placed accurately to the right location on the circuitry pattern.
  • the transponder web can be laminated with a suitable layer to protect the integrated circuits on the chips and the circuitry patterns.
  • Surroundings of the chip may be coated with a reactive adhesive and after that the web may be laminated with a plastic film.
  • Another possibility is to laminate a perforated adhesive film on the web and after that laminate a continuous film on the transponder web.
  • Fig.1. shows one embodiment of a chip carrier substrate with chips in a cross-sectional view
  • Fig.2. shows a single smart label in a top view
  • Fig.3. shows a process according to the invention in a side view.
  • Figure 1 shows a chip having a shape of a truncated pyramid in a cavity of a chip carrier substrate in a cross-sectional view (rasters are left out to maintain clarity).
  • the chip 2 is located in a correspondingly shaped cavity 5 of an endless web 4.
  • a tiny hole 7 is in the bottom of the cavity 5.
  • a negative pressure exerts through the hole 7, thus keeping the chip 2 in the cavity 7.
  • the active side 6 of the chip is up when the chip 2 is transferred with the web 4.
  • the height of the cavity 5 is lower than that of the chip 2, so the chip 2 protrudes from the plane of the web 4.
  • FIG. 2 shows a single smart label in a top view.
  • a smart label web 1 is a continuous web which contains circuitry patterns 3, each having an integrated circuit on a chip 2, at suitable spaces one after another and/or next to each other.
  • the circuitry pattern 3 can be made by printing the circuitry pattern on a film with an electroconductive printing ink, by etching the circuitry pattern on a metal film, by punching the circuitry pattern off a metal film, or by winding the circuitry pattern of e.g. a copper wire.
  • the circuitry pattern is provided with an identification circuit, such as a radio frequency identification (RFID) circuit.
  • RFID radio frequency identification
  • the identification circuit is a simple electric oscillating circuit (RCL circuit) tuned to operate at a defined frequency.
  • the circuit consists of a coil, a capacitor, and a circuit integrated on a chip, consisting of an escort memory and an RF part for communication with a reader device.
  • the capacitor of the RCL circuit can also be integrated on the chip or the capacitor/s can be located outside the chip.
  • FIG. 3 shows a process according to the invention in a side view.
  • the smart label web 1 comprising single smart labels moves ahead in the process line.
  • the endless metallic web 4 comprising cavities including chips moves towards the smart label web 1.
  • the movement of the smart label web 1 and the endless metallic web 4 is synchronized in such a manner that an attachment of a chip to a precise location of the smart label is possible.
  • the chips 2 are brought on the metallic web 4 from a dispenser 8 in a continuous manner and supplied into the cavities 5 by using air streams from a blower 9 and sucking caused by the negative pressure through the holes 7.
  • the negative pressure is created by a vacuum device 10.
  • the chips 2 place themselves in the cavities 5 in such a way that their active surfaces are upwards.
  • the cavities 5 of the metallic web 4 may be arranged so that they form zones in the machine direction. Thus the synchronizing of the movement of the metallic web 4 with the smart label web 1 is easier.
  • Suitable adhesive material for adhering the chip for example a piece of a tape, a hot melt adhesive, or an adhesive film, is placed on the smart label before attaching the chip.
  • the smart label may be heated to enhance the adhering properties of the adhesive material by a heater 11.
  • the chips 2 protruding from the cavities 5 are brought in contact with the smart label web 1 , and hence the chips 2 adhere to the adhesive material on the smart label.
  • the chip is bonded to the circuitry pattern of the smart label in nips N1 and N2.
  • the nips are preferably formed between the metallic web and a roll. The pressure in the nips can be adjusted for example by controlling the tension of the smart label web 1.
  • the smart label web may be laminated with a cover web 12 in a nip N3, which protects the circuitry pattern 3 and the chip 2 against environmental conditions.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The present invention relates to a method for supplying chips (2) to cavities (5) of a chip carrier web (4) by allowing the chips (2) to flow over the chip carrier web (4) in a medium. The medium is a gas. The presentinvention also relates to a method for attaching chips (2) to transponders on a transponder web (1)comprising successive and/or adjacent circuitry patterns (3), or to a structural part web, from which structuralparts are separated and attached to the transponder web. The chips (2), which are located in cavities (5) of achip carrier web (4), are attached to precise locations on the transponder web (1), or the structural part web by bringing the transponder web (1), or the structural part web and the chips (2) in contact with each other in a nip (N1).

Description

A method for attaching chips to a transponder
The present invention relates to a method for supplying chips to cavities of a chip carrier web by allowing the chips to flow over the chip carrier web in a medium. The present invention also relates to a method for attaching chips to transponders on a transponder web comprising successive and/or adjacent circuitry patterns, or to a structural part web, from which structural parts are separated and attached to the transponder web.
In the present application, transponders refer to cards, tags, labels, and the like comprising an RF-ID circuit (identification). A reader device and the transponder are coupled inductively. Typically the transponder is used for the retail logistics and the supply chain management. Such a transponder can also be used for example as an electrical purse, as a ticket in public service vehicles, or for personal identification. A base material of the transponder may be plastic or paper. A circuitry pattern and an integrated circuit on a chip are located on the base material. In addition to the transponders having the inductive coupling to the reader device, also transponders having an antenna based on the dipole antenna technique and an electric coupling belong to the scope of the invention.
A general technique to attach a chip on a substrate is to use a so- called flip-chip technology. The flip-chip technology includes several sub-techniques but their common feature is that the chip is taken from a wafer by a tool, the tool is turned and the chip is attached to the substrate in such a manner that an active surface of the chip is against the substrate. In this context, the active surface means the surface having electrical contacts for connecting the chip to the circuitry pattern.
In this application, chips, which are delivered as separate single chips are called shaped blocks. The shaped blocks may have smaller dimensions than the chips to be separated from a wafer. When the shaped blocks are concerned, it is cumbersome to use the flip-chip technology. To attach the chips to the substrate, the chips shall be arranged so that they all have the active surface on the same side. The flip-chip technology is too slow, and restricts the manufacturing capacity. Even if high investments are made to enhance the technology a satisfying level is not achieved. Further, when using the flip-chip technology, the surface on which the tool is arranged to grip must not be the active surface. For example, when the chips have a shape of a truncated pyramid, their active surface are on the lower surface of the pyramid, in other words, on the surface having a larger area. Otherwise the chip has to be turned once again before attaching to the substrate. However, due to the shape of the truncated pyramid of the chip, the easiest way to arrange the chips is to arrange them the active surface upwards.
A known technique for supplying chips to cavities of a chip carrier substrate is a fluidic self assembly. The technique is described for example in the publications US 6,274,508 and US 6,281 ,038. The method consists of suspending chips in a liquid, and allowing the chips flow across a substrate surface. As the chips pass over the substrate surface they drop into correspondingly shaped holes. A drawback of this method is the use of the liquid, which is not the most convenient way to handle chips during a continuous manufacturing process.
Another known technique is a vibratory assembly concept by Philips. Chips are fed to a vibratory feeder, which is able to turn the chips to a right position. The chips are then dropped to cavities, which are located on a surface of a vacuum cylinder. The successive cavities form a row of the cavities. Each row is provided with a vibratory dispenser, which dispenses the chips into the cavities. There is also an orientation check unit for each row, which controls that the chips are positioned right. Drawbacks of this method are a capacity of the process, and the need for the orientation check for each row, which makes the process complex.
Methods of the invention are aimed to overcome the above mentioned problems. The method for supplying chips is characterized in that the medium is a gas. The method for attaching chips is characterized in that the chips, which are located in cavities of a chip carrier web, are attached to precise locations on the transponder web, or the structural part web by bringing the transponder web, or the structural part web and the chips in contact with each other in a nip.
By using the method for supplying chips, the chips can be placed in the cavities of the chip carrier substrate, and thus the chips are surely in a right location. No extra orientation check is required. The method for attaching chips is an easy and time-saving way to attach the chips to the transponders because no additional turning operations or tools are needed. The both methods are suitable for rapid production rates.
In the present application, transponders refer to transponders comprising an RF-ID circuit (identification). The transponder web comprising successive and/or adjacent transponders can be formed in a continuous process. The transponder web is a web that is flexible but still has a suitable rigidity. The circuitry pattern can be manufactured for example by printing the circuitry pattern with an electroconductive printing ink on a film, by electroplating (a conductive ink is first printed on a substrate, and then a layer is formed on the ink layer by electrolysis), by etching the circuitry pattern on a metal film, by punching the circuitry pattern from a metal film, or by winding the circuitry pattern of for example copper wire. Typically the circuitry pattern is formed by electroplating.
The electrically operating RFID (radio frequency identification) circuit of the transponder is an electric oscillating circuit (RCL circuit) operating at a determined frequency. The circuit consists of an antenna, a capacitor, and an integrated circuit on a chip. The antenna may be a coil, or an antenna based on the dipole antenna technique. The shape of the chip can vary. The chip may have a shape of a truncated pyramid, which active side is on the lower surface of the pyramid, in other words, it is on that surface which has a larger surface area. The integrated circuit comprises an escort memory and an RF part, which is arranged to communicate with a reader device. Also the capacitor of the RCL circuit can be integrated in the chip or it can be located outside the chip. To manufacture transponders comprising the shaped blocks, two sequential process steps are required, namely supplying the chips to the chip carrier substrate, and attaching the chips to the transponders on the transponder web. Instead of attaching the chip to the circuitry pattern on the transponder web, it is possible to attach the chip first to a structural part on a structural part web, and after that attach the structural part to the circuitry pattern in such a way that the circuitry pattern and the chip are connected electrically. In other words, the ready transponder is formed from two parts, namely the basic label and the structural part, which are attached to each other. In the above- mentioned embodiment is required a third process step, which is separating the structural parts from the structural part web, and attaching them to the transponder web.
The chip carrier substrate is preferably an endless web, which rotates around guiding rolls. The web is preferably of metal. In the metallic web, which thickness is preferably 50 - 150 μm, has been engraved successive cavities, which are compatible with the shaped blocks. The cavities do not necessarily have the same shape and size as the shaped blocks; The main purpose is to control the location of the active surface. In addition to one active surface, the shaped blocks may have two active surfaces. For example, there may be an active surface in contact with the bottom of the cavity and an active surface on the top, or two active surfaces in contact with the side walls of the cavity. In the case of chips having the shape of the truncated pyramid, the cavities may have the same shape and enlarge upwards. The cavities and the surface of the web are coated by a non-sticking material, for example polytetrafluoroethylene (PTFE), to enhance a separation of the chip from the web in a suitable process step. The depth of the cavity is chosen so, that the cavity is 10 - 20 μm lower than the height of the chip. The web comprises successive and/or adjacent cavities. The width of the metallic web is preferably 50 - 2000 mm. The length of the metallic web is preferably 500 - 2000 mm. In use, the metallic web is arranged to be an endless belt, which is guided by differences in pressure, such as suction and/or blowing. The chips are supplied on the metallic web in a continuous manner, and the surface of the web is flushed by a gas stream, for example an air stream, to distribute the chips in the cavities. The plane of the metallic web is preferably inclined, thus causing the chips to drop into the cavities more easily.
In addition, the surface of the metallic web may have different properties in different locations. The surface region, which is located near the cavity may have a lower coefficient of friction than the other parts of the surface. On one hand, this arrangement assists the chip to drop into the cavity, and on the other hand prevents the chip to slip further from the cavity.
The cavities are provided with tiny holes through which a pressure differing from the pressure prevailing at the chip carrier web is arranged to exert. The pressure may be a positive or a negative pressure, preferably it is the negative pressure. The negative pressure is produced underneath the metallic web for example by using suction rolls as the guiding rolls of the metallic web or another suitable vacuum device. The difference in pressure and the gravity hold the chips in the cavities.
In the process according to the invention, the shaped blocks, which are located in the cavities of the metallic web, are attached to the circuitry patterns of the transponders on the transponder web in a continuous process. The position where the chip is to be located has been pre- treated with a suitable adhesive material, such as a conductive hot melt adhesive, a non-conductive polymer paste or an anisotropically conductive paste, to adhere the chip. There is also a possibility that the transponder web is entirely or partly covered with an adhesive film, such as an anisotropic or non-conductive adhesive film. The adhesive films can be thermosetting, thermoplastic, or a hybrid of those two.
The chips are released from the cavities by a difference in pressure, for example with a help of a positive pressure blown through the tiny holes in the cavities. A gas flow is arranged to prevent loose chips to adhere to the transponder web. In the cross-direction of the metallic web, the alignment of the chip must be precise but in the machine direction some variation is allowed. A movement of the transponder web and a movement of the metallic web are made compatible with each other, i.e. speeds of the both webs can be synchronized so that the chip can be placed accurately to the right location on the circuitry pattern.
After attaching the chips to the circuitry patterns, the transponder web can be laminated with a suitable layer to protect the integrated circuits on the chips and the circuitry patterns. Surroundings of the chip may be coated with a reactive adhesive and after that the web may be laminated with a plastic film. Another possibility is to laminate a perforated adhesive film on the web and after that laminate a continuous film on the transponder web.
In the following, the methods of the invention are described with figures. In the figures,
Fig.1. shows one embodiment of a chip carrier substrate with chips in a cross-sectional view,
Fig.2. shows a single smart label in a top view, and
Fig.3. shows a process according to the invention in a side view.
Figure 1 shows a chip having a shape of a truncated pyramid in a cavity of a chip carrier substrate in a cross-sectional view (rasters are left out to maintain clarity). The chip 2 is located in a correspondingly shaped cavity 5 of an endless web 4. A tiny hole 7 is in the bottom of the cavity 5. A negative pressure exerts through the hole 7, thus keeping the chip 2 in the cavity 7. The active side 6 of the chip is up when the chip 2 is transferred with the web 4. The height of the cavity 5 is lower than that of the chip 2, so the chip 2 protrudes from the plane of the web 4.
Figure 2 shows a single smart label in a top view. A smart label web 1 is a continuous web which contains circuitry patterns 3, each having an integrated circuit on a chip 2, at suitable spaces one after another and/or next to each other. The circuitry pattern 3 can be made by printing the circuitry pattern on a film with an electroconductive printing ink, by etching the circuitry pattern on a metal film, by punching the circuitry pattern off a metal film, or by winding the circuitry pattern of e.g. a copper wire. The circuitry pattern is provided with an identification circuit, such as a radio frequency identification (RFID) circuit. The identification circuit is a simple electric oscillating circuit (RCL circuit) tuned to operate at a defined frequency. The circuit consists of a coil, a capacitor, and a circuit integrated on a chip, consisting of an escort memory and an RF part for communication with a reader device. The capacitor of the RCL circuit can also be integrated on the chip or the capacitor/s can be located outside the chip.
Figure 3 shows a process according to the invention in a side view. The smart label web 1 comprising single smart labels moves ahead in the process line. The endless metallic web 4 comprising cavities including chips moves towards the smart label web 1. The movement of the smart label web 1 and the endless metallic web 4 is synchronized in such a manner that an attachment of a chip to a precise location of the smart label is possible.
The chips 2 are brought on the metallic web 4 from a dispenser 8 in a continuous manner and supplied into the cavities 5 by using air streams from a blower 9 and sucking caused by the negative pressure through the holes 7. The negative pressure is created by a vacuum device 10. The chips 2 place themselves in the cavities 5 in such a way that their active surfaces are upwards. The cavities 5 of the metallic web 4 may be arranged so that they form zones in the machine direction. Thus the synchronizing of the movement of the metallic web 4 with the smart label web 1 is easier.
Suitable adhesive material for adhering the chip, for example a piece of a tape, a hot melt adhesive, or an adhesive film, is placed on the smart label before attaching the chip. The smart label may be heated to enhance the adhering properties of the adhesive material by a heater 11.
The chips 2 protruding from the cavities 5 are brought in contact with the smart label web 1 , and hence the chips 2 adhere to the adhesive material on the smart label. The chip is bonded to the circuitry pattern of the smart label in nips N1 and N2. The nips are preferably formed between the metallic web and a roll. The pressure in the nips can be adjusted for example by controlling the tension of the smart label web 1. The smart label web may be laminated with a cover web 12 in a nip N3, which protects the circuitry pattern 3 and the chip 2 against environmental conditions.
The invention is not restricted to the description above, but the invention may vary within the scope of the claims.

Claims

Claims:
1. A method for supplying chips (2) to cavities (5) of a chip carrier web (4) by allowing the chips (2) to flow over the chip carrier web (4) in a medium, characterized in that the medium is a gas.
2. The method according to claim 1 , characterized in that the chips (2) are supplied on a surface of the chip carrier web (4), and a gas stream is directed to the chips to move them along the chip carrier web (4) in such a manner that the chips are forced to drop into the cavities (5).
3. The method according to claim 1 or 2, characterized in that the chips (2) are held in the cavities (5) by a difference in pressure.
4. A method for attaching chips (2) to transponders on a transponder web (1) comprising successive and/or adjacent circuitry patterns (3), or to a structural part web, from which structural parts are separated and attached to the transponder web, characterized in that the chips (2), which are located in cavities (5) of a chip carrier web (4), are attached to precise locations on the transponder web (1), or the structural part web by bringing the transponder web (1), or the structural part web and the chips (2) in contact with each other in a nip (N1).
5. The method according to claim 4, characterized in that the speeds of the transponder web (1), or the structural part web and the chip carrier web (4) are synchronized.
6. The method according to claim 4 or 5, characterized in that the chips (2) are held in the cavities (5) by a difference in pressure.
7. The method according to any preceding claim 4 - 6, characterized in that the chips (2) are released from the cavities (5) by a difference in pressure.
8. The method according to any preceding claim 4 - 7, characterized in that the nip (N1) is formed between a roll and the chip carrier web (4).
PCT/FI2003/000877 2002-11-29 2003-11-18 A method for attaching chips to a transponder Ceased WO2004051701A2 (en)

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FI20022107A FI20022107L (en) 2002-11-29 2002-11-29 Method for attaching chips to a transponder

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WO2007060631A1 (en) 2005-11-28 2007-05-31 Nxp B.V. A method of producing a transponder and a transponder
EP2355145A1 (en) 2010-02-10 2011-08-10 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Pressure assisted self targeting assembly
CN113165372A (en) * 2018-12-03 2021-07-23 捷德货币技术有限责任公司 Applying and fixing a defined number of individual elements to a base web

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
JP2002536695A (en) * 1999-02-05 2002-10-29 エイリアン・テクノロジイ・コーポレーション Apparatus and method for forming an assembly
US6281038B1 (en) * 1999-02-05 2001-08-28 Alien Technology Corporation Methods for forming assemblies

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007060631A1 (en) 2005-11-28 2007-05-31 Nxp B.V. A method of producing a transponder and a transponder
EP1966743B1 (en) * 2005-11-28 2011-02-16 Nxp B.V. A method of producing a transponder and a transponder
US8968510B2 (en) 2005-11-28 2015-03-03 Nxp B.V. Method of producing a transponder and a transponder
US9779349B2 (en) 2005-11-28 2017-10-03 Nxp B.V. Method of producing a transponder and a transponder
EP2355145A1 (en) 2010-02-10 2011-08-10 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Pressure assisted self targeting assembly
WO2011099848A2 (en) 2010-02-10 2011-08-18 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Pressure assisted self targeting assembly
WO2011099848A3 (en) * 2010-02-10 2012-10-26 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Air flow assisted chip self-assembly
CN113165372A (en) * 2018-12-03 2021-07-23 捷德货币技术有限责任公司 Applying and fixing a defined number of individual elements to a base web

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WO2004051701A3 (en) 2004-11-11
AU2003282145A1 (en) 2004-06-23
FI20022107A0 (en) 2002-11-29
FI20022107L (en) 2004-05-30
AU2003282145A8 (en) 2004-06-23

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