WO2005008205A1 - Sensoreinrichtung - Google Patents
Sensoreinrichtung Download PDFInfo
- Publication number
- WO2005008205A1 WO2005008205A1 PCT/DE2004/001266 DE2004001266W WO2005008205A1 WO 2005008205 A1 WO2005008205 A1 WO 2005008205A1 DE 2004001266 W DE2004001266 W DE 2004001266W WO 2005008205 A1 WO2005008205 A1 WO 2005008205A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- housing
- sealing material
- sensor device
- protective cover
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Definitions
- the invention relates to a sensor device, in particular a pressure sensor, with the features of the preamble of independent claim 1.
- Such a sensor device is known for example from US Pat. No. 6,521,966 B1.
- the sensor element in the sensor devices shown in US Pat. No. 6,521,966 B1 which can also be a chip with an integrated evaluation circuit, inserted into a housing of the sensor device without using a printed circuit board or a hybrid.
- the sensor element can, for example, be bonded indirectly or directly to the inside of a housing part, which is, for example, an injection-molded part made of plastic, and then electrically contacted by means of bonding wires with connection sections of the connection elements that protrude into the interior of the housing.
- a housing part which is, for example, an injection-molded part made of plastic
- EMC capacitors solder interference suppression capacitors
- a protective cover made of gel is applied to the sensor element provided with the integrated evaluation circuit, which also covers the bond wires and the exit point of the connection elements from the housing plastic.
- the sensor device advantageously prevents air, which has penetrated into the area between the connection elements and the plastic of the housing part or was already contained there due to the production, from penetrating into the protective cover made of gel.
- This is advantageously achieved by a sealing material that is applied in the area of the entry point of the connection sections into the housing interior and the part of the inside of the housing part surrounding the entry point. The sealing material seals the entry point of the connection sections on the inside of the housing, so that no air can get into the protective cover.
- a sealing adhesive can be used as the sealing material, which is applied to the inside of the housing part provided with the sensor element in the region of the entry point of the connection elements into the interior of the housing.
- the sealing material can in particular be a curable sealing material.
- a receptacle for the sealing material surrounding the entry point of the connection sections is formed on the inside of the housing part, so that the sealing material can be applied with a metering device and then distributed in the receptacle.
- FIG. 1 An embodiment of the invention is shown in the drawing and is explained in the following description.
- the single figure shows a cross section through a sensor device according to the invention, which in the example shown is designed as a pressure sensor.
- the single figure shows a sensor device in cross section, which in the example shown is a pressure sensor.
- the sensor device has a housing 1 which hides an interior 19 of the housing.
- the housing 1 is formed in two parts with a first housing part 2 and a second housing part 3, which can be placed on the first housing part 2.
- the second housing part 3 has a pressure connection 4 with a pressure channel 5 opening into the housing interior 19.
- the first housing part 2 can be connected to the second housing part 3 by gluing, snapping, welding or in another suitable manner.
- Both housing parts 2, 3 are made of plastic in the exemplary embodiment shown here.
- the first housing part 2 has connection elements 7, which are introduced into the first housing part 2 as insert parts. This can be done, for example, by an injection molding process.
- connection elements 7 are felt from the outside through the housing part 2 into the housing interior 19 and have connection sections 17 which enter the housing interior 19 on the inside 14 of the first housing part 2 at one entry point 15 each.
- the outer ends 18 of the connection elements 7 facing away from the connection sections 17 are led out of the housing part 2 to the rear (not shown in the figure) and serve to contact the sensor device with external devices.
- the part 13 of the inside 14 surrounding the entry point 15 of the connection sections 17 forms a receptacle which is delimited by an outer wall 12 on the side facing away from the sensor element and by an inner wall 11 on the side facing the sensor element.
- a sealing material 20 is applied to the part 13 of the inside of the housing part 2 in such a way that the sealing material in the region of the entry point 15 covers the outer wall of the connecting sections 17 and the part 13 surrounding the inside.
- the sealing material 20 can advantageously be a curable sealing material, for example a curable sealing adhesive, which hermetically seals the entry point 15.
- the sealing adhesive should be as thin as possible in the uncured state so that it can penetrate well into the capillaries. In the hardened state, the sealing adhesive should be resistant to temperature changes and still be tough and not brittle in order not to form cracks when subjected to temperature changes.
- a one- or two-component epoxy resin adhesive could be used as the sealing adhesive.
- a poly-urethane adhesive, an acrylate adhesive or another suitable adhesive can also be used.
- the sensor element 9 is a pressure sensor chip which is applied to a glass base 8, which in turn is glued to the inside 14 of the housing part 2, for example.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04738716A EP1646854A1 (de) | 2003-07-15 | 2004-06-18 | Sensoreinrichtung |
| JP2005518250A JP2006510920A (ja) | 2003-07-15 | 2004-06-18 | センサ装置 |
| US10/525,944 US7036380B2 (en) | 2003-07-15 | 2004-06-18 | Sensor device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10331967.0 | 2003-07-15 | ||
| DE10331967A DE10331967A1 (de) | 2003-07-15 | 2003-07-15 | Sensoreinrichtung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2005008205A1 true WO2005008205A1 (de) | 2005-01-27 |
Family
ID=33560109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2004/001266 Ceased WO2005008205A1 (de) | 2003-07-15 | 2004-06-18 | Sensoreinrichtung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7036380B2 (de) |
| EP (1) | EP1646854A1 (de) |
| JP (1) | JP2006510920A (de) |
| CN (1) | CN1823267A (de) |
| DE (1) | DE10331967A1 (de) |
| WO (1) | WO2005008205A1 (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017220319A1 (de) * | 2016-06-20 | 2017-12-28 | Robert Bosch Gmbh | Anordnung mit einem träger und einem gehäusekörper, und verfahren zum herstellen einer anordnung mit einem bauelement |
| EP3404392A1 (de) * | 2017-05-16 | 2018-11-21 | Honeywell International Inc. | Drucksensor ohne intern geflügeltem fluid im gehäusedeckel |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10357041A1 (de) * | 2003-12-04 | 2005-07-07 | Vega Grieshaber Kg | Messwertaufnehmer |
| DE102004012593A1 (de) * | 2004-03-12 | 2005-09-29 | Robert Bosch Gmbh | Sensormodul |
| JP2006047190A (ja) * | 2004-08-06 | 2006-02-16 | Denso Corp | 圧力センサ |
| DE102009028966A1 (de) * | 2009-08-28 | 2011-03-03 | Robert Bosch Gmbh | Drucksensor |
| US8245575B2 (en) * | 2009-12-08 | 2012-08-21 | Jen-Huang Albert Chiou | Pressure sensor device with breakwater to reduce protective gel vibration |
| DE102010001505A1 (de) | 2010-02-02 | 2011-08-04 | Robert Bosch GmbH, 70469 | Vorrichtung zum Schutz eines Bonddrahtes |
| DE102011077684A1 (de) * | 2011-06-17 | 2012-12-20 | Robert Bosch Gmbh | Abdeckmaterial für einen Mikrochip, Mikrochip mit Abdeckmaterial sowie Verfahren zur Bereitstellung eines solchen Mikrochips |
| CN102661829A (zh) * | 2012-04-28 | 2012-09-12 | 无锡永阳电子科技有限公司 | So8塑料封装传感器 |
| FR3000205B1 (fr) * | 2012-12-21 | 2015-07-31 | Michelin & Cie | Capteur de pression perfectionne a boitier etanche |
| JP6051975B2 (ja) * | 2013-03-12 | 2016-12-27 | 株式会社デンソー | 圧力センサ |
| JP6317956B2 (ja) * | 2014-03-05 | 2018-04-25 | 株式会社フジクラ | 圧力センサ、及び圧力センサの製造方法 |
| DE102016210532B4 (de) * | 2016-06-14 | 2020-11-26 | Robert Bosch Gmbh | Sensoranordnung |
| JP6892404B2 (ja) * | 2018-03-15 | 2021-06-23 | 株式会社鷺宮製作所 | 圧力センサ |
| US11225409B2 (en) | 2018-09-17 | 2022-01-18 | Invensense, Inc. | Sensor with integrated heater |
| DE102018222781A1 (de) * | 2018-12-21 | 2020-06-25 | Robert Bosch Gmbh | Drucksensoranordnung |
| DE102021134430A1 (de) * | 2021-12-22 | 2023-06-22 | Systec Automotive Gmbh | Vorrichtung zur Druck-, Kraft- oder Temperaturmessung |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4838089A (en) * | 1986-05-07 | 1989-06-13 | Nippondenso Co., Ltd. | Semiconductor pressure sensor |
| US5209120A (en) * | 1991-01-24 | 1993-05-11 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure-detecting apparatus |
| US6521966B1 (en) * | 1999-04-14 | 2003-02-18 | Denso Corporation | Semiconductor strain sensor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4532952A (en) * | 1980-12-15 | 1985-08-06 | Logic Controls Corp. | Controller for well installations |
| DE8802411U1 (de) * | 1988-02-24 | 1989-06-29 | Keller AG für Druckmeßtechnik, Winterthur | Druckmeßvorrichtung |
| US5001934A (en) * | 1990-01-02 | 1991-03-26 | Walbro Corporation | Solid state pressure sensor |
| US5461922A (en) * | 1993-07-27 | 1995-10-31 | Lucas-Novasensor | Pressure sensor isolated within housing having integral diaphragm and method of making same |
-
2003
- 2003-07-15 DE DE10331967A patent/DE10331967A1/de not_active Withdrawn
-
2004
- 2004-06-18 US US10/525,944 patent/US7036380B2/en not_active Expired - Fee Related
- 2004-06-18 CN CNA200480020038XA patent/CN1823267A/zh active Pending
- 2004-06-18 EP EP04738716A patent/EP1646854A1/de not_active Withdrawn
- 2004-06-18 WO PCT/DE2004/001266 patent/WO2005008205A1/de not_active Ceased
- 2004-06-18 JP JP2005518250A patent/JP2006510920A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4838089A (en) * | 1986-05-07 | 1989-06-13 | Nippondenso Co., Ltd. | Semiconductor pressure sensor |
| US5209120A (en) * | 1991-01-24 | 1993-05-11 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure-detecting apparatus |
| US6521966B1 (en) * | 1999-04-14 | 2003-02-18 | Denso Corporation | Semiconductor strain sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017220319A1 (de) * | 2016-06-20 | 2017-12-28 | Robert Bosch Gmbh | Anordnung mit einem träger und einem gehäusekörper, und verfahren zum herstellen einer anordnung mit einem bauelement |
| EP3404392A1 (de) * | 2017-05-16 | 2018-11-21 | Honeywell International Inc. | Drucksensor ohne intern geflügeltem fluid im gehäusedeckel |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1646854A1 (de) | 2006-04-19 |
| US20050247133A1 (en) | 2005-11-10 |
| JP2006510920A (ja) | 2006-03-30 |
| DE10331967A1 (de) | 2005-02-03 |
| US7036380B2 (en) | 2006-05-02 |
| CN1823267A (zh) | 2006-08-23 |
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