WO2004054342A3 - Method, system and apparatus for cooling high power density devices - Google Patents

Method, system and apparatus for cooling high power density devices Download PDF

Info

Publication number
WO2004054342A3
WO2004054342A3 PCT/US2003/037738 US0337738W WO2004054342A3 WO 2004054342 A3 WO2004054342 A3 WO 2004054342A3 US 0337738 W US0337738 W US 0337738W WO 2004054342 A3 WO2004054342 A3 WO 2004054342A3
Authority
WO
WIPO (PCT)
Prior art keywords
power density
high power
cooling high
density devices
turbomachine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/037738
Other languages
French (fr)
Other versions
WO2004054342A2 (en
Inventor
Mehmet Arik
Chellappa Balan
Warren Bessler
Michael Bowman
Ronald Bunker
Charles Byrd
William Gerstler
Nirm Nirmalan
Daniel Smith
Todd Wetzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Priority to AU2003293073A priority Critical patent/AU2003293073A1/en
Priority to JP2004559173A priority patent/JP2006509370A/en
Priority to EP03790065A priority patent/EP1570521B1/en
Priority to DE60326877T priority patent/DE60326877D1/en
Priority to CA2507651A priority patent/CA2507651C/en
Publication of WO2004054342A2 publication Critical patent/WO2004054342A2/en
Publication of WO2004054342A3 publication Critical patent/WO2004054342A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F25B1/04—Compression machines, plants or systems with non-reversible cycle with compressor of rotary type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2341/00—Details of ejectors not being used as compression device; Details of flow restrictors or expansion valves
    • F25B2341/001—Ejectors not being used as compression device
    • F25B2341/0014—Ejectors with a high pressure hot primary flow from a compressor discharge
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/01—Geometry problems, e.g. for reducing size
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B31/00—Compressor arrangements
    • F25B31/006—Cooling of compressor or motor

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)

Abstract

A turbomachinery system (200) for cooling a high power density device (220) includes a turbomachine (300, 405, 505) configured to deliver a high flux cooling medium and a high power density device (220) arranged in fluid communication with the turbomachine (300, 405, 505), the turbomachine (300, 405, 505) having a motor (310) and a compressor (340) driven by the motor (310).
PCT/US2003/037738 2002-12-06 2003-11-24 Method, system and apparatus for cooling high power density devices Ceased WO2004054342A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU2003293073A AU2003293073A1 (en) 2002-12-06 2003-11-24 Method, system and apparatus for cooling high power density devices
JP2004559173A JP2006509370A (en) 2002-12-06 2003-11-24 Method, system and apparatus for cooling high power density devices
EP03790065A EP1570521B1 (en) 2002-12-06 2003-11-24 Method, system and apparatus for cooling high power density devices
DE60326877T DE60326877D1 (en) 2002-12-06 2003-11-24 METHOD, SYSTEM AND DEVICE FOR COOLING INTEGRATED HIGH-PERFORMANCE DEVICES
CA2507651A CA2507651C (en) 2002-12-06 2003-11-24 Method, system and apparatus for cooling high power density devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/065,985 2002-12-06
US10/065,985 US20040107718A1 (en) 2002-12-06 2002-12-06 Method, system and apparatus for cooling high power density devices

Publications (2)

Publication Number Publication Date
WO2004054342A2 WO2004054342A2 (en) 2004-06-24
WO2004054342A3 true WO2004054342A3 (en) 2004-12-09

Family

ID=32467275

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/037738 Ceased WO2004054342A2 (en) 2002-12-06 2003-11-24 Method, system and apparatus for cooling high power density devices

Country Status (9)

Country Link
US (2) US20040107718A1 (en)
EP (1) EP1570521B1 (en)
JP (1) JP2006509370A (en)
CN (2) CN1914968B (en)
AT (2) ATE511620T1 (en)
AU (1) AU2003293073A1 (en)
CA (1) CA2507651C (en)
DE (1) DE60326877D1 (en)
WO (1) WO2004054342A2 (en)

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Also Published As

Publication number Publication date
AU2003293073A8 (en) 2004-06-30
AU2003293073A1 (en) 2004-06-30
EP1570521B1 (en) 2009-03-25
ATE426919T1 (en) 2009-04-15
CN1914968A (en) 2007-02-14
CA2507651C (en) 2014-04-29
ATE511620T1 (en) 2011-06-15
CN1745475A (en) 2006-03-08
CN1914968B (en) 2010-10-06
US7010930B2 (en) 2006-03-14
DE60326877D1 (en) 2009-05-07
US20040221603A1 (en) 2004-11-11
CN100547771C (en) 2009-10-07
US20040107718A1 (en) 2004-06-10
JP2006509370A (en) 2006-03-16
CA2507651A1 (en) 2004-06-24
WO2004054342A2 (en) 2004-06-24
EP1570521A2 (en) 2005-09-07

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