WO2004077578A3 - Beleuchtungsmodul auf leuchtdioden-basis und verfahren zu dessen herstellung - Google Patents

Beleuchtungsmodul auf leuchtdioden-basis und verfahren zu dessen herstellung Download PDF

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Publication number
WO2004077578A3
WO2004077578A3 PCT/DE2004/000040 DE2004000040W WO2004077578A3 WO 2004077578 A3 WO2004077578 A3 WO 2004077578A3 DE 2004000040 W DE2004000040 W DE 2004000040W WO 2004077578 A3 WO2004077578 A3 WO 2004077578A3
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WO
WIPO (PCT)
Prior art keywords
semiconductor
layered construction
lighting module
semiconductor layered
reflective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2004/000040
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English (en)
French (fr)
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WO2004077578A2 (de
Inventor
Volker Haerle
Berthold Hahn
Hans-Juergen Lugauer
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to JP2006501461A priority Critical patent/JP4791951B2/ja
Priority to KR1020057016082A priority patent/KR101278885B1/ko
Priority to US10/547,217 priority patent/US7560741B2/en
Priority to EP04702280.1A priority patent/EP1597776B1/de
Publication of WO2004077578A2 publication Critical patent/WO2004077578A2/de
Publication of WO2004077578A3 publication Critical patent/WO2004077578A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)

Abstract

Die Erfindung bezieht sich auf ein Beleuchtungsmodul mit zumindest einem auf einem elektrische Anschlussleiter aufweisenden Chipträger aufgebrachten Dünnfilm-Leuchtdiodenchip, der eine erste une eine zweite elektrische Anschlussseite sowie eine epitaktisch hergestellte Halbleiterschichtfolge aufweist. Die Halbleiterschichtfolge weist eine n-leitende Halbleiterschicht, eine p-leitende Halbleiterschicht und einen zwischen diesen beiden Halbleiterschichten angeordneten elektromagnetische Strahlung erzeugenden Bereich auf und ist auf einem Träger angeordnet. Zudem weist sie an einer zu dem Träger hin gewandten Hauptfläche eine reflektierende Schicht auf, die zumindest einen Teil der in der Halbleiterschichtfolge erzeugten elektromagnetischen Strahlung in diese zurückreflektiert. Die Halbleiterschichtfolge weist mindestens eine Halbleiterschicht mit zumindest einer mikrostrukturierten, rauhen Fläche auf. Die Auskoppelfläche des Dünnfilm-Leuchtdiodenchips ist im Wesentlichen durch eine von der reflektierenden Schicht abgewandten Hauptfläche definiert und ist frei von Gehäusematerial wie Verguss- oder Verkapselungsmaterial.
PCT/DE2004/000040 2003-02-28 2004-01-15 Beleuchtungsmodul auf leuchtdioden-basis und verfahren zu dessen herstellung Ceased WO2004077578A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006501461A JP4791951B2 (ja) 2003-02-28 2004-01-15 照明モジュールおよび該照明モジュールの製造方法
KR1020057016082A KR101278885B1 (ko) 2003-02-28 2004-01-15 조명용 모듈 및 그 제조 방법
US10/547,217 US7560741B2 (en) 2003-02-28 2004-01-15 Lighting module and method for the production thereof
EP04702280.1A EP1597776B1 (de) 2003-02-28 2004-01-15 Lichtemitterendes halbleiterbauelement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10308866.0 2003-02-28
DE10308866A DE10308866A1 (de) 2003-02-28 2003-02-28 Beleuchtungsmodul und Verfahren zu dessen Herstellung

Publications (2)

Publication Number Publication Date
WO2004077578A2 WO2004077578A2 (de) 2004-09-10
WO2004077578A3 true WO2004077578A3 (de) 2005-07-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2004/000040 Ceased WO2004077578A2 (de) 2003-02-28 2004-01-15 Beleuchtungsmodul auf leuchtdioden-basis und verfahren zu dessen herstellung

Country Status (8)

Country Link
US (1) US7560741B2 (de)
EP (1) EP1597776B1 (de)
JP (1) JP4791951B2 (de)
KR (1) KR101278885B1 (de)
CN (1) CN100565944C (de)
DE (1) DE10308866A1 (de)
TW (1) TWI237910B (de)
WO (1) WO2004077578A2 (de)

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US20060163601A1 (en) 2006-07-27
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TW200425544A (en) 2004-11-16
JP4791951B2 (ja) 2011-10-12
WO2004077578A2 (de) 2004-09-10
JP2006519481A (ja) 2006-08-24
EP1597776A2 (de) 2005-11-23
US7560741B2 (en) 2009-07-14
TWI237910B (en) 2005-08-11
CN1754268A (zh) 2006-03-29
DE10308866A1 (de) 2004-09-09
KR20050114632A (ko) 2005-12-06

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